JP2008300806A - 基板処理装置、露光装置及びデバイス製造方法 - Google Patents

基板処理装置、露光装置及びデバイス製造方法 Download PDF

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Publication number
JP2008300806A
JP2008300806A JP2007148622A JP2007148622A JP2008300806A JP 2008300806 A JP2008300806 A JP 2008300806A JP 2007148622 A JP2007148622 A JP 2007148622A JP 2007148622 A JP2007148622 A JP 2007148622A JP 2008300806 A JP2008300806 A JP 2008300806A
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JP
Japan
Prior art keywords
cold trap
substrate processing
door
substrate
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007148622A
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English (en)
Japanese (ja)
Other versions
JP2008300806A5 (enExample
Inventor
Toshikazu Oki
俊和 大木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007148622A priority Critical patent/JP2008300806A/ja
Priority to US12/123,541 priority patent/US20080299493A1/en
Priority to EP08156643A priority patent/EP2000854A3/en
Priority to EP09180374A priority patent/EP2161351A1/en
Priority to TW097119725A priority patent/TW200913008A/zh
Priority to KR1020080052369A priority patent/KR20080106859A/ko
Publication of JP2008300806A publication Critical patent/JP2008300806A/ja
Publication of JP2008300806A5 publication Critical patent/JP2008300806A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

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  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
JP2007148622A 2007-06-04 2007-06-04 基板処理装置、露光装置及びデバイス製造方法 Pending JP2008300806A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007148622A JP2008300806A (ja) 2007-06-04 2007-06-04 基板処理装置、露光装置及びデバイス製造方法
US12/123,541 US20080299493A1 (en) 2007-06-04 2008-05-20 Substrate processing apparatus and method of manufacturing device
EP08156643A EP2000854A3 (en) 2007-06-04 2008-05-21 Substrate processing apparatus and method of manufacturing device
EP09180374A EP2161351A1 (en) 2007-06-04 2008-05-21 Substrate processing apparatus and method of manufacturing a device
TW097119725A TW200913008A (en) 2007-06-04 2008-05-28 Substrate processing apparatus and method of manufacturing device
KR1020080052369A KR20080106859A (ko) 2007-06-04 2008-06-04 기판처리장치 및 디바이스의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007148622A JP2008300806A (ja) 2007-06-04 2007-06-04 基板処理装置、露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2008300806A true JP2008300806A (ja) 2008-12-11
JP2008300806A5 JP2008300806A5 (enExample) 2010-07-15

Family

ID=39769412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007148622A Pending JP2008300806A (ja) 2007-06-04 2007-06-04 基板処理装置、露光装置及びデバイス製造方法

Country Status (5)

Country Link
US (1) US20080299493A1 (enExample)
EP (2) EP2000854A3 (enExample)
JP (1) JP2008300806A (enExample)
KR (1) KR20080106859A (enExample)
TW (1) TW200913008A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159939A (ja) * 2010-02-04 2011-08-18 Canon Inc 捕獲器、真空容器、処理装置、及びデバイス製造方法
JP2016134553A (ja) * 2015-01-21 2016-07-25 東京エレクトロン株式会社 ガス供給系清浄化方法および基板処理装置
WO2021045867A1 (en) * 2019-09-06 2021-03-11 Lam Research Corporation Sorption chamber walls for semiconductor equipment

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300806A (ja) 2007-06-04 2008-12-11 Canon Inc 基板処理装置、露光装置及びデバイス製造方法
WO2011075110A1 (en) * 2008-11-19 2011-06-23 Brooks Automation, Inc. Process chamber with intergrated pumping
SG11201908803XA (en) * 2017-04-11 2019-10-30 Asml Netherlands Bv Lithographic apparatus and cooling method
EP4575644A1 (en) * 2023-12-19 2025-06-25 ASML Netherlands B.V. Vessel configured to receive a radiation beam with a cold trap for contamination capture

