JP2008270721A - Substrate mounting base and substrate processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent damage to a lifter pin and an electrode provided on a mounting base made of a plurality of stacked plates. <P>SOLUTION: A substrate mounting base comprises a lifter pin 242 provided so that it can go up and down freely in a pin insertion hole 214 that penetrates through an electrode plate 210 arranged at the uppermost part, and a lifting guide body 300 that guides the ascending/descending of the lifter pin 242, wherein the lifting guide body 300 is arranged through a through-hole 226 of a temperature adjustment plate 220 stacked beneath the electrode plate 210, and regulated by a positioning pin 350 so that it cannot move in the horizontal direction with respect to the electrode plate 210. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate mounting table and a substrate processing apparatus on which a substrate for a flat panel display (Flat Panel Display) such as a liquid crystal display or an electro-luminescence display (Electro-Luminescence Display) is mounted.

  In this kind of substrate processing apparatus for processing a single wafer, it is necessary to carry unprocessed substrates one by one on a mounting table provided in the processing chamber one by one using a transfer arm or the like and to carry out processed substrates from the processing chamber. There is. For this reason, in order to assist loading and unloading with respect to the mounting table in the processing chamber, a lifter pin mechanism for pushing up the substrate above the mounting surface of the mounting table with a lifter pin is often used.

  As such a conventional lifter pin mechanism, for example, as shown in Patent Document 1, in a mounting table composed of a single electrode plate, in order to prevent displacement of the lifter pin hole and the lifter pin due to thermal expansion of the electrode plate. , It is known that a lifting guide of a lifter pin mechanism is attached to the lower side of an electrode plate. Also, as shown in Patent Document 2, there is a type in which a lifter pin is inserted into an electrode formed by laminating an upper plate and a lower plate, and a lifter pin lifting guide (support mechanism) is attached to the bottom of the processing chamber.

JP-A-10-102259 JP 2001-185606 A

  By the way, in a mounting table having an electrode formed by laminating a plurality of plates like the mounting table described in Patent Document 2, the temperature of each plate is adjusted by adjusting the temperature of the electrode or generating plasma. As they rise, they both expand thermally. In this case, the uppermost plate is exposed to the influence of plasma generation or the temperature in the processing chamber because the upper surface is exposed in the processing chamber. There is a temperature difference between the plate and the lower plate. For this reason, there is a difference in the amount of thermal expansion between these plates, resulting in a horizontal displacement between the uppermost plate and the lower plate.

  Therefore, in the mounting table having an electrode formed by laminating a plurality of such plates, as in the case of Patent Documents 1 and 2, when a lifter pin is arranged in a pin insertion hole that penetrates the electrode, that is, each plate, There is a possibility that a horizontal displacement occurs between the pin insertion hole of the plate and the pin insertion hole of the lower plate, and a shearing force may act on the lifter pin inserted therethrough. If the lifter pin is lifted and lowered while such a shearing force is applied to the lifter pin, the lifter pin may be damaged or the plate may be damaged.

  In particular, in recent years, the size of the substrate has become larger and the size of each plate of the mounting table on which the substrate is placed has also increased. The larger the size of the plate that constitutes such a mounting table, the greater the amount of thermal expansion. Therefore, the horizontal displacement between the uppermost plate and the lower plate is so large that it cannot be ignored. In this case, a shearing force is easily generated.

  Therefore, the present invention has been made in view of such problems, and the object of the present invention is to prevent damage to lifter pins and electrodes provided on a mounting table having an electrode formed by laminating a plurality of plates. An object of the present invention is to provide a substrate mounting table that can be prevented.

  In order to solve the above-described problem, according to an aspect of the present invention, there is provided a substrate mounting table having an electrode formed by stacking a plurality of plates on the top and bottom, and is disposed on the top of the plurality of plates. A lifter pin provided with a pin insertion hole penetrating the top plate so as to freely move up and down, and a lift guide body for guiding the lift of the lifter pin. The lift guide body is laminated below the top plate. The substrate mounting table is characterized in that the substrate mounting table is disposed through the through hole of the lower plate and is positioned so as to be immovable in the horizontal direction with respect to the uppermost plate.

  In order to solve the above problems, according to another aspect of the present invention, there is provided a substrate processing apparatus for performing plasma processing on a substrate, a processing chamber configured to be evacuated, and a processing gas supplied to the processing chamber. A gas supply means for supplying the gas to the substrate, a gas introduction means for introducing the gas from the gas supply means toward the substrate on the mounting table, and a gas supply means disposed below the process chamber. A substrate mounting table, wherein the substrate mounting table moves up and down a pin insertion hole penetrating an electrode formed by stacking a plurality of plates vertically and an uppermost plate arranged at an uppermost part of the plurality of plates. A substrate mounting table comprising: a freely provided lifter pin; and a lifting guide body that is positioned so as not to move horizontally with respect to the uppermost plate and guides the lifting and lowering of the lifter pin. Plate processing apparatus is provided.

