DE602005016463D1 - Silberhaltige tintenstrahltinte - Google Patents

Silberhaltige tintenstrahltinte

Info

Publication number
DE602005016463D1
DE602005016463D1 DE602005016463T DE602005016463T DE602005016463D1 DE 602005016463 D1 DE602005016463 D1 DE 602005016463D1 DE 602005016463 T DE602005016463 T DE 602005016463T DE 602005016463 T DE602005016463 T DE 602005016463T DE 602005016463 D1 DE602005016463 D1 DE 602005016463D1
Authority
DE
Germany
Prior art keywords
ink
silvery
ink jet
jet
jet ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005016463T
Other languages
German (de)
English (en)
Inventor
Nicole M Reinartz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE602005016463D1 publication Critical patent/DE602005016463D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0023—Digital printing methods characterised by the inks used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
DE602005016463T 2004-12-16 2005-12-15 Silberhaltige tintenstrahltinte Expired - Fee Related DE602005016463D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63661004P 2004-12-16 2004-12-16
PCT/US2005/045482 WO2006066033A1 (en) 2004-12-16 2005-12-15 Silver-containing inkjet ink

Publications (1)

Publication Number Publication Date
DE602005016463D1 true DE602005016463D1 (de) 2009-10-15

Family

ID=36192111

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005016463T Expired - Fee Related DE602005016463D1 (de) 2004-12-16 2005-12-15 Silberhaltige tintenstrahltinte

Country Status (5)

Country Link
US (1) US20060130700A1 (enExample)
EP (1) EP1846518B1 (enExample)
JP (1) JP2008524395A (enExample)
DE (1) DE602005016463D1 (enExample)
WO (1) WO2006066033A1 (enExample)

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JP2009529443A (ja) * 2006-03-09 2009-08-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー インクジェットインクセット
US9533523B2 (en) * 2006-05-31 2017-01-03 Sicpa Holding Sa Reflective features with co-planar elements and processes for making them
US7491646B2 (en) * 2006-07-20 2009-02-17 Xerox Corporation Electrically conductive feature fabrication process
JP2008047793A (ja) * 2006-08-21 2008-02-28 Konica Minolta Holdings Inc 金属パターンの形成方法
CA2612557A1 (en) * 2006-08-31 2008-03-15 Kruger Inc. Method of protecting a radio frequency identification inlay
DE102007037079A1 (de) 2006-10-25 2008-04-30 Bayer Materialscience Ag Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
US7615111B2 (en) * 2007-04-18 2009-11-10 Hewlett-Packard Development Company, L.P. Metallic inkjet ink and method for forming the same
CN101795794A (zh) * 2007-09-19 2010-08-04 E.I.内穆尔杜邦公司 通过还原银聚胺络合物来制备银球
JP2011515510A (ja) 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
WO2009132665A1 (en) * 2008-04-30 2009-11-05 Stichting Dutch Polymer Institute Method for generation of metal surface structures and use of silver complex for forming surface patterns
EP2315813A4 (en) * 2008-07-25 2012-11-28 Methode Electronics Inc METAL NANOPARTICLE INK COMPOSITIONS
CN101754584B (zh) * 2008-12-12 2012-01-25 清华大学 制备导电线路的方法
CN101768386B (zh) * 2009-01-07 2012-08-29 清华大学 墨水及采用该墨水制备导电线路的方法
CN101857217B (zh) * 2009-04-07 2013-03-20 清华大学 碳纳米管金属复合物及其制备方法
JP5977673B2 (ja) * 2009-11-09 2016-08-24 カーネギー メロン ユニバーシティ 金属インク組成物、導電性パターン、方法および素子
AT509296B1 (de) 2009-12-16 2015-05-15 Joanneum Res Forschungsgmbh Metallisch leitfähige tinte für tintenstrahldruck sowie verfahren zur herstellung derselben
WO2011126706A2 (en) * 2010-04-09 2011-10-13 Henkel Corporation Printable materials and methods of manufacture thereof
CN102248782B (zh) * 2010-05-14 2015-09-09 精工爱普生株式会社 喷墨记录方法和记录物
JP2011241241A (ja) 2010-05-14 2011-12-01 Seiko Epson Corp 水系インク組成物およびこれを用いた記録物
WO2012061171A2 (en) 2010-11-03 2012-05-10 Cabot Corporation Metallic dispersions for inkjet printing
US20140302292A1 (en) * 2010-12-15 2014-10-09 Newpage Corporation Inkjet printed electronic device
TWI567205B (zh) 2011-05-04 2017-01-21 黎可德Ｘ印製金屬公司 自分子油墨形成金屬合金之方法及組合物
WO2013063320A1 (en) 2011-10-28 2013-05-02 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
JP5891712B2 (ja) * 2011-11-02 2016-03-23 セイコーエプソン株式会社 記録物
KR102109390B1 (ko) * 2011-12-23 2020-05-12 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 전도성 은 구조체 제조용 잉크 조성물
TWI696668B (zh) 2012-02-27 2020-06-21 美商黎可德X印製金屬公司 可溶於極性質子溶劑之自還原性金屬錯合物墨水及改良的固化方法
JPWO2014046306A1 (ja) 2012-09-21 2016-08-18 住友化学株式会社 導電性膜形成用の組成物
KR102059805B1 (ko) * 2012-09-28 2019-12-27 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
US10849231B2 (en) * 2013-03-29 2020-11-24 Toppan Forms Co., Ltd. Laminate and circuit board
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
EP2883694A1 (en) * 2013-12-12 2015-06-17 Agfa Graphics Nv Laminated Safety Glass
JP6508481B2 (ja) * 2014-01-24 2019-05-08 トッパン・フォームズ株式会社 配線板
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US20170151347A1 (en) * 2015-11-29 2017-06-01 Berney PENG Functionalized nanoparticles with encapsulated cargo and method of their self-assembly
EP3390548B1 (en) * 2015-12-14 2021-06-02 King Abdullah University Of Science And Technology Silver-organo-complex ink with high conductivity and inkjet stability
EP3416771A4 (en) 2016-02-16 2019-10-16 Arizona Board of Regents on behalf of Arizona State University MANUFACTURE OF METAL OR CERAMIC COMPONENTS WITH 3D PRINTING WITH SOLDER SUPPORTS FROM ANOTHER MATERIAL
WO2018013178A1 (en) 2016-07-15 2018-01-18 Arizona Board Of Regents On Behalf Of Arizona State University Dissolving metal supports in 3d printed metals and ceramics using sensitization
JP2018130845A (ja) * 2017-02-13 2018-08-23 富士フイルム株式会社 画像記録方法及び記録物
CN110832040A (zh) 2017-05-15 2020-02-21 巴斯夫欧洲公司 制备金属纳米颗粒层的方法及其在装饰或安全元件中的用途
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Also Published As

Publication number Publication date
WO2006066033A1 (en) 2006-06-22
US20060130700A1 (en) 2006-06-22
JP2008524395A (ja) 2008-07-10
EP1846518B1 (en) 2009-09-02
EP1846518A1 (en) 2007-10-24

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee