JP2008544498A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008544498A5 JP2008544498A5 JP2008516007A JP2008516007A JP2008544498A5 JP 2008544498 A5 JP2008544498 A5 JP 2008544498A5 JP 2008516007 A JP2008516007 A JP 2008516007A JP 2008516007 A JP2008516007 A JP 2008516007A JP 2008544498 A5 JP2008544498 A5 JP 2008544498A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- optionally
- light emitting
- emitting diode
- diode assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004952 Polyamide Substances 0.000 claims 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- -1 aliphatic dicarboxylic acids Chemical class 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 150000003951 lactams Chemical class 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68977205P | 2005-06-10 | 2005-06-10 | |
| PCT/US2006/022723 WO2006135841A1 (en) | 2005-06-10 | 2006-06-09 | Light-emitting diode assembly housing comprising high temperature polyamide compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008544498A JP2008544498A (ja) | 2008-12-04 |
| JP2008544498A5 true JP2008544498A5 (enExample) | 2009-05-14 |
Family
ID=36942199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008516007A Pending JP2008544498A (ja) | 2005-06-10 | 2006-06-09 | 高温ポリアミド組成物を含む発光ダイオードアセンブリハウジング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060293435A1 (enExample) |
| EP (1) | EP1888679A1 (enExample) |
| JP (1) | JP2008544498A (enExample) |
| CA (1) | CA2611278A1 (enExample) |
| WO (1) | WO2006135841A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0707219B1 (pt) | 2006-01-26 | 2018-01-23 | Dsm Ip Assets B.V. | Poliamida semi-aromática semicristalina, seu processo de preparação, composição de polímero, uso da referida poliamida ou da composição de polímero, parte moldada e seu uso |
| DE502008000140D1 (de) * | 2007-05-03 | 2009-11-26 | Ems Patent Ag | Teilaromatische Polyamidformmassen und deren Verwendungen |
| JP5313356B2 (ja) * | 2009-09-11 | 2013-10-09 | 旭化成ケミカルズ株式会社 | 発光装置用リフレクタ及び発光装置 |
| JPWO2011074536A1 (ja) * | 2009-12-14 | 2013-04-25 | 東洋紡株式会社 | 共重合ポリアミド |
| FR2954773B1 (fr) * | 2009-12-24 | 2013-01-04 | Arkema France | Polyamide semi-aromatique, son procede de preparation, composition comprenant un tel polyamide et leurs utilisations |
| EP2388293B1 (de) * | 2010-05-17 | 2012-12-26 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten |
| JP6211419B2 (ja) * | 2010-10-13 | 2017-10-11 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | 耐汚染性物品 |
| WO2012049255A1 (en) * | 2010-10-13 | 2012-04-19 | Solvay Specialty Polymers Usa, Llc | Stain-resistant articles |
| KR101279978B1 (ko) * | 2010-10-18 | 2013-07-05 | 제일모직주식회사 | 폴리아미드 수지 |
| US10024510B2 (en) * | 2010-10-26 | 2018-07-17 | Steven G. Hammond | Flexible light emitting diode lighting process and assembly |
| JP5648426B2 (ja) * | 2010-11-01 | 2015-01-07 | 東洋紡株式会社 | ポリアミド樹脂組成物およびポリアミド樹脂発泡成形体 |
| FR2973387B1 (fr) * | 2011-04-04 | 2013-03-29 | Rhodia Operations | Composition polyamide de forte conductivite thermique |
| KR101763948B1 (ko) * | 2011-05-06 | 2017-08-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 반사체 및 이를 구비하는 발광장치 |
| JP2014062139A (ja) * | 2011-06-14 | 2014-04-10 | Toyobo Co Ltd | 共重合ポリアミドフィルム |
| EP2431419A1 (en) * | 2011-06-21 | 2012-03-21 | DSM IP Assets B.V. | Anti-yellowing polyamide composition |
| CN103890040B (zh) * | 2011-08-19 | 2018-01-02 | 索尔维特殊聚合物美国有限责任公司 | 用于led应用的改进的聚酰胺组合物 |
| US20140221546A1 (en) * | 2011-08-19 | 2014-08-07 | Solvay Speciality Polymers Usa, Llc | Polyamide compositions for led applications |
| CN102372921B (zh) * | 2011-10-10 | 2013-05-08 | 金发科技股份有限公司 | 一种耐热聚酰胺组合物及其应用 |
| US10079323B2 (en) * | 2012-02-24 | 2018-09-18 | Solvay Specialty Polymers Usa, Llc. | Framing structure for a solar panel |
| CN105452381B (zh) * | 2013-07-04 | 2018-02-16 | 东洋纺株式会社 | 吸水时的防振性能优异且具有高熔点的聚酰胺树脂组合物 |
| GB2567456B (en) | 2017-10-12 | 2021-08-11 | Si Group Switzerland Chaa Gmbh | Antidegradant blend |
| GB201807302D0 (en) | 2018-05-03 | 2018-06-20 | Addivant Switzerland Gmbh | Antidegradant blend |
| WO2021037850A1 (en) | 2019-08-27 | 2021-03-04 | Solvay Specialty Polymers Usa, Llc | Polyamides and corresponding polymer compositions, articles and methods for making and using |
| CN114437341A (zh) * | 2020-11-02 | 2022-05-06 | 上海凯赛生物技术股份有限公司 | 一种用于生产耐高温聚酰胺的方法、聚酰胺制品及其应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3843591A (en) * | 1972-06-05 | 1974-10-22 | Monsanto Co | Reinforced polyamide compositions |