  In such a substrate mounting table according to the present invention, the uppermost plate is thermally expanded more than the lower plate, so that even if a horizontal relative displacement occurs between them, the lifting guide Since the body is regulated in the horizontal direction, it moves following the top plate. Accordingly, a constant clearance can always be maintained between the lifter pins that are lifted and lowered by the lifting guide body and the pin insertion holes of the uppermost plate. Thereby, it is possible to prevent lifter pin breakage (breakage) and electrode plate damage due to the displacement of the uppermost plate with respect to the lower plate.

  Further, the position of the elevating guide body is regulated by a positioning member (for example, a positioning pin) inserted into a positioning hole formed in the upper surface of the elevating guide body and the lower surface of the uppermost plate, for example. By using such a positioning member, the position of the lifting guide body in the horizontal direction with respect to the lower surface of the uppermost plate can be easily regulated.

  Further, the inner diameter of the through hole of the lower plate is formed larger than the outer diameter of the elevating guide body, and the difference between the inner diameter and the outer shape depends on the maximum deviation amount of the uppermost plate with respect to the lower plate. Is preferably determined. As a result, when the amount of thermal expansion of the uppermost plate varies depending on processing conditions (for example, set temperature, pressure in the processing chamber, and high frequency power applied to the lower electrode), it is possible to cope with any processing conditions. Can do.

  The lifting guide body may be attached to the lower plate so as to be movable in the horizontal direction. Thus, assembly can be facilitated by allowing the lifting guide body to be attached to the lower plate.

  The uppermost plate is, for example, an electrode plate constituting an electrode body, and the lower plate is, for example, a temperature adjusting plate for adjusting the temperature of the electrode plate. While the temperature adjustment plate is usually maintained at a constant temperature, the electrode plate is at the top, so it is easily affected by plasma and ambient temperature, so it is between the electrode plate and the temperature adjustment plate. In particular, since a difference in thermal expansion is likely to occur, the position of the electrode plate relative to the temperature adjustment plate is likely to occur. Therefore, the effect of applying the present invention to the mounting table having such a configuration is great.

  In order to solve the above-described problem, according to another aspect of the present invention, there is provided a substrate mounting table having an electrode formed by stacking a plurality of plates on the top and bottom, and disposed on the top of the plurality of plates. And a lift guide body for guiding the lifting and lowering of the lifter pin, the upper portion of the lift guide body having a lower surface of the top plate. By being inserted into and fixed to the positioning hole formed in the plate, the position is restricted so that it cannot move in the horizontal direction, and is disposed through the through hole of the lower plate stacked on the lower side of the uppermost plate. A substrate mounting table is provided.

  In order to solve the above problems, according to another aspect of the present invention, there is provided a substrate processing apparatus for performing plasma processing on a substrate, a processing chamber configured to be evacuated, and a processing gas supplied to the processing chamber. A gas supply means for supplying the gas to the substrate, a gas introduction means for introducing the gas from the gas supply means toward the substrate on the mounting table, and a gas supply means disposed below the process chamber. A substrate mounting table, wherein the substrate mounting table moves up and down a pin insertion hole penetrating an electrode formed by stacking a plurality of plates vertically and an uppermost plate arranged at an uppermost part of the plurality of plates. A lifter pin provided freely and a lifting guide body for guiding the lifting and lowering of the lifter pin are provided, and the lifting guide body is fixed by being inserted into a positioning hole formed in the lower surface of the uppermost plate. Is While it is immovably position restriction in the horizontal direction by the substrate processing apparatus characterized by being arranged through the through-holes of the lower plate to be laminated on the lower side of the top plate is provided.

  In such a substrate mounting table according to the present invention, the uppermost plate is thermally expanded more than the lower plate, so that even if a horizontal relative displacement occurs between them, the lifting guide Since the body is positioned and fixed to the top plate and is horizontally regulated, it moves following the top plate. Accordingly, a constant clearance can always be maintained between the lifter pins that are lifted and lowered by the lifting guide body and the pin insertion holes of the uppermost plate. Thereby, it is possible to prevent lifter pin breakage (breakage) and electrode plate damage due to the displacement of the uppermost plate with respect to the lower plate.

  In addition, the lifting guide body can be easily positioned on the top plate simply by fitting the upper part of the lifting guide body into the positioning hole of the top plate and fixing it. Thus, for example, the lifter pin is attached to the lower plate, the lifting guide body is attached to the uppermost plate, and the upper plate is placed on the lower plate so that the lifter pin is inserted into the lifting guide body. Can be attached, so it can be assembled easily.

  According to the present invention, when a lifter pin is disposed on a mounting table having electrodes composed of a plurality of plates, the lifter pin breaks due to, for example, the uppermost plate being displaced from the lower plate due to thermal expansion. (Damage) and damage to the electrode plate can be prevented.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(Substrate processing equipment)
First, an embodiment of a substrate processing apparatus to which a substrate mounting table according to the present invention can be applied will be described with reference to the drawings. Here, as an example of the substrate processing apparatus, a plasma processing apparatus that performs plasma processing such as etching and film formation on an FPD substrate (hereinafter also simply referred to as “substrate”) G mounted on a substrate mounting table is given. I will explain. FIG. 1 is a longitudinal sectional view showing a schematic configuration of the plasma processing apparatus according to the present embodiment. FIG. 2 is a view of the mounting table viewed from above, and the cross-sectional view of the mounting table shown in FIG. 1 corresponds to the cross-sectional view taken along the line P-P ′ shown in FIG.

