JP2008524395A - 銀含有インクジェットインキ - Google Patents

銀含有インクジェットインキ Download PDF

Info

Publication number
JP2008524395A
JP2008524395A JP2007546907A JP2007546907A JP2008524395A JP 2008524395 A JP2008524395 A JP 2008524395A JP 2007546907 A JP2007546907 A JP 2007546907A JP 2007546907 A JP2007546907 A JP 2007546907A JP 2008524395 A JP2008524395 A JP 2008524395A
Authority
JP
Japan
Prior art keywords
ink
silver
inkjet
pattern
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007546907A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008524395A5 (enExample
Inventor
ニコル エム ライナーツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2008524395A publication Critical patent/JP2008524395A/ja
Publication of JP2008524395A5 publication Critical patent/JP2008524395A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0023—Digital printing methods characterised by the inks used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
JP2007546907A 2004-12-16 2005-12-15 銀含有インクジェットインキ Pending JP2008524395A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63661004P 2004-12-16 2004-12-16
PCT/US2005/045482 WO2006066033A1 (en) 2004-12-16 2005-12-15 Silver-containing inkjet ink

Publications (2)

Publication Number Publication Date
JP2008524395A true JP2008524395A (ja) 2008-07-10
JP2008524395A5 JP2008524395A5 (enExample) 2009-02-12

Family

ID=36192111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007546907A Pending JP2008524395A (ja) 2004-12-16 2005-12-15 銀含有インクジェットインキ

Country Status (5)

Country Link
US (1) US20060130700A1 (enExample)
EP (1) EP1846518B1 (enExample)
JP (1) JP2008524395A (enExample)
DE (1) DE602005016463D1 (enExample)
WO (1) WO2006066033A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012061171A3 (en) * 2010-11-03 2012-09-27 Cabot Corporation Metallic dispersions for inkjet printing
JP2013095081A (ja) * 2011-11-02 2013-05-20 Seiko Epson Corp 記録物および記録装置
WO2014046306A1 (ja) * 2012-09-21 2014-03-27 住友化学株式会社 導電性膜形成用の組成物
KR20150063042A (ko) * 2012-09-28 2015-06-08 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
KR20160008974A (ko) * 2014-07-15 2016-01-25 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 무전해 구리 도금 조성물
JP2018130845A (ja) * 2017-02-13 2018-08-23 富士フイルム株式会社 画像記録方法及び記録物

