CN110289242B - Base adjusting device, chamber and semiconductor processing equipment - Google Patents
Base adjusting device, chamber and semiconductor processing equipment Download PDFInfo
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- CN110289242B CN110289242B CN201810225956.XA CN201810225956A CN110289242B CN 110289242 B CN110289242 B CN 110289242B CN 201810225956 A CN201810225956 A CN 201810225956A CN 110289242 B CN110289242 B CN 110289242B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
The invention provides a base adjusting device, a chamber and semiconductor processing equipment, wherein the device comprises a lifting support, a main adjusting assembly, a first auxiliary adjusting assembly and a second auxiliary adjusting assembly, wherein the lifting support is connected with a lifting mechanism of a base; the main adjusting component, the first auxiliary adjusting component and the second auxiliary adjusting component fix the lifting support below the cavity, and the arrangement mode of the three is as follows: two orthographic projection centers on the base are connected to form a triangle, and the center of the triangle is overlapped with the center of the base; the main adjusting assembly is used for driving the lifting support to move along a first horizontal direction or a second horizontal direction, and the first horizontal direction is vertical to the second horizontal direction; the first auxiliary adjusting component and the second auxiliary adjusting component are used for driving the lifting support to ascend or descend. The base adjusting device provided by the invention can adjust the levelness and the horizontal position of the base, and simultaneously avoids mutual interference between levelness adjustment and horizontal position adjustment, thereby reducing the adjustment difficulty and improving the adjustment precision.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a base adjusting device, a chamber and semiconductor processing equipment.
Background
In recent years, semiconductor-related devices have been rapidly developed, and devices such as integrated circuits, solar panels, flat panel displays, microelectronics, and light emitting diodes have been developed, and these devices are mainly formed by forming a plurality of thin films of different materials and thicknesses on a substrate. Therefore, reliability and stability of a film forming apparatus, which is a core of a semiconductor apparatus, are important factors that determine quality and yield of thin film growth of a semiconductor device.
In general, a susceptor for placing a substrate is provided in a reaction chamber of a semiconductor film forming apparatus, and is generally controlled to be lifted and lowered by a lifting mechanism so as to reach a process position. However, the conventional semiconductor devices have a problem of film formation unevenness due to: firstly, because the process air inlet component is not concentric with the base, the position deviation of the wafer on the base and the process air inlet component is caused, and the film forming is not uniform; secondly, the upper surface of the base is not parallel to the lower surface of the process gas inlet component, so that the process gas flow in the chamber is not uniform (disordered), and the film forming uniformity is influenced.
In order to solve the above problems, it is known to provide a susceptor adjusting device at the bottom of the chamber for adjusting the parallelism and horizontal position of the susceptor. Referring to fig. 1, a susceptor 4 is disposed in a conventional chamber 2, and an air inlet device 5 is disposed above the susceptor 4. And, still be provided with elevating system in cavity 2 bottom, this elevating system includes lift axle 1, guide rail lead screw 10 and rotating electrical machines 6, wherein, the upper end of lift axle 1 is connected with base 4, and the lower extreme extends to the outside of cavity to be connected with slider 7 of guide rail lead screw 10 through supporting shoe 3. Under the drive of the rotating motor 6, the slide block 7 ascends or descends along the guide rail screw 10, so that the support block 3, the lifting shaft 1 and the base 4 are driven to ascend or descend.
The existing base adjusting device comprises an adjusting block 14 and four adjusting screws (11A-11D), wherein the adjusting block 14 is positioned between the supporting block 3 and the sliding block 7; the two adjusting screws (11A, 11B) are arranged on the adjusting block 14 at intervals along the vertical direction, and the axes of the two adjusting screws (11A, 11B) are arranged along the first horizontal direction; the other two adjusting screws (11C, 11D) are arranged on the adjusting block 14 at intervals along the vertical direction, and the axes of the two adjusting screws (11C, 11D) are arranged along the second horizontal direction; the first horizontal direction and the second horizontal direction are two directions in a horizontal plane and are perpendicular to each other. The base 4 is adjustable to be concentric with the process unit 5 in a first horizontal direction by two adjustment screws (11A, 11B), and the base 4 is adjustable to be concentric with the air intake unit 5 in a second horizontal direction by two adjustment screws (11C, 11D). Meanwhile, the base 4 and the air inlet device 5 can be adjusted to be parallel to each other in a first horizontal direction by two adjusting screws (11A, 11B); the base 4 and the air intake device 5 can be adjusted to be parallel to each other in the second horizontal direction by two adjustment screws (11C, 11D).
From the above, the concentricity and the parallelism of the base 4 and the air intake device 5 in the first horizontal direction are both achieved by the adjustment of the two adjustment screws (11A, 11B), and the concentricity and the parallelism of the base 4 and the air intake device 5 in the second horizontal direction are both achieved by the adjustment of the two adjustment screws (11C, 11D), and specifically, when the base 4 and the air intake device 5 are made parallel in the first horizontal direction, it is necessary to rotate one of the two adjustment screws (11A, 11B) and it is necessary that the other is fixed and cannot rotate. When the base 4 and the air intake device 5 are concentric in the first horizontal direction, the two adjusting screws (11A, 11B) need to be simultaneously and simultaneously rotated by the same angle in the same direction. Therefore, when the adjusting base 4 is parallel to the air intake device 5, the concentricity of the adjusting base 4 and the air intake device 5 is inevitably affected, so that the adjusting and the concentricity are interfered with each other, which is very demanding for operators and is difficult to realize.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a base adjusting device, a chamber and semiconductor processing equipment, which can adjust the levelness and the horizontal position of a base and simultaneously avoid the mutual interference between the adjustment of the levelness and the adjustment of the horizontal position, thereby reducing the adjustment difficulty and improving the adjustment precision.
