CN1866494A - High precision silicon slice bench and uses thereof - Google Patents
High precision silicon slice bench and uses thereof Download PDFInfo
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- CN1866494A CN1866494A CN 200610027591 CN200610027591A CN1866494A CN 1866494 A CN1866494 A CN 1866494A CN 200610027591 CN200610027591 CN 200610027591 CN 200610027591 A CN200610027591 A CN 200610027591A CN 1866494 A CN1866494 A CN 1866494A
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Abstract
The invention discloses a high-precision silicon chip table and utility, which comprises the following parts: air-float support, leveling organization, plane motor and reed, wherein the square lens is set on the reed, which is supported by at least three square lens supports with bottom on the upper surface of leveling organization; the sucker is set on the upper surface of square lens to place silicon chip; the electric vortex sensor is set between air-float support and square lens; the leveling organization is composed of at least three leveling executers along circumferential direction, which correspond to square lens supports; the mirror plane is set on the square lens, which aligns mark board and reflects laser beam. The invention can assemble high-precise silicon chip within 50 nm vertical precision and 10 nm leveling precision, which improves manufacturing precision of semiconductor equipment greatly.
Description
Technical field
The present invention relates to semiconductor equipment and make the field, relate to a kind of high precision silicon slice bench and uses thereof.
Background technology
Traditional silicon chip platform structure adopts the guide rail base of contact mostly, and the friction of motion resistance is bigger, and caloric value is higher, and dynamic and static coefficient of friction is difficult to be consistent, and operation and reaction speed are slower, and running precision is not high, also creeping phenomenon can occur under the low speed situation.This traditional silicon chip platform structure can't satisfy silicon chip at all and be at a high speed or the hi-Fix problem under the high acceleration, has influenced the accuracy of manufacture of semiconductor equipment to a great extent, has also therefore hindered the development of semiconductor manufacturing industry.
Summary of the invention
The object of the present invention is to provide a kind of high precision silicon slice bench and uses thereof, can make silicon chip on workbench, have six-freedom degree simultaneously, realize the accurate location of silicon chip on work stage, the vertical installation accuracy that guarantees silicon chip is in the 50nm, horizontal installation accuracy in 10nm, thereby increase substantially the accuracy of manufacture of semiconductor equipment.
The object of the present invention is achieved like this: high precision silicon slice bench, its substantive distinguishing features is, comprise from bottom to top the gas bearing support, levelling gear, planar motor, the reed that connect successively, the top of reed is side's mirror, and the upper surface of Fang Jing is provided with a sucker that is used for placing silicon chip;
Described Fang Jing is by at least three square mirror shore supports, and the bottom of square mirror pillar is arranged on the upper surface of described levelling gear; Also be provided with current vortex sensor between described gas bearing support and the Fang Jing;
Described levelling gear comprises circumferentially uniform leveling actuator of at least three edges, described side's mirror pillar and the corresponding setting of described leveling actuator;
Be respectively equipped with the minute surface of alignment mark plate and reflection lasering beam on the described Fang Jing.
Above-mentioned high precision silicon slice bench, wherein, described three leveling actuators are triangularly arranged between gas bearing support and square mirror, and they can and handle Fang Jing along vertical adjusting, make the motion of its Rx with respect to gas bearing support, Ry and Z direction.
Above-mentioned high precision silicon slice bench, wherein, described three current vortex sensors are being mutual inverted triangular arrangement on the silicon chip platform and between described three leveling actuators.
Above-mentioned high precision silicon slice bench wherein, is vacuum state between described sucker and the Fang Jing, and the middle part of Fang Jing is provided with a circular groove, sucker by vacuum suction in the circular groove of Fang Jing.
Above-mentioned high precision silicon slice bench, wherein, described reed is foliated flexure spring.
Above-mentioned high precision silicon slice bench, wherein, described planar motor comprises at least three high accuracy Lorentz lorentz motors; One of them moves in the X-axis direction, and two are moved along Y direction in addition.
Above-mentioned high precision silicon slice bench, wherein, the mirror surface on the described Fang Jing is arranged on its front and the left side, in order to measure the position of Fang Jing in X, Y, Rx, Ry, Rz direction.
Above-mentioned high precision silicon slice bench, wherein, described alignment mark plate is set in place the square mirror upper surface in the vacuum cup periphery.
