MY139006A - Lead solder indicator and method - Google Patents

Lead solder indicator and method

Info

Publication number
MY139006A
MY139006A MYPI20052523A MYPI20052523A MY139006A MY 139006 A MY139006 A MY 139006A MY PI20052523 A MYPI20052523 A MY PI20052523A MY PI20052523 A MYPI20052523 A MY PI20052523A MY 139006 A MY139006 A MY 139006A
Authority
MY
Malaysia
Prior art keywords
solder
carrier
indicator
semiconductor device
solder system
Prior art date
Application number
MYPI20052523A
Other languages
English (en)
Inventor
Terry E Burnette
Thomas H Koschmieder
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of MY139006A publication Critical patent/MY139006A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
MYPI20052523A 2004-06-29 2005-06-02 Lead solder indicator and method MY139006A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/879,242 US7074627B2 (en) 2004-06-29 2004-06-29 Lead solder indicator and method

Publications (1)

Publication Number Publication Date
MY139006A true MY139006A (en) 2009-08-28

Family

ID=35504780

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20052523A MY139006A (en) 2004-06-29 2005-06-02 Lead solder indicator and method

Country Status (8)

Country Link
US (1) US7074627B2 (https=)
EP (1) EP1761951A4 (https=)
JP (1) JP5159306B2 (https=)
KR (1) KR101227210B1 (https=)
CN (1) CN100501960C (https=)
MY (1) MY139006A (https=)
TW (1) TWI407514B (https=)
WO (1) WO2006007141A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
WO2010050026A1 (ja) * 2008-10-30 2010-05-06 トヨタ自動車株式会社 被検査物に存在する鉛を検出する方法
KR101097488B1 (ko) * 2009-09-08 2011-12-22 삼성전기주식회사 핀 그리드 어레이 기판의 제조방법
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
WO2021046818A1 (en) * 2019-09-12 2021-03-18 Yangtze Memory Technologies Co., Ltd. Electronic component comprising substrate with thermal indicator
WO2021240979A1 (ja) * 2020-05-28 2021-12-02 パナソニックＩｐマネジメント株式会社 実装基板製造装置および実装基板製造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330917A (en) 1989-02-02 1994-07-19 Hybrivet Systems, Inc. Test swab device and method of detecting lead, mercury, arsenic, and bismuth
US5039618A (en) 1989-02-02 1991-08-13 Hybrivet Systems, Inc. Test swab cartridge type device and method for detecting lead and cadmium
US5364792A (en) * 1989-02-02 1994-11-15 Hybrivet Systems, Inc. Test swab and method of making and using same
DE4034087A1 (de) * 1989-10-27 1991-05-23 Tsubakimoto Chain Co Spannvorrichtung
US5086966A (en) 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5120678A (en) 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5088007A (en) 1991-04-04 1992-02-11 Motorola, Inc. Compliant solder interconnection
US5229070A (en) 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5320272A (en) 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5523920A (en) 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5519535A (en) 1994-04-04 1996-05-21 Motorola, Inc. Precision placement apparatus having liquid crystal shuttered dual prism probe
US5708812A (en) * 1996-01-18 1998-01-13 Microsoft Corporation Method and apparatus for Migrating from a source domain network controller to a target domain network controller
JP2000515968A (ja) * 1996-07-12 2000-11-28 アイビーシー・アドヴァンスト・テクノロジーズ・インコーポレーテッド イオンの比色定量方法
US5832274A (en) * 1996-10-09 1998-11-03 Novell, Inc. Method and system for migrating files from a first environment to a second environment
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
JP2002511929A (ja) * 1997-06-11 2002-04-16 アメリカ合衆国 鉛の存在をハンドワイプで明らかにする方法
JPH11272427A (ja) * 1998-03-24 1999-10-08 Hitachi Ltd データ退避方法および外部記憶装置
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6462413B1 (en) 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
JP2001208742A (ja) * 2000-01-26 2001-08-03 Hitachi Ltd 鉛検出用治具
ATE400395T1 (de) * 2000-11-29 2008-07-15 Senju Metal Industry Co Lötpasten
CN1209222C (zh) * 2001-07-25 2005-07-06 邓和升 铝焊锡丝
US6640291B2 (en) * 2001-08-10 2003-10-28 Hitachi, Ltd. Apparatus and method for online data migration with remote copy
JP4168626B2 (ja) * 2001-12-06 2008-10-22 株式会社日立製作所 記憶装置間のファイル移行方法
US7007046B2 (en) * 2002-03-19 2006-02-28 Network Appliance, Inc. Format for transmission file system information between a source and a destination
JP2004102374A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd データ移行装置を有する情報処理システム
JP4411929B2 (ja) * 2003-02-28 2010-02-10 株式会社日立製作所 バックアップ方法、システム、及びプログラム
CN1189738C (zh) * 2003-06-11 2005-02-16 中国人民解放军军事医学科学院卫生学环境医学研究所 一种铅检测试纸及其制备方法

Also Published As

Publication number Publication date
CN1977370A (zh) 2007-06-06
US7074627B2 (en) 2006-07-11
JP2008504963A (ja) 2008-02-21
WO2006007141A3 (en) 2006-10-05
WO2006007141A2 (en) 2006-01-19
TWI407514B (zh) 2013-09-01
KR20070083395A (ko) 2007-08-24
EP1761951A4 (en) 2009-09-09
EP1761951A2 (en) 2007-03-14
TW200625484A (en) 2006-07-16
JP5159306B2 (ja) 2013-03-06
CN100501960C (zh) 2009-06-17
US20050285274A1 (en) 2005-12-29
KR101227210B1 (ko) 2013-01-28

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