  As shown in FIG. 1, the plasma processing apparatus 100 includes a processing chamber 102. The processing chamber 102 is configured by a substantially rectangular tube-shaped processing container made of aluminum whose surface is anodized (anodized), for example. The processing chamber 102 is grounded. A mounting table 200 that functions as a lower electrode is disposed at the bottom of the processing chamber 102. The mounting table 200 functions as a substrate mounting table on which a rectangular substrate G is mounted. The mounting table 200 is formed in a rectangular shape as shown in FIG. The shape of the mounting table 200 is determined according to the shape of the substrate G. Details of the specific configuration of the mounting table 200 will be described later.

  Above the mounting table 200, a shower head 110 as a gas introduction unit that functions as an upper electrode is disposed so as to be opposed to and parallel to the mounting table 200. The shower head 110 is supported on the upper portion of the processing chamber 102, has a buffer chamber 122 therein, and has a plurality of discharge holes 124 for discharging a processing gas on the lower surface facing the mounting table 200. The shower head 110 as the upper electrode is grounded to the ground, and constitutes a pair of parallel plate electrodes together with the mounting table 200 as the lower electrode.

  A gas introduction port 126 is provided on the upper surface of the shower head 110, and a gas introduction pipe 128 is connected to the gas introduction port 126. A gas supply means including a processing gas supply source 134 is connected to the gas introduction pipe 128 via an open / close valve 130 and a mass flow controller (MFC) 132.

The processing gas from the processing gas supply source 134 is controlled to a predetermined flow rate by a mass flow controller (MFC) 132 and is introduced into the buffer chamber 122 of the shower head 110 through the gas inlet 126. As the processing gas (etching gas), for example, a gas usually used in this field such as a halogen-based gas such as CF ₄ gas, O ₂ gas, or Ar gas can be used.

  A gate valve 106 for opening and closing the substrate loading / unloading port 104 is provided on the side wall of the processing chamber 102. An exhaust port is provided below the side wall of the processing chamber 102, and an exhaust device 109 including a vacuum pump (not shown) is connected to the exhaust port via an exhaust pipe 108. By exhausting the interior of the processing chamber 102 by the exhaust device 109, the inside of the processing chamber 102 can be maintained in a predetermined vacuum atmosphere (for example, 10 mTorr = about 1.33 Pa) during the plasma processing.

(Configuration of mounting table)
Next, a specific configuration of the mounting table 200 according to the present embodiment will be described. The mounting table 200 is configured by stacking a plurality of (here, two) plates vertically. Specifically, the mounting table 200 includes an electrode plate 210 as an uppermost plate disposed at the uppermost portion thereof, and a temperature adjustment plate 220 as a lower plate stacked thereunder. Among these, the electrode plate 210 is a plate constituting the main body of the lower electrode, and the temperature adjusting plate 220 is a plate for adjusting the temperature of the electrode plate 210. The electrode plate 210 and the temperature adjustment plate 220 are attached in close contact.

  The electrode plate 210 is attached to the bottom of the processing chamber 102 via a base member 230 made of, for example, a ceramic or quartz insulating member. Further, a rectangular frame-shaped outer frame portion 202 made of, for example, a ceramic or quartz insulating member is formed so as to constitute an outer frame of the mounting table 200 and surround the electrode plate 210, the temperature adjustment plate 220, and the base member 230. Arranged.

  The electrode plate 210 is made of, for example, plate-like aluminum, and the surface of the substrate G on which the mounting surface 212 is formed is anodized. The output terminal of the high frequency power supply 116 is electrically connected to the electrode plate 210 via the matching unit 114. The output frequency of the high frequency power supply 116 is selected to be a relatively high frequency, for example, 13.56 MHz. When high frequency power from the high frequency power supply 116 is applied to the electrode plate 210, plasma of a processing gas is generated on the substrate G placed on the placement surface 212 of the placement table 200, and the plasma is generated on the substrate G. A predetermined plasma etching process is performed.

  The temperature adjustment plate 220 is made of the same member as the electrode plate 210, for example, plate-like aluminum, and a flow path 222 through which the temperature adjustment medium flows is formed. A temperature adjusting medium adjusted to a predetermined temperature from a medium supply source (not shown) flows through the flow path 222, whereby the temperature of the electrode plate 210 can be adjusted to a predetermined temperature. The temperature adjustment plate 220 is not limited to the above configuration, and for example, a heater may be provided inside to heat the electrode plate 210.

  A plurality of lifter pins (push-up pins) 242 for pushing up the substrate G to assist loading and unloading of the substrate G with respect to the placement surface 212 are provided at a plurality of places on the placement table 200. For example, as shown in FIG. 2, one lifter pin (center lifter pin) 242 is provided at the center of the mounting surface 212 of the mounting table 200, and ten lifter pins ( Peripheral lifter pins) 242 are provided so as to be spaced apart from each other. In the example shown in FIG. 2, the peripheral lifter pins 242 are provided separately on each of two parallel sides in the longitudinal direction of the mounting surface 212, and on each of the other two parallel sides. Two are spaced apart. The number of lifter pins 242 is not limited to this, and is preferably determined according to the size of the substrate G.

