JP2008504963A5 - - Google Patents

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Publication number
JP2008504963A5
JP2008504963A5 JP2007519215A JP2007519215A JP2008504963A5 JP 2008504963 A5 JP2008504963 A5 JP 2008504963A5 JP 2007519215 A JP2007519215 A JP 2007519215A JP 2007519215 A JP2007519215 A JP 2007519215A JP 2008504963 A5 JP2008504963 A5 JP 2008504963A5
Authority
JP
Japan
Prior art keywords
carrier
solder
solder system
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007519215A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008504963A (ja
JP5159306B2 (ja
Filing date
Publication date
Priority claimed from US10/879,242 external-priority patent/US7074627B2/en
Application filed filed Critical
Publication of JP2008504963A publication Critical patent/JP2008504963A/ja
Publication of JP2008504963A5 publication Critical patent/JP2008504963A5/ja
Application granted granted Critical
Publication of JP5159306B2 publication Critical patent/JP5159306B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007519215A 2004-06-29 2005-05-19 鉛はんだインジケータ及び方法 Expired - Fee Related JP5159306B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/879,242 US7074627B2 (en) 2004-06-29 2004-06-29 Lead solder indicator and method
US10/879,242 2004-06-29
PCT/US2005/017702 WO2006007141A2 (en) 2004-06-29 2005-05-19 Lead solder indicator and method

Publications (3)

Publication Number Publication Date
JP2008504963A JP2008504963A (ja) 2008-02-21
JP2008504963A5 true JP2008504963A5 (https=) 2008-07-10
JP5159306B2 JP5159306B2 (ja) 2013-03-06

Family

ID=35504780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007519215A Expired - Fee Related JP5159306B2 (ja) 2004-06-29 2005-05-19 鉛はんだインジケータ及び方法

Country Status (8)

Country Link
US (1) US7074627B2 (https=)
EP (1) EP1761951A4 (https=)
JP (1) JP5159306B2 (https=)
KR (1) KR101227210B1 (https=)
CN (1) CN100501960C (https=)
MY (1) MY139006A (https=)
TW (1) TWI407514B (https=)
WO (1) WO2006007141A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
WO2010050026A1 (ja) * 2008-10-30 2010-05-06 トヨタ自動車株式会社 被検査物に存在する鉛を検出する方法
KR101097488B1 (ko) * 2009-09-08 2011-12-22 삼성전기주식회사 핀 그리드 어레이 기판의 제조방법
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
WO2021046818A1 (en) * 2019-09-12 2021-03-18 Yangtze Memory Technologies Co., Ltd. Electronic component comprising substrate with thermal indicator
WO2021240979A1 (ja) * 2020-05-28 2021-12-02 パナソニックＩｐマネジメント株式会社 実装基板製造装置および実装基板製造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330917A (en) 1989-02-02 1994-07-19 Hybrivet Systems, Inc. Test swab device and method of detecting lead, mercury, arsenic, and bismuth
US5039618A (en) 1989-02-02 1991-08-13 Hybrivet Systems, Inc. Test swab cartridge type device and method for detecting lead and cadmium
US5364792A (en) * 1989-02-02 1994-11-15 Hybrivet Systems, Inc. Test swab and method of making and using same
DE4034087A1 (de) * 1989-10-27 1991-05-23 Tsubakimoto Chain Co Spannvorrichtung
US5086966A (en) 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5120678A (en) 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5088007A (en) 1991-04-04 1992-02-11 Motorola, Inc. Compliant solder interconnection
US5229070A (en) 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5320272A (en) 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5523920A (en) 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5519535A (en) 1994-04-04 1996-05-21 Motorola, Inc. Precision placement apparatus having liquid crystal shuttered dual prism probe
US5708812A (en) * 1996-01-18 1998-01-13 Microsoft Corporation Method and apparatus for Migrating from a source domain network controller to a target domain network controller
JP2000515968A (ja) * 1996-07-12 2000-11-28 アイビーシー・アドヴァンスト・テクノロジーズ・インコーポレーテッド イオンの比色定量方法
US5832274A (en) * 1996-10-09 1998-11-03 Novell, Inc. Method and system for migrating files from a first environment to a second environment
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
JP2002511929A (ja) * 1997-06-11 2002-04-16 アメリカ合衆国 鉛の存在をハンドワイプで明らかにする方法
JPH11272427A (ja) * 1998-03-24 1999-10-08 Hitachi Ltd データ退避方法および外部記憶装置
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6462413B1 (en) 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
JP2001208742A (ja) * 2000-01-26 2001-08-03 Hitachi Ltd 鉛検出用治具
ATE400395T1 (de) * 2000-11-29 2008-07-15 Senju Metal Industry Co Lötpasten
CN1209222C (zh) * 2001-07-25 2005-07-06 邓和升 铝焊锡丝
US6640291B2 (en) * 2001-08-10 2003-10-28 Hitachi, Ltd. Apparatus and method for online data migration with remote copy
JP4168626B2 (ja) * 2001-12-06 2008-10-22 株式会社日立製作所 記憶装置間のファイル移行方法
US7007046B2 (en) * 2002-03-19 2006-02-28 Network Appliance, Inc. Format for transmission file system information between a source and a destination
JP2004102374A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd データ移行装置を有する情報処理システム
JP4411929B2 (ja) * 2003-02-28 2010-02-10 株式会社日立製作所 バックアップ方法、システム、及びプログラム
CN1189738C (zh) * 2003-06-11 2005-02-16 中国人民解放军军事医学科学院卫生学环境医学研究所 一种铅检测试纸及其制备方法

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