TWI456716B - 遮蔽式積體電路接墊結構 - Google Patents
遮蔽式積體電路接墊結構 Download PDFInfo
- Publication number
- TWI456716B TWI456716B TW098102531A TW98102531A TWI456716B TW I456716 B TWI456716 B TW I456716B TW 098102531 A TW098102531 A TW 098102531A TW 98102531 A TW98102531 A TW 98102531A TW I456716 B TWI456716 B TW I456716B
- Authority
- TW
- Taiwan
- Prior art keywords
- grounding
- pad
- integrated circuit
- strip
- strips
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Claims (5)
- 一種積體電路,包含:一接墊;一接地片元件,其包含一組接地片,位於該接墊之下;一第一傳導元件,耦接至該接墊;及至少兩個拼接層,位於該第一傳導元件之下且位於該接地片元件之上。
- 一種積體電路,包含:一接墊;一接地片元件,其包含一組接地片,位於該接墊之下;一第一傳導元件,耦接至該接墊;至少兩個拼接層,位於該第一傳導元件之下且位於該接地片元件之上;及至少一導體,實質上佈線於該組接地片中之其中一接地片之下且與之平行。
- 一種積體電路,包含:一接墊;一接地片元件,其包含一組接地片,位於該接墊之下;一第一傳導元件,耦接至該接墊;至少兩個拼接層,位於該第一傳導元件之下且位於該接地片元件之上;及 至少一導體,實質上佈線於該組接地片中之其中一接地片之下且與之平行,其中該組接地片中之該接地片的一接地片寬度係至少等於該至少一導體的一導體寬度。
- 一種積體電路,包含:一接墊,其位於一接地遮蔽圍籠中,該接地遮蔽圍籠具有包含一組接地片的一底部傳導接地元件,該組接地片中之至少一個接地片沿著該積體電路之一信號佈線路徑。
- 一種積體電路,包含:一接墊,其位於一接地遮蔽圍籠中,該接地遮蔽圍籠具有包含一組接地片的一底部傳導接地元件,該組接地片中之至少一個接地片沿著該積體電路之一信號佈線路徑;及一組堆疊傳導接地元件,形成多個側壁。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/028,650 US7843033B2 (en) | 2008-02-08 | 2008-02-08 | Shielded integrated circuit pad structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201003868A TW201003868A (en) | 2010-01-16 |
TWI456716B true TWI456716B (zh) | 2014-10-11 |
Family
ID=40938192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098102531A TWI456716B (zh) | 2008-02-08 | 2009-01-22 | 遮蔽式積體電路接墊結構 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7843033B2 (zh) |
TW (1) | TWI456716B (zh) |
WO (1) | WO2009099699A2 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9322114B2 (en) | 2012-12-03 | 2016-04-26 | Exxonmobil Chemical Patents Inc. | Polypropylene fibers and fabrics |
CN104241242B (zh) * | 2013-06-09 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | 接地屏蔽结构及半导体器件 |
US9514966B2 (en) | 2014-04-11 | 2016-12-06 | Qualcomm Incorporated | Apparatus and methods for shielding differential signal pin pairs |
CN106206534B (zh) * | 2015-04-29 | 2019-04-09 | 瑞昱半导体股份有限公司 | 积体电感 |
TWI647572B (zh) * | 2016-02-01 | 2019-01-11 | 聯發科技股份有限公司 | 積體電路、電子設備及資料傳輸方法 |
KR102435019B1 (ko) * | 2017-12-15 | 2022-08-22 | 삼성전자주식회사 | 전자파 차폐구조를 포함하는 전자기기 |
US11127689B2 (en) | 2018-06-01 | 2021-09-21 | Qorvo Us, Inc. | Segmented shielding using wirebonds |
US11219144B2 (en) | 2018-06-28 | 2022-01-04 | Qorvo Us, Inc. | Electromagnetic shields for sub-modules |
US11114363B2 (en) | 2018-12-20 | 2021-09-07 | Qorvo Us, Inc. | Electronic package arrangements and related methods |
US11515282B2 (en) | 2019-05-21 | 2022-11-29 | Qorvo Us, Inc. | Electromagnetic shields with bonding wires for sub-modules |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020084509A1 (en) * | 2001-01-02 | 2002-07-04 | International Business Machines Corporation | Spiral inductor semiconducting device with grounding strips and conducting vias |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5442228A (en) * | 1992-04-06 | 1995-08-15 | Motorola, Inc. | Monolithic shielded integrated circuit |
US5489539A (en) * | 1994-01-10 | 1996-02-06 | Hughes Aircraft Company | Method of making quantum well structure with self-aligned gate |
US6720493B1 (en) * | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
US5602421A (en) * | 1995-01-31 | 1997-02-11 | Hughes Aircraft Company | Microwave monolithic integrated circuit package with improved RF ports |
JPH09107048A (ja) * | 1995-03-30 | 1997-04-22 | Mitsubishi Electric Corp | 半導体パッケージ |
US6097260A (en) * | 1998-01-22 | 2000-08-01 | Harris Corporation | Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks |
KR20010094784A (ko) * | 2000-04-06 | 2001-11-03 | 윤종용 | 커패시터 보상회로를 갖는 콤라인 구조의 무선필터 |
US6784074B2 (en) * | 2001-05-09 | 2004-08-31 | Nsc-Nanosemiconductor Gmbh | Defect-free semiconductor templates for epitaxial growth and method of making same |
KR100632464B1 (ko) | 2004-08-03 | 2006-10-09 | 삼성전자주식회사 | 수동 소자 쉴드 구조를 포함하는 집적 회로 및 그 제조방법 |
US7566952B2 (en) | 2005-01-05 | 2009-07-28 | International Business Machines Corporation | On-chip circuit pad structure |
US7576382B2 (en) | 2005-02-02 | 2009-08-18 | Ricoh Company, Ltd. | Semiconductor integrated device and method of providing shield interconnection therein |
US7170144B2 (en) | 2005-02-25 | 2007-01-30 | United Microelectronics Corp. | System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference |
US9153645B2 (en) * | 2005-05-17 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
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2008
- 2008-02-08 US US12/028,650 patent/US7843033B2/en active Active
-
2009
- 2009-01-09 WO PCT/US2009/030512 patent/WO2009099699A2/en active Application Filing
- 2009-01-22 TW TW098102531A patent/TWI456716B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020084509A1 (en) * | 2001-01-02 | 2002-07-04 | International Business Machines Corporation | Spiral inductor semiconducting device with grounding strips and conducting vias |
Non-Patent Citations (1)
Title |
---|
Adem Aktas and Mohammed Ismail,"Pad de-embedding in RF CMOS" ,Circuits and Devices Magazine, IEEE May 2001,Vol. 17 ,Issue 3,Page(s):8-11 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009099699A2 (en) | 2009-08-13 |
TW201003868A (en) | 2010-01-16 |
US7843033B2 (en) | 2010-11-30 |
US20090200647A1 (en) | 2009-08-13 |
WO2009099699A3 (en) | 2009-10-15 |
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