JP2008535587A5 - - Google Patents

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Publication number
JP2008535587A5
JP2008535587A5 JP2008505662A JP2008505662A JP2008535587A5 JP 2008535587 A5 JP2008535587 A5 JP 2008535587A5 JP 2008505662 A JP2008505662 A JP 2008505662A JP 2008505662 A JP2008505662 A JP 2008505662A JP 2008535587 A5 JP2008535587 A5 JP 2008535587A5
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JP
Japan
Prior art keywords
microneedle
application device
sensing element
microneedle application
force sensing
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Application number
JP2008505662A
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English (en)
Japanese (ja)
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JP2008535587A (ja
JP5301985B2 (ja
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Priority claimed from PCT/US2006/013608 external-priority patent/WO2006108185A1/en
Publication of JP2008535587A publication Critical patent/JP2008535587A/ja
Publication of JP2008535587A5 publication Critical patent/JP2008535587A5/ja
Application granted granted Critical
Publication of JP5301985B2 publication Critical patent/JP5301985B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2008505662A 2005-04-07 2006-04-07 ツールフィードバック感知のためのシステム及び方法 Expired - Fee Related JP5301985B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US66913305P 2005-04-07 2005-04-07
US60/669,133 2005-04-07
PCT/US2006/013608 WO2006108185A1 (en) 2005-04-07 2006-04-07 System and method for tool feedback sensing

Publications (3)

Publication Number Publication Date
JP2008535587A JP2008535587A (ja) 2008-09-04
JP2008535587A5 true JP2008535587A5 (https=) 2009-05-21
JP5301985B2 JP5301985B2 (ja) 2013-09-25

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JP2008505662A Expired - Fee Related JP5301985B2 (ja) 2005-04-07 2006-04-07 ツールフィードバック感知のためのシステム及び方法

Country Status (4)

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US (1) US10035008B2 (https=)
EP (1) EP1871459B1 (https=)
JP (1) JP5301985B2 (https=)
WO (1) WO2006108185A1 (https=)

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