JP2008311270A - プリント配線板およびその製造方法 - Google Patents
プリント配線板およびその製造方法 Download PDFInfo
- Publication number
- JP2008311270A JP2008311270A JP2007154903A JP2007154903A JP2008311270A JP 2008311270 A JP2008311270 A JP 2008311270A JP 2007154903 A JP2007154903 A JP 2007154903A JP 2007154903 A JP2007154903 A JP 2007154903A JP 2008311270 A JP2008311270 A JP 2008311270A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- printed wiring
- transmission line
- signal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007154903A JP2008311270A (ja) | 2007-06-12 | 2007-06-12 | プリント配線板およびその製造方法 |
PCT/JP2008/051490 WO2008152827A1 (fr) | 2007-06-12 | 2008-01-31 | Carte de câblage imprimé et procédé pour sa fabrication |
TW97106622A TW200850098A (en) | 2007-06-12 | 2008-02-26 | Printed-wiring board and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007154903A JP2008311270A (ja) | 2007-06-12 | 2007-06-12 | プリント配線板およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008311270A true JP2008311270A (ja) | 2008-12-25 |
Family
ID=40129441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007154903A Pending JP2008311270A (ja) | 2007-06-12 | 2007-06-12 | プリント配線板およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2008311270A (fr) |
TW (1) | TW200850098A (fr) |
WO (1) | WO2008152827A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105578733B (zh) * | 2016-02-26 | 2019-03-05 | 青岛海信移动通信技术股份有限公司 | 一种pcb及其制作方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04313300A (ja) * | 1991-04-10 | 1992-11-05 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板 |
JP2002324949A (ja) * | 2001-04-24 | 2002-11-08 | Nippon Mektron Ltd | 回路基板及びその製造法 |
JP3969523B2 (ja) * | 2002-02-25 | 2007-09-05 | 独立行政法人産業技術総合研究所 | プリント配線基板の製造方法 |
JP2004119604A (ja) * | 2002-09-25 | 2004-04-15 | Nippon Mektron Ltd | シールド型回路基板およびその製造方法 |
JP2006041102A (ja) * | 2004-07-26 | 2006-02-09 | Fujikura Ltd | プリント配線板およびその製造方法 |
-
2007
- 2007-06-12 JP JP2007154903A patent/JP2008311270A/ja active Pending
-
2008
- 2008-01-31 WO PCT/JP2008/051490 patent/WO2008152827A1/fr active Application Filing
- 2008-02-26 TW TW97106622A patent/TW200850098A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2008152827A1 (fr) | 2008-12-18 |
TW200850098A (en) | 2008-12-16 |
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