JP2009038259A5 - - Google Patents
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- Publication number
- JP2009038259A5 JP2009038259A5 JP2007202250A JP2007202250A JP2009038259A5 JP 2009038259 A5 JP2009038259 A5 JP 2009038259A5 JP 2007202250 A JP2007202250 A JP 2007202250A JP 2007202250 A JP2007202250 A JP 2007202250A JP 2009038259 A5 JP2009038259 A5 JP 2009038259A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor module
- module according
- sealing material
- wiring layer
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 24
- 239000003566 sealing material Substances 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000000463 material Substances 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 3
- 239000003550 marker Substances 0.000 claims 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000006247 magnetic powder Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007202250A JP5154162B2 (ja) | 2007-08-02 | 2007-08-02 | 半導体モジュールの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007202250A JP5154162B2 (ja) | 2007-08-02 | 2007-08-02 | 半導体モジュールの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012265153A Division JP5541350B2 (ja) | 2012-12-04 | 2012-12-04 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009038259A JP2009038259A (ja) | 2009-02-19 |
| JP2009038259A5 true JP2009038259A5 (https=) | 2010-09-02 |
| JP5154162B2 JP5154162B2 (ja) | 2013-02-27 |
Family
ID=40439893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007202250A Expired - Fee Related JP5154162B2 (ja) | 2007-08-02 | 2007-08-02 | 半導体モジュールの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5154162B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069807A (ja) * | 2011-09-21 | 2013-04-18 | Shinko Electric Ind Co Ltd | 半導体パッケージ及びその製造方法 |
| CN112789723B (zh) * | 2018-09-28 | 2024-08-02 | 株式会社村田制作所 | 电路模块和通信装置 |
| CN116387278A (zh) * | 2023-03-21 | 2023-07-04 | 珠海越亚半导体股份有限公司 | 嵌埋磁体框架、集成结构及制作方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4027788B2 (ja) * | 2002-12-10 | 2007-12-26 | 新光電気工業株式会社 | 電子部品実装構造の製造方法 |
-
2007
- 2007-08-02 JP JP2007202250A patent/JP5154162B2/ja not_active Expired - Fee Related
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