JP2008544498A5 - - Google Patents
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- Publication number
- JP2008544498A5 JP2008544498A5 JP2008516007A JP2008516007A JP2008544498A5 JP 2008544498 A5 JP2008544498 A5 JP 2008544498A5 JP 2008516007 A JP2008516007 A JP 2008516007A JP 2008516007 A JP2008516007 A JP 2008516007A JP 2008544498 A5 JP2008544498 A5 JP 2008544498A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- optionally
- light emitting
- emitting diode
- diode assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004952 Polyamide Substances 0.000 claims 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- -1 aliphatic dicarboxylic acids Chemical class 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 150000003951 lactams Chemical class 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68977205P | 2005-06-10 | 2005-06-10 | |
| PCT/US2006/022723 WO2006135841A1 (en) | 2005-06-10 | 2006-06-09 | Light-emitting diode assembly housing comprising high temperature polyamide compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008544498A JP2008544498A (ja) | 2008-12-04 |
| JP2008544498A5 true JP2008544498A5 (enExample) | 2009-05-14 |
Family
ID=36942199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008516007A Pending JP2008544498A (ja) | 2005-06-10 | 2006-06-09 | 高温ポリアミド組成物を含む発光ダイオードアセンブリハウジング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060293435A1 (enExample) |
| EP (1) | EP1888679A1 (enExample) |
| JP (1) | JP2008544498A (enExample) |
| CA (1) | CA2611278A1 (enExample) |
| WO (1) | WO2006135841A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9428612B2 (en) | 2006-01-26 | 2016-08-30 | Dsm Ip Assets B.V. | Semi-crystalline semi-aromatic polyamide |
| EP1988113B1 (de) | 2007-05-03 | 2009-10-14 | Ems-Patent Ag | Teilaromatische Polyamidformmassen und deren Verwendungen |
| EP2477243B1 (en) * | 2009-09-11 | 2016-01-06 | Asahi Kasei Chemicals Corporation | Reflector for light-emitting device, and light-emitting device |
| JPWO2011074536A1 (ja) * | 2009-12-14 | 2013-04-25 | 東洋紡株式会社 | 共重合ポリアミド |
| FR2954773B1 (fr) * | 2009-12-24 | 2013-01-04 | Arkema France | Polyamide semi-aromatique, son procede de preparation, composition comprenant un tel polyamide et leurs utilisations |
| EP2388293B1 (de) * | 2010-05-17 | 2012-12-26 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten |
| US20130197150A1 (en) * | 2010-10-13 | 2013-08-01 | Solvay Specialty Polymers Usa, Llc | Stain-resistant articles |
| US9321918B2 (en) * | 2010-10-13 | 2016-04-26 | Solvay Specialty Polymers Usa, Llc | Stain-resistant articles |
| KR101279978B1 (ko) * | 2010-10-18 | 2013-07-05 | 제일모직주식회사 | 폴리아미드 수지 |
| US10024510B2 (en) * | 2010-10-26 | 2018-07-17 | Steven G. Hammond | Flexible light emitting diode lighting process and assembly |
| JP5648426B2 (ja) * | 2010-11-01 | 2015-01-07 | 東洋紡株式会社 | ポリアミド樹脂組成物およびポリアミド樹脂発泡成形体 |
| FR2973387B1 (fr) * | 2011-04-04 | 2013-03-29 | Rhodia Operations | Composition polyamide de forte conductivite thermique |
| KR101763948B1 (ko) * | 2011-05-06 | 2017-08-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 반사체 및 이를 구비하는 발광장치 |
| JP2014062139A (ja) * | 2011-06-14 | 2014-04-10 | Toyobo Co Ltd | 共重合ポリアミドフィルム |
| EP2431419A1 (en) * | 2011-06-21 | 2012-03-21 | DSM IP Assets B.V. | Anti-yellowing polyamide composition |
| CN103890040B (zh) * | 2011-08-19 | 2018-01-02 | 索尔维特殊聚合物美国有限责任公司 | 用于led应用的改进的聚酰胺组合物 |
