CN101878252B - 用于金属电镀制品的部分芳香族聚酰胺组合物 - Google Patents

用于金属电镀制品的部分芳香族聚酰胺组合物 Download PDF

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Publication number
CN101878252B
CN101878252B CN2008801182936A CN200880118293A CN101878252B CN 101878252 B CN101878252 B CN 101878252B CN 2008801182936 A CN2008801182936 A CN 2008801182936A CN 200880118293 A CN200880118293 A CN 200880118293A CN 101878252 B CN101878252 B CN 101878252B
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CN
China
Prior art keywords
polyamide
weight
acid
compsn
partially aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801182936A
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English (en)
Chinese (zh)
Other versions
CN101878252A (zh
Inventor
A·E·艾丽娅
C·皮尔多梅尼科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN101878252A publication Critical patent/CN101878252A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
CN2008801182936A 2007-11-30 2008-11-24 用于金属电镀制品的部分芳香族聚酰胺组合物 Expired - Fee Related CN101878252B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US485707P 2007-11-30 2007-11-30
US61/004857 2007-11-30
PCT/US2008/084507 WO2009073435A1 (en) 2007-11-30 2008-11-24 Partially aromatic polyamide compositions for metal plated articles

Publications (2)

Publication Number Publication Date
CN101878252A CN101878252A (zh) 2010-11-03
CN101878252B true CN101878252B (zh) 2012-10-10

Family

ID=40445237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801182936A Expired - Fee Related CN101878252B (zh) 2007-11-30 2008-11-24 用于金属电镀制品的部分芳香族聚酰胺组合物

Country Status (6)

Country Link
US (2) US20090143520A1 (enExample)
EP (1) EP2215151A1 (enExample)
JP (1) JP2011505463A (enExample)
KR (1) KR20100094542A (enExample)
CN (1) CN101878252B (enExample)
WO (1) WO2009073435A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8394507B2 (en) 2009-06-02 2013-03-12 Integran Technologies, Inc. Metal-clad polymer article
US8906515B2 (en) 2009-06-02 2014-12-09 Integran Technologies, Inc. Metal-clad polymer article
US20120234682A1 (en) 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
EP2714807B1 (en) * 2011-06-01 2019-01-02 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
JP6457062B2 (ja) * 2015-02-20 2019-01-23 旭化成株式会社 ポリアミド樹脂組成物、ポリアミド樹脂組成物の製造方法、及び成形品
CN106046781B (zh) * 2016-07-12 2019-01-04 江门市德众泰工程塑胶科技有限公司 用于电镀处理的芳香族聚酰胺复合物及其制备方法
KR101940418B1 (ko) 2017-10-30 2019-01-18 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
US11577496B2 (en) * 2017-12-31 2023-02-14 Lotte Chemical Corporation Polyamide resin composition and molded article comprising the same
KR102171421B1 (ko) * 2017-12-31 2020-10-29 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
KR101893709B1 (ko) * 2017-12-31 2018-08-30 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
CN108251874B (zh) * 2018-01-24 2019-08-16 永星化工(上海)有限公司 适于电镀的功能性树脂组合物上涂布金属层的预处理溶液
KR102198388B1 (ko) 2018-05-31 2021-01-05 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432458B2 (enExample) * 1974-11-26 1979-10-15
US4444836A (en) * 1979-09-17 1984-04-24 Allied Corporation Metal plated polyamide articles
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
US5266655A (en) * 1989-07-11 1993-11-30 Rhone-Poulenc Chimie Single phase/amorphous blends of amorphous semiaromatic polyamides and semicrystalline nylon polyamides
JP3123119B2 (ja) * 1991-06-17 2001-01-09 三菱化学株式会社 ポリアミド樹脂メッキ製品
US6376093B1 (en) * 1998-05-26 2002-04-23 Toyo Boseki Kabushiki Kaisha Polyamide film and polyamide laminate film
DE60224489T2 (de) * 2001-11-16 2008-12-24 Mitsubishi Engineering-Plastics Corp. Polyamid-Formmassen und daraus hergestellte dickwandige Formteile
CH695687A5 (de) * 2002-09-06 2006-07-31 Ems Chemie Ag Polyamid-Formmassen mit ultrafeinen Füllstoffen und daraus herstellbare Lichtreflektier-Bauteile.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof

Also Published As

Publication number Publication date
WO2009073435A1 (en) 2009-06-11
US20100247774A1 (en) 2010-09-30
JP2011505463A (ja) 2011-02-24
CN101878252A (zh) 2010-11-03
EP2215151A1 (en) 2010-08-11
KR20100094542A (ko) 2010-08-26
US20090143520A1 (en) 2009-06-04

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