  Each lifter pin 242 projects and sinks simultaneously from the mounting surface 212 to provide a support level for supporting the substrate G horizontally in cooperation. For example, when loading and unloading the substrate G with respect to the mounting surface 212 by a transfer arm (not shown), the substrate G is supported by the lifter pins 242 while being lifted from the mounting surface 212 as shown in FIG. The

  As shown in FIG. 1, each lifter pin 242 is configured to be movable up and down through a pin insertion hole 214 formed through the electrode plate 210 in the vertical direction. A lift guide body 300 for guiding the lift of the lifter pins 242 is provided at an intermediate portion of each lifter pin 242. A specific configuration example of the lifting guide body 300 will be described later. The lower end portion of each lifter pin 242 is supported by the slide plate 250 via a support body 243 configured to be slidable in the horizontal direction. As a result, as described later, even if the lifter pin 242 moves in the horizontal direction following the electrode plate 210 together with the lift guide body 300, the support body 243 slides in the horizontal direction, so the lift guide body 300 of the lifter pin 242. The lower part can always be held vertically.

  The slide plate 250 is moved up and down along slide guides 252 provided for the respective lifter pins 242 below the bottom of the processing chamber 102. A motor 254 for moving the slide plate 250 up and down is attached to the lower side of the bottom of the processing chamber 102. The motor 254 is connected to a control unit (not shown) that controls the plasma processing apparatus. By driving the motor 254 in accordance with a command from the control unit to raise and lower the slide plate 250, the lifter pins 242 are raised and lowered accordingly, and the tips of the lifter pins 242 protrude and retract from the placement surface 212. it can.

(Location of lifter pin and lifting guide body)
By the way, in the mounting table having the lower electrode in which the electrode plate 210 and the temperature adjusting plate 220 are vertically stacked like the mounting table 200 of the present embodiment, depending on the positions where the lifter pins 242 and the lifting guide body 300 are disposed. As described later, there is a possibility of causing a problem such as breakage of the lifter pin 242. Therefore, in the mounting table 200 of the present embodiment, the lifter pin 242 and the lifting guide body 300 are disposed so as not to cause such a problem. ing.

  Here, the arrangement positions of the lifter pin 242 and the lifting guide body 300 of this embodiment will be described in comparison with a comparative example. FIGS. 3A and 3B are diagrams showing an example of the arrangement and operation of lifter pins and lifting guide bodies for comparison with the case of this embodiment, and FIGS. 4A and 4B are the lifter pins and lifting guide bodies in this embodiment. It is a figure which shows the example of arrangement | positioning, and its effect | action.

  In FIG. 3A, the lifter pin 242 is disposed in pin insertion holes 214 and 224 penetrating the electrode plate 210 and the temperature adjustment plate 220, respectively, and the lifting guide body 300 is disposed in the horizontal direction with respect to the lower temperature adjustment plate 220. This is a case where the position is restricted so that it cannot be moved. In this case, for example, the elevating guide body 300 is fixed to the lower side of the temperature adjustment plate 220 and the position is regulated in the horizontal direction. In addition, a positioning pin may be provided on the upper surface of the elevating guide body 300 and the lower surface of the temperature adjustment plate 220 to restrict the position in the horizontal direction.

  If the lifter pin 242 and the lifting guide body 300 are disposed as shown in FIG. 3A, the following problem occurs. The problem will be described below. If the temperature adjustment medium is circulated through the flow path 222 of the temperature adjustment plate 220 of the mounting table 200 to adjust the temperature or generate plasma, the temperature of the electrode plate 210 and the temperature adjustment plate 220 rises. , These both thermally expand.

  At this time, since the temperature adjusting medium adjusted to a predetermined temperature flows through the flow path 222 of the temperature adjusting plate 220, the temperature is maintained at a constant temperature. On the other hand, since the upper surface of the electrode plate 210 is exposed in the processing chamber, the electrode plate 210 is easily affected by the influence of plasma generation and the temperature in the processing chamber. For this reason, there is a high probability that a temperature difference occurs between the electrode plate 210 and the temperature adjustment plate 220, and a difference in thermal expansion amount is generated.

  For example, when plasma is generated and the temperature rise of the electrode plate 210 occurs, the electrode plate 210 is higher in temperature than the temperature adjustment plate 220, and therefore the electrode plate 210 is higher than the temperature adjustment plate 220. Also, the amount of thermal expansion increases.

  Due to the difference in the amount of thermal expansion, as shown in FIG. 3B, the contact surface between the electrode plate 210 and the temperature adjusting plate 220 is displaced in the horizontal direction. A positional deviation occurs between 214 and the pin insertion hole 224 of the temperature adjustment plate 220.