The purposes of above-mentioned high precision silicon slice bench, the hi-Fix that is used for silicon chip is installed, and it comprises following key link:
(1) level and vertical two closed-loop control systems are set, have guaranteed the reliable and stable of silicon chip platform motion, make silicon chip realize hi-Fix by structure, control and measurement from structure and environment;
Wherein, horizontal closed-loop control system is by X, Y, the motion of Rz direction of servo-plane Electric Machine Control silicon chip platform; Vertical closed-loop control system is by Z, Rx, the motion of Ry direction of leveling actuator control silicon chip platform, thus the control and the adjusting of realization silicon chip six-freedom degree on the silicon chip platform;
(2) utilize be arranged on Fang Jing go up X, Y to speculum, for silicon chip platform fine motion control provides measuring basis;
(3) adopt the vertical height of electric vortex sensor measuring, and use the voice coil motor leveling, realize the high accuracy adjusting.Promptly adopt closed-loop control to carry out vertical adjusting, utilize the signal of high-precision current vortex sensor collection to carry out computing, carry out by voice coil motor by matrix;
(4) adopt Lorentz lorentz's motor-driven, improve kinematic accuracy;
(5) adopt gas bearing support 1, make the silicon chip platform can isolate vibrations effectively and reduce friction;
(6) utilize the alignment mark that is arranged on the Fang Jing to provide benchmark for the accurate location of silicon chip on the silicon chip platform.
High precision silicon slice bench of the present invention and uses thereof makes it compared with prior art owing to adopted above-mentioned technical scheme, has following advantage and good effect:
1, because the present invention uses gas bearing support as support, and the friction of motion resistance is minimum, caloric value is extremely low; Dynamic and static coefficient of friction is almost consistent, and operation and reaction speed are fast; The running precision height does not have creeping phenomenon under the low speed situation, can guarantee the hi-Fix problem of silicon chip under high speed, high acceleration.
2, the present invention is owing to adopt the measuring transducer of current vortex sensor as the leveling of silicon chip platform, and it is all easy to install under the prerequisite that does not influence precision and change.
3, because drive motors of the present invention drives Fang Jing via flexible strip mechanism, thereby, can reduce the impact that is caused that motor is in the other side's mirror under acceleration or the deceleration situation effectively, guarantee running precision.
4, since sucker of the present invention be by vacuum suction on Fang Jing, therefore, dismantle very convenient.
5, because the present invention adopts Lorentz lorentz's motor-driven, can further improve the kinematic accuracy of silicon chip platform.
6, because the alignment mark plate that Fang Jing of the present invention go up to be provided with accurately provides benchmark in the location for it, the mirror surface of setting is for the rotation of silicon chip platform provides measuring basis.
7, because the present invention has controlled silicon chip several key links that hi-Fix is installed on the silicon chip platform, thereby realized the accurate location of silicon chip on the silicon chip platform, the vertical precision of silicon chip is controlled in the 50nm, horizontal accuracy is controlled in the 10nm.Therefore, improved the accuracy of manufacture of semiconductor equipment greatly, the development of semiconductor manufacturing industry that promoted China to a great extent.
Description of drawings
By the description of a following embodiment to high precision silicon slice bench of the present invention and uses thereof, can further understand purpose, specific structural features and the advantage of its invention in conjunction with its accompanying drawing.Wherein, accompanying drawing is:
Fig. 1 is the whole sectional structure schematic diagram of high precision silicon slice bench of the present invention;
Fig. 2 is the plan structure schematic diagram of Fig. 1;
Fig. 3 is the vertical servo loop of high precision silicon slice bench of the present invention.
In the accompanying drawing:
The 1-gas bearing support; The 2-levelling gear; 21-leveling actuator; The 3-planar motor; The 4-reed; 5-side's mirror; The 6-sucker; 7-side's mirror column; The 8-current vortex sensor; 9-alignment mark plate; The 10-mirror surface.
Embodiment
High precision silicon slice bench as shown in Figure 1, 2 comprises from bottom to top the gas bearing support 1, levelling gear 2, planar motor 3, the reed 4 that connect successively, and the top of reed 4 is side's mirror 5, and the upper surface of square mirror 5 is provided with a sucker 6 that is used for placing silicon chip.
The present invention uses two rigidity gas bearing supports 1 as pedestal, isolates frame vibration with it, and reduces friction of motion, eliminates the foozle of base platform, guarantees the speed stability of scanning motion.In addition, also can prevent the shear pressure that microdisplacement that