JP6139524B2 - バリアアセンブリ - Google Patents
バリアアセンブリ Download PDFInfo
- Publication number
- JP6139524B2 JP6139524B2 JP2014523961A JP2014523961A JP6139524B2 JP 6139524 B2 JP6139524 B2 JP 6139524B2 JP 2014523961 A JP2014523961 A JP 2014523961A JP 2014523961 A JP2014523961 A JP 2014523961A JP 6139524 B2 JP6139524 B2 JP 6139524B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical device
- assembly
- barrier laminate
- sheet
- barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004888 barrier function Effects 0.000 title claims description 109
- 239000010410 layer Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 59
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 29
- 229920002313 fluoropolymer Polymers 0.000 claims description 22
- 239000004811 fluoropolymer Substances 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 22
- 229920002367 Polyisobutene Polymers 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 15
- 239000003566 sealing material Substances 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 14
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000003963 antioxidant agent Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 239000004611 light stabiliser Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 4
- 229920009638 Tetrafluoroethylene-Hexafluoropropylene-Vinylidenefluoride Copolymer Polymers 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004202 carbamide Substances 0.000 claims description 3
- 239000012963 UV stabilizer Substances 0.000 claims description 2
- 239000003017 thermal stabilizer Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 89
- -1 primed surface Substances 0.000 description 30
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 239000000178 monomer Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000008393 encapsulating agent Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000003381 stabilizer Substances 0.000 description 12
- 230000032798 delamination Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000004215 Carbon black (E152) Substances 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 8
- 238000006731 degradation reaction Methods 0.000 description 8
- 229930195733 hydrocarbon Natural products 0.000 description 8
- 150000002430 hydrocarbons Chemical class 0.000 description 8
- 229920006254 polymer film Polymers 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 239000002274 desiccant Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 230000001737 promoting effect Effects 0.000 description 6
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- SXMUXFDPJBTNRM-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-[2-hydroxy-3-(2-methylprop-2-enoyloxy)propoxy]phenyl]propan-2-yl]phenoxy]propyl] 2-methylprop-2-enoate;2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C.C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 SXMUXFDPJBTNRM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000006188 syrup Substances 0.000 description 4
