JP2008535275A5 - - Google Patents
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- JP2008535275A5 JP2008535275A5 JP2008504617A JP2008504617A JP2008535275A5 JP 2008535275 A5 JP2008535275 A5 JP 2008535275A5 JP 2008504617 A JP2008504617 A JP 2008504617A JP 2008504617 A JP2008504617 A JP 2008504617A JP 2008535275 A5 JP2008535275 A5 JP 2008535275A5
- Authority
- JP
- Japan
- Prior art keywords
- transfer tools
- column arrangement
- create
- row array
- tools
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011159 matrix material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005016521 | 2005-04-08 | ||
| DE102005016521.4 | 2005-04-08 | ||
| PCT/DE2006/000628 WO2006105782A2 (de) | 2005-04-08 | 2006-04-10 | Verfahren und vorrichtung zur übertragung eines chips auf ein kontaktsubstrat |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008535275A JP2008535275A (ja) | 2008-08-28 |
| JP2008535275A5 true JP2008535275A5 (enExample) | 2016-01-07 |
| JP5964005B2 JP5964005B2 (ja) | 2016-08-03 |
Family
ID=37073818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008504617A Active JP5964005B2 (ja) | 2005-04-08 | 2006-04-10 | チップを接触基板に移送する方法及び装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9401298B2 (enExample) |
| EP (1) | EP1869701B1 (enExample) |
| JP (1) | JP5964005B2 (enExample) |
| KR (1) | KR101250186B1 (enExample) |
| CN (1) | CN101164150B (enExample) |
| DE (1) | DE112006001493A5 (enExample) |
| WO (1) | WO2006105782A2 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100820741B1 (ko) | 2007-03-30 | 2008-04-11 | 삼성전자주식회사 | 전자부품의 본딩장치 |
| TW200947641A (en) | 2008-05-15 | 2009-11-16 | Gio Optoelectronics Corp | Die bonding apparatus |
| WO2012142177A2 (en) * | 2011-04-11 | 2012-10-18 | Ndsu Research Foundation | Selective laser-assisted transfer of discrete components |
| CN103302431B (zh) * | 2012-03-09 | 2016-03-02 | 鸿富锦精密工业（深圳）有限公司 | 芯片焊接装置 |
| US10218049B2 (en) | 2013-12-05 | 2019-02-26 | Uniqarta, Inc. | Electronic device incorporated into a sheet |
| US9624100B2 (en) * | 2014-06-12 | 2017-04-18 | Apple Inc. | Micro pick up array pivot mount with integrated strain sensing elements |
| KR102403580B1 (ko) * | 2014-08-05 | 2022-05-30 | 쿨리케 & 소파 네덜란드 비.브이. | 쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성 |
| JP6367084B2 (ja) | 2014-10-30 | 2018-08-01 | 株式会社東芝 | 半導体チップの接合方法及び半導体チップの接合装置 |
| WO2016175654A2 (en) * | 2015-04-28 | 2016-11-03 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Transfer and soldering of chips |
| US10224307B2 (en) * | 2015-07-14 | 2019-03-05 | Goertek, Inc. | Assembling method, manufacturing method, device and electronic apparatus of flip-die |
| US10446532B2 (en) * | 2016-01-13 | 2019-10-15 | Invensas Bonding Technologies, Inc. | Systems and methods for efficient transfer of semiconductor elements |
| TW202524641A (zh) * | 2016-01-15 | 2025-06-16 | 荷蘭商庫力克及索發荷蘭公司 | 放置超小或超薄之離散組件 |
| US11776989B2 (en) | 2016-06-10 | 2023-10-03 | Applied Materials, Inc. | Methods of parallel transfer of micro-devices using treatment |
| JP6976972B2 (ja) * | 2016-06-10 | 2021-12-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | マイクロデバイスのマスクレス並列ピックアンドプレース移載 |
| US11756982B2 (en) | 2016-06-10 | 2023-09-12 | Applied Materials, Inc. | Methods of parallel transfer of micro-devices using mask layer |
| SG11201806151UA (en) * | 2016-06-22 | 2019-01-30 | Suzuki Co Ltd | Mounting method, mounting head and mounting apparatus |
| US11508599B2 (en) * | 2017-01-30 | 2022-11-22 | Shinkawa Ltd. | Pick-up device and pick-up method |
| US11201077B2 (en) | 2017-06-12 | 2021-12-14 | Kulicke & Soffa Netherlands B.V. | Parallel assembly of discrete components onto a substrate |
| JP6720333B2 (ja) * | 2017-06-12 | 2020-07-08 | ユニカルタ・インコーポレイテッド | 基板上に個別部品を並列に組み立てる方法 |
| KR102077049B1 (ko) * | 2017-12-21 | 2020-02-13 | 한국기계연구원 | 마이크로 소자 전사방법 및 마이크로 소자 전사장치 |
| JP6900006B2 (ja) * | 2018-02-14 | 2021-07-07 | 東芝デバイス＆ストレージ株式会社 | チップ移載部材、チップ移載装置、およびチップ移載方法 |
