JP2009021401A5 - - Google Patents

Download PDF

Info

Publication number
JP2009021401A5
JP2009021401A5 JP2007182918A JP2007182918A JP2009021401A5 JP 2009021401 A5 JP2009021401 A5 JP 2009021401A5 JP 2007182918 A JP2007182918 A JP 2007182918A JP 2007182918 A JP2007182918 A JP 2007182918A JP 2009021401 A5 JP2009021401 A5 JP 2009021401A5
Authority
JP
Japan
Prior art keywords
conductor
land
inspection
conductive layers
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007182918A
Other languages
English (en)
Japanese (ja)
Other versions
JP5067048B2 (ja
JP2009021401A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007182918A priority Critical patent/JP5067048B2/ja
Priority claimed from JP2007182918A external-priority patent/JP5067048B2/ja
Publication of JP2009021401A publication Critical patent/JP2009021401A/ja
Publication of JP2009021401A5 publication Critical patent/JP2009021401A5/ja
Application granted granted Critical
Publication of JP5067048B2 publication Critical patent/JP5067048B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007182918A 2007-07-12 2007-07-12 プリント配線板 Expired - Fee Related JP5067048B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007182918A JP5067048B2 (ja) 2007-07-12 2007-07-12 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007182918A JP5067048B2 (ja) 2007-07-12 2007-07-12 プリント配線板

Publications (3)

Publication Number Publication Date
JP2009021401A JP2009021401A (ja) 2009-01-29
JP2009021401A5 true JP2009021401A5 (zh) 2010-08-19
JP5067048B2 JP5067048B2 (ja) 2012-11-07

Family

ID=40360791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007182918A Expired - Fee Related JP5067048B2 (ja) 2007-07-12 2007-07-12 プリント配線板

Country Status (1)

Country Link
JP (1) JP5067048B2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5359757B2 (ja) * 2009-10-08 2013-12-04 パナソニック株式会社 多層プリント配線板の位置認識マーク
JP2013021236A (ja) * 2011-07-13 2013-01-31 Seiko Precision Inc 溶着力評価装置、溶着力評価方法、及びそのコンピュータプログラム
KR101320204B1 (ko) 2012-07-31 2013-10-23 삼성전기주식회사 검사 쿠폰을 갖는 회로 기판
US10454352B1 (en) * 2016-05-02 2019-10-22 Williams International Co., L.L.C. Method of producing a laminated magnetic core

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151510A (ja) * 1984-08-22 1986-03-14 Shimadzu Corp 多層プリント基板の層間ずれ検査方法
JPH0391993A (ja) * 1989-09-04 1991-04-17 Fujitsu Ltd 多層プリント配線板の内層ずれ測定方法
JP3206635B2 (ja) * 1995-04-28 2001-09-10 エルナー株式会社 多層印刷配線板
JPH11145628A (ja) * 1997-11-05 1999-05-28 Toshiba Corp 印刷配線基板
JP2000294935A (ja) * 1999-04-01 2000-10-20 Fujitsu Ten Ltd 多層基板及び多層基板の検査方法
JP2003283145A (ja) * 2002-03-26 2003-10-03 Sumitomo Bakelite Co Ltd 多層配線板の位置ずれ検査方法
JP4119702B2 (ja) * 2002-07-30 2008-07-16 エルナー株式会社 多層プリント配線板の検査方法

Similar Documents

Publication Publication Date Title
JP2014082455A5 (ja) フレキシブル基板、基板接続構造及び光モジュール
JP2011155251A5 (zh)
JP2011023439A5 (ja) キャパシタ及び配線基板
JP2010062530A5 (zh)
JP2017539090A5 (zh)
JP2011151185A5 (ja) 半導体装置
JP2013225610A5 (zh)
TW200717551A (en) Embedded inductor and the application thereof
JP2011176279A5 (zh)
JP2009289849A5 (zh)
JP2008153542A5 (zh)
JP2014501448A5 (zh)
JP2014501449A5 (zh)
JP2009021401A5 (zh)
TWI456716B (zh) 遮蔽式積體電路接墊結構
TWI457063B (zh) 多層配線基板
JP2009027172A5 (zh)
JP2016033933A (ja) 配線基板
JP2014501450A5 (ja) 印刷回路基板
JP2011023528A5 (zh)
JP2014134658A5 (zh)
JP2013149758A5 (zh)
JP2009010260A5 (zh)
JP2009036743A5 (zh)
JP2010278104A5 (zh)