- 235000020357 syrup Nutrition 0.000 description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- 239000004971 Cross linker Substances 0.000 description 3
- 101710121003 Oxygen-evolving enhancer protein 3, chloroplastic Proteins 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000012939 laminating adhesive Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 229920006260 polyaryletherketone Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- LTYBJDPMCPTGEE-UHFFFAOYSA-N (4-benzoylphenyl) prop-2-enoate Chemical compound C1=CC(OC(=O)C=C)=CC=C1C(=O)C1=CC=CC=C1 LTYBJDPMCPTGEE-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 239000004322 Butylated hydroxytoluene Substances 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 229920005987 OPPANOL® Polymers 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000003373 anti-fouling effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 229940095259 butylated hydroxytoluene Drugs 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- CHJAYYWUZLWNSQ-UHFFFAOYSA-N 1-chloro-1,2,2-trifluoroethene;ethene Chemical group C=C.FC(F)=C(F)Cl CHJAYYWUZLWNSQ-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- ZWWKXEXFVYBART-UHFFFAOYSA-N 2,5-diisocyanato-5-methylcyclohexa-1,3-diene Chemical compound O=C=NC1(C)CC=C(N=C=O)C=C1 ZWWKXEXFVYBART-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- UZUNCLSDTUBVCN-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-(2-phenylpropan-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound C=1C(C(C)(C)CC(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C(O)C=1C(C)(C)C1=CC=CC=C1 UZUNCLSDTUBVCN-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- NCTBYWFEJFTVEL-UHFFFAOYSA-N 2-methylbutyl prop-2-enoate Chemical compound CCC(C)COC(=O)C=C NCTBYWFEJFTVEL-UHFFFAOYSA-N 0.000 description 1
- ZTEVZRQIBGJEHG-UHFFFAOYSA-N 2-naphthalen-1-yl-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=2C3=CC=CC=C3C=CC=2)=N1 ZTEVZRQIBGJEHG-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- BVDBXCXQMHBGQM-UHFFFAOYSA-N 4-methylpentan-2-yl prop-2-enoate Chemical compound CC(C)CC(C)OC(=O)C=C BVDBXCXQMHBGQM-UHFFFAOYSA-N 0.000 description 1
- YXHRTMJUSBVGMX-UHFFFAOYSA-N 4-n-butyl-2-n,4-n-bis(2,2,6,6-tetramethylpiperidin-4-yl)-2-n-[6-[(2,2,6,6-tetramethylpiperidin-4-yl)amino]hexyl]-1,3,5-triazine-2,4-diamine Chemical compound N=1C=NC(N(CCCCCCNC2CC(C)(C)NC(C)(C)C2)C2CC(C)(C)NC(C)(C)C2)=NC=1N(CCCC)C1CC(C)(C)NC(C)(C)C1 YXHRTMJUSBVGMX-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 230000032900 absorption of visible light Effects 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- NEFJPHDWZWTFQC-UHFFFAOYSA-N benzene-1,3-dicarboxylic acid;benzene-1,3-diol Chemical compound