To achieve the object of the present invention, there is provided a susceptor adjusting apparatus including a lifting bracket, a main adjusting assembly, a first sub adjusting assembly, and a second sub adjusting assembly, wherein,
the lifting support is connected with the lifting mechanism of the base;
the main adjusting assembly, the first auxiliary adjusting assembly and the second auxiliary adjusting assembly fix the lifting support below the chamber; and, the arrangement mode of main adjusting part, first vice adjusting part and the vice adjusting part of second is: the two forward projection centers of the three parts on the base are connected to form a triangle, and the center of the triangle is overlapped with the center of the base; wherein the content of the first and second substances,
the main adjusting assembly is used for driving the lifting support to move along a first horizontal direction or a second horizontal direction, and the first horizontal direction is vertical to the second horizontal direction;
the first auxiliary adjusting assembly and the second auxiliary adjusting assembly are used for driving the lifting support to ascend or descend.
Optionally, the lifting support comprises a leveling plate, a mounting plate and a support plate, wherein the leveling plate is horizontally arranged; the mounting plate and the supporting plate are vertically arranged and are perpendicular to each other, and the upper ends of the mounting plate and the supporting plate are connected with the bottom of the leveling plate;
the mounting plate is connected with the lifting mechanism of the base;
the primary adjustment assembly, the first secondary adjustment assembly and the second secondary adjustment assembly secure the leveling plate below the chamber.
Optionally, a first through hole and a first long circular hole are formed in the leveling plate at a position corresponding to the main adjusting assembly, and the length direction of the first long circular hole is perpendicular to the first horizontal direction; a first guide groove is formed in the bottom surface of the leveling plate, and the length direction of the first guide groove is parallel to the first horizontal direction;
the main adjusting component comprises an upper adjusting piece, a lower adjusting piece, a connecting shaft, a first eccentric shaft and a second eccentric shaft, wherein,
the upper adjusting piece is matched with the first guide groove and can move along the first guide groove; a central hole and an upper long round hole are arranged in the upper adjusting piece; the length direction of the upper long round hole is vertical to the second horizontal direction;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the first through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode;
the first eccentric shaft includes a first rotation part and a first eccentric part, the first rotation part being rotatably provided in the upper adjustment member; the first eccentric part is matched with the first long circular hole;
the second eccentric shaft includes a second rotation part and a second eccentric part, the second rotation part being rotatably provided in the lower adjustment member; the second eccentric part is matched with the upper long round hole.
Optionally, a second through hole is formed in the leveling plate at a position corresponding to the first auxiliary adjusting assembly; a second guide groove is formed in the bottom surface of the leveling plate, and the length direction of the second guide groove is parallel to the first horizontal direction;
the first sub-adjustment assembly comprises an upper adjustment member, a lower adjustment member and a connecting shaft, wherein,
the upper adjusting piece is matched with the second guide groove and can move along the second guide groove; a central hole is arranged in the upper adjusting piece;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the second through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode.
Optionally, a third through hole is formed in the leveling plate at a position corresponding to the second auxiliary adjusting component; a third guide groove is formed in the bottom surface of the leveling plate, and the length direction of the third guide groove is parallel to the first horizontal direction;
the second pair of adjustment assemblies comprises an upper adjustment member, a lower adjustment member, and a connecting shaft, wherein,
the upper adjusting piece is matched with the third guide groove and can move along the third guide groove; a central hole is arranged in the upper adjusting piece;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the third through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode.
Optionally, the connecting shaft comprises a connecting column and a joint bearing, wherein,
the connecting column penetrates through the first through hole to be in threaded connection with the cavity;
the joint bearing comprises a mounting seat and a ball body, wherein the mounting seat is fixed in the lower adjusting piece; the ball body is rotatably arranged in the mounting seat, a central through hole is formed in the ball body, and the central through hole is matched with the connecting column.
Optionally, a first threaded hole, a second threaded hole and a third threaded hole are further provided in the leveling plate, wherein,
a first mounting hole is formed in the upper adjusting part of the main adjusting assembly and corresponds to the first threaded hole, the main adjusting assembly further comprises a first screw, and the first screw penetrates through the first mounting hole from bottom to top and is matched with the first threaded hole; the diameter of the first mounting hole is larger than that of the first screw;
a second mounting hole is formed in the upper adjusting part of the first auxiliary adjusting assembly and corresponds to the second threaded hole, the first auxiliary adjusting assembly further comprises a second screw, and the second screw penetrates through the second mounting hole from bottom to top and is matched with the second threaded hole; the diameter of the second mounting hole is larger than that of the second screw;
a third mounting hole is formed in the upper adjusting part of the second auxiliary adjusting assembly and corresponds to the third threaded hole, and the second auxiliary adjusting assembly further comprises a third screw which penetrates through the third mounting hole from bottom to top and is matched with the third threaded hole; the diameter of the third mounting hole is larger than that of the third screw.