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237365A (ja) * 1988-03-15 1989-09-21 Toshiba Corp クライオポンプ装置
JPH0749084A (ja) * 1993-08-05 1995-02-21 Hitachi Ltd クライオポンプ
JPH07208332A (ja) * 1994-01-07 1995-08-08 Anelva Corp スパッタリング装置におけるクライオポンプ再生方法
US5520002A (en) * 1995-02-01 1996-05-28 Sony Corporation High speed pump for a processing vacuum chamber
JPH10121224A (ja) * 1996-10-18 1998-05-12 Anelva Corp クライオポンプを用いたスパッタリング装置の動作方法及びその装置
JPH11200031A (ja) * 1997-12-25 1999-07-27 Applied Materials Inc スパッタリング装置及びその高速真空排気方法
JP2005020009A (ja) * 2003-06-27 2005-01-20 Asml Netherlands Bv リソグラフィ投影装置およびデバイス製造方法
JP2005101537A (ja) * 2003-08-29 2005-04-14 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2006222198A (ja) * 2005-02-09 2006-08-24 Canon Inc 露光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638587A (en) * 1979-09-01 1981-04-13 Nec Corp Vacuum device
US4464342A (en) * 1982-05-14 1984-08-07 At&T Bell Laboratories Molecular beam epitaxy apparatus for handling phosphorus
NL9500225A (nl) * 1995-02-07 1996-09-02 Hauzer Techno Coating Europ B Werkwijze voor het regenereren van cryocondensatiepomppanelen in een vacuümkamer, vacuümkamer geschikt voor het uitvoeren van de werkwijze en een inrichting voor het coaten van produkten voorzien van een dergelijke vacuümkamer.
US5644568A (en) 1995-03-15 1997-07-01 Motorola, Inc. Method and apparatus for organizing and recovering information communicated in a radio communication system
JP4274648B2 (ja) * 1999-09-29 2009-06-10 住友重機械工業株式会社 クライオポンプの制御装置
JP4370924B2 (ja) * 2003-08-27 2009-11-25 株式会社ニコン 真空装置、真空装置の運転方法、露光装置、及び露光装置の運転方法
KR20060095763A (ko) * 2003-10-21 2006-09-01 가부시키가이샤 니콘 환경 제어장치, 디바이스 제조장치, 디바이스 제조방법, 및노광장치
JP2005353986A (ja) 2004-06-14 2005-12-22 Canon Inc 露光装置
KR20060088817A (ko) * 2005-01-28 2006-08-07 가부시키가이샤 이빔 기판처리장치 및 기판처리방법
JP2008300806A (ja) 2007-06-04 2008-12-11 Canon Inc 基板処理装置、露光装置及びデバイス製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237365A (ja) * 1988-03-15 1989-09-21 Toshiba Corp クライオポンプ装置
JPH0749084A (ja) * 1993-08-05 1995-02-21 Hitachi Ltd クライオポンプ
JPH07208332A (ja) * 1994-01-07 1995-08-08 Anelva Corp スパッタリング装置におけるクライオポンプ再生方法
US5520002A (en) * 1995-02-01 1996-05-28 Sony Corporation High speed pump for a processing vacuum chamber
JPH10121224A (ja) * 1996-10-18 1998-05-12 Anelva Corp クライオポンプを用いたスパッタリング装置の動作方法及びその装置
JPH11200031A (ja) * 1997-12-25 1999-07-27 Applied Materials Inc スパッタリング装置及びその高速真空排気方法
JP2005020009A (ja) * 2003-06-27 2005-01-20 Asml Netherlands Bv リソグラフィ投影装置およびデバイス製造方法
JP2005101537A (ja) * 2003-08-29 2005-04-14 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2006222198A (ja) * 2005-02-09 2006-08-24 Canon Inc 露光装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159939A (ja) * 2010-02-04 2011-08-18 Canon Inc 捕獲器、真空容器、処理装置、及びデバイス製造方法
US8814970B2 (en) 2010-02-04 2014-08-26 Canon Kabushiki Kaisha Trapping device that traps particles in vacuum atmosphere
JP2016134553A (ja) * 2015-01-21 2016-07-25 東京エレクトロン株式会社 ガス供給系清浄化方法および基板処理装置
WO2021045867A1 (en) * 2019-09-06 2021-03-11 Lam Research Corporation Sorption chamber walls for semiconductor equipment
KR20220054679A (ko) * 2019-09-06 2022-05-03 램 리써치 코포레이션 반도체 장비를 위한 수착 (sorption) 챔버 벽들
CN114730686A (zh) * 2019-09-06 2022-07-08 朗姆研究公司 用于半导体设备的吸附室壁
CN114730686B (zh) * 2019-09-06 2025-02-18 朗姆研究公司 用于半导体设备的吸附室壁
KR102866852B1 (ko) 2019-09-06 2025-09-30 램 리써치 코포레이션 반도체 장비를 위한 수착 (sorption) 챔버 벽들

Also Published As

Publication number Publication date
US20080299493A1 (en) 2008-12-04
KR20080106859A (ko) 2008-12-09
EP2161351A1 (en) 2010-03-10
EP2000854A2 (en) 2008-12-10
EP2000854A3 (en) 2009-09-23
TW200913008A (en) 2009-03-16

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