JP2011505463A5 - - Google Patents

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Publication number
JP2011505463A5
JP2011505463A5 JP2010536093A JP2010536093A JP2011505463A5 JP 2011505463 A5 JP2011505463 A5 JP 2011505463A5 JP 2010536093 A JP2010536093 A JP 2010536093A JP 2010536093 A JP2010536093 A JP 2010536093A JP 2011505463 A5 JP2011505463 A5 JP 2011505463A5
Authority
JP
Japan
Prior art keywords
weight percent
composition
weight
earth metal
partially aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2010536093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011505463A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/084507 external-priority patent/WO2009073435A1/en
Publication of JP2011505463A publication Critical patent/JP2011505463A/ja
Publication of JP2011505463A5 publication Critical patent/JP2011505463A5/ja
Abandoned legal-status Critical Current

Links

JP2010536093A 2007-11-30 2008-11-24 金属めっき物品用の部分芳香族ポリアミド組成物 Abandoned JP2011505463A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US485707P 2007-11-30 2007-11-30
PCT/US2008/084507 WO2009073435A1 (en) 2007-11-30 2008-11-24 Partially aromatic polyamide compositions for metal plated articles

Publications (2)

Publication Number Publication Date
JP2011505463A JP2011505463A (ja) 2011-02-24
JP2011505463A5 true JP2011505463A5 (enExample) 2012-01-19

Family

ID=40445237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010536093A Abandoned JP2011505463A (ja) 2007-11-30 2008-11-24 金属めっき物品用の部分芳香族ポリアミド組成物

Country Status (6)

Country Link
US (2) US20090143520A1 (enExample)
EP (1) EP2215151A1 (enExample)
JP (1) JP2011505463A (enExample)
KR (1) KR20100094542A (enExample)
CN (1) CN101878252B (enExample)
WO (1) WO2009073435A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8906515B2 (en) 2009-06-02 2014-12-09 Integran Technologies, Inc. Metal-clad polymer article
US8394507B2 (en) 2009-06-02 2013-03-12 Integran Technologies, Inc. Metal-clad polymer article
US20120234682A1 (en) 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
JP6062425B2 (ja) * 2011-06-01 2017-01-18 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ シリコン貫通ビアおよび相互接続フィーチャーのボトムアップ充填のための添加剤を含む金属電気めっきのための組成物
EP3260500B1 (en) * 2015-02-20 2023-11-08 Asahi Kasei Kabushiki Kaisha Polyamide resin composition, method for producing polyamide resin composition, and molded article
CN106046781B (zh) * 2016-07-12 2019-01-04 江门市德众泰工程塑胶科技有限公司 用于电镀处理的芳香族聚酰胺复合物及其制备方法
KR101940418B1 (ko) 2017-10-30 2019-01-18 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
KR102171421B1 (ko) * 2017-12-31 2020-10-29 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
US11577496B2 (en) * 2017-12-31 2023-02-14 Lotte Chemical Corporation Polyamide resin composition and molded article comprising the same
KR101893709B1 (ko) * 2017-12-31 2018-08-30 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
CN108251874B (zh) * 2018-01-24 2019-08-16 永星化工(上海)有限公司 适于电镀的功能性树脂组合物上涂布金属层的预处理溶液
KR102198388B1 (ko) 2018-05-31 2021-01-05 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432458B2 (enExample) * 1974-11-26 1979-10-15
US4444836A (en) * 1979-09-17 1984-04-24 Allied Corporation Metal plated polyamide articles
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof
US5266655A (en) * 1989-07-11 1993-11-30 Rhone-Poulenc Chimie Single phase/amorphous blends of amorphous semiaromatic polyamides and semicrystalline nylon polyamides
JP3123119B2 (ja) * 1991-06-17 2001-01-09 三菱化学株式会社 ポリアミド樹脂メッキ製品
US6376093B1 (en) * 1998-05-26 2002-04-23 Toyo Boseki Kabushiki Kaisha Polyamide film and polyamide laminate film
EP1312647B1 (en) * 2001-11-16 2008-01-09 Mitsubishi Engineering-Plastics Corporation Polyamide moulding compositions and thick-wall molded products therefrom
CH695687A5 (de) * 2002-09-06 2006-07-31 Ems Chemie Ag Polyamid-Formmassen mit ultrafeinen Füllstoffen und daraus herstellbare Lichtreflektier-Bauteile.

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