Optionally, a fourth threaded hole is arranged in the upper adjusting piece; correspondingly, a fourth mounting hole is formed in the lower adjusting piece, and a fourth screw penetrates through the fourth mounting hole from bottom to top and is matched with the fourth threaded hole; the diameter of the fourth mounting hole is larger than that of the fourth screw.
Optionally, the lifting mechanism comprises a lifting guide rail, a sliding block, a base mounting block, a lifting shaft and a corrugated pipe, wherein,
the lifting guide rail is vertically arranged and is fixedly connected with the mounting plate;
the sliding block can do lifting linear motion along the lifting guide rail;
the base mounting block is fixedly connected with the sliding block;
the lifting shaft is vertically arranged, the upper end of the lifting shaft is fixedly connected with the base, and the lower end of the lifting shaft extends to the outside of the chamber and is fixedly connected with the base mounting block;
the corrugated pipe is sleeved outside the lifting shaft and used for sealing a gap between the lifting shaft and the chamber wall of the chamber.
Optionally, the triangle includes a right-angled triangle or an equilateral triangle; when the triangle is a right triangle, the center of the main adjusting component corresponds to the right angle of the right triangle.
As another technical scheme, the invention also provides a chamber, wherein a base is arranged in the chamber, an air inlet part is arranged above the base, and a lifting mechanism is arranged below the base and used for driving the base to do lifting linear motion; and a base adjusting device is arranged below the chamber and used for adjusting the levelness and the horizontal position of the base through the lifting mechanism, and the base adjusting device adopts the base adjusting device provided by the invention.
As another technical solution, the present invention further provides a semiconductor processing apparatus including the above chamber provided by the present invention.
The invention has the following beneficial effects:
according to the base adjusting device provided by the invention, the main adjusting component, the first auxiliary adjusting component and the second auxiliary adjusting component are connected with each other at the orthographic projection center on the base to form a triangle, and the triangle is mutually overlapped with the center of the base. The main adjusting assembly is used for driving the lifting support to move along a first horizontal direction or a second horizontal direction, and the first horizontal direction is vertical to the second horizontal direction; the first auxiliary adjusting component and the second auxiliary adjusting component are used for driving the lifting support to ascend or descend. When the levelness of the base is adjusted, the main adjusting component is fixed, and the heights of the base at the positions of the main adjusting component and the auxiliary adjusting component are adjusted respectively until the upper surface of the base is parallel to the reference surface. When the horizontal position of the base is adjusted, the main adjusting assembly is used for driving the base to move along the first horizontal direction and/or the second horizontal direction until the base is concentric with the air inlet device. Therefore, the base adjusting device provided by the invention can avoid the mutual interference between the adjustment of the levelness of the base and the adjustment of the horizontal position, thereby reducing the adjustment difficulty and improving the adjustment precision.
According to the chamber provided by the invention, by adopting the base adjusting device provided by the invention, the levelness and the horizontal position of the base can be adjusted, and meanwhile, the adjustment of the levelness and the adjustment of the horizontal position are prevented from interfering with each other, so that the adjustment difficulty is reduced, and the adjustment precision is improved.
According to the semiconductor processing equipment provided by the invention, the levelness and the horizontal position of the base can be adjusted by adopting the cavity provided by the invention, and meanwhile, the adjustment of the levelness and the adjustment of the horizontal position are prevented from interfering with each other, so that the adjustment difficulty is reduced, and the adjustment precision is improved.
Drawings
FIG. 1 is a block diagram of a conventional chamber;
FIG. 2 is an installation view of a base adjustment device provided in accordance with an embodiment of the present invention;
FIG. 3 is a bottom view of a base adjustment device provided in accordance with an embodiment of the present invention;
FIG. 4 is a block diagram of a lift bracket used in an embodiment of the present invention;
FIG. 5A is a block diagram of a primary adjustment assembly employed by an embodiment of the present invention;
FIG. 5B is a cross-sectional view of the primary adjustment assembly of FIG. 5A taken along the X-direction;
FIG. 5C is a cross-sectional view of the primary adjustment assembly of FIG. 5A taken along the Y-direction;
FIG. 6 is a structural view of an eccentric shaft employed in the embodiment of the present invention;
fig. 7 is a structural view of a lower regulating member employed in the embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the susceptor adjusting apparatus, the chamber and the semiconductor processing apparatus provided by the present invention will be described in detail below with reference to the accompanying drawings.
Referring to fig. 2 and 3, a susceptor adjusting device according to an embodiment of the present invention is disposed at the bottom of the chamber 100, and is used for adjusting the levelness and the horizontal position of the susceptor 101 by a lifting mechanism to achieve leveling and concentricity of the susceptor 101 and the air inlet device 102. Specifically, the base adjustment device includes a lifting bracket 60, a primary adjustment assembly 40, a first secondary adjustment assembly 50A, and a second secondary adjustment assembly 50B, wherein the lifting bracket 60 is connected to a lifting mechanism. The primary adjustment assembly 40, the first secondary adjustment assembly 50A and the second secondary adjustment assembly 50B secure the lift bracket 60 below the chamber 100.