  In recent years, the size of the substrate has become larger and the size of each plate of the mounting table 200 on which the substrate is placed has also increased. As the size of the electrode plate 210 and the temperature adjustment plate 220 constituting the mounting table 200 increases, the amount of thermal expansion also increases. Therefore, the horizontal displacement between the electrode plate 210 and the temperature adjustment plate 220 also increases. It becomes too big to ignore.

  Thus, as the positional deviation between the electrode plate 210 and the temperature adjustment plate 220 increases, the clearance between the pin insertion hole 214 and the lifter pin 242 of the electrode plate 210 collapses. When the wall of the pin insertion hole 214 of the electrode plate 210 comes into contact with the lifter pin 242 and the electrode plate 210 presses the lifter pin 242 in the horizontal direction, the lifter pin 242 itself has a shape as shown by an arrow in FIG. 3B. Shear force works.

  For this reason, the lifter pin 242 may be bent as shown by the dotted line in FIG. 3B. Further, if the positional deviation is further increased, the lifter pin 242 may be damaged. Further, if the lifter pin 242 is moved up and down while the above-described shearing force is applied to the lifter pin 242, the lifter pin 242 may be damaged or the electrode plate 210 may be damaged.

  Therefore, in the present embodiment, as shown in FIG. 4A, the lifter pin 242 is disposed in the pin insertion hole 214 that penetrates the electrode plate 210, and the temperature adjustment plate 220 has a diameter larger than the diameter of the elevating guide body 300. A hole 226 is formed, and the position is regulated so that it cannot move in the horizontal direction with respect to the upper electrode plate 210 through the elevating guide body 300 through the through hole 226. For example, positioning pins are provided on the upper surface of the lifting guide body 300 and the lower surface of the electrode plate 210 to restrict the position in the horizontal direction. Further, the elevating guide body 300 may be fixed to the lower side of the electrode plate 210 to restrict the position in the horizontal direction.

  As a result, even when the horizontal displacement of the contact surface between the electrode plate 210 and the temperature adjustment plate 220 occurs, the lifting guide body 300 moves with the electrode plate 210 as shown in FIG. 4B. The clearance between the pin insertion hole 214 of the electrode plate 210 and the lifter pin 242 is maintained. For this reason, the lifter pin 242 is not tilted, and no shearing force is applied to the lifter pin 242. Therefore, even if the lifter pin 242 is moved up and down, the lifter pin 242 is damaged or the electrode plate 210 is damaged. Never do.

(Specific configuration example of lifting guide body)
Next, a specific configuration of the lifting guide body 300 according to the present embodiment will be described with reference to the drawings. FIG. 5 is a cross-sectional view showing a configuration example of the lifting guide body in the present embodiment. Here, a description will be given of a specific example in which the elevating guide body 300 is attached to the temperature adjustment plate 220 so as to be movable in the horizontal direction and the electrode plate 210 is restricted so as not to move in the horizontal direction. .

  First, the internal configuration of the lifting guide body 300 will be described. As shown in FIG. 5, the elevating guide body 300 includes a substantially cylindrical guide body 302, and a lifter pin 242 is inserted therein. The lifter pin 242 shown in FIG. 5 has a pin main body 244 arranged at the tip, and a support bar 246 that supports the lower end portion of the pin main body 244. Since the tip end of the pin body 244 contacts the back side of the substrate G, it is formed into a spherical shape, for example. The support rod 246 has a diameter slightly larger than that of the pin main body 244, and a base portion 248 having an enlarged diameter is provided at the lower end thereof. Further, an auxiliary rod 249 is provided at the lower end of the base portion 248.

  In the guide main body 302, an insertion hole 312 through which the pin main body 244 and the support rod 246 can be inserted vertically is formed. The upper pin hole 314 of the insertion hole 312 is configured to have the same diameter (or slightly larger diameter) as the pin insertion hole 214 of the electrode plate 210, and the lower centering hole 316 of the insertion hole 312 is the upper pin insertion hole. The diameter is further expanded from 214. Specifically, the pin hole 314 at the upper part of the insertion hole 312 is configured with a diameter that allows the pin main body 244 to be loosely fitted, and the centering hole 316 at the lower part of the insertion hole 312 is configured with a diameter that allows the support rod 246 to be loosely fitted. The

  In the centering hole 316, a centering lifter bush 320 fitted into the support bar 246 is disposed. The centering lifter bush 320 is for aligning the center of the lifter pin 242 with the center of the pin insertion hole 214 of the electrode plate 210.

  By the way, the lower part of the lifter pin 242 (below the elevating guide body 300) is usually exposed to an atmospheric pressure atmosphere (normal pressure atmosphere), on the other hand, above the lifter pin 242 (above the electrode plate 210). Since the processing chamber 102 is in a vacuum atmosphere, it is necessary to disconnect the communication between them. For this reason, for example, a metal expandable / contractible bellows 322 is disposed between the lower end of the guide main body 302 and the base 248 of the support rod 246 so as to surround the support rod 246. Specifically, the bottom of the bellows 322 is fixed to the base 248 of the support rod 246, while a flange 324 is disposed on the top of the bellows 322. The flange 324 is attached to the lower end of the guide body 302.