| JPH0645753B2 (ja) * | 1985-02-21 | 1994-06-15 | 三井石油化学工業株式会社 | ポリアミド組成物 |
| JPH0372565A (ja) | 1989-05-01 | 1991-03-27 | Mitsui Petrochem Ind Ltd | 赤外線リフロー用組成物および電子部品 |
| JP2928325B2 (ja) | 1989-05-01 | 1999-08-03 | 三井化学株式会社 | 赤外線リフロー用組成物および電子部品 |
| EP0400174B1 (de) | 1989-05-31 | 1995-08-30 | Siemens Aktiengesellschaft | Adaptereinrichtung zum störungsfreien Anschluss von peripheren Rechnereinrichtungen an eine von Rechnersystemen gesteuerte Peripherieschnittstelle |
| JP3077948B2 (ja) * | 1991-12-27 | 2000-08-21 | 日本ジーイープラスチックス株式会社 | 樹脂組成物 |
| IL117216A (en) * | 1995-02-23 | 2003-10-31 | Martinswerk Gmbh | Surface-modified filler composition |
| TW521082B (en) | 2000-09-12 | 2003-02-21 | Kuraray Co | Polyamide resin composition |
| JP2002114906A (ja) * | 2000-10-10 | 2002-04-16 | Mitsui Chemicals Inc | 電気・電子部品成形材料および電気・電子部品 |
| JP2002234942A (ja) | 2000-11-28 | 2002-08-23 | Mitsui Chemicals Inc | ポリアミド樹脂、ポリアミド樹脂組成物、およびその成形品、ならびにそれらを用いた電子部品付基板の製造方法 |
| JP4892140B2 (ja) * | 2001-03-30 | 2012-03-07 | 大塚化学株式会社 | Led反射板用樹脂組成物 |
| DE10122002A1 (de) | 2001-05-07 | 2002-11-21 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement |
| JP4850368B2 (ja) | 2001-09-12 | 2012-01-11 | 富士通株式会社 | コンテンツ管理装置およびコンテンツ管理方法 |
| JP2003176408A (ja) | 2001-09-21 | 2003-06-24 | Kuraray Co Ltd | 電気・電子部品封止用ポリアミド組成物 |
| JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
| AU2003236271A1 (en) | 2002-04-05 | 2003-10-20 | Mitsui Chemicals, Inc. | Resin composition for light emitting diode reflectors |
| CA2432522C (en) | 2002-06-21 | 2010-09-21 | Hideaki Oka | Polyamide composition |
| CN100349977C (zh) | 2002-08-09 | 2007-11-21 | 纳幕尔杜邦公司 | 聚酰胺模塑组合物和由其模塑的具有提高的热稳定性的电气和电子元件 |
| JP2004107576A (ja) * | 2002-09-20 | 2004-04-08 | Kuraray Co Ltd | ポリアミド組成物 |
| ATE384338T1 (de) | 2002-10-15 | 2008-02-15 | Solvay Advanced Polymers Llc | Anti-vergilbungs- polykondensationspolymerzusammensetzungen und gegenstände |
| CN1890323A (zh) | 2003-12-09 | 2007-01-03 | 三井化学株式会社 | 反射板用树脂组合物和反射板 |
-
2006
- 2006-06-08 US US11/449,295 patent/US20060293435A1/en not_active Abandoned
- 2006-06-09 WO PCT/US2006/022723 patent/WO2006135841A1/en not_active Ceased
- 2006-06-09 CA CA002611278A patent/CA2611278A1/en not_active Abandoned
- 2006-06-09 JP JP2008516007A patent/JP2008544498A/ja active Pending
- 2006-06-09 EP EP06760741A patent/EP1888679A1/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008544498A5 (enExample) | ||
| SG147407A1 (en) | Semiaromatic polyamide molding compositions and their use | |
| MY155949A (en) | Semi-aromatic, semi-crystalline copolyamides | |
| JP2012529396A5 (enExample) | ||
| EP2397300A3 (en) | Injection molded body having excellent barrier property | |
| ATE441684T1 (de) | Teilaromatische copolyamide mit hoher kristallinität | |
| WO2011003973A3 (de) | Formmasse auf basis eines terephthalsäure- sowie trimethylhexamethylendiamin-einheiten enthaltenden copolyamids | |
| RU2011115093A (ru) | Полиамидная смола | |
| JP2011529993A5 (enExample) | ||
| WO2010004199A3 (fr) | Polyamide, composition comprenant un tel polyamide et leurs utilisations | |
| TW200641049A (en) | Resin composition for reflector and reflector | |
| MX348751B (es) | Moldeados de resina de poliamida. | |
| WO2009153170A3 (fr) | Procede de preparation d'un polyamideimide, polyamideimide et composition comprenant ce polyamideimide | |
| JP2014503675A5 (enExample) | ||
| WO2011014548A3 (en) | Heat aging resistant polyamide compositions including polyhydroxy polymers | |
| DE602007002886D1 (de) | Amorphe copolyamide, die p-bis(aminocyclohexyl)methan und terephthalsäure enthalten | |
| JP2013515100A5 (enExample) | ||
| MY162176A (en) | Polyamide moulding material and use thereof for production of led housing components | |
| WO2011084797A3 (en) | Polyamide compositiions having high acid ends | |
| RU2012121824A (ru) | Сополимеризованная полиамидная смола, способ ее получения, смоляная композиция и формованное изделие, изготовленное из сополимеризованной полиамидной смолы или смоляной композиции | |
| WO2007143349A3 (en) | Reinforced poly(arylene ether)/polyamide composition and articles thereof | |
| JP2011505463A5 (enExample) | ||
| JP2011046781A5 (enExample) | ||
| JP2005535754A5 (enExample) | ||
| JP2010248402A5 (enExample) |