OC1=CC=CC(O)=C1.OC(=O)C1=CC=CC(C(O)=O)=C1 NEFJPHDWZWTFQC-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 235000008504 concentrate Nutrition 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- BLCKNMAZFRMCJJ-UHFFFAOYSA-N cyclohexyl cyclohexyloxycarbonyloxy carbonate Chemical compound C1CCCCC1OC(=O)OOC(=O)OC1CCCCC1 BLCKNMAZFRMCJJ-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- YSLAUVZTCDVIPD-UHFFFAOYSA-N n-(2,2-dihydroxyethyl)-n-ethylprop-2-enamide Chemical compound OC(O)CN(CC)C(=O)C=C YSLAUVZTCDVIPD-UHFFFAOYSA-N 0.000 description 1
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- AWGZKFQMWZYCHF-UHFFFAOYSA-N n-octylprop-2-enamide Chemical compound CCCCCCCCNC(=O)C=C AWGZKFQMWZYCHF-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920006120 non-fluorinated polymer Polymers 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000013086 organic photovoltaic Methods 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- MXXWOMGUGJBKIW-YPCIICBESA-N piperine Chemical compound C=1C=C2OCOC2=CC=1/C=C/C=C/C(=O)N1CCCCC1 MXXWOMGUGJBKIW-YPCIICBESA-N 0.000 description 1
- 229940075559 piperine Drugs 0.000 description 1
- WVWHRXVVAYXKDE-UHFFFAOYSA-N piperine Natural products O=C(C=CC=Cc1ccc2OCOc2c1)C3CCCCN3 WVWHRXVVAYXKDE-UHFFFAOYSA-N 0.000 description 1
- 235000019100 piperine Nutrition 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Description
本開示によるアセンブリは、例えば、光電池などの太陽光装置などの電気装置を含む。したがって、本開示は、光電池を含むアセンブリを提示する。好適な光電池としては、多様な材料で開発され、太陽エネルギーを電気に変換する、それぞれ固有の吸収スペクトルを有するものが挙げられる。光電池の製造に使用される材料及びこれらの太陽光吸収帯端波長の例としては、結晶性シリコン単接合(約400nm〜約1150nm)、非晶質シリコン単接合(約300nm〜約720nm)、リボンシリコン(約350nm〜約1150nm)、CIS(銅インジウムセレン化物)(約400nm〜約1300nm)、CIGS(銅インジウムガリウム二セレン化物)(約350nm〜約1100nm)、CdTe(約400nm〜約895nm)、GaAsマルチ接合(約350nm〜約1750nm)が挙げられる。これらの半導体材料の短い波長の左吸収帯端は、通常、300nm〜400nmの間である。特定の実施形態において、電気装置はCIGS電池である。いくつかの実施形態では、アセンブリが適用される太陽光装置(例えば、光電池)は、可撓性フィルム基材を備え、可撓性光起電装置を生じる。
多層フィルムは一般的に、バリア積層物、及び耐候性シート、及びいくつかの実施形態においては基材を含む。多層フィルムは一般的に、可視光線及び赤外線に対して透過性である。本明細書で使用するとき、用語「可視光及び赤外線に対して透過性」は、垂直軸に沿って測定した際にスペクトルの可視光及び赤外線部分の範囲の平均透過率が少なくとも75%(一部の実施形態では少なくとも約80、85、90、92、95、97又は98%)であることを意味することができる。一部の実施形態では、可視光及び赤外線透過性アセンブリは、400nm〜1400nmの範囲の平均透過率が少なくとも約75%(一部の実施形態では少なくとも約80、85、90、92、95、97又は98%)である。可視光及び赤外線透過性アセンブリは、例えば、光電池による、可視光及び赤外線の吸収に関して干渉しないものである。一部の実施形態では、可視光及び赤外線透過性アセンブリは、光電池に有用である光の波長の範囲の平均透過率が少なくとも約75%(一部の実施形態では少なくとも約80、85、90、92、95、97又は98%)である。
本開示によるアセンブリは基材を含む。一般的に基材はポリマーフィルムである。本出願の関連において、用語「ポリマー」は、有機ホモポリマー及びコポリマー、並びに例えば、共押出し又はエステル交換を含む反応により混和性ブレンド中で形成される場合があるポリマー又はコポリマーを含むように理解される。用語「ポリマー」及び「コポリマー」は、ランダム及びブロックコポリマーの両方を含む。
多層フィルムは、バリア積層物を含む。バリア積層物は、様々な構成から選択され得る。用語「バリアフィルム」は、酸素又は水の少なくとも1つに対してバリアをもたらすフィルムを指す。バリア積層物は、用途により要求される特定のレベルで酸素及び水透過率を有するように選択される。一部の実施形態では、バリア積層物は、38℃及び相対湿度100%で約0.005g/m2/日未満、一部の実施形態では38℃及び相対湿度100%で約0.0005g/m2/日未満、一部の実施形態では38℃及び相対湿度100%で約0.00005g/m2/日未満の水蒸気透過率(WVTR)を有する。一部の実施形態では、可撓性バリア積層物は、50℃及び相対湿度100%で約0.05、0.005、0.0005又は0.00005g/m2/日未満、又は更に85℃及び相対湿度100%でも約0.005、0.0005、0.00005g/m2/日未満のWVTRを有する。一部の実施形態では、バリア積層物は、23℃及び90%相対湿度で約0.005g/m2/日未満、一部の実施形態では23℃及び相対湿度90%で約0.0005g/m2/日未満、一部の実施形態では23℃及び相対湿度90%で約0.00005g/m2/日未満の酸素透過率を有する。