As shown in fig. 3, the main adjusting assembly 40, the first sub-adjusting assembly 50A and the second sub-adjusting assembly 50B are arranged in the following manner: the centers of the three orthographic projections on the base 101 are connected to form a triangle, and the center of the triangle is overlapped with the center of the base 101. The dashed lines in fig. 3 indicate triangles. In this embodiment, the triangle is a right triangle, preferably an isosceles right triangle. And, the main adjusting unit 40 is located at the right angle of the right triangle. By overlapping the triangle with the center of the base 101, i.e., the center of the base 101 is located within the triangle or coincides with one of the sides of the triangle, it is ensured that the main adjusting assembly 40, the first sub-adjusting assembly 50A and the second sub-adjusting assembly 50B can uniformly bear the weight of the base 101.
The main adjustment assembly 40 is configured to drive the lifting bracket 60 to move in a first horizontal direction or in a second horizontal direction, where the first horizontal direction is perpendicular to the second horizontal direction. As shown in fig. 3, when the triangle is a right triangle, the first horizontal direction is a central connecting line direction of the main adjusting assembly 40 and the first sub adjusting assembly 50A, i.e., an X direction; the second horizontal direction is a direction connecting the centers of the main adjustment assembly 40 and the second sub-adjustment assembly 50B, i.e., the Y direction. When the horizontal position of the base 101 is adjusted, the lifting mechanism 60 and the base 101 thereon are driven by the main adjusting assembly 40 to move in the first horizontal direction and/or the second horizontal direction until the base 101 is concentric with the air inlet device 102.
It should be noted that, in the present embodiment, the triangle is a right triangle, but the present invention is not limited to this, and in practical application, the triangle may also be an isosceles triangle or other triangles. In this case, the first horizontal direction and the second horizontal direction are still perpendicular to each other, but are different from the direction of the center line connecting the main adjustment unit 40 and the first sub adjustment unit 50A and the direction of the center line connecting the main adjustment unit 40 and the second sub adjustment unit 50B, respectively.
The first auxiliary adjusting assembly 50A and the second auxiliary adjusting assembly 50B are used for driving the lifting bracket 60 to ascend or descend, so as to drive the base 101 to ascend or descend. When the levelness of the base 101 is adjusted, the main adjusting assembly 40 is fixed, and the heights of the base 101 at the positions of the main adjusting assembly and the base 101 are adjusted by the first auxiliary adjusting assembly 50A and the second auxiliary adjusting assembly 50B respectively until the upper surface of the base 101 is parallel to the reference surface, so that the leveling of the base 101 and the air inlet device 102 is realized.
From the above, the main adjusting assembly 40, the first auxiliary adjusting assembly 50A and the second auxiliary adjusting assembly 50B are arranged in a triangular shape, the main adjusting assembly 40 can be used for realizing the concentricity of the base 101 and the air inlet device 102, and the first auxiliary adjusting assembly 50A and the second auxiliary adjusting assembly 50B are used for realizing the leveling of the base 101 and the air inlet device 102, so that the mutual interference between the adjustment of the levelness of the base and the adjustment of the horizontal position can be avoided, the adjusting difficulty is reduced, and the adjusting precision is improved.
Referring to fig. 1, in the prior art, a lead screw 10 and a lifting shaft 1 are independently installed at the bottom of a chamber 2, so that a base 4 is in a cantilever state, and as the base is lifted and the pressure inside the chamber changes, a cantilever structure is affected by an irregularly changing moment, so that a supporting block 3 and the lead screw 10 are deformed, and the position and the levelness of the base 4 are changed.
In order to solve the above problem, as shown in fig. 4, in the present embodiment, the lifting bracket 60 includes a leveling plate 61, a mounting plate 62, and a support plate 63, wherein the leveling plate 61 is horizontally disposed, and the lifting mechanism is connected to the base 101 through an opening 615 of the leveling plate 61. Mounting panel 62 and backup pad 63 are all vertical setting, and the two mutually perpendicular to the upper end of mounting panel 62 and backup pad 63 all is connected with leveling board 61's bottom.
The mounting plate 62 is connected to the lift mechanism. The primary adjustment assembly 40, the first secondary adjustment assembly 50A and the second secondary adjustment assembly 50B secure the leveling plate 61 below the chamber 100. Because the main adjusting assembly 40, the first auxiliary adjusting assembly 50A and the second auxiliary adjusting assembly 50B are arranged in a triangle and fix the leveling plate 61 below the chamber 100, three corners of the leveling plate 61 are all restrained to form a deflection structure, thereby preventing the leveling plate 61 from deforming. Moreover, the mounting plate 62 and the support plate 63, which are perpendicular to each other, can increase the overall rigidity of the lifting bracket 60, thereby preventing the lifting bracket 60 from deforming and not deforming with the pressure change in the chamber, thereby ensuring the process quality.
In the present embodiment, a first through hole 611C and a first oblong hole 612 are provided in the leveling plate 61 at a position corresponding to the main adjustment assembly 40, and a longitudinal direction of the first oblong hole 612 is perpendicular to the first horizontal direction (X direction). A first guide groove 613C, the longitudinal direction of which is parallel to the first horizontal direction (X direction), is provided on the bottom surface of the leveling plate 61.
Referring to fig. 5A to 5C, the main adjusting assembly 40 includes an upper adjusting member 401, a lower adjusting member 404, a connecting shaft 402, a first eccentric shaft 403 and a second eccentric shaft 413, wherein the upper adjusting member 401 is engaged with the first guiding groove 613C and can move along the first guiding groove 613C, i.e. along the X direction. Also, a center hole 411 and an upper long circular hole 407 are provided in the upper adjuster 401. The upper oblong hole 407 has a longitudinal direction perpendicular to a second horizontal direction (Y direction).