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080997A1 (ja) * 2006-01-11 2007-07-19 Dowa Electronics Materials Co., Ltd. 銀導電膜およびその製造法
JP2009529443A (ja) * 2006-03-09 2009-08-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー インクジェットインクセット
US9533523B2 (en) * 2006-05-31 2017-01-03 Sicpa Holding Sa Reflective features with co-planar elements and processes for making them
US7491646B2 (en) * 2006-07-20 2009-02-17 Xerox Corporation Electrically conductive feature fabrication process
JP2008047793A (ja) * 2006-08-21 2008-02-28 Konica Minolta Holdings Inc 金属パターンの形成方法
CA2612557A1 (en) * 2006-08-31 2008-03-15 Kruger Inc. Method of protecting a radio frequency identification inlay
DE102007037079A1 (de) 2006-10-25 2008-04-30 Bayer Materialscience Ag Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
US7615111B2 (en) * 2007-04-18 2009-11-10 Hewlett-Packard Development Company, L.P. Metallic inkjet ink and method for forming the same
CN101795794A (zh) * 2007-09-19 2010-08-04 E.I.内穆尔杜邦公司 通过还原银聚胺络合物来制备银球
JP2011515510A (ja) 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
WO2009132665A1 (en) * 2008-04-30 2009-11-05 Stichting Dutch Polymer Institute Method for generation of metal surface structures and use of silver complex for forming surface patterns
EP2315813A4 (en) * 2008-07-25 2012-11-28 Methode Electronics Inc METAL NANOPARTICLE INK COMPOSITIONS
CN101754584B (zh) * 2008-12-12 2012-01-25 清华大学 制备导电线路的方法
CN101768386B (zh) * 2009-01-07 2012-08-29 清华大学 墨水及采用该墨水制备导电线路的方法
CN101857217B (zh) * 2009-04-07 2013-03-20 清华大学 碳纳米管金属复合物及其制备方法
JP5977673B2 (ja) * 2009-11-09 2016-08-24 カーネギー メロン ユニバーシティ 金属インク組成物、導電性パターン、方法および素子
AT509296B1 (de) 2009-12-16 2015-05-15 Joanneum Res Forschungsgmbh Metallisch leitfähige tinte für tintenstrahldruck sowie verfahren zur herstellung derselben
WO2011126706A2 (en) * 2010-04-09 2011-10-13 Henkel Corporation Printable materials and methods of manufacture thereof
CN102248782B (zh) * 2010-05-14 2015-09-09 精工爱普生株式会社 喷墨记录方法和记录物
JP2011241241A (ja) 2010-05-14 2011-12-01 Seiko Epson Corp 水系インク組成物およびこれを用いた記録物
US20140302292A1 (en) * 2010-12-15 2014-10-09 Newpage Corporation Inkjet printed electronic device
TWI567205B (zh) 2011-05-04 2017-01-21 黎可德X印製金屬公司 自分子油墨形成金屬合金之方法及組合物
WO2013063320A1 (en) 2011-10-28 2013-05-02 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
KR102109390B1 (ko) * 2011-12-23 2020-05-12 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 전도성 은 구조체 제조용 잉크 조성물
TWI696668B (zh) 2012-02-27 2020-06-21 美商黎可德X印製金屬公司 可溶於極性質子溶劑之自還原性金屬錯合物墨水及改良的固化方法
US10849231B2 (en) * 2013-03-29 2020-11-24 Toppan Forms Co., Ltd. Laminate and circuit board
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
EP2883694A1 (en) * 2013-12-12 2015-06-17 Agfa Graphics Nv Laminated Safety Glass
JP6508481B2 (ja) * 2014-01-24 2019-05-08 トッパン・フォームズ株式会社 配線板
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
US20170151347A1 (en) * 2015-11-29 2017-06-01 Berney PENG Functionalized nanoparticles with encapsulated cargo and method of their self-assembly
EP3390548B1 (en) * 2015-12-14 2021-06-02 King Abdullah University Of Science And Technology Silver-organo-complex ink with high conductivity and inkjet stability
EP3416771A4 (en) 2016-02-16 2019-10-16 Arizona Board of Regents on behalf of Arizona State University MANUFACTURE OF METAL OR CERAMIC COMPONENTS WITH 3D PRINTING WITH SOLDER SUPPORTS FROM ANOTHER MATERIAL
WO2018013178A1 (en) 2016-07-15 2018-01-18 Arizona Board Of Regents On Behalf Of Arizona State University Dissolving metal supports in 3d printed metals and ceramics using sensitization
CN110832040A (zh) 2017-05-15 2020-02-21 巴斯夫欧洲公司 制备金属纳米颗粒层的方法及其在装饰或安全元件中的用途
WO2018213640A1 (en) * 2017-05-17 2018-11-22 Mariana Bertoni Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing
EP3658701A1 (en) 2017-07-28 2020-06-03 Basf Se Process for the preparation of metallic nano-particle layers and their use for decora-tive or security elements
US10633550B2 (en) * 2017-08-31 2020-04-28 Xerox Corporation Molecular organic reactive inks for conductive silver printing
GB2586450A (en) 2019-08-12 2021-02-24 Montauniversitaet Leoben Ink Composition, kit, method of manufacturing a deformable conductor utilizing the ink composition, deformable conductor and electronic device comprising the
US11346000B2 (en) 2019-12-03 2022-05-31 Scodix Ltd. Method for patterning a metal on a substrate and articles comprising same
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN116072350B (zh) * 2023-04-07 2023-08-15 江西理工大学南昌校区 一种原位制备太阳能电池电极用导电银浆的方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254661A (en) * 1975-10-31 1977-05-04 Shoei Chemical Ind Co Method to manufacture silver powder
JPH04323309A (ja) * 1991-04-12 1992-11-12 Daido Steel Co Ltd 金属微粉末の製造方法
JPH0776710A (ja) * 1993-07-13 1995-03-20 E I Du Pont De Nemours & Co 微細な稠密充填球状銀粒子の製造法
JPH07235754A (ja) * 1993-12-27 1995-09-05 Mitsubishi Materials Corp 微細パターンの形成方法およびペースト
JPH10195505A (ja) * 1997-01-09 1998-07-28 Mitsui Chem Inc 金属超微粒子およびその製造方法
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
WO2004068389A2 (en) * 2003-01-28 2004-08-12 Conductive Inkjet Technology Limited Method of forming a conductive metal region on a substrate
WO2004106585A1 (en) * 2003-05-30 2004-12-09 Avantone Oy Method for producing metal conductors on a substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266229A (en) * 1979-03-26 1981-05-05 Whittaker Corporation Light sensitive jet inks
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US5091003A (en) * 1990-06-15 1992-02-25 Ford Motor Company Ink compositions and method for placing indicia on glass
EP0696515B1 (en) * 1994-07-11 1998-12-02 Agfa-Gevaert N.V. Ink jet printing process
CN1137285C (zh) * 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
DE10037071A1 (de) * 2000-07-29 2002-02-21 Omg Ag & Co Kg Edelmetall-Nanopartikel, Verfahren zu ihrer Herstellung und Verwendung
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
JP2003288812A (ja) * 2001-12-29 2003-10-10 Samsung Electronics Co Ltd 金属ナノ粒子クラスターインクおよびこれを用いた金属パターン形成方法
US6777071B2 (en) * 2002-04-25 2004-08-17 Micron Technology, Inc. Electrical interconnect using locally conductive adhesive
JP4636496B2 (ja) * 2002-06-13 2011-02-23 シーマ ナノテック イスラエル リミテッド 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク
US7311393B2 (en) * 2002-08-26 2007-12-25 Fujifilm Corporation Inkjet recording ink and method of inkjet recording
WO2004027113A2 (en) * 2002-09-20 2004-04-01 Noble Fiber Technologies Improved silver plating method and articles made therefrom
US8470066B2 (en) * 2004-10-29 2013-06-25 Clarkson University Aqueous-based method for producing ultra-fine metal powders

