JP2008541460A5 - - Google Patents
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- Publication number
- JP2008541460A5 JP2008541460A5 JP2008511413A JP2008511413A JP2008541460A5 JP 2008541460 A5 JP2008541460 A5 JP 2008541460A5 JP 2008511413 A JP2008511413 A JP 2008511413A JP 2008511413 A JP2008511413 A JP 2008511413A JP 2008541460 A5 JP2008541460 A5 JP 2008541460A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- package assembly
- chip package
- polyimide
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 229920001721 Polyimide Polymers 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 4
- 239000011148 porous material Substances 0.000 claims 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 239000002861 polymer material Substances 0.000 claims 2
- 239000000565 sealant Substances 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims 1
- 229920001690 polydopamine Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Claims (7)
- シリコン基板と、
少なくとも１つの半導体チップと、
少なくとも１つの露出端部とその中に充填された多孔質材料とを有する、前記シリコン基板内の少なくとも１つの電気伝導性ビアと、
リフローされて前記少なくとも１つの電気伝導性ビアの前記多孔質材料内へ浸入し、前記多孔質材料を封止する、高分子材料を含むシーラントと、
を含む、半導体チップ・パッケージ組立体。 - 前記高分子材料が、ポリイミド材料又は高い熱安定性の熱硬化性材料を含む、請求項１に記載の半導体チップ・パッケージ組立体。
- 前記高分子材料が、ポリイミド前駆体溶液を含む、請求項１に記載の半導体チップ・パッケージ組立体。
- 前記ポリイミド前駆体溶液が、高濃度の固形分を含み、１ｃＰから１５０ｃＰまでの粘度を有する、請求項３に記載の半導体チップ・パッケージ組立体。
- 前記ポリイミド材料が、その前駆体状態において低粘度及び低融点のニートな熱硬化性材料である、請求項２に記載の半導体チップ・パッケージ組立体。
- 前記熱安定性の熱硬化性材料が、Ｍａｔｒｉｍｉｄ（登録商標）、ＰＭＤＡ−ＯＤＡ、ＢＰＤＡ−ＰＤＡ、又はＰＩ２５６２を含む、請求項２に記載の半導体チップ・パッケージ組立体。
- 前記シーラントが堆積された銅被覆を含む、請求項１に記載の半導体チップ・パッケージ組立体。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/908,480 US7199450B2 (en) | 2005-05-13 | 2005-05-13 | Materials and method to seal vias in silicon substrates |
| PCT/US2006/018458 WO2006124607A2 (en) | 2005-05-13 | 2006-05-12 | Materials and method to seal vias in silicon substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008541460A JP2008541460A (ja) | 2008-11-20 |
| JP2008541460A5 true JP2008541460A5 (ja) | 2009-07-23 |
| JP4563483B2 JP4563483B2 (ja) | 2010-10-13 |
Family
ID=37418363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008511413A Expired - Fee Related JP4563483B2 (ja) | 2005-05-13 | 2006-05-12 | 半導体チップ・パッケージ組立体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7199450B2 (ja) |
| EP (1) | EP1883961A4 (ja) |
| JP (1) | JP4563483B2 (ja) |
| CN (1) | CN101176203B (ja) |
| TW (1) | TWI406365B (ja) |
| WO (1) | WO2006124607A2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090083977A1 (en) * | 2007-09-28 | 2009-04-02 | Andre Hanke | Method for Filling Via Holes in Semiconductor Substrates |
| US9666514B2 (en) | 2015-04-14 | 2017-05-30 | Invensas Corporation | High performance compliant substrate |
| CN110402616B (zh) | 2016-11-18 | 2023-04-04 | 申泰公司 | 填充材料以及基板通孔的填充方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4126758A (en) * | 1973-12-03 | 1978-11-21 | Raychem Corporation | Method for sealing integrated circuit components with heat recoverable cap and resulting package |
| US4880684A (en) * | 1988-03-11 | 1989-11-14 | International Business Machines Corporation | Sealing and stress relief layers and use thereof |
| US5139851A (en) * | 1988-03-11 | 1992-08-18 | International Business Machines Corporation | Low dielectric composite substrate |
| JPH02106956A (ja) * | 1988-10-17 | 1990-04-19 | Hitachi Ltd | 半導体装置及びその製造方法 |
| JPH05198697A (ja) * | 1992-01-20 | 1993-08-06 | Fujitsu Ltd | シリコン基板金属ビア形成方法およびマルチチップモジュール製造方法 |
| US5904502A (en) * | 1997-09-04 | 1999-05-18 | International Business Machines Corporation | Multiple 3-dimensional semiconductor device processing method and apparatus |
| US5998292A (en) | 1997-11-12 | 1999-12-07 | International Business Machines Corporation | Method for making three dimensional circuit integration |
| US6100114A (en) * | 1998-08-10 | 2000-08-08 | International Business Machines Corporation | Encapsulation of solder bumps and solder connections |
| US6555762B2 (en) * | 1999-07-01 | 2003-04-29 | International Business Machines Corporation | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition |
| JP4576728B2 (ja) * | 2001-03-06 | 2010-11-10 | ソニー株式会社 | 導電性ぺースト、プリント配線基板とその製造方法および半導体装置とその製造方法 |
| US6593644B2 (en) | 2001-04-19 | 2003-07-15 | International Business Machines Corporation | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face |
| JP3993458B2 (ja) * | 2002-04-17 | 2007-10-17 | 株式会社東芝 | 半導体装置 |
-
2005
- 2005-05-13 US US10/908,480 patent/US7199450B2/en active Active
-
2006
- 2006-05-05 TW TW095116152A patent/TWI406365B/zh active
- 2006-05-12 CN CN2006800162315A patent/CN101176203B/zh active Active
- 2006-05-12 WO PCT/US2006/018458 patent/WO2006124607A2/en active Application Filing
- 2006-05-12 JP JP2008511413A patent/JP4563483B2/ja not_active Expired - Fee Related
- 2006-05-12 EP EP06759690A patent/EP1883961A4/en not_active Withdrawn
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