JP2008507688A - 圧力試験のための圧力試験装置および方法 - Google Patents

圧力試験のための圧力試験装置および方法 Download PDF

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Publication number
JP2008507688A
JP2008507688A JP2007521967A JP2007521967A JP2008507688A JP 2008507688 A JP2008507688 A JP 2008507688A JP 2007521967 A JP2007521967 A JP 2007521967A JP 2007521967 A JP2007521967 A JP 2007521967A JP 2008507688 A JP2008507688 A JP 2008507688A
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Japan
Prior art keywords
pressure
support plate
housing
pressure chamber
wafer
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JP2007521967A
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English (en)
Japanese (ja)
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JP2008507688A5 (https=
Inventor
ヘントネン，ベサ
ハンヌカイネン，カリ
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アフォレ オサケユイチア
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Priority claimed from EP04396050A external-priority patent/EP1622195A1/en
Priority claimed from EP04396051A external-priority patent/EP1619716B1/en
Application filed by アフォレ オサケユイチア filed Critical アフォレ オサケユイチア
Publication of JP2008507688A publication Critical patent/JP2008507688A/ja
Publication of JP2008507688A5 publication Critical patent/JP2008507688A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G01N3/10—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by pneumatic or hydraulic pressure
    • G01N3/12—Pressure testing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
JP2007521967A 2004-07-21 2005-07-20 圧力試験のための圧力試験装置および方法 Pending JP2008507688A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04396050A EP1622195A1 (en) 2004-07-21 2004-07-21 Apparatus and method for testing devices fabricated in a wafer
EP04396051A EP1619716B1 (en) 2004-07-21 2004-07-21 Pressure testing apparatus and method for pressure testing
PCT/FI2005/000334 WO2006008337A1 (en) 2004-07-21 2005-07-20 Pressure testing apparatus and method for pressure testing

Publications (2)

Publication Number Publication Date
JP2008507688A true JP2008507688A (ja) 2008-03-13
JP2008507688A5 JP2008507688A5 (https=) 2008-08-14

Family

ID=35784899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007521967A Pending JP2008507688A (ja) 2004-07-21 2005-07-20 圧力試験のための圧力試験装置および方法

Country Status (4)

Country Link
US (1) US7595653B2 (https=)
JP (1) JP2008507688A (https=)
KR (1) KR20070034595A (https=)
WO (1) WO2006008337A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006008337A1 (en) 2004-07-21 2006-01-26 Afore Oy Pressure testing apparatus and method for pressure testing
WO2009117674A2 (en) * 2008-03-20 2009-09-24 University Of Utah Research Foundation Apparatus, system and methods for analyzing pressure-sensitive devices
CN103837185B (zh) * 2014-03-10 2016-08-24 上海华虹宏力半导体制造有限公司 测试仪器安装支架
US9527731B2 (en) 2014-10-15 2016-12-27 Nxp Usa, Inc. Methodology and system for wafer-level testing of MEMS pressure sensors
AT516900A1 (de) * 2015-03-09 2016-09-15 Dr Collin Gmbh Vorrichtung und Verfahren zum Testen von Werkstoffen
JP6156450B2 (ja) * 2015-07-15 2017-07-05 日亜化学工業株式会社 発光装置の外観検査方法
US11079406B2 (en) * 2016-08-31 2021-08-03 International Business Machines Corporation Semiconductor micro probe array having compliance
US11373890B2 (en) * 2018-12-17 2022-06-28 Applied Materials, Inc. Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
EP3734303B1 (en) * 2019-05-03 2024-04-03 Afore Oy Cryogenic probe station with loading assembly
CN110264653B (zh) * 2019-06-04 2020-12-11 国网浙江省电力有限公司衢州供电公司 一种基于物联网的头戴式身份识别及越界预警系统
KR102184158B1 (ko) * 2019-09-11 2020-11-30 한국표준과학연구원 어레이형 촉각센서의 성능 평가시스템
CN113447364A (zh) * 2021-07-01 2021-09-28 南京特敏传感技术有限公司 一种芯片耐压范围批量测量装备
CN114235272A (zh) * 2021-11-22 2022-03-25 中核检修有限公司 一种压差发讯器测试用治具及测试装置
CN114216790B (zh) * 2021-12-14 2024-03-19 杭州赛维动力科技有限公司 一种电力胶桶的自动检测装置
CN114720826B (zh) * 2022-04-07 2023-12-08 江苏宏飞线缆科技有限公司 一种风电专用线缆生产用耐压试验装置及方法
CN115356205B (zh) * 2022-07-27 2024-04-09 苏州信息职业技术学院 半导体芯片的打线质量测试系统与测试方法
CN117213829B (zh) * 2023-11-07 2024-01-23 山东永生机械有限公司 一种制动器总成用液压试压装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122546A (en) * 1981-01-22 1982-07-30 Toshiba Corp Sealing method for semiconductor enclosure
JPS6232332A (ja) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc 圧力検出素子の検定方法及び装置
JPS62170543A (ja) * 1986-01-21 1987-07-27 旭化成株式会社 ストツキング用仮撚加工糸
US20040020438A1 (en) * 2002-07-30 2004-02-05 Applied Materials, Inc. Managing work-piece deflection

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777716A (en) * 1986-08-25 1988-10-18 Motorola Inc. Method for low pressure testing of a solid state pressure sensor
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
JP2677913B2 (ja) * 1991-05-13 1997-11-17 三菱電機株式会社 半導体製造装置のシール機構および半導体装置の製造方法
JPH0735815A (ja) 1993-07-20 1995-02-07 Hitachi Ltd プレッシャークッカ試験装置
JPH088152A (ja) 1994-06-23 1996-01-12 Nippon Steel Corp 排気装置
US5677477A (en) 1996-02-20 1997-10-14 Motorola, Inc. Hermetic pressure sensor test chamber
US5668305A (en) * 1996-03-29 1997-09-16 Motorola, Inc. Method and apparatus for over pressure testing pressure sensitive devices on a wafer
US6596236B2 (en) * 1999-01-15 2003-07-22 Advanced Technology Materials, Inc. Micro-machined thin film sensor arrays for the detection of H2 containing gases, and method of making and using the same
US6373271B1 (en) 1999-12-29 2002-04-16 Motorola, Inc. Semiconductor wafer front side pressure testing system and method therefor
US6867608B2 (en) * 2002-07-16 2005-03-15 Aehr Test Systems Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
JP4285063B2 (ja) 2003-04-28 2009-06-24 ソニー株式会社 半導体チップの検査方法及びその方法を用いた半導体チップ検査装置
TW200506375A (en) * 2003-05-16 2005-02-16 Tokyo Electron Ltd Inspection apparatus
WO2006008337A1 (en) 2004-07-21 2006-01-26 Afore Oy Pressure testing apparatus and method for pressure testing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122546A (en) * 1981-01-22 1982-07-30 Toshiba Corp Sealing method for semiconductor enclosure
JPS6232332A (ja) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc 圧力検出素子の検定方法及び装置
JPS62170543A (ja) * 1986-01-21 1987-07-27 旭化成株式会社 ストツキング用仮撚加工糸
US20040020438A1 (en) * 2002-07-30 2004-02-05 Applied Materials, Inc. Managing work-piece deflection

Also Published As

Publication number Publication date
WO2006008337A1 (en) 2006-01-26
US20070245808A1 (en) 2007-10-25
US7595653B2 (en) 2009-09-29
WO2006008337A8 (en) 2006-04-13
KR20070034595A (ko) 2007-03-28

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