A fourth guide groove (not shown) is formed in the bottom surface of the upper adjusting member 401, and the length direction of the fourth guide groove is parallel to the second horizontal direction (Y direction); the lower adjusting member 404 is engaged with the fourth guide groove and can move along the fourth guide groove, i.e., in the Y direction.
The upper end of the connection shaft 402 passes through the first through hole 611C of the leveling plate 61 and is connected to the bottom wall of the chamber 100. The lower end of the connecting shaft 402 is swingably connected to the lower adjuster 404 through the center hole 411. In the present embodiment, as shown in fig. 5B, the connection shaft 402 includes a connection column 402a and a joint bearing, wherein an upper portion of the connection column 402a (having an external thread) is threadedly connected to the chamber 100 through the first through hole 611C, and a lower portion of the connection column 402a (having an external thread) is threadedly connected to the nut 402 d. The spherical plain bearing includes a mount 402c and a ball 402b, wherein, as shown in fig. 7, a center hole 416 is provided in the lower adjustment member 404, and the mount 402c is fixed in the center hole 416 of the lower adjustment member 404; a ball 402b is rotatably disposed in the mounting block 402c and a central through hole is provided in the ball 402b that mates with a nut 402d on the connecting post. When the nut 402d is tightened against the connecting post 402a, the primary adjustment assembly 40 is fixed relative to the chamber 100. In addition, as shown in fig. 5A, a bearing locking ring 406 is used to lock the knuckle bearing so that it is fixed relative to the lower adjuster 404.
As shown in fig. 6, the first eccentric shaft 403 includes a first rotation portion 403b and a first eccentric portion 403a, the first rotation portion 403b being rotatably provided in the upper adjustment member 401; the first eccentric portion 403a is offset from the rotation center of the first rotating portion 403b and fits into the first oblong hole 612 of the leveling plate 61.
Similar to the first eccentric shaft 403 described above, the second eccentric shaft 413 includes a second rotation portion rotatably provided in a through hole 415 (shown in fig. 7) of the lower adjustment member 404 and a second eccentric portion; the second eccentric portion is offset from the center of rotation of the second rotating portion and fits into the upper oblong hole 407 of the upper adjustment member 401.
When it is required to adjust the position of the base 101 in the first horizontal direction (X direction), the lock nut 402d is engaged with the coupling post 402a, so that the main adjustment assembly 40 is fixed with respect to the chamber 100. Then, by rotating first eccentric shaft 403 clockwise or counterclockwise, the friction force generated by first eccentric portion 403a of first eccentric shaft 403 and first long circular hole 612 of leveling plate 61 in cooperation therewith can make upper adjusting piece 401 and first guide groove 613C move relatively, that is, leveling plate 61 moves in the X direction, so as to drive lifting mechanism and base 101 thereon to move in the X direction until base 101 is concentric with air inlet device 102 in the X direction.
When the position of the base 101 in the second horizontal direction (X direction) needs to be adjusted, the second eccentric shaft 413 is rotated clockwise or counterclockwise, the lower adjusting member 404 and the fourth guide slot can move relatively by the friction force generated by the second eccentric portion of the second eccentric shaft 413 and the upper long circular hole 407 of the upper adjusting member 401 matching with the second eccentric shaft, so that the lower adjusting member 404 drives the leveling plate 61 to move along the Y direction, and the lifting mechanism and the base 101 thereon are driven to move along the Y direction until the base 101 is concentric with the air inlet device 102 in the Y direction.
It should be noted that, during the process of adjusting the horizontal position of the base 101, the connecting shaft 402 may swing, and in order to reserve a sufficient swing space for the connecting shaft 402, the diameter of the first through hole 611C should be greater than or equal to the sum of the diameter of the through hole of the connecting shaft 402 and the adjustment amount.
In the present embodiment, referring to fig. 5C and fig. 7, a fourth threaded hole 408 is disposed in the upper adjusting member 401; correspondingly, a fourth mounting hole 414 is formed in the lower adjusting member 404, and a fourth screw 412 passes through the fourth mounting hole 414 from bottom to top and is matched with the fourth threaded hole 408, so that the upper adjusting member 401 and the lower adjusting member 404 are fixed. The diameter of the fourth mounting hole 414 is larger than the diameter of the fourth screw 412, and preferably, the fourth mounting hole 414 is an oblong hole whose longitudinal direction is perpendicular to the Y direction. The length or diameter of the fourth mounting hole 414 in the Y direction should be greater than or equal to the sum of the diameter of the fourth screw 412 and the adjustment amount to provide sufficient space for the horizontal movement of the lower adjustment member 404.
The first and second secondary adjustment assemblies 50A and 50B are similarly constructed to include upper and lower adjustment members and a connecting shaft, as compared to the primary adjustment assembly 40 described above. However, the first and second sub-adjusting units 50A and 50B are not provided with the first and second eccentric shafts, and other configurations of the first and second sub-adjusting units 50A and 50B are the same as the main adjusting unit 40.
Specifically, a second through hole 611A is provided on the leveling plate 61 at a position corresponding to the first sub-adjustment member 50A. A second guide groove 613A is provided in the bottom surface of the leveling plate 61.