  With such a configuration in the elevating guide body 300, the lifter pin 242 can be moved up and down by the centering lifter bush 320 in the elevating guide body 300 so as to pass through the center of the pin insertion hole 214 of the electrode plate 210.

  Next, an arrangement example of the lifting guide body 300 will be described. The elevating guide body 300 is attached to the upper surface of the temperature adjusting plate 220 in a state of loosely fitting in the through hole 226 of the temperature adjusting plate 220 so that the upper surface thereof is in close contact with the lower surface of the electrode plate 210.

  Specifically, a flange portion 330 is formed on the upper and lower guide bodies 300, and the upper portion of the through hole 226 that opens to the upper surface of the temperature adjustment plate 220 expands to the extent that the flange portion 330 can be loosely fitted. It is a diameter. The flange portion 330 is inserted into the expanded flange insertion hole 228 and attached to the surface of the temperature adjustment plate 220 where the flange insertion hole 228 is formed with a bolt 340.

  The bolt 340 may be attached to the bottom surface of the bolt hole 332 formed in the flange portion 330 via a washer 342 that is slippery and surface-treated. Accordingly, even if the flange portion 330 is fixed to the temperature adjustment plate 220 with the bolt 340, the surface of the washer 342 interposed between the bolt 340 and the flange portion 330 is easily slipped. Can move in the horizontal direction with respect to the temperature adjustment plate 220.

  Further, the position of the upper surface of the lifting guide body 300 is restricted so that it cannot move in the horizontal direction so that the center of the pin hole 314 of the lifting guide body 300 is aligned with the center of the pin insertion hole 214 of the electrode plate 210. Specifically, the position is restricted so that it cannot move in the horizontal direction by a positioning pin 350 as an example of a positioning member inserted into a positioning hole 352 formed in the upper surface of the lifting guide body 300 and the lower surface of the electrode plate 210. .

  By using such a positioning member, the position of the elevating guide body 300 in the horizontal direction with respect to the lower surface of the electrode plate 210 can be easily regulated. Note that a plurality (two in this case) of positioning pins 350 are preferably provided around the pin hole 314.

  The diameter of the positioning hole 352 is such that the positioning pin 350 is fixed by fitting, and the positioning hole 352 is formed to be slightly deeper than the length of the positioning pin 350. Accordingly, the positioning pin 350 cannot move in the horizontal direction, and a space is formed in the longitudinal direction of the positioning pin 350. Therefore, even if the positioning pin 350 is thermally expanded, internal stress is not generated in the positioning hole 352. be able to.

  A plurality of hermetic holding members such as O-rings are attached to the lifting guide body 300 and the vicinity thereof in order to maintain airtightness between the atmospheric pressure atmosphere and the vacuum pressure atmosphere and to prevent intrusion of plasma.

  Specifically, for example, an O-ring 362 is interposed between the pin hole 314 of the elevating guide body 300 and the pin body 244. Further, an O-ring 364 is interposed on the upper surface of the elevating guide body 300 between the lower surface of the electrode plate 210 so as to surround the pin hole 314. These O-rings 362 and 364 are provided mainly to prevent intrusion of plasma from the pin insertion hole 214.

  In addition, an O-ring 366 is interposed on the upper surface of the lifting guide body 300 between the lower surface of the electrode plate 210 and the outer side of the positioning pin 350. An O-ring 368 is interposed between the upper surface of the temperature adjustment plate 220 and the lower surface of the electrode plate 210 so as to surround the flange portion 330 of the elevating guide body 300. These O-rings 366 and 368 mainly include an atmospheric pressure atmosphere (normal pressure atmosphere) below the lifter pin 242 (below the lifting guide body 300) and a processing chamber 102 above the lifter pin 242 (above the electrode plate 210). It is provided in order to maintain airtightness.

  In the elevating guide body 300 having such a configuration, as described above, the electrode plate 210 is thermally expanded more than the temperature adjusting plate 220, so that the relative displacement in the horizontal direction occurs on these contact surfaces. Even if it occurs, the position of the lifting guide body 300 is restricted by the positioning pins 350 in the horizontal direction, so that it moves following the electrode plate 210. Therefore, the pin insertion hole 214 of the electrode plate 210 and the pin hole 314 of the lifting guide body 300 are not displaced. Therefore, even if the lifter pin 242 is lifted and lowered in this state, the lifter pin 242 may be damaged or the electrode plate 210 may be It will not be damaged. As described above, according to the mounting table 200 according to the present embodiment, it is possible to prevent the lifter pin 242 and the electrode plate 210 from being damaged due to the displacement of the electrode plate 210 with respect to the temperature adjustment plate 220. .

  The size of the through hole 226 through which the elevating guide body 300 is inserted depends on the maximum amount of displacement that is assumed when the electrode plate 210 and the temperature adjustment plate 220 are displaced relative to each other in the horizontal direction. Is preferably determined. For example, if the maximum displacement amount of the electrode plate 210 with respect to the temperature adjustment plate 220 is L, the inner diameter of the through hole 226 may be at least 2L larger than the outer diameter of the elevating guide body 300. Thus, for example, when the amount of thermal expansion of the electrode plate 210 varies depending on the processing conditions (for example, set temperature, pressure in the processing chamber, high frequency power applied to the lower electrode), it corresponds to the case where the substrate processing is executed under any processing conditions. be able to.