本開示によるアセンブリは、単層又は多層であり得る、耐候性シートを含む。耐候性シートは、概して、可撓性であり、並びに、可視光及び赤外線に対して透過性であり、並びに、有機膜形成ポリマーを含む。耐候性シートを形成できる有用な材料としては、ポリエステル、ポリカーボネート、ポリエーテル、ポリイミド、ポリオレフィン、フルオロポリマー及びこれらの組み合わせが挙げられる。
感圧接着剤(「PSA」)は、耐候性シートとバリア積層物との間にあってよい。PSAは、(1)侵襲性及び永続性のある粘着力、(2)指圧以下の圧力による接着力、(3)被着体を保持する充分な能力、及び(4)被着体からきれいに取り外すのに充分な結合力を含む特性を有することが、当業者には周知である。PSAとして良好に機能することが分かっている材料は、必要な粘弾性特性を示し、粘着、剥離接着、及び剪断保持力の所望のバランスをもたらすように設計並びに処方されたポリマーである。
場合により、本開示によるアセンブリは、乾燥剤を含有することができる。一部の実施形態では、本開示によるアセンブリは、乾燥剤を本質的に含まない。「乾燥剤を本質的に含まない」は、乾燥剤が存在し得るものの、光起電モジュールを効果的に乾燥させるには不十分な量であり得ることを意味する。乾燥剤を本質的に含まないアセンブリとしては、乾燥剤がアセンブリに全く組み込まれていないものが挙げられる。
「HELIOSEAL PVS 101」は1.0N/mm(5.5lb/in)であった。
「SOLARGAIN LP02」は0.31N/mm(1.8lbs/in)であった。
本明細書に記載の実施態様の一部を[1]−[30]に記載する。
[1]
アセンブリであって、
電気装置と、
多層フィルムであって、前記多層フィルムは、
前記電気装置に隣接するバリア積層物、及び
前記電気装置の反対側の、前記バリア積層物に隣接する耐候性シートを含む、多層フィルムとを含み、
前記耐候性シートは、前記電気装置に結合される、アセンブリ。
[2]
前記バリア積層物は、ポリマー層、及び無機バリア層を含む、項目1に記載のアセンブリ。
[3]
前記無機バリア層が、酸化物層である、項目2に記載のアセンブリ。
[4]
前記多層フィルムは、透明及び可撓性である、項目1に記載のアセンブリ。
[5]
前記多層フィルムは、前記電気装置と前記バリア積層物との間に基材を含む、項目1に記載のアセンブリ。
[6]
前記電気装置は、カプセル化材料層を含む、項目1に記載のアセンブリ。
[7]
前記電気装置は、縁部封止材料を含む、項目1に記載のアセンブリ。
[8]
前記電気装置は、バックシートを含む、項目1に記載のアセンブリ。
[9]
前記電気装置は、屋根部を含む、項目1に記載のアセンブリ。
[10]
前記耐候性シートは、感圧接着剤により前記電気装置に結合される、項目1に記載のアセンブリ。
[11]
前記耐候性シートが、前記縁部封止材料に結合される、項目7に記載のアセンブリ。
[12]
前記耐候性シートが、前記バックシートに結合される、項目8に記載のアセンブリ。
[13]
前記耐候性シートが、前記屋根部に結合される、項目9に記載のアセンブリ。
[14]
前記縁部封止材料が、ブチルゴムを含む、項目7に記載のアセンブリ。
[15]
前記縁部封止材料が、乾燥ポリマーを含む、項目7に記載のアセンブリ。
[16]
前記基材が、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリエーテルエーテルケトン、ポリアリールエーテルケトン、ポリアクリレート、ポリエーテルイミド、ポリアリールスルホン、ポリエーテルスルホン、ポリアミドイミド、又はポリイミドのうちの少なくとも1つを含む、項目5に記載のアセンブリ。
[17]
前記耐候性シートが、フルオロポリマーを含む、項目1に記載のアセンブリ。
[18]
前記フルオロポリマーが、エチレンテトラフルオロエチレンコポリマー、テトラフルオロエチレンヘキサフルオロプロピレンコポリマー、テトラフルオロエチレンヘキサフルオロプロピレンフッ化ビニリデンコポリマー、又はポリフッ化ビニリデンの少なくとも1つを含む、項目17に記載のアセンブリ。
[19]
前記耐候性シートと前記バリア積層物との間に、感圧接着剤層を含む、項目1に記載のアセンブリ。
[20]
前記感圧接着剤は、アクリレート、シリコーン、ポリイソブチレン、尿素、又はこれらの混合物である、項目19に記載のアセンブリ。
[21]
前記感圧接着剤は、UV安定剤、ヒンダードアミン光安定剤、抗酸化剤、又は熱安定剤の少なくとも1つを含む、項目19に記載のアセンブリ。
[22]
前記バリア積層物の酸化物層は、前記バリア積層物のポリマー層とシロキサン結合を共有する、項目1に記載のアセンブリ。
[23]
前記電気装置は、光電池である、項目1に記載のアセンブリ。
[24]
前記光電池が、CIGS電池である、項目20に記載のアセンブリ。
[25]
前記基材は、熱安定性である、項目5に記載のアセンブリ。
[26]
前記バリア積層物は、50℃及び100%相対湿度において、0.005cc/m 2 /日未満の水蒸気透過率を有する、項目1に記載のアセンブリ。
[27]
前記バリア積層物は、23℃及び90%相対湿度において、0.005cc/m 2 /日未満の酸素透過率を有する、項目1に記載のアセンブリ。
[28]
前記バリア積層物は、少なくとも2つの酸化物層を含む、項目1に記載のアセンブリ。
[29]
前記バリア積層物は、少なくとも2つのポリマー層を含む、項目1に記載のアセンブリ。
[30]
前記耐候性シートが、前記カプセル化材料に結合される、項目6に記載のアセンブリ。
Claims (5)
- アセンブリであって、
電気装置と、
多層フィルムであって、前記多層フィルムは、
前記電気装置に隣接するバリア積層物、
前記電気装置の反対側の、前記バリア積層物に隣接する耐候性シート、及び
前記耐候性シートと前記バリア積層物との間に配置される感圧接着剤層を含む、多層フィルムとを含み、