The first sub regulation assembly 50A includes an upper regulation member, a lower regulation member, and a connection shaft, wherein the upper regulation member is engaged with the second guide groove 613A and is movable along the second guide groove 613A, that is, along the X direction. A central bore is provided in the upper adjustment member.
A fourth guide groove is arranged on the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction (Y direction); the lower adjusting member is engaged with the fourth guide groove and is movable along the fourth guide groove, i.e., in the Y direction.
The upper end of the connecting shaft passes through the second through hole 611A and is connected to the bottom wall of the chamber 100, and the lower end of the connecting shaft passes through the central hole of the upper adjuster and is swingably connected to the lower adjuster. Similar to the connecting shaft 402 of the main adjuster 40, the connecting shaft may also be configured as a connecting column and a joint bearing, which are not described in detail since they are described in detail above.
Corresponding to the second sub-adjustment assembly 50B, a third through hole (not shown) is formed in the leveling member 61 at a position corresponding to the second sub-adjustment assembly 50B. Further, a third guide groove (not shown) is provided on the bottom surface of the leveling plate 61.
The second sub-adjustment assembly 50B comprises an upper adjustment member, a lower adjustment member and a connecting shaft, wherein the upper adjustment member is engaged with the third guide groove and is movable along the third guide groove, i.e., along the X direction. A central bore is provided in the upper adjustment member.
A fourth guide groove is arranged on the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction (Y direction); the lower adjusting member is engaged with the fourth guide groove and is movable along the fourth guide groove, i.e., in the Y direction.
The upper end of the connecting shaft passes through the third through hole and is connected with the bottom wall of the chamber 100, and the lower end of the connecting shaft passes through the central hole of the upper adjusting piece and is connected with the lower adjusting piece in a swinging way. Similar to the connecting shaft 402 of the main adjuster 40, the connecting shaft may also be configured as a connecting column and a joint bearing, which are not described in detail since they are described in detail above.
When the levelness of the base 101 in the first horizontal direction (X direction) needs to be adjusted, the nut (the structure of which is the same as the nut 402 d) of the connecting shaft of the first auxiliary adjusting assembly 50A is rotated clockwise or counterclockwise, the internal thread of the nut is matched with the external thread of the connecting column, so that the nut ascends or descends relative to the connecting shaft, the lower adjusting piece and the upper adjusting piece which are connected through the fixing seat are driven to synchronously ascend or descend, the lifting support 60 is driven to incline corresponding to one corner where the first auxiliary adjusting assembly 50A is located, the base 101 inclines accordingly, and the leveling of the base 101 in the X direction is achieved.
When the levelness of the base 101 in the second horizontal direction (Y direction) needs to be adjusted, the nut of the connecting shaft of the second auxiliary adjusting component 50B is rotated clockwise or counterclockwise, the internal thread of the nut is matched with the external thread of the connecting column, so that the nut is lifted or lowered relative to the connecting shaft, thereby driving the lower adjusting part and the upper adjusting part which are connected through the fixing seat to be lifted or lowered synchronously, further driving the lifting bracket 60 to incline at an angle corresponding to the second auxiliary adjusting component 50B, and the base 101 is inclined therewith, thereby realizing the leveling of the base 101 in the Y direction.
Alternatively, the first and second secondary adjustment assemblies 50A and 50B may be made lower in height relative to the height of the primary adjustment assembly 40 to facilitate leveling of the base 101. Specifically, the intermediate non-threaded portion of the connecting shaft of the first and second secondary adjustment assemblies 50A and 50B may be made larger than the intermediate non-threaded portion of the connecting shaft of the primary adjustment assembly 40.
Alternatively, the levelness of the base 101 in the X direction and the Y direction may be adjusted first, and then the levelness of the base 101 in the X direction and the Y direction may be adjusted.
In the present embodiment, a first threaded hole 614C, a second threaded hole 614A and a third threaded hole (not shown in the figure) are further provided in the leveling plate 61, wherein a first mounting hole 410 is provided in the upper adjustment member 401 of the main adjustment assembly 40 at a position corresponding to the first threaded hole 614C, and the main adjustment assembly 40 further includes a first screw 409, and the first screw 409 passes through the first mounting hole 410 from bottom to top and is matched with the first threaded hole 614C, so as to fix the upper adjustment member 401 to the leveling plate 61. The diameter of the first mounting hole 410 is larger than the diameter of the first screw 409 to reserve enough space for the leveling plate 61 to translate.
Similar to the above-mentioned main adjusting assembly, a second mounting hole is provided in the upper adjusting member of the first sub-adjusting assembly 50A at a position corresponding to the second threaded hole 614A, and the first sub-adjusting assembly 50A further includes a second screw passing through the second mounting hole from bottom to top and engaging with the second threaded hole 614A; the diameter of the second mounting hole is larger than that of the second screw.
Similarly, a third mounting hole is formed in the upper adjusting member of the second sub-adjusting assembly 50B at a position corresponding to the third threaded hole, and the second sub-adjusting assembly further includes a third screw passing through the third mounting hole from bottom to top and matching with the third threaded hole; the diameter of the third mounting hole is larger than that of the third screw.
