KR101227210B1 - 리드 땜납 표시자 및 그 방법 - Google Patents

리드 땜납 표시자 및 그 방법 Download PDF

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Publication number
KR101227210B1
KR101227210B1 KR1020067027716A KR20067027716A KR101227210B1 KR 101227210 B1 KR101227210 B1 KR 101227210B1 KR 1020067027716 A KR1020067027716 A KR 1020067027716A KR 20067027716 A KR20067027716 A KR 20067027716A KR 101227210 B1 KR101227210 B1 KR 101227210B1
Authority
KR
South Korea
Prior art keywords
lead
solder
carrier
indicator
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067027716A
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English (en)
Korean (ko)
Other versions
KR20070083395A (ko
Inventor
테리 이. 버네트
토마스 에이치. 코시미더
Original Assignee
프리스케일 세미컨덕터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR20070083395A publication Critical patent/KR20070083395A/ko
Application granted granted Critical
Publication of KR101227210B1 publication Critical patent/KR101227210B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR1020067027716A 2004-06-29 2005-05-19 리드 땜납 표시자 및 그 방법 Expired - Fee Related KR101227210B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/879,242 US7074627B2 (en) 2004-06-29 2004-06-29 Lead solder indicator and method
US10/879,242 2004-06-29
PCT/US2005/017702 WO2006007141A2 (en) 2004-06-29 2005-05-19 Lead solder indicator and method

Publications (2)

Publication Number Publication Date
KR20070083395A KR20070083395A (ko) 2007-08-24
KR101227210B1 true KR101227210B1 (ko) 2013-01-28

Family

ID=35504780

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067027716A Expired - Fee Related KR101227210B1 (ko) 2004-06-29 2005-05-19 리드 땜납 표시자 및 그 방법

Country Status (8)

Country Link
US (1) US7074627B2 (https=)
EP (1) EP1761951A4 (https=)
JP (1) JP5159306B2 (https=)
KR (1) KR101227210B1 (https=)
CN (1) CN100501960C (https=)
MY (1) MY139006A (https=)
TW (1) TWI407514B (https=)
WO (1) WO2006007141A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
WO2010050026A1 (ja) * 2008-10-30 2010-05-06 トヨタ自動車株式会社 被検査物に存在する鉛を検出する方法
KR101097488B1 (ko) * 2009-09-08 2011-12-22 삼성전기주식회사 핀 그리드 어레이 기판의 제조방법
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
WO2021046818A1 (en) * 2019-09-12 2021-03-18 Yangtze Memory Technologies Co., Ltd. Electronic component comprising substrate with thermal indicator
WO2021240979A1 (ja) * 2020-05-28 2021-12-02 パナソニックＩｐマネジメント株式会社 実装基板製造装置および実装基板製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187114B1 (en) * 1996-10-17 2001-02-13 Matsushita Electric Industrial Co. Ltd. Solder material and electronic part using the same

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US5330917A (en) 1989-02-02 1994-07-19 Hybrivet Systems, Inc. Test swab device and method of detecting lead, mercury, arsenic, and bismuth
US5039618A (en) 1989-02-02 1991-08-13 Hybrivet Systems, Inc. Test swab cartridge type device and method for detecting lead and cadmium
US5364792A (en) * 1989-02-02 1994-11-15 Hybrivet Systems, Inc. Test swab and method of making and using same
DE4034087A1 (de) * 1989-10-27 1991-05-23 Tsubakimoto Chain Co Spannvorrichtung
US5086966A (en) 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5120678A (en) 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5088007A (en) 1991-04-04 1992-02-11 Motorola, Inc. Compliant solder interconnection
US5229070A (en) 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5320272A (en) 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5523920A (en) 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5519535A (en) 1994-04-04 1996-05-21 Motorola, Inc. Precision placement apparatus having liquid crystal shuttered dual prism probe
US5708812A (en) * 1996-01-18 1998-01-13 Microsoft Corporation Method and apparatus for Migrating from a source domain network controller to a target domain network controller
JP2000515968A (ja) * 1996-07-12 2000-11-28 アイビーシー・アドヴァンスト・テクノロジーズ・インコーポレーテッド イオンの比色定量方法
US5832274A (en) * 1996-10-09 1998-11-03 Novell, Inc. Method and system for migrating files from a first environment to a second environment
JP2002511929A (ja) * 1997-06-11 2002-04-16 アメリカ合衆国 鉛の存在をハンドワイプで明らかにする方法
JPH11272427A (ja) * 1998-03-24 1999-10-08 Hitachi Ltd データ退避方法および外部記憶装置
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
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JP4168626B2 (ja) * 2001-12-06 2008-10-22 株式会社日立製作所 記憶装置間のファイル移行方法
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Also Published As

Publication number Publication date
CN1977370A (zh) 2007-06-06
US7074627B2 (en) 2006-07-11
JP2008504963A (ja) 2008-02-21
WO2006007141A3 (en) 2006-10-05
WO2006007141A2 (en) 2006-01-19
TWI407514B (zh) 2013-09-01
KR20070083395A (ko) 2007-08-24
EP1761951A4 (en) 2009-09-09
EP1761951A2 (en) 2007-03-14
TW200625484A (en) 2006-07-16
JP5159306B2 (ja) 2013-03-06
MY139006A (en) 2009-08-28
CN100501960C (zh) 2009-06-17
US20050285274A1 (en) 2005-12-29

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