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254661A (en) * 1975-10-31 1977-05-04 Shoei Chemical Ind Co Method to manufacture silver powder
JPH04323309A (ja) * 1991-04-12 1992-11-12 Daido Steel Co Ltd 金属微粉末の製造方法
JPH0776710A (ja) * 1993-07-13 1995-03-20 E I Du Pont De Nemours & Co 微細な稠密充填球状銀粒子の製造法
JPH07235754A (ja) * 1993-12-27 1995-09-05 Mitsubishi Materials Corp 微細パターンの形成方法およびペースト
JPH10195505A (ja) * 1997-01-09 1998-07-28 Mitsui Chem Inc 金属超微粒子およびその製造方法
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
JP2005537386A (ja) * 2001-10-05 2005-12-08 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法
WO2004068389A2 (en) * 2003-01-28 2004-08-12 Conductive Inkjet Technology Limited Method of forming a conductive metal region on a substrate
WO2004106585A1 (en) * 2003-05-30 2004-12-09 Avantone Oy Method for producing metal conductors on a substrate
JP2006526074A (ja) * 2003-05-30 2006-11-16 アヴァントーネ オサケユキチュア 基体に金属の導電体を生産するための方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012061171A3 (en) * 2010-11-03 2012-09-27 Cabot Corporation Metallic dispersions for inkjet printing
US8764895B2 (en) 2010-11-03 2014-07-01 Cabot Corporation Metallic dispersions for inkjet printing
JP2013095081A (ja) * 2011-11-02 2013-05-20 Seiko Epson Corp 記録物および記録装置
WO2014046306A1 (ja) * 2012-09-21 2014-03-27 住友化学株式会社 導電性膜形成用の組成物
US9758688B2 (en) 2012-09-21 2017-09-12 Sumitomo Chemical Company, Limited Composition for forming conductive film
KR20150063042A (ko) * 2012-09-28 2015-06-08 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
KR102059805B1 (ko) * 2012-09-28 2019-12-27 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
KR20160008974A (ko) * 2014-07-15 2016-01-25 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 무전해 구리 도금 조성물
KR101686828B1 (ko) 2014-07-15 2016-12-28 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 무전해 구리 도금 조성물
JP2018130845A (ja) * 2017-02-13 2018-08-23 富士フイルム株式会社 画像記録方法及び記録物

Also Published As

Publication number Publication date
WO2006066033A1 (en) 2006-06-22
US20060130700A1 (en) 2006-06-22
DE602005016463D1 (de) 2009-10-15
EP1846518B1 (en) 2009-09-02
EP1846518A1 (en) 2007-10-24

Similar Documents

Publication Publication Date Title
EP1846518B1 (en) Silver-containing inkjet ink
EP3006516B1 (en) Ink jet recording method
EP3903970B1 (en) Dispersion of metal fine particles and method for producing a printed material
JP5982033B2 (ja) 金属微粒子分散体、銅微粒子分散体、銅微粒子分散体の製造方法、及び導電性基板の製造方法
CN101384438B (zh) 用于形成导电图案的银有机溶胶墨水
US7896483B2 (en) Palladium complexes for printing circuits
KR100751165B1 (ko) 잉크젯 펜에서 코게이션을 방지하고 레지스터 수명을연장시키는 잉크젯 잉크
JP6161391B2 (ja) インク、インクカートリッジ、及びインクジェット記録方法
EP2684918B1 (en) Electrically conductive aqueous ink for inkjet recording
KR100602811B1 (ko) 잉크젯 프린터용 전도성 잉크 조성물, 잉크젯 프린팅에의한 금속패턴 형성 방법 및 이에 의해 제조된 인쇄회로기판
EP3020566B1 (en) Image forming method and image recording material
CN114901762A (zh) 含有金属微粒的油墨
JP2013253238A (ja) インク、インクカートリッジ、及びインクジェット記録方法
WO2009031849A2 (en) Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
JP2008524395A5 (enExample)
CN113728063A (zh) 含有金属微粒的油墨
CN102286226A (zh) 一种无色透明导电墨水及其制备方法和应用
CN101258449B (zh) 用于形成导电图案的银有机溶胶墨水
US20090308646A1 (en) Conductor pattern forming ink, conductor pattern, and wiring substrate
JP7490629B2 (ja) 金属微粒子含有インク
US20070076021A1 (en) Processes for inkjet printing
US12305055B2 (en) Method for manufacturing electrically conductive member
EP1996659A2 (en) Pigmented ink-jet inks with quality enhancing polymers
US10814659B2 (en) Methods for printing conductive objects
WO2009132665A1 (en) Method for generation of metal surface structures and use of silver complex for forming surface patterns

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081215

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111121

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120604