前記感圧接着剤層の厚さは、0.005mm〜0.1mmであり、
前記耐候性シートは、前記電気装置に結合され、
前記バリア積層物は、ポリマー層、及び無機バリア層を含み、及び
前記無機バリア層が、酸化物層である、アセンブリ。 - 前記多層フィルムは、前記電気装置と前記バリア積層物との間に基材を含み、
前記電気装置は、カプセル化材料層を含み、
前記電気装置は、縁部封止材料を含み、
前記電気装置は、バックシートを含み、及び
前記多層フィルムは、透明及び可撓性である、請求項1に記載のアセンブリ。 - 前記耐候性シートが、フルオロポリマーを含み、及び
前記フルオロポリマーが、エチレンテトラフルオロエチレンコポリマー、テトラフルオロエチレンヘキサフルオロプロピレンコポリマー、テトラフルオロエチレンヘキサフルオロプロピレンフッ化ビニリデンコポリマー、又はポリフッ化ビニリデンの少なくとも1つを含む、請求項1に記載のアセンブリ。 - 前記感圧接着剤は、アクリレート、シリコーン、ポリイソブチレン、尿素、又はこれらの混合物であり、及び
前記感圧接着剤は、UV安定剤、ヒンダードアミン光安定剤、抗酸化剤、又は熱安定剤の少なくとも1つを含む、請求項1に記載のアセンブリ。 - 前記バリア積層物は、50℃及び100%相対湿度において、0.005cc/m2/日未満の水蒸気透過率を有し、及び
前記バリア積層物は、23℃及び90%相対湿度において、0.005cc/m2/日未満の酸素透過率を有する、請求項1に記載のアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161515028P | 2011-08-04 | 2011-08-04 | |
US61/515,028 | 2011-08-04 | ||
PCT/US2012/047916 WO2013019466A1 (en) | 2011-08-04 | 2012-07-24 | Barrier assemblies |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014529882A JP2014529882A (ja) | 2014-11-13 |
JP2014529882A5 JP2014529882A5 (ja) | 2015-09-10 |
JP6139524B2 true JP6139524B2 (ja) | 2017-05-31 |
Family
ID=47629592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014523961A Expired - Fee Related JP6139524B2 (ja) | 2011-08-04 | 2012-07-24 | バリアアセンブリ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140290736A1 (ja) |
EP (1) | EP2740327A4 (ja) |
JP (1) | JP6139524B2 (ja) |
KR (1) | KR20140048309A (ja) |
CN (1) | CN103733725A (ja) |
TW (1) | TWI581445B (ja) |
WO (1) | WO2013019466A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117739B2 (en) | 2010-03-08 | 2015-08-25 | Cree, Inc. | Semiconductor devices with heterojunction barrier regions and methods of fabricating same |
WO2013019695A2 (en) * | 2011-08-04 | 2013-02-07 | 3M Innovative Properties Company | Edge protected barrier assemblies |
US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
WO2013116032A1 (en) | 2012-01-31 | 2013-08-08 | 3M Innovative Properties Company | Methods for sealing the edges of multi-layer articles |
KR20150017710A (ko) | 2012-05-03 | 2015-02-17 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 내구성 태양광 미러 필름 |
KR20230169406A (ko) | 2012-12-27 | 2023-12-15 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
JP2014192455A (ja) * | 2013-03-28 | 2014-10-06 | Fujifilm Corp | 太陽電池モジュール |
EP3079911B1 (en) | 2013-12-12 | 2020-07-29 | Kateeva, Inc. | Ink-based layer fabrication using halftoning to control thickness |
WO2019088098A1 (ja) * | 2017-10-31 | 2019-05-09 | ダイキン工業株式会社 | 積層体 |
KR102377621B1 (ko) * | 2020-06-05 | 2022-03-22 | 한화솔루션 주식회사 | 수분 안정성과 장기 안정성이 향상된 태양전지 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06125103A (ja) * | 1991-08-26 | 1994-05-06 | Canon Inc | 太陽電池モジュール |
DE69410536T2 (de) * | 1993-06-24 | 1998-11-26 | Canon K.K., Tokio/Tokyo | Solarmodul mit warm-verschweisstem Teil zur Verbesserung der Feuchtigkeitsbeständigkeit |