In the present embodiment, as shown in fig. 2, the lifting mechanism includes a lifting rail 71, a slider (not shown), a base mounting block 72, a lifting shaft 75, a bellows 73, and a motor 74, wherein the lifting rail 71 is vertically disposed and fixedly connected to the mounting plate 62. The motor 74 drives the slider to move up and down through the lifting guide rail 71, thereby driving the lifting shaft 75 to move up and down. Alternatively, as shown in fig. 4, a positioning groove 621 is provided on the side of the mounting plate 62 opposite to the lifting mechanism, and the lifting rail 71 cooperates with the positioning groove 621 to define the position of the lifting rail 71, so as to ensure that the lifting rail 71 can move synchronously with the mounting plate 62.
The slider can make 71 lifting linear motion along the lifting guide rail. The base mounting block 72 is fixedly connected to the slider. The elevating shaft 75 is vertically disposed, an upper end of the elevating shaft 75 is fixedly connected to the base 101, and a lower end of the elevating shaft 75 extends to an outside of the chamber 100 and is fixedly connected to the base mounting block 72. The bellows 73 is fitted around the elevating shaft 75 to seal a gap between the elevating shaft 75 and a chamber wall of the chamber 100.
In the process of adjusting the levelness or horizontal position of the base 101, the lifting guide rail 71 moves synchronously with the mounting plate 62 and drives the base mounting block 72, the lifting shaft 75 and the base 101 to move synchronously.
As another technical solution, as shown in fig. 2, an embodiment of the present invention further provides a chamber 100, in which a susceptor 101 is disposed in the chamber 100, an air inlet part 102 is disposed above the susceptor 101, and a lifting mechanism is disposed below the susceptor 101 for driving the susceptor 101 to perform a lifting linear motion; a susceptor adjusting device is further provided below the chamber 100 for adjusting the levelness and horizontal position of the susceptor 101 by the elevating mechanism. The base adjusting device provided by the embodiment of the invention is adopted.
According to the chamber provided by the embodiment of the invention, by adopting the base adjusting device provided by the embodiment of the invention, the levelness and the horizontal position of the base can be adjusted, and meanwhile, the adjustment of the levelness and the adjustment of the horizontal position are prevented from interfering with each other, so that the adjusting difficulty is reduced, and the adjusting precision is improved.
As another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, including the chamber provided in the embodiment of the present invention.
According to the semiconductor processing equipment provided by the embodiment of the invention, the levelness and the horizontal position of the base can be adjusted by adopting the cavity provided by the embodiment of the invention, and meanwhile, the adjustment of the levelness and the adjustment of the horizontal position are prevented from interfering with each other, so that the adjustment difficulty is reduced, and the adjustment precision is improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (14)
1. A base adjusting device is characterized by comprising a lifting bracket, a main adjusting component, a first auxiliary adjusting component and a second auxiliary adjusting component, wherein,
the lifting support is connected with the lifting mechanism of the base;
the main adjusting assembly, the first auxiliary adjusting assembly and the second auxiliary adjusting assembly fix the lifting support below the chamber; and, the arrangement mode of main adjusting part, first vice adjusting part and the vice adjusting part of second is: the two forward projection centers of the three parts on the base are connected to form a triangle, and the center of the triangle is overlapped with the center of the base; wherein the content of the first and second substances,
the main adjusting assembly is used for driving the lifting support to move along a first horizontal direction or a second horizontal direction, and the first horizontal direction is vertical to the second horizontal direction;
the first auxiliary adjusting assembly and the second auxiliary adjusting assembly are used for driving the lifting support to ascend or descend.
2. The susceptor adjustment apparatus of claim 1, wherein the lifting bracket includes a leveling plate, a mounting plate, and a support plate, wherein the leveling plate is horizontally disposed; the mounting plate and the supporting plate are vertically arranged and are perpendicular to each other, and the upper ends of the mounting plate and the supporting plate are connected with the bottom of the leveling plate;
the mounting plate is connected with the lifting mechanism of the base;
the primary adjustment assembly, the first secondary adjustment assembly and the second secondary adjustment assembly secure the leveling plate below the chamber.
3. The susceptor adjustment apparatus of claim 2, wherein a first through hole and a first oblong hole are provided on the leveling plate at a position corresponding to the main adjustment assembly, and a length direction of the first oblong hole is perpendicular to the first horizontal direction; a first guide groove is formed in the bottom surface of the leveling plate, and the length direction of the first guide groove is parallel to the first horizontal direction;
the main adjusting component comprises an upper adjusting piece, a lower adjusting piece, a connecting shaft, a first eccentric shaft and a second eccentric shaft, wherein,
the upper adjusting piece is matched with the first guide groove and can move along the first guide groove; a central hole and an upper long round hole are arranged in the upper adjusting piece; the length direction of the upper long round hole is vertical to the second horizontal direction;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the first through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode;
the first eccentric shaft includes a first rotation part and a first eccentric part, the first rotation part being rotatably provided in the upper adjustment member; the first eccentric part is matched with the first long circular hole;
the second eccentric shaft includes a second rotation part and a second eccentric part, the second rotation part being rotatably provided in the lower adjustment member; the second eccentric part is matched with the upper long round hole.
4. The susceptor adjustment apparatus of claim 2, wherein a second through hole is provided on the leveling plate at a position corresponding to the first sub-adjustment member; a second guide groove is formed in the bottom surface of the leveling plate, and the length direction of the second guide groove is parallel to the first horizontal direction;
the first sub-adjustment assembly comprises an upper adjustment member, a lower adjustment member and a connecting shaft, wherein,
the upper adjusting piece is matched with the second guide groove and can move along the second guide groove; a central hole is arranged in the upper adjusting piece;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the second through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode.
