CN100501960C - 铅焊料指示剂和方法 - Google Patents

铅焊料指示剂和方法 Download PDF

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Publication number
CN100501960C
CN100501960C CNB2005800217949A CN200580021794A CN100501960C CN 100501960 C CN100501960 C CN 100501960C CN B2005800217949 A CNB2005800217949 A CN B2005800217949A CN 200580021794 A CN200580021794 A CN 200580021794A CN 100501960 C CN100501960 C CN 100501960C
Authority
CN
China
Prior art keywords
lead
solder system
solder
carrier
indicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800217949A
Other languages
English (en)
Chinese (zh)
Other versions
CN1977370A (zh
Inventor
特里·E·伯内特
托马斯·H·科施米德尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN1977370A publication Critical patent/CN1977370A/zh
Application granted granted Critical
Publication of CN100501960C publication Critical patent/CN100501960C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CNB2005800217949A 2004-06-29 2005-05-19 铅焊料指示剂和方法 Expired - Fee Related CN100501960C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/879,242 US7074627B2 (en) 2004-06-29 2004-06-29 Lead solder indicator and method
US10/879,242 2004-06-29

Publications (2)

Publication Number Publication Date
CN1977370A CN1977370A (zh) 2007-06-06
CN100501960C true CN100501960C (zh) 2009-06-17

Family

ID=35504780

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800217949A Expired - Fee Related CN100501960C (zh) 2004-06-29 2005-05-19 铅焊料指示剂和方法

Country Status (8)

Country Link
US (1) US7074627B2 (https=)
EP (1) EP1761951A4 (https=)
JP (1) JP5159306B2 (https=)
KR (1) KR101227210B1 (https=)
CN (1) CN100501960C (https=)
MY (1) MY139006A (https=)
TW (1) TWI407514B (https=)
WO (1) WO2006007141A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
WO2010050026A1 (ja) * 2008-10-30 2010-05-06 トヨタ自動車株式会社 被検査物に存在する鉛を検出する方法
KR101097488B1 (ko) * 2009-09-08 2011-12-22 삼성전기주식회사 핀 그리드 어레이 기판의 제조방법
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
WO2021046818A1 (en) * 2019-09-12 2021-03-18 Yangtze Memory Technologies Co., Ltd. Electronic component comprising substrate with thermal indicator
WO2021240979A1 (ja) * 2020-05-28 2021-12-02 パナソニックＩｐマネジメント株式会社 実装基板製造装置および実装基板製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187114B1 (en) * 1996-10-17 2001-02-13 Matsushita Electric Industrial Co. Ltd. Solder material and electronic part using the same
JP2001208742A (ja) * 2000-01-26 2001-08-03 Hitachi Ltd 鉛検出用治具
CN1398695A (zh) * 2001-07-25 2003-02-26 邓和升 铝焊锡丝
CN1458515A (zh) * 2003-06-11 2003-11-26 中国人民解放军军事医学科学院卫生学环境医学研究所 一种铅检测试纸及其制备方法
CN1478009A (zh) * 2000-11-29 2004-02-25 ǧס������ҵ��ʽ���� 焊锡膏

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US5330917A (en) 1989-02-02 1994-07-19 Hybrivet Systems, Inc. Test swab device and method of detecting lead, mercury, arsenic, and bismuth
US5039618A (en) 1989-02-02 1991-08-13 Hybrivet Systems, Inc. Test swab cartridge type device and method for detecting lead and cadmium
US5364792A (en) * 1989-02-02 1994-11-15 Hybrivet Systems, Inc. Test swab and method of making and using same
DE4034087A1 (de) * 1989-10-27 1991-05-23 Tsubakimoto Chain Co Spannvorrichtung
US5086966A (en) 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5120678A (en) 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5088007A (en) 1991-04-04 1992-02-11 Motorola, Inc. Compliant solder interconnection
US5229070A (en) 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5320272A (en) 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5523920A (en) 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5519535A (en) 1994-04-04 1996-05-21 Motorola, Inc. Precision placement apparatus having liquid crystal shuttered dual prism probe
US5708812A (en) * 1996-01-18 1998-01-13 Microsoft Corporation Method and apparatus for Migrating from a source domain network controller to a target domain network controller
JP2000515968A (ja) * 1996-07-12 2000-11-28 アイビーシー・アドヴァンスト・テクノロジーズ・インコーポレーテッド イオンの比色定量方法
US5832274A (en) * 1996-10-09 1998-11-03 Novell, Inc. Method and system for migrating files from a first environment to a second environment
JP2002511929A (ja) * 1997-06-11 2002-04-16 アメリカ合衆国 鉛の存在をハンドワイプで明らかにする方法
JPH11272427A (ja) * 1998-03-24 1999-10-08 Hitachi Ltd データ退避方法および外部記憶装置
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6462413B1 (en) 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
US6640291B2 (en) * 2001-08-10 2003-10-28 Hitachi, Ltd. Apparatus and method for online data migration with remote copy
JP4168626B2 (ja) * 2001-12-06 2008-10-22 株式会社日立製作所 記憶装置間のファイル移行方法
US7007046B2 (en) * 2002-03-19 2006-02-28 Network Appliance, Inc. Format for transmission file system information between a source and a destination
JP2004102374A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd データ移行装置を有する情報処理システム
JP4411929B2 (ja) * 2003-02-28 2010-02-10 株式会社日立製作所 バックアップ方法、システム、及びプログラム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187114B1 (en) * 1996-10-17 2001-02-13 Matsushita Electric Industrial Co. Ltd. Solder material and electronic part using the same
JP2001208742A (ja) * 2000-01-26 2001-08-03 Hitachi Ltd 鉛検出用治具
CN1478009A (zh) * 2000-11-29 2004-02-25 ǧס������ҵ��ʽ���� 焊锡膏
CN1398695A (zh) * 2001-07-25 2003-02-26 邓和升 铝焊锡丝
CN1458515A (zh) * 2003-06-11 2003-11-26 中国人民解放军军事医学科学院卫生学环境医学研究所 一种铅检测试纸及其制备方法

Also Published As

Publication number Publication date
CN1977370A (zh) 2007-06-06
US7074627B2 (en) 2006-07-11
JP2008504963A (ja) 2008-02-21
WO2006007141A3 (en) 2006-10-05
WO2006007141A2 (en) 2006-01-19
TWI407514B (zh) 2013-09-01
KR20070083395A (ko) 2007-08-24
EP1761951A4 (en) 2009-09-09
EP1761951A2 (en) 2007-03-14
TW200625484A (en) 2006-07-16
JP5159306B2 (ja) 2013-03-06
MY139006A (en) 2009-08-28
US20050285274A1 (en) 2005-12-29
KR101227210B1 (ko) 2013-01-28

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Texas in the United States

Patentee after: NXP USA, Inc.

Address before: Texas in the United States

Patentee before: FREESCALE SEMICONDUCTOR, Inc.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090617