JP2008544528A5 - - Google Patents
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- Publication number
- JP2008544528A5 JP2008544528A5 JP2008517112A JP2008517112A JP2008544528A5 JP 2008544528 A5 JP2008544528 A5 JP 2008544528A5 JP 2008517112 A JP2008517112 A JP 2008517112A JP 2008517112 A JP2008517112 A JP 2008517112A JP 2008544528 A5 JP2008544528 A5 JP 2008544528A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69075905P | 2005-06-14 | 2005-06-14 | |
US60/690,759 | 2005-06-14 | ||
US11/329,576 US7989958B2 (en) | 2005-06-14 | 2006-01-10 | Patterned contact |
US11/329,576 | 2006-01-10 | ||
US11/329,481 | 2006-01-10 | ||
US11/329,556 | 2006-01-10 | ||
US11/329,481 US8154131B2 (en) | 2005-06-14 | 2006-01-10 | Profiled contact |
US11/329,556 US7767493B2 (en) | 2005-06-14 | 2006-01-10 | Post & penetration interconnection |
PCT/US2006/023364 WO2006138492A2 (en) | 2005-06-14 | 2006-06-14 | Post & penetration interconnection |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008544528A JP2008544528A (ja) | 2008-12-04 |
JP2008544528A5 true JP2008544528A5 (ja) | 2009-07-30 |
JP5253158B2 JP5253158B2 (ja) | 2013-07-31 |
Family
ID=37571183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008517112A Expired - Fee Related JP5253158B2 (ja) | 2005-06-14 | 2006-06-14 | ポストおよびペネトレーション相互接続 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5253158B2 (ja) |
KR (1) | KR101419548B1 (ja) |
WO (1) | WO2006138492A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7850060B2 (en) | 2007-04-05 | 2010-12-14 | John Trezza | Heat cycle-able connection |
US7748116B2 (en) | 2007-04-05 | 2010-07-06 | John Trezza | Mobile binding in an electronic connection |
US8258625B2 (en) * | 2007-04-06 | 2012-09-04 | Hitachi, Ltd. | Semiconductor device |
KR100975652B1 (ko) * | 2007-10-05 | 2010-08-17 | 한국과학기술원 | 아연 및 아연합금을 이용한 비아 및 그의 형성 방법, 그를3차원 다중 칩 스택 패키지 제조 방법 |
CN103050420A (zh) * | 2008-06-05 | 2013-04-17 | 丘费尔资产股份有限公司 | 对电连接中具有高迁移率的组分的束缚 |
KR102190382B1 (ko) | 2012-12-20 | 2020-12-11 | 삼성전자주식회사 | 반도체 패키지 |
KR102544296B1 (ko) * | 2018-09-13 | 2023-06-16 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 표면발광레이저 소자 및 이를 구비한 표면발광레이저 장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0516866A1 (en) * | 1991-05-03 | 1992-12-09 | International Business Machines Corporation | Modular multilayer interwiring structure |
US5234153A (en) * | 1992-08-28 | 1993-08-10 | At&T Bell Laboratories | Permanent metallic bonding method |
JP3348528B2 (ja) * | 1994-07-20 | 2002-11-20 | 富士通株式会社 | 半導体装置の製造方法と半導体装置及び電子回路装置の製造方法と電子回路装置 |
US5814889A (en) * | 1995-06-05 | 1998-09-29 | Harris Corporation | Intergrated circuit with coaxial isolation and method |
US7052941B2 (en) * | 2003-06-24 | 2006-05-30 | Sang-Yun Lee | Method for making a three-dimensional integrated circuit structure |
JPH10270498A (ja) * | 1997-03-27 | 1998-10-09 | Toshiba Corp | 電子装置の製造方法 |
JP2000114206A (ja) * | 1998-10-05 | 2000-04-21 | Sony Corp | 半導体パッケージの製造方法 |
US6122187A (en) * | 1998-11-23 | 2000-09-19 | Micron Technology, Inc. | Stacked integrated circuits |
JP3386029B2 (ja) * | 2000-02-09 | 2003-03-10 | 日本電気株式会社 | フリップチップ型半導体装置及びその製造方法 |
JP2001338947A (ja) * | 2000-05-26 | 2001-12-07 | Nec Corp | フリップチップ型半導体装置及びその製造方法 |
JP3723453B2 (ja) * | 2000-09-12 | 2005-12-07 | ローム株式会社 | 半導体装置 |
JP2002134545A (ja) | 2000-10-26 | 2002-05-10 | Oki Electric Ind Co Ltd | 半導体集積回路チップ及び基板、並びにその製造方法 |
JP3832334B2 (ja) * | 2000-12-28 | 2006-10-11 | 松下電工株式会社 | 半導体チップ実装基板およびその製造方法 |
US6512300B2 (en) * | 2001-01-10 | 2003-01-28 | Raytheon Company | Water level interconnection |
US6939789B2 (en) * | 2002-05-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of wafer level chip scale packaging |
SG111972A1 (en) * | 2002-10-17 | 2005-06-29 | Agency Science Tech & Res | Wafer-level package for micro-electro-mechanical systems |
TWI251313B (en) * | 2003-09-26 | 2006-03-11 | Seiko Epson Corp | Intermediate chip module, semiconductor device, circuit board, and electronic device |
US7230318B2 (en) * | 2003-12-24 | 2007-06-12 | Agency For Science, Technology And Research | RF and MMIC stackable micro-modules |
-
2006
- 2006-06-14 JP JP2008517112A patent/JP5253158B2/ja not_active Expired - Fee Related
- 2006-06-14 KR KR1020077029402A patent/KR101419548B1/ko active IP Right Grant
- 2006-06-14 WO PCT/US2006/023364 patent/WO2006138492A2/en active Application Filing
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