| CN103890039A (zh) * | 2011-08-19 | 2014-06-25 | 索尔维特殊聚合物美国有限责任公司 | 用于led应用的改进的聚酰胺组合物 |
| CN102372921B (zh) * | 2011-10-10 | 2013-05-08 | 金发科技股份有限公司 | 一种耐热聚酰胺组合物及其应用 |
| CN104247254A (zh) * | 2012-02-24 | 2014-12-24 | 索尔维特殊聚合物美国有限责任公司 | 用于太阳能电池板的框架结构 |
| CN105452381B (zh) * | 2013-07-04 | 2018-02-16 | 东洋纺株式会社 | 吸水时的防振性能优异且具有高熔点的聚酰胺树脂组合物 |
| GB2567456B (en) | 2017-10-12 | 2021-08-11 | Si Group Switzerland Chaa Gmbh | Antidegradant blend |
| GB201807302D0 (en) | 2018-05-03 | 2018-06-20 | Addivant Switzerland Gmbh | Antidegradant blend |
| EP4021959B1 (en) | 2019-08-27 | 2023-10-11 | Solvay Specialty Polymers USA, LLC. | Polyamides and corresponding polymer compositions, articles and methods for making and using |
| CN114437341A (zh) * | 2020-11-02 | 2022-05-06 | 上海凯赛生物技术股份有限公司 | 一种用于生产耐高温聚酰胺的方法、聚酰胺制品及其应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3843591A (en) * | 1972-06-05 | 1974-10-22 | Monsanto Co | Reinforced polyamide compositions |
| JPH0645753B2 (ja) * | 1985-02-21 | 1994-06-15 | 三井石油化学工業株式会社 | ポリアミド組成物 |
| JPH0372565A (ja) * | 1989-05-01 | 1991-03-27 | Mitsui Petrochem Ind Ltd | 赤外線リフロー用組成物および電子部品 |
| JP2928325B2 (ja) | 1989-05-01 | 1999-08-03 | 三井化学株式会社 | 赤外線リフロー用組成物および電子部品 |
| ATE127255T1 (de) | 1989-05-31 | 1995-09-15 | Siemens Ag | Adaptereinrichtung zum störungsfreien anschluss von peripheren rechnereinrichtungen an eine von rechnersystemen gesteuerte peripherieschnittstelle. |
| JP3077948B2 (ja) * | 1991-12-27 | 2000-08-21 | 日本ジーイープラスチックス株式会社 | 樹脂組成物 |
| IL117216A (en) * | 1995-02-23 | 2003-10-31 | Martinswerk Gmbh | Surface-modified filler composition |
| TW521082B (en) | 2000-09-12 | 2003-02-21 | Kuraray Co | Polyamide resin composition |
| JP2002114906A (ja) * | 2000-10-10 | 2002-04-16 | Mitsui Chemicals Inc | 電気・電子部品成形材料および電気・電子部品 |
| JP2002234942A (ja) | 2000-11-28 | 2002-08-23 | Mitsui Chemicals Inc | ポリアミド樹脂、ポリアミド樹脂組成物、およびその成形品、ならびにそれらを用いた電子部品付基板の製造方法 |
| JP4892140B2 (ja) * | 2001-03-30 | 2012-03-07 | 大塚化学株式会社 | Led反射板用樹脂組成物 |
| DE10122002A1 (de) | 2001-05-07 | 2002-11-21 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement |
| JP4850368B2 (ja) | 2001-09-12 | 2012-01-11 | 富士通株式会社 | コンテンツ管理装置およびコンテンツ管理方法 |
| JP2003176408A (ja) | 2001-09-21 | 2003-06-24 | Kuraray Co Ltd | 電気・電子部品封止用ポリアミド組成物 |
| JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
| WO2003085029A1 (en) * | 2002-04-05 | 2003-10-16 | Mitsui Chemicals, Inc. | Resin composition for light emitting diode reflectors |
| CA2432522C (en) | 2002-06-21 | 2010-09-21 | Kuraray Co., Ltd. | Polyamide composition |
| AU2003259730A1 (en) * | 2002-08-09 | 2004-02-25 | E. I. Du Pont De Nemours And Company | Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability |
| JP2004107576A (ja) * | 2002-09-20 | 2004-04-08 | Kuraray Co Ltd | ポリアミド組成物 |
| KR101016583B1 (ko) | 2002-10-15 | 2011-02-22 | 솔베이 어드밴스트 폴리머스 엘.엘.씨. | 황화저항성 중축합 중합체 조성물 및 성형품 |
| KR20060135649A (ko) | 2003-12-09 | 2006-12-29 | 미쓰이 가가쿠 가부시키가이샤 | 반사판용 수지 조성물 및 반사판 |
-
2006
- 2006-06-08 US US11/449,295 patent/US20060293435A1/en not_active Abandoned
- 2006-06-09 JP JP2008516007A patent/JP2008544498A/ja active Pending
- 2006-06-09 WO PCT/US2006/022723 patent/WO2006135841A1/en not_active Ceased
- 2006-06-09 EP EP06760741A patent/EP1888679A1/en not_active Withdrawn
- 2006-06-09 CA CA002611278A patent/CA2611278A1/en not_active Abandoned
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