JP2008543049A - 半導体パッケージ及び同パッケージを形成する方法 - Google Patents
半導体パッケージ及び同パッケージを形成する方法 Download PDFInfo
- Publication number
- JP2008543049A JP2008543049A JP2008513466A JP2008513466A JP2008543049A JP 2008543049 A JP2008543049 A JP 2008543049A JP 2008513466 A JP2008513466 A JP 2008513466A JP 2008513466 A JP2008513466 A JP 2008513466A JP 2008543049 A JP2008543049 A JP 2008543049A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor package
- gold
- semiconductor
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29111—Tin [Sn] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83447—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15763—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550 C
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
本発明に関する以下の詳細な説明は本質的に単なる例示に過ぎず、本発明、または本発明の適用及び使用を制限するものではない。更に、決して、本発明に関連して前に示した背景説明、または本発明に関する以下の詳細な説明に提示される理論によって限定を付加しようとするものではない。
Claims (20)
- 基板の第1表面の内部に形成される複数の金属パッド、前記基板の反対側の第2表面に形成される接着/メッキ層、及び前記接着/メッキ層の表面に形成される金層を含む半導体ウェハ積層構造を設ける工程と、
前記金層、前記接着/メッキ層、及び前記基板の複数のエッジ部分を露出させるべく、前記金層を前記半導体ウェハ積層構造のダイシングストリート領域でエッチングする工程と、
エッジシールを前記接着/メッキ層及び前記金層の前記露出エッジ部分の周りに形成する工程と、
前記半導体積層構造を前記ダイシングストリート領域でダイシングして半導体チップを画定する工程と、
前記チップを支持構造に接着させる工程とを備える、半導体パッケージの製造方法。 - エッジシールを形成する工程では、バリアメタル層を反対側の前記第2表面に堆積させる、請求項1記載の半導体パッケージの製造方法。
- バリアメタル層を堆積させる工程では、チタン層、ニッケル−バナジウム層、及び金層により構成されるバリアメタル層をスパッタリング法により形成し、そしてバリアメタル層の金は、前記接着/メッキ層の表面に形成される金層よりも小さい割合で存在する、請求項2記載の半導体パッケージの製造方法。
- バリアメタル層は、1.0〜1.7ミクロンの範囲の膜厚を有する、請求項2記載の半導体パッケージの製造方法。
- 支持構造はリードフレームである、請求項1記載の半導体パッケージの製造方法。
- 金層を形成する工程は、金層を接着/メッキ層にスパッタリング法により堆積させる工程を含む、請求項1記載の半導体パッケージの製造方法。
- エッチング工程では、湿式化学エッチングを用いてエッチングする、請求項1記載の半導体パッケージの製造方法。
- エッジシールによって、前記チップを支持構造に接着させている間に使用される半田材料におけるボイドの形成を防止する、請求項1記載の半導体パッケージの製造方法。
- 基板の第1表面の内部に形成される複数の金属パッド、及び複数の金属パッドに位置整合して形成される複数のサーマルビアを有する半導体積層構造を設ける工程と、
接着/メッキ層を、基板の反対側の第2表面に、サーマルビアの中にまで延びるように堆積させる工程と、
金層を接着/メッキ層の上に、サーマルビアの中にまで延びるように堆積させる工程と、
金層、接着/メッキ層、及び基板のエッジを露出させるべく、金層を半導体積層構造のダイシングストリート領域でダイシングする工程と、
エッジシールを、金層及び接着/メッキ層の露出エッジ部分の周りにバリアメタル層を使用して形成する工程と、
半導体積層構造をダイシングストリート領域でダイシングする工程と、
半導体積層構造を支持構造に半田付けして半導体パッケージを形成する工程とを備える、半導体パッケージの製造方法。 - エッチング工程では、湿式化学エッチングを用いてエッチングする、請求項9記載の半導体パッケージの製造方法。
- エッジシールを形成する工程では、バリアメタル層をスパッタリング法により堆積させ、バリアメタル層は1.0〜1.7ミクロンの範囲の膜厚を有する、請求項9記載の半導体パッケージの製造方法。
- バリアメタル層は、チタン層、ニッケル−バナジウム層、及び金層を含む、請求項9記載の半導体パッケージの製造方法。
- エッジシールによって、半田付けプロセスの間に使用される半田材料への金層の溶出、及び半田材料におけるボイドの形成を防止する、請求項9記載の半導体パッケージの製造方法。
- 支持構造はリードフレームである、請求項9記載の半導体パッケージの製造方法。
- 半導体チップと、そして半導体チップに半田付けされる支持構造とを備える半導体パッケージであって、半導体チップは、
基板と、
基板の第1表面の内部に形成される少なくとも一つの金属パッドと、
基板の第1表面とは反対側の第2表面に形成され、かつエッジ部分を有する接着/メッキ層と、
接着/メッキ層の上に形成され、かつエッジ部分を有する金層と、
金層の表面に形成されるバリアメタル層と、を有し、
バリアメタル層によってエッジシールが、金層のエッジ部分、及び接着/メッキ層のエッジ部分の周りに形成される、半導体パッケージ。 - 基板は砒化ガリウムを含む、請求項15記載の半導体パッケージ。
- エッジシールによって、半田材料への金層の溶出を防止する、請求項15記載の半導体パッケージ。
- 金層の露出エッジ部分、及び接着/メッキ層の露出エッジ部分がエッチング工程の間に、半導体チップのダイシングストリート領域に形成される、請求項15記載の半導体パッケージ。
- バリアメタル層は、チタン層、ニッケル−バナジウム層、及び金層により構成され、バリアメタル層は1.0〜1.7ミクロンの範囲の膜厚を有する、請求項15記載の半導体パッケージ。
- 基板の中に形成される複数のサーマルビアを更に有する、請求項15記載の半導体パッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/140,351 US7339267B2 (en) | 2005-05-26 | 2005-05-26 | Semiconductor package and method for forming the same |
US11/140,351 | 2005-05-26 | ||