  Since the elevating guide body 300 shown in FIG. 5 is attached toward the temperature adjusting plate 220, for example, the elevating guide body 300 can be attached to the temperature adjusting plate 220, and then the electrode plate 210 can be attached thereon. Assembly can be facilitated.

  The elevating guide body 300 in FIG. 5 is attached to the temperature adjusting plate 220. For example, as shown in FIG. 6, the elevating guide body 300 is fixed to the electrode plate 210 with a bolt 344 or the like. You may do it. In this case, instead of providing the positioning pin on the lower surface of the electrode plate 210, a counterbore 216 as a positioning hole may be provided on the lower surface of the electrode plate 210, and the upper portion of the flange portion 330 may be fitted into the counterbore 216. As a result, the elevating guide body 300 is positioned on the lower surface of the electrode plate 210 and is regulated in the horizontal direction.

  Further, as shown in FIG. 6, the elevating guide body 300 may be configured by separately connecting the flange portion 330 and the guide main body 302 with bolts or the like, or may be configured integrally.

  Further, the bellows 322 may be attached to the attachment member 304 provided under the temperature adjustment plate 220 instead of attaching the flange 324 to the elevating guide body 300. The attachment member 304 is formed in a shape (for example, a cup shape) that covers the guide main body 302 protruding downward from the temperature adjustment plate 220 with a gap, and is provided so as to surround the opening below the through hole 226. And it attaches to the temperature adjustment plate 220 so that the support rod 246 of the lifter pin 242 may penetrate from the through-hole formed in the lower surface of the attachment member 304. The flange 324 of the bellows 322 is attached so as to surround a through hole formed in the lower surface of the attachment member 304.

  A sealing O-ring 306 is preferably provided between the temperature adjustment plate 220 and the mounting member 304. Further, a plurality of (for example, two) centering lifter bushes 320 may be provided apart from each other as shown in FIG. Thereby, the centering accuracy of the lifter pin 242 can be further improved.

  In the elevating guide body 300 having such a configuration, as described above, the electrode plate 210 is thermally expanded more than the temperature adjusting plate 220, so that the relative displacement in the horizontal direction occurs on these contact surfaces. Even if it occurs, the elevating guide body 300 is fixed to the electrode plate 210 and is horizontally regulated by the counterbore 216, so that it moves following the electrode plate 210. Therefore, the pin insertion hole 214 of the electrode plate 210 and the pin hole 314 of the lifting guide body 300 are not displaced. Therefore, even if the lifter pin 242 is lifted and lowered in this state, the lifter pin 242 may be damaged or the electrode plate 210 may be It will not be damaged.

  Further, the elevating guide body 300 can be easily positioned on the electrode plate 210 simply by fitting the upper portion of the flange portion 330 to the counterbore 216 of the electrode plate 210 and fixing it with the bolt 344. Accordingly, the lifting guide body 300 is attached to the electrode plate 210 and the lifter pin 242 is attached to the temperature adjustment plate 220 via the bellows 322 so that the lifter pin 242 is inserted into the lifting guide body 300. Thus, since the electrode plate 210 can be attached on the temperature adjustment plate 220, it can be assembled easily.

  By the way, among the plurality of lifter pins 242 provided on the mounting table 200 as described above, all the lifter pins 242 may be configured as shown in FIGS. 4A, 5 and 6, and the temperature is adjusted by thermal expansion. Only the lifter pin 242 arranged at a position where the probability that the displacement of the electrode plate 210 with respect to the plate 220 is large is high may be configured as shown in FIGS. 4A, 5 and 6.

  For example, among the plurality of lifter pins 242 arranged as shown in FIG. 2, the lifter pin 242 arranged at the center of the mounting surface 212 of the mounting table 200 has almost no displacement of the electrode plate 210 due to thermal expansion. Although it does not occur, the displacement of the electrode plate 210 tends to increase as the distance from the central portion increases. This is because the thermal expansion of the electrode plate 210 expands radially from the center to the periphery.

  Therefore, only the peripheral lifter pins 242 arranged in the peripheral part of the mounting surface 212 where the positional deviation of the electrode plate 210 is large may be configured as shown in FIGS. 4A, 5 and 6. In this case, the center lifter pin 242 disposed at the center of the mounting surface 212 may be configured as shown in FIG. 3A, for example.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  The present invention is applicable to a mounting table and a substrate processing apparatus for mounting a substrate such as a liquid crystal display substrate.

