JP5154162B2 - 半導体モジュールの製造方法 - Google Patents

半導体モジュールの製造方法 Download PDF

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Publication number
JP5154162B2
JP5154162B2 JP2007202250A JP2007202250A JP5154162B2 JP 5154162 B2 JP5154162 B2 JP 5154162B2 JP 2007202250 A JP2007202250 A JP 2007202250A JP 2007202250 A JP2007202250 A JP 2007202250A JP 5154162 B2 JP5154162 B2 JP 5154162B2
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Japan
Prior art keywords
chip
wiring layer
sealing
layer
multilayer wiring
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Expired - Fee Related
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JP2007202250A
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Japanese (ja)
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JP2009038259A5 (https=
JP2009038259A (ja
Inventor
剛 小川
浩和 中山
廣仁 宮崎
奈美子 竹島
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Sony Corp
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Sony Corp
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Priority to JP2007202250A priority Critical patent/JP5154162B2/ja
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Publication of JP2009038259A5 publication Critical patent/JP2009038259A5/ja
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  • Semiconductor Integrated Circuits (AREA)
JP2007202250A 2007-08-02 2007-08-02 半導体モジュールの製造方法 Expired - Fee Related JP5154162B2 (ja)

Priority Applications (1)

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JP2007202250A JP5154162B2 (ja) 2007-08-02 2007-08-02 半導体モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007202250A JP5154162B2 (ja) 2007-08-02 2007-08-02 半導体モジュールの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012265153A Division JP5541350B2 (ja) 2012-12-04 2012-12-04 半導体モジュール

Publications (3)

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JP2009038259A JP2009038259A (ja) 2009-02-19
JP2009038259A5 JP2009038259A5 (https=) 2010-09-02
JP5154162B2 true JP5154162B2 (ja) 2013-02-27

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ID=40439893

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JP2007202250A Expired - Fee Related JP5154162B2 (ja) 2007-08-02 2007-08-02 半導体モジュールの製造方法

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JP (1) JP5154162B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069807A (ja) * 2011-09-21 2013-04-18 Shinko Electric Ind Co Ltd 半導体パッケージ及びその製造方法
CN112789723B (zh) * 2018-09-28 2024-08-02 株式会社村田制作所 电路模块和通信装置
CN116387278A (zh) * 2023-03-21 2023-07-04 珠海越亚半导体股份有限公司 嵌埋磁体框架、集成结构及制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027788B2 (ja) * 2002-12-10 2007-12-26 新光電気工業株式会社 電子部品実装構造の製造方法

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JP2009038259A (ja) 2009-02-19

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