PCT/US2006/010745 WO2006127107A2 (en) | 2005-05-26 | 2006-03-24 | Semiconductor package and method for forming the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008543049A true JP2008543049A (ja) | 2008-11-27 |
JP2008543049A5 JP2008543049A5 (ja) | 2009-05-07 |
JP5300470B2 JP5300470B2 (ja) | 2013-09-25 |
Family
ID=37452517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008513466A Expired - Fee Related JP5300470B2 (ja) | 2005-05-26 | 2006-03-24 | 半導体パッケージ及び同パッケージを形成する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7339267B2 (ja) |
JP (1) | JP5300470B2 (ja) |
CN (1) | CN100539008C (ja) |
TW (1) | TWI433279B (ja) |
WO (1) | WO2006127107A2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7949601B2 (en) * | 2007-04-21 | 2011-05-24 | Hartford Fire Insurance Company | Method and system for providing minimum contract values in an annuity with lifetime benefit payments |
DE102009044086A1 (de) * | 2009-09-23 | 2011-03-24 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung eines elektronischen Bauteils und nach diesem Verfahren hergestelltes elektronisches Bauteil |
US8680674B2 (en) | 2012-05-31 | 2014-03-25 | Freescale Semiconductor, Inc. | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices |
US9093429B2 (en) | 2012-06-27 | 2015-07-28 | Freescale Semiconductor, Inc. | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices |
US9875987B2 (en) | 2014-10-07 | 2018-01-23 | Nxp Usa, Inc. | Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices |
US9589860B2 (en) * | 2014-10-07 | 2017-03-07 | Nxp Usa, Inc. | Electronic devices with semiconductor die coupled to a thermally conductive substrate |
US9698116B2 (en) | 2014-10-31 | 2017-07-04 | Nxp Usa, Inc. | Thick-silver layer interface for a semiconductor die and corresponding thermal layer |
CN107579032B (zh) * | 2017-07-27 | 2019-04-09 | 厦门市三安集成电路有限公司 | 一种化合物半导体器件的背面制程方法 |
CN110767604B (zh) * | 2019-10-31 | 2022-03-18 | 厦门市三安集成电路有限公司 | 化合物半导体器件和化合物半导体器件的背面铜制程方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01123418A (ja) * | 1987-11-09 | 1989-05-16 | Nec Corp | 半導体装置の製造方法 |
JP2003045875A (ja) * | 2001-07-30 | 2003-02-14 | Nec Kagobutsu Device Kk | 半導体装置およびその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3881884A (en) * | 1973-10-12 | 1975-05-06 | Ibm | Method for the formation of corrosion resistant electronic interconnections |
US5027189A (en) * | 1990-01-10 | 1991-06-25 | Hughes Aircraft Company | Integrated circuit solder die-attach design and method |
US5156998A (en) * | 1991-09-30 | 1992-10-20 | Hughes Aircraft Company | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes |
JP3374880B2 (ja) * | 1994-10-26 | 2003-02-10 | 三菱電機株式会社 | 半導体装置の製造方法、及び半導体装置 |
US6140703A (en) * | 1996-08-05 | 2000-10-31 | Motorola, Inc. | Semiconductor metallization structure |
US6040239A (en) * | 1997-08-22 | 2000-03-21 | Micron Technology, Inc. | Non-oxidizing touch contact interconnect for semiconductor test systems and method of fabrication |
JP4438133B2 (ja) * | 1999-08-19 | 2010-03-24 | シャープ株式会社 | ヘテロ接合型バイポーラトランジスタおよびその製造方法 |
US6312830B1 (en) * | 1999-09-02 | 2001-11-06 | Intel Corporation | Method and an apparatus for forming an under bump metallization structure |
US6960824B1 (en) * | 2000-11-15 | 2005-11-01 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless chip carrier |