| US10573543B2 (en) * | 2018-04-30 | 2020-02-25 | Cree, Inc. | Apparatus and methods for mass transfer of electronic die |
| KR102171374B1 (ko) * | 2018-07-27 | 2020-10-29 | 주식회사 비에스피 | 마이크로 소자 리워크 방법 |
| DE102018006771B4 (de) | 2018-08-27 | 2022-09-08 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
| US11069555B2 (en) * | 2018-09-03 | 2021-07-20 | Assembleon B.V. | Die attach systems, and methods of attaching a die to a substrate |
| US11134595B2 (en) * | 2018-09-05 | 2021-09-28 | Assembleon B.V. | Compliant die attach systems having spring-driven bond tools |
| TWI690980B (zh) * | 2018-12-07 | 2020-04-11 | 台灣愛司帝科技股份有限公司 | 晶片移轉方法及晶片移轉設備 |
| WO2020186479A1 (en) * | 2019-03-20 | 2020-09-24 | Boe Technology Group Co., Ltd. | Micro light emitting diode transferring apparatus, method for transferring micro light emitting diode, and display apparatus |
| US12103787B2 (en) | 2020-02-18 | 2024-10-01 | Ev Group E. Thallner Gmbh | Method and device for transferring components |
| KR102436955B1 (ko) * | 2020-03-11 | 2022-08-26 | 넥스타테크놀로지 주식회사 | 실장 헤드 및 이를 포함하는 부품 실장 장치 |
| KR102391169B1 (ko) * | 2020-03-11 | 2022-05-03 | 넥스타테크놀로지 주식회사 | 실장 헤드 및 이를 포함하는 부품 실장 장치 |
| KR102182856B1 (ko) * | 2020-03-11 | 2020-11-25 | 넥스타테크놀로지 주식회사 | 부품 실장 장치 |
| TWI770612B (zh) * | 2020-09-18 | 2022-07-11 | 歆熾電氣技術股份有限公司 | 晶片移轉系統與晶片移轉方法 |
| KR102271499B1 (ko) * | 2020-10-16 | 2021-07-01 | 넥스타테크놀로지 주식회사 | 실장 헤드 및 이를 포함하는 부품 실장 장치 |
| CN115547895B (zh) * | 2022-11-24 | 2023-03-10 | 深圳新控半导体技术有限公司 | 一种芯片粘贴工装 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62101040A (ja) * | 1985-10-26 | 1987-05-11 | Seiko Instr & Electronics Ltd | 半導体素子の接続法および装置 |
| EP0367705A3 (en) | 1988-10-31 | 1990-09-26 | International Business Machines Corporation | Laser assisted ultrasonic bonding |
| KR0127044B1 (ko) * | 1990-04-04 | 1997-12-29 | 야마나까 가즈다까 | Ic 소켓에 있어서 콘택트의 개폐장치 |
| JP3195970B2 (ja) | 1992-05-29 | 2001-08-06 | 澁谷工業株式会社 | 半導体チップボンダにおけるチップ加熱機構 |
| JP3416979B2 (ja) | 1993-03-11 | 2003-06-16 | セイコーエプソン株式会社 | 接合装置 |
| JP3498877B2 (ja) * | 1995-12-05 | 2004-02-23 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
| DE19749909C2 (de) | 1996-12-10 | 2000-08-31 | Fraunhofer Ges Forschung | Vorrichtung zum Herstellen von Verbindungen zwischen jeweils zwei Kontaktelementen mittels Laserenergie |
| JPH11121481A (ja) | 1997-10-17 | 1999-04-30 | Fujitsu Ltd | 半導体部品の実装装置 |
| US6284086B1 (en) * | 1999-08-05 | 2001-09-04 | Three - Five Systems, Inc. | Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive |
| JP2002026071A (ja) | 2000-07-05 | 2002-01-25 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| WO2002084631A1 (en) * | 2001-04-11 | 2002-10-24 | Sony Corporation | Element transfer method, element arrangmenet method using the same, and image display apparatus production method |
| US20030224581A1 (en) | 2002-06-03 | 2003-12-04 | Robert Bosch Gmbh | Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method |
| JP2005005245A (ja) * | 2002-11-08 | 2005-01-06 | Fuji Photo Film Co Ltd | 転写素材の転写方法、形状転写方法及び転写装置 |
| JP3743424B2 (ja) | 2003-01-10 | 2006-02-08 | 松下電器産業株式会社 | 電子部品圧着装置および電子部品圧着方法 |
| DE10313481B4 (de) * | 2003-03-26 | 2005-07-07 | Protechna S.A. | Transport- und Lagerbehälter für Flüssigkeiten |
| US7244326B2 (en) * | 2003-05-16 | 2007-07-17 | Alien Technology Corporation | Transfer assembly for manufacturing electronic devices |
| US7423286B2 (en) | 2003-09-05 | 2008-09-09 | Si2 Technologies, Inc. | Laser transfer article and method of making |
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2006
- 2006-04-10 WO PCT/DE2006/000628 patent/WO2006105782A2/de not_active Ceased
- 2006-04-10 DE DE112006001493T patent/DE112006001493A5/de not_active Withdrawn
- 2006-04-10 KR KR1020077025897A patent/KR101250186B1/ko active Active
- 2006-04-10 EP EP06742229.5A patent/EP1869701B1/de active Active
- 2006-04-10 JP JP2008504617A patent/JP5964005B2/ja active Active
- 2006-04-10 US US11/910,771 patent/US9401298B2/en active Active
- 2006-04-10 CN CN2006800111703A patent/CN101164150B/zh active Active