JPH07142756A (ja) * | 1993-06-24 | 1995-06-02 | Canon Inc | 太陽電池モジュール及びその製造方法 |
JP3740251B2 (ja) * | 1997-06-09 | 2006-02-01 | キヤノン株式会社 | 太陽電池モジュールの製造方法 |
US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
US7198832B2 (en) * | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
JP5127123B2 (ja) * | 2005-07-22 | 2013-01-23 | ダイキン工業株式会社 | 太陽電池のバックシート |
FR2904508B1 (fr) * | 2006-07-28 | 2014-08-22 | Saint Gobain | Dispositif electroluminescent encapsule |
JP5263849B2 (ja) * | 2008-04-09 | 2013-08-14 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | 酸素及び/又は水分に敏感な電子デバイスをカプセル封じするための多層膜 |
US7960643B2 (en) * | 2009-05-12 | 2011-06-14 | Miasole | Isolated metallic flexible back sheet for solar module encapsulation |
WO2010150759A1 (ja) * | 2009-06-24 | 2010-12-29 | 三菱化学株式会社 | 有機電子デバイス及びその製造方法 |
US20120145240A1 (en) * | 2009-08-24 | 2012-06-14 | E.I. Du Pont De Nemours And Company | Barrier films for thin-film photovoltaic cells |
WO2011062932A1 (en) * | 2009-11-18 | 2011-05-26 | 3M Innovative Properties Company | Flexible assembly and method of making and using the same |
-
2012
- 2012-07-24 EP EP12820451.8A patent/EP2740327A4/en not_active Withdrawn
- 2012-07-24 WO PCT/US2012/047916 patent/WO2013019466A1/en active Application Filing
- 2012-07-24 KR KR1020147005195A patent/KR20140048309A/ko not_active Application Discontinuation
- 2012-07-24 CN CN201280038529.1A patent/CN103733725A/zh active Pending
- 2012-07-24 US US14/236,697 patent/US20140290736A1/en not_active Abandoned
- 2012-07-24 JP JP2014523961A patent/JP6139524B2/ja not_active Expired - Fee Related
- 2012-08-03 TW TW101128153A patent/TWI581445B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2740327A4 (en) | 2015-05-20 |
TW201324813A (zh) | 2013-06-16 |
TWI581445B (zh) | 2017-05-01 |
KR20140048309A (ko) | 2014-04-23 |
JP2014529882A (ja) | 2014-11-13 |
US20140290736A1 (en) | 2014-10-02 |
EP2740327A1 (en) | 2014-06-11 |
CN103733725A (zh) | 2014-04-16 |
WO2013019466A1 (en) | 2013-02-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10038112B2 (en) | Edge protected barrier assemblies | |
JP6139524B2 (ja) | バリアアセンブリ | |
JP6208695B2 (ja) | 連続多層フィルムを形成する方法 | |
JP6228116B2 (ja) | 縁部保護バリアアセンブリ | |
JP2014526985A (ja) | エッジの保護されたバリアー性組立品 | |
JP6185465B2 (ja) | 層間剥離抵抗アセンブリの作製方法 | |
JP6141842B2 (ja) | エッジの保護されたバリアー性組立品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150724 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150724 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160511 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160517 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160816 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170328 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170427 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6139524 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |