KR20070034595A - 압력 테스트 장치 및 압력 테스트 방법 - Google Patents

압력 테스트 장치 및 압력 테스트 방법 Download PDF

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Publication number
KR20070034595A
KR20070034595A KR1020077001249A KR20077001249A KR20070034595A KR 20070034595 A KR20070034595 A KR 20070034595A KR 1020077001249 A KR1020077001249 A KR 1020077001249A KR 20077001249 A KR20077001249 A KR 20077001249A KR 20070034595 A KR20070034595 A KR 20070034595A
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KR
South Korea
Prior art keywords
pressure
housing
wafer
support plate
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077001249A
Other languages
English (en)
Korean (ko)
Inventor
베사 헨토넨
카리 하누카이넨
Original Assignee
어포어 오와이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP04396050A external-priority patent/EP1622195A1/en
Priority claimed from EP04396051A external-priority patent/EP1619716B1/en
Application filed by 어포어 오와이 filed Critical 어포어 오와이
Publication of KR20070034595A publication Critical patent/KR20070034595A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G01N3/10—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by pneumatic or hydraulic pressure
    • G01N3/12—Pressure testing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
KR1020077001249A 2004-07-21 2005-07-20 압력 테스트 장치 및 압력 테스트 방법 Withdrawn KR20070034595A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP04396050.9 2004-07-21
EP04396051.7 2004-07-21
EP04396050A EP1622195A1 (en) 2004-07-21 2004-07-21 Apparatus and method for testing devices fabricated in a wafer
EP04396051A EP1619716B1 (en) 2004-07-21 2004-07-21 Pressure testing apparatus and method for pressure testing
PCT/FI2005/000334 WO2006008337A1 (en) 2004-07-21 2005-07-20 Pressure testing apparatus and method for pressure testing

Publications (1)

Publication Number Publication Date
KR20070034595A true KR20070034595A (ko) 2007-03-28

Family

ID=35784899

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077001249A Withdrawn KR20070034595A (ko) 2004-07-21 2005-07-20 압력 테스트 장치 및 압력 테스트 방법

Country Status (4)

Country Link
US (1) US7595653B2 (https=)
JP (1) JP2008507688A (https=)
KR (1) KR20070034595A (https=)
WO (1) WO2006008337A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006008337A1 (en) 2004-07-21 2006-01-26 Afore Oy Pressure testing apparatus and method for pressure testing
WO2009117674A2 (en) * 2008-03-20 2009-09-24 University Of Utah Research Foundation Apparatus, system and methods for analyzing pressure-sensitive devices
CN103837185B (zh) * 2014-03-10 2016-08-24 上海华虹宏力半导体制造有限公司 测试仪器安装支架
US9527731B2 (en) 2014-10-15 2016-12-27 Nxp Usa, Inc. Methodology and system for wafer-level testing of MEMS pressure sensors
AT516900A1 (de) * 2015-03-09 2016-09-15 Dr Collin Gmbh Vorrichtung und Verfahren zum Testen von Werkstoffen
JP6156450B2 (ja) * 2015-07-15 2017-07-05 日亜化学工業株式会社 発光装置の外観検査方法
US11079406B2 (en) * 2016-08-31 2021-08-03 International Business Machines Corporation Semiconductor micro probe array having compliance
US11373890B2 (en) * 2018-12-17 2022-06-28 Applied Materials, Inc. Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
EP3734303B1 (en) * 2019-05-03 2024-04-03 Afore Oy Cryogenic probe station with loading assembly
CN110264653B (zh) * 2019-06-04 2020-12-11 国网浙江省电力有限公司衢州供电公司 一种基于物联网的头戴式身份识别及越界预警系统
KR102184158B1 (ko) * 2019-09-11 2020-11-30 한국표준과학연구원 어레이형 촉각센서의 성능 평가시스템
CN113447364A (zh) * 2021-07-01 2021-09-28 南京特敏传感技术有限公司 一种芯片耐压范围批量测量装备
CN114235272A (zh) * 2021-11-22 2022-03-25 中核检修有限公司 一种压差发讯器测试用治具及测试装置
CN114216790B (zh) * 2021-12-14 2024-03-19 杭州赛维动力科技有限公司 一种电力胶桶的自动检测装置
CN114720826B (zh) * 2022-04-07 2023-12-08 江苏宏飞线缆科技有限公司 一种风电专用线缆生产用耐压试验装置及方法
CN115356205B (zh) * 2022-07-27 2024-04-09 苏州信息职业技术学院 半导体芯片的打线质量测试系统与测试方法
CN117213829B (zh) * 2023-11-07 2024-01-23 山东永生机械有限公司 一种制动器总成用液压试压装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122546A (en) * 1981-01-22 1982-07-30 Toshiba Corp Sealing method for semiconductor enclosure
JPS6232332A (ja) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc 圧力検出素子の検定方法及び装置
JPS62170543A (ja) * 1986-01-21 1987-07-27 旭化成株式会社 ストツキング用仮撚加工糸
US4777716A (en) * 1986-08-25 1988-10-18 Motorola Inc. Method for low pressure testing of a solid state pressure sensor
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
JP2677913B2 (ja) * 1991-05-13 1997-11-17 三菱電機株式会社 半導体製造装置のシール機構および半導体装置の製造方法
JPH0735815A (ja) 1993-07-20 1995-02-07 Hitachi Ltd プレッシャークッカ試験装置
JPH088152A (ja) 1994-06-23 1996-01-12 Nippon Steel Corp 排気装置
US5677477A (en) 1996-02-20 1997-10-14 Motorola, Inc. Hermetic pressure sensor test chamber
US5668305A (en) * 1996-03-29 1997-09-16 Motorola, Inc. Method and apparatus for over pressure testing pressure sensitive devices on a wafer
US6596236B2 (en) * 1999-01-15 2003-07-22 Advanced Technology Materials, Inc. Micro-machined thin film sensor arrays for the detection of H2 containing gases, and method of making and using the same
US6373271B1 (en) 1999-12-29 2002-04-16 Motorola, Inc. Semiconductor wafer front side pressure testing system and method therefor
US6867608B2 (en) * 2002-07-16 2005-03-15 Aehr Test Systems Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US6932873B2 (en) * 2002-07-30 2005-08-23 Applied Materials Israel, Ltd. Managing work-piece deflection
JP4285063B2 (ja) 2003-04-28 2009-06-24 ソニー株式会社 半導体チップの検査方法及びその方法を用いた半導体チップ検査装置
TW200506375A (en) * 2003-05-16 2005-02-16 Tokyo Electron Ltd Inspection apparatus
WO2006008337A1 (en) 2004-07-21 2006-01-26 Afore Oy Pressure testing apparatus and method for pressure testing

Also Published As

Publication number Publication date
WO2006008337A1 (en) 2006-01-26
JP2008507688A (ja) 2008-03-13
US20070245808A1 (en) 2007-10-25
US7595653B2 (en) 2009-09-29
WO2006008337A8 (en) 2006-04-13

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

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St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000