5. The susceptor adjustment apparatus of claim 2, wherein a third through hole is provided in the leveling plate at a position corresponding to the second set of adjustment members; a third guide groove is formed in the bottom surface of the leveling plate, and the length direction of the third guide groove is parallel to the first horizontal direction;
the second pair of adjustment assemblies comprises an upper adjustment member, a lower adjustment member, and a connecting shaft, wherein,
the upper adjusting piece is matched with the third guide groove and can move along the third guide groove; a central hole is arranged in the upper adjusting piece;
a fourth guide groove is formed in the bottom surface of the upper adjusting piece, and the length direction of the fourth guide groove is parallel to the second horizontal direction; the lower adjusting piece is matched with the fourth guide groove and can move along the fourth guide groove;
the upper end of the connecting shaft penetrates through the third through hole and is connected with the cavity, and the lower end of the connecting shaft penetrates through the central hole and is connected with the lower adjusting piece in a swinging mode.
6. Base adjustment device according to claim 3, characterized in that the connection shaft comprises a connection column and a joint bearing, wherein,
the connecting column penetrates through the first through hole to be in threaded connection with the cavity;
the joint bearing comprises a mounting seat and a ball body, wherein the mounting seat is fixed in the lower adjusting piece; the ball body is rotatably arranged in the mounting seat, a central through hole is formed in the ball body, and the central through hole is matched with the connecting column.
7. Susceptor adjustment device according to claim 3, characterized in that a first threaded hole is also provided in the levelling plate,
a first mounting hole is formed in the upper adjusting part of the main adjusting assembly and corresponds to the first threaded hole, the main adjusting assembly further comprises a first screw, and the first screw penetrates through the first mounting hole from bottom to top and is matched with the first threaded hole; the diameter of the first mounting hole is larger than that of the first screw.
8. The susceptor adjustment apparatus of claim 4, wherein a second threaded hole is further provided in the leveling plate, a second mounting hole is provided in the upper adjustment member of the first sub-adjustment assembly at a position corresponding to the second threaded hole, the first sub-adjustment assembly further includes a second screw passing through the second mounting hole from bottom to top and being fitted with the second threaded hole; the diameter of the second mounting hole is larger than that of the second screw.
9. The susceptor adjustment apparatus of claim 5, wherein a third threaded hole is further provided in the leveling plate, a third mounting hole is provided in the upper adjustment member of the second secondary adjustment assembly at a position corresponding to the third threaded hole, and the second secondary adjustment assembly further includes a third screw passing through the third mounting hole from bottom to top and engaged with the third threaded hole; the diameter of the third mounting hole is larger than that of the third screw.
10. Base adjustment device according to any of claims 3-5, characterized in that a fourth threaded hole is provided in the upper adjustment member; correspondingly, a fourth mounting hole is formed in the lower adjusting piece, and a fourth screw penetrates through the fourth mounting hole from bottom to top and is matched with the fourth threaded hole; the diameter of the fourth mounting hole is larger than that of the fourth screw.
11. The susceptor adjustment device of claim 2, wherein the lift mechanism comprises a lift rail, a slider, a susceptor mounting block, a lift shaft, and a bellows, wherein,
the lifting guide rail is vertically arranged and is fixedly connected with the mounting plate;
the sliding block can do lifting linear motion along the lifting guide rail;
the base mounting block is fixedly connected with the sliding block;
the lifting shaft is vertically arranged, the upper end of the lifting shaft is fixedly connected with the base, and the lower end of the lifting shaft extends to the outside of the chamber and is fixedly connected with the base mounting block;
the corrugated pipe is sleeved outside the lifting shaft and used for sealing a gap between the lifting shaft and the chamber wall of the chamber.
12. The base adjustment device of claim 1, wherein the triangle comprises a right angle triangle or an equilateral triangle; when the triangle is a right triangle, the center of the main adjusting component corresponds to the right angle of the right triangle.
13. A chamber is provided with a base, an air inlet part is arranged above the base, and a lifting mechanism is arranged below the base and used for driving the base to do lifting linear motion; a base adjusting device is arranged below the chamber and used for adjusting the levelness and the horizontal position of the base through the lifting mechanism, and the base adjusting device is characterized by adopting the base adjusting device in any one of claims 1-12.
14. A semiconductor processing apparatus comprising the chamber of claim 13.
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| CN201810225956.XA CN110289242B (en) | 2018-03-19 | 2018-03-19 | Base adjusting device, chamber and semiconductor processing equipment |
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| CN201810225956.XA CN110289242B (en) | 2018-03-19 | 2018-03-19 | Base adjusting device, chamber and semiconductor processing equipment |
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| CN110289242B true CN110289242B (en) | 2021-08-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111534809B (en) * | 2020-05-11 | 2022-09-16 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment |
| CN113088915B (en) * | 2021-03-30 | 2022-07-22 | 京东方科技集团股份有限公司 | Driving device and evaporation system |
| CN114318525A (en) * | 2021-12-23 | 2022-04-12 | 北京北方华创微电子装备有限公司 | Semiconductor epitaxial equipment and method for adjusting coaxiality of base and preheating ring of semiconductor epitaxial equipment |
| CN115110053B (en) * | 2022-07-26 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjustable level base and semiconductor process equipment |
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