JP2008300687A - プラズマドーピング方法及びその装置 - Google Patents

プラズマドーピング方法及びその装置 Download PDF

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Publication number
JP2008300687A
JP2008300687A JP2007146034A JP2007146034A JP2008300687A JP 2008300687 A JP2008300687 A JP 2008300687A JP 2007146034 A JP2007146034 A JP 2007146034A JP 2007146034 A JP2007146034 A JP 2007146034A JP 2008300687 A JP2008300687 A JP 2008300687A
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JP
Japan
Prior art keywords
plasma
gas
doping
impurity element
plasma doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007146034A
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English (en)
Japanese (ja)
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JP2008300687A5 (enExample
Inventor
Masahiro Horigome
正弘 堀込
Yoshihiro Ishida
義弘 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007146034A priority Critical patent/JP2008300687A/ja
Priority to PCT/JP2008/058778 priority patent/WO2008149643A1/ja
Priority to DE112008001446T priority patent/DE112008001446T5/de
Priority to US12/601,993 priority patent/US20100167507A1/en
Priority to TW097117747A priority patent/TW200913019A/zh
Publication of JP2008300687A publication Critical patent/JP2008300687A/ja
Publication of JP2008300687A5 publication Critical patent/JP2008300687A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412—Plasma immersion ion implantation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Electron Sources, Ion Sources (AREA)
JP2007146034A 2007-05-31 2007-05-31 プラズマドーピング方法及びその装置 Pending JP2008300687A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007146034A JP2008300687A (ja) 2007-05-31 2007-05-31 プラズマドーピング方法及びその装置
PCT/JP2008/058778 WO2008149643A1 (ja) 2007-05-31 2008-05-13 プラズマドーピング装置及び方法
DE112008001446T DE112008001446T5 (de) 2007-05-31 2008-05-13 Plasmadotierungsvorrichtung und Plasmadotierungsverfahren
US12/601,993 US20100167507A1 (en) 2007-05-31 2008-05-13 Plasma doping apparatus and plasma doping method
TW097117747A TW200913019A (en) 2007-05-31 2008-05-14 Plasma doping apparatus and plasma doping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007146034A JP2008300687A (ja) 2007-05-31 2007-05-31 プラズマドーピング方法及びその装置

Publications (2)

Publication Number Publication Date
JP2008300687A true JP2008300687A (ja) 2008-12-11
JP2008300687A5 JP2008300687A5 (enExample) 2010-09-02

Family

ID=40093468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007146034A Pending JP2008300687A (ja) 2007-05-31 2007-05-31 プラズマドーピング方法及びその装置

Country Status (5)

Country Link
US (1) US20100167507A1 (enExample)
JP (1) JP2008300687A (enExample)
DE (1) DE112008001446T5 (enExample)
TW (1) TW200913019A (enExample)
WO (1) WO2008149643A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142238A (ja) * 2010-01-08 2011-07-21 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP2013073950A (ja) * 2011-09-26 2013-04-22 Toshiba Corp 半導体装置の製造方法
JP2014127572A (ja) * 2012-12-26 2014-07-07 Tokyo Electron Ltd プラズマドーピング装置、およびプラズマドーピング方法
WO2016104206A1 (ja) * 2014-12-24 2016-06-30 東京エレクトロン株式会社 ドーピング方法、ドーピング装置および半導体素子の製造方法
KR20160150035A (ko) * 2015-06-19 2016-12-28 도쿄엘렉트론가부시키가이샤 공정 화학 제어에 가열된 기판을 이용하는 방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5424299B2 (ja) * 2008-12-16 2014-02-26 国立大学法人東北大学 イオン注入装置、イオン注入方法、及び半導体装置
WO2011080876A1 (ja) * 2009-12-28 2011-07-07 パナソニック株式会社 プラズマドーピング装置
TW201205648A (en) * 2010-06-23 2012-02-01 Tokyo Electron Ltd Plasma doping device, plasma doping method, method for manufacturing semiconductor element, and semiconductor element
JP5537324B2 (ja) * 2010-08-05 2014-07-02 株式会社東芝 半導体装置の製造方法
JP5742810B2 (ja) * 2012-10-02 2015-07-01 東京エレクトロン株式会社 プラズマドーピング装置、プラズマドーピング方法、および半導体素子の製造方法
JP2015128108A (ja) * 2013-12-27 2015-07-09 東京エレクトロン株式会社 ドーピング方法、ドーピング装置及び半導体素子の製造方法
EP3095026B1 (en) * 2014-01-17 2025-04-23 Osterhout Group, Inc. See-through computer display systems