US6607941B2 (en) * | 2002-01-11 | 2003-08-19 | National Semiconductor Corporation | Process and structure improvements to shellcase style packaging technology |
KR100611778B1 (ko) * | 2002-09-24 | 2006-08-10 | 주식회사 하이닉스반도체 | 반도체장치 제조방법 |
-
2005
- 2005-05-26 US US11/140,351 patent/US7339267B2/en active Active
-
2006
- 2006-03-24 CN CNB2006800182164A patent/CN100539008C/zh not_active Expired - Fee Related
- 2006-03-24 WO PCT/US2006/010745 patent/WO2006127107A2/en active Application Filing
- 2006-03-24 JP JP2008513466A patent/JP5300470B2/ja not_active Expired - Fee Related
- 2006-04-17 TW TW095113584A patent/TWI433279B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01123418A (ja) * | 1987-11-09 | 1989-05-16 | Nec Corp | 半導体装置の製造方法 |
JP2003045875A (ja) * | 2001-07-30 | 2003-02-14 | Nec Kagobutsu Device Kk | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200644192A (en) | 2006-12-16 |
JP5300470B2 (ja) | 2013-09-25 |
WO2006127107A2 (en) | 2006-11-30 |
US7339267B2 (en) | 2008-03-04 |
US20060270194A1 (en) | 2006-11-30 |
WO2006127107A3 (en) | 2007-06-14 |
CN101185153A (zh) | 2008-05-21 |
CN100539008C (zh) | 2009-09-09 |
TWI433279B (zh) | 2014-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5300470B2 (ja) | 半導体パッケージ及び同パッケージを形成する方法 | |
US8133761B2 (en) | Packaged system of semiconductor chips having a semiconductor interposer | |
EP0704895B1 (en) | Process for manufacturing semiconductor device and semiconductor wafer | |
JP2004023101A (ja) | 半導体素子パッケージおよびその製造方法 | |
JPH04326534A (ja) | 半導体装置のチップボンディング方法 | |
US10192849B2 (en) | Semiconductor modules with semiconductor dies bonded to a metal foil | |
US7425503B1 (en) | Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices | |
JP2586344B2 (ja) | キャリアフィルム | |
WO2006016449A1 (ja) | 電子装置およびそれを用いた半導体装置、ならびに半導体装置の製造方法 | |
JPH07201864A (ja) | 突起電極形成方法 | |
WO2007034791A1 (ja) | 半田層及びこれを用いた放熱基板並びにその製造方法 | |
JP2006278463A (ja) | サブマウント | |
JP2001118953A (ja) | 半導体電子部品の製造方法 | |
JP2005311284A (ja) | パワー半導体素子およびこれを用いた半導体装置 | |
TWI483314B (zh) | 通過裝設附加保護層以在運送期間保護半導體裝置的反應性金屬表面的技術 | |
JP2003158140A (ja) | 半導体パッケージ、半導体パッケージの製造方法、モジュール及び電子機器 | |
JP2004063804A (ja) | 半導体装置、積層型半導体装置およびそれらの製造方法 | |
US11552014B2 (en) | Semiconductor package structure and method of making the same | |
WO2023090261A1 (ja) | 半導体装置 | |
JP2004186643A (ja) | 半導体装置およびその製造方法 | |
JP4104506B2 (ja) | 半導体装置の製造方法 | |
KR20030075814A (ko) | 반도체 멀티칩 모듈 패키지 및 그 제조 방법 | |
EP2153465A1 (en) | Packaged system of semiconductor chips having a semiconductor interposer | |
JP2004007022A (ja) | 半導体装置 | |
JP5278287B2 (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090319 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090319 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110609 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110614 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110914 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120508 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120808 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120815 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120910 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130528 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130618 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5300470 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |