JP2008535275A5 - - Google Patents

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Publication number
JP2008535275A5
JP2008535275A5 JP2008504617A JP2008504617A JP2008535275A5 JP 2008535275 A5 JP2008535275 A5 JP 2008535275A5 JP 2008504617 A JP2008504617 A JP 2008504617A JP 2008504617 A JP2008504617 A JP 2008504617A JP 2008535275 A5 JP2008535275 A5 JP 2008535275A5
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JP
Japan
Prior art keywords
transfer tools
column arrangement
create
row array
tools
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JP2008504617A
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English (en)
Japanese (ja)
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JP5964005B2 (ja
JP2008535275A (ja
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Priority claimed from PCT/DE2006/000628 external-priority patent/WO2006105782A2/de
Publication of JP2008535275A publication Critical patent/JP2008535275A/ja
Publication of JP2008535275A5 publication Critical patent/JP2008535275A5/ja
Application granted granted Critical
Publication of JP5964005B2 publication Critical patent/JP5964005B2/ja
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JP2008504617A 2005-04-08 2006-04-10 チップを接触基板に移送する方法及び装置 Active JP5964005B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005016521.4 2005-04-08
DE102005016521 2005-04-08
PCT/DE2006/000628 WO2006105782A2 (de) 2005-04-08 2006-04-10 Verfahren und vorrichtung zur übertragung eines chips auf ein kontaktsubstrat

Publications (3)

Publication Number Publication Date
JP2008535275A JP2008535275A (ja) 2008-08-28
JP2008535275A5 true JP2008535275A5 (enExample) 2016-01-07
JP5964005B2 JP5964005B2 (ja) 2016-08-03

Family

ID=37073818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008504617A Active JP5964005B2 (ja) 2005-04-08 2006-04-10 チップを接触基板に移送する方法及び装置

Country Status (7)

Country Link
US (1) US9401298B2 (enExample)
EP (1) EP1869701B1 (enExample)
JP (1) JP5964005B2 (enExample)
KR (1) KR101250186B1 (enExample)
CN (1) CN101164150B (enExample)
DE (1) DE112006001493A5 (enExample)
WO (1) WO2006105782A2 (enExample)

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CN103302431B (zh) * 2012-03-09 2016-03-02 鸿富锦精密工业（深圳）有限公司 芯片焊接装置
WO2015085064A1 (en) * 2013-12-05 2015-06-11 Uniqarta, Inc. Electronic device incorporated into a sheet
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
JP6367084B2 (ja) 2014-10-30 2018-08-01 株式会社東芝 半導体チップの接合方法及び半導体チップの接合装置
EP3289605A2 (en) 2015-04-28 2018-03-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Transfer and soldering of chips
JP6398008B2 (ja) * 2015-07-14 2018-09-26 ゴルテック．インク フリップダイの組立方法、製造方法、装置及び電子機器
US10446532B2 (en) * 2016-01-13 2019-10-15 Invensas Bonding Technologies, Inc. Systems and methods for efficient transfer of semiconductor elements
TWI889995B (zh) * 2016-01-15 2025-07-11 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
US11776989B2 (en) 2016-06-10 2023-10-03 Applied Materials, Inc. Methods of parallel transfer of micro-devices using treatment
TWI723178B (zh) * 2016-06-10 2021-04-01 美商應用材料股份有限公司 微型裝置的無遮罩並行取放轉印
US11756982B2 (en) 2016-06-10 2023-09-12 Applied Materials, Inc. Methods of parallel transfer of micro-devices using mask layer
JP6603412B2 (ja) * 2016-06-22 2019-11-06 株式会社鈴木 実装装置
WO2018139667A1 (ja) * 2017-01-30 2018-08-02 株式会社新川 ピックアップ装置およびピックアップ方法
US11201077B2 (en) 2017-06-12 2021-12-14 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate
KR20240130146A (ko) * 2017-06-12 2024-08-28 쿨리케 & 소파 네덜란드 비.브이. 개별 부품들의 기판 상으로의 병렬적 조립
KR102077049B1 (ko) * 2017-12-21 2020-02-13 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사장치
JP6900006B2 (ja) * 2018-02-14 2021-07-07 東芝デバイス＆ストレージ株式会社 チップ移載部材、チップ移載装置、およびチップ移載方法
US10573543B2 (en) * 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
KR102171374B1 (ko) * 2018-07-27 2020-10-29 주식회사 비에스피 마이크로 소자 리워크 방법
DE102018006771B4 (de) * 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
US11134595B2 (en) * 2018-09-05 2021-09-28 Assembleon B.V. Compliant die attach systems having spring-driven bond tools
TWI690980B (zh) * 2018-12-07 2020-04-11 台灣愛司帝科技股份有限公司 晶片移轉方法及晶片移轉設備
US11107711B2 (en) * 2019-03-20 2021-08-31 Beijing Boe Display Technology Co., Ltd. Micro light emitting diode transferring apparatus, method for transferring micro light emitting diode, and display apparatus
WO2021164855A1 (de) * 2020-02-18 2021-08-26 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur übertragung von bauteilen
KR102391169B1 (ko) * 2020-03-11 2022-05-03 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102182856B1 (ko) * 2020-03-11 2020-11-25 넥스타테크놀로지 주식회사 부품 실장 장치
KR102436955B1 (ko) * 2020-03-11 2022-08-26 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
TWI770612B (zh) * 2020-09-18 2022-07-11 歆熾電氣技術股份有限公司 晶片移轉系統與晶片移轉方法
KR102271499B1 (ko) * 2020-10-16 2021-07-01 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
CN115547895B (zh) * 2022-11-24 2023-03-10 深圳新控半导体技术有限公司 一种芯片粘贴工装

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JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
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