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294550A (ja) * 1999-04-05 2000-10-20 Tokyo Electron Ltd 半導体製造方法及び半導体製造装置
JP2004047695A (ja) * 2002-07-11 2004-02-12 Matsushita Electric Ind Co Ltd プラズマドーピング方法及び装置
JP2005086023A (ja) * 2003-09-09 2005-03-31 Tadahiro Omi 半導体装置及びその製造方法
WO2006106858A1 (ja) * 2005-03-31 2006-10-12 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法及び装置
WO2006121131A1 (ja) * 2005-05-12 2006-11-16 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法およびプラズマドーピング装置
JP2007042951A (ja) * 2005-08-04 2007-02-15 Tokyo Electron Ltd プラズマ処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04319243A (ja) 1991-04-17 1992-11-10 Tokyo Electron Ltd イオン注入装置
JPH05251033A (ja) 1992-03-03 1993-09-28 Tokyo Electron Ltd イオン注入装置
JP3136054B2 (ja) * 1994-08-16 2001-02-19 東京エレクトロン株式会社 プラズマ処理装置
JP2000100790A (ja) * 1998-09-22 2000-04-07 Canon Inc プラズマ処理装置及びそれを用いた処理方法
US7294563B2 (en) * 2000-08-10 2007-11-13 Applied Materials, Inc. Semiconductor on insulator vertical transistor fabrication and doping process
JP5138131B2 (ja) * 2001-03-28 2013-02-06 忠弘 大見 マイクロ波プラズマプロセス装置及びプラズマプロセス制御方法
EP1804274A3 (en) * 2001-03-28 2007-07-18 Tadahiro Ohmi Plasma processing apparatus
JP4278915B2 (ja) * 2002-04-02 2009-06-17 東京エレクトロン株式会社 エッチング方法
JP4544447B2 (ja) * 2002-11-29 2010-09-15 パナソニック株式会社 プラズマドーピング方法
JP4532897B2 (ja) * 2003-12-26 2010-08-25 財団法人国際科学振興財団 プラズマ処理装置、プラズマ処理方法及び製品の製造方法
JP2007146034A (ja) 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd 蛍光体薄膜とその成膜方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294550A (ja) * 1999-04-05 2000-10-20 Tokyo Electron Ltd 半導体製造方法及び半導体製造装置
JP2004047695A (ja) * 2002-07-11 2004-02-12 Matsushita Electric Ind Co Ltd プラズマドーピング方法及び装置
JP2005086023A (ja) * 2003-09-09 2005-03-31 Tadahiro Omi 半導体装置及びその製造方法
WO2006106858A1 (ja) * 2005-03-31 2006-10-12 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法及び装置
WO2006121131A1 (ja) * 2005-05-12 2006-11-16 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法およびプラズマドーピング装置
JP2007042951A (ja) * 2005-08-04 2007-02-15 Tokyo Electron Ltd プラズマ処理装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142238A (ja) * 2010-01-08 2011-07-21 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP2013073950A (ja) * 2011-09-26 2013-04-22 Toshiba Corp 半導体装置の製造方法
JP2014127572A (ja) * 2012-12-26 2014-07-07 Tokyo Electron Ltd プラズマドーピング装置、およびプラズマドーピング方法
US9029249B2 (en) 2012-12-26 2015-05-12 Tokyo Electron Limited Plasma doping apparatus and plasma doping method
KR101544938B1 (ko) * 2012-12-26 2015-08-17 도쿄엘렉트론가부시키가이샤 플라즈마 도핑 장치 및 플라즈마 도핑 방법
WO2016104206A1 (ja) * 2014-12-24 2016-06-30 東京エレクトロン株式会社 ドーピング方法、ドーピング装置および半導体素子の製造方法
KR20160150035A (ko) * 2015-06-19 2016-12-28 도쿄엘렉트론가부시키가이샤 공정 화학 제어에 가열된 기판을 이용하는 방법
KR102611265B1 (ko) * 2015-06-19 2023-12-06 도쿄엘렉트론가부시키가이샤 공정 화학 제어에 가열된 기판을 이용하는 방법

Also Published As

Publication number Publication date
US20100167507A1 (en) 2010-07-01
WO2008149643A1 (ja) 2008-12-11
DE112008001446T5 (de) 2010-05-06
TW200913019A (en) 2009-03-16

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