It is sectional drawing which shows the structure of the substrate processing apparatus concerning embodiment of this invention. It is the figure which looked at the mounting base shown in FIG. 1 from the upper side. It is a figure which shows the example of arrangement | positioning of the lifter pin and the raising / lowering guide body for comparing with the case of this embodiment. It is a figure explaining an effect | action when an electrode plate has shifted | deviated with respect to the temperature adjustment plate in the case of FIG. 3A. It is a figure which shows the example of arrangement | positioning of the lifter pin and raising / lowering guide body in this embodiment. It is a figure explaining an effect | action when an electrode plate has shifted | deviated with respect to the temperature adjustment plate in the case of FIG. 4A. It is sectional drawing which shows the structural example of the raising / lowering guide body in this embodiment. It is sectional drawing which shows the other structural example of the raising / lowering guide body in this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Plasma processing apparatus 102 Processing chamber 104 Substrate carrying-in / out port 106 Gate valve 108 Exhaust pipe 109 Exhaust apparatus 110 Shower head 114 Matching device 116 High frequency power supply 122 Buffer chamber 124 Discharge hole 126 Gas introduction port 128 Gas introduction pipe 130 Open / close valve 132 Mass flow controller ( MFC)
134 Processing gas supply source 200 Mounting table 202 Outer frame portion 210 Electrode plate 212 Mounting surface 214, 224 Pin insertion hole 216 Counterbore 220 Temperature adjusting plate 222 Channel 226 Through hole 228 Flange insertion hole 230 Base member 242 Lifter pin (center) Part lifter pin, peripheral part lifter pin)
243 Support body 244 Pin body 246 Support rod 248 Base 250 Slide plate 252 Slide guide 254 Motor 300 Lifting guide body 302 Guide body 304 Mounting member 306 O-ring 312 Insertion hole 314 Pin hole 316 Centering hole 320 Centering lifter bush 322 Bellows 324 Flange 330 Flange portion 332 Bolt hole 340 Bolt 342 Washer 344 Bolt 350 Positioning pin 352 Positioning hole 362, 364 O-ring 366, 368 O-ring 369 O-ring G Substrate

Claims (8)

A substrate mounting table having electrodes formed by laminating a plurality of plates vertically,
A lifter pin provided so as to be movable up and down through a pin insertion hole penetrating the uppermost plate disposed at the uppermost portion of the plurality of plates;
A lifting guide body for guiding the lifting and lowering of the lifter pin,
The elevating guide body is disposed through a through hole of a lower plate stacked on the lower side of the uppermost plate, and is positioned so as to be immovable in a horizontal direction with respect to the uppermost plate. Substrate mounting table. 2. The substrate mounting table according to claim 1, wherein the position of the elevating guide body is regulated by a positioning member fitted in a positioning hole formed on an upper surface of the elevating guide body and a lower surface of the uppermost plate. An inner diameter of the through hole of the lower plate is formed larger than an outer diameter of the elevating guide body, and a difference between the inner diameter and the outer shape is determined according to a maximum deviation amount of the uppermost plate with respect to the lower plate. The substrate mounting table according to claim 1, wherein: The substrate mounting table according to claim 1, wherein the lifting guide body is attached to the lower plate so as to be movable in a horizontal direction. The uppermost plate is an electrode plate constituting the electrode body, and the lower plate is a temperature adjusting plate for adjusting the temperature of the electrode plate. Substrate mounting table. A substrate processing apparatus for performing plasma processing on a substrate,
A processing chamber configured to be evacuated;
Gas supply means for supplying a processing gas to the processing chamber;
A gas introduction means disposed above the processing chamber and introducing the gas from the gas supply means toward the substrate on the mounting table;
A substrate mounting table disposed below the processing chamber,
The substrate mounting table includes: an electrode formed by stacking a plurality of plates vertically; a lifter pin provided with a pin insertion hole penetrating through the uppermost plate disposed at the uppermost part of the plurality of plates; A substrate processing apparatus comprising: a substrate mounting table including a lifting guide body that is positioned so as to be immovable in a horizontal direction with respect to the uppermost plate and guides the lifting and lowering of the lifter pins. A substrate mounting table having electrodes formed by laminating a plurality of plates vertically,
A lifter pin provided so as to be movable up and down through a pin insertion hole penetrating the uppermost plate disposed at the uppermost portion of the plurality of plates;
A lifting guide body for guiding the lifting and lowering of the lifter pin,
The elevating guide body is positioned so as to be immovable in the horizontal direction by being inserted into and fixed to a positioning hole formed in the lower surface of the uppermost plate, and the lower side of the uppermost plate. A substrate mounting table, wherein the substrate mounting table is disposed through a through hole of a lower plate stacked on the substrate. A substrate processing apparatus for performing plasma processing on a substrate,
A processing chamber configured to be evacuated;
Gas supply means for supplying a processing gas to the processing chamber;
A gas introduction means disposed above the processing chamber and introducing the gas from the gas supply means toward the substrate on the mounting table;
A substrate mounting table disposed below the processing chamber,
The substrate mounting table includes: an electrode formed by stacking a plurality of plates vertically; a lifter pin provided with a pin insertion hole penetrating through the uppermost plate disposed at the uppermost part of the plurality of plates; A lifting guide body for guiding the lifting and lowering of the lifter pin,
The elevating guide body is positioned so as to be immovable in the horizontal direction by being inserted into and fixed to a positioning hole formed in the lower surface of the uppermost plate, and the lower side of the uppermost plate. A substrate processing apparatus, wherein the substrate processing apparatus is disposed through a through hole of a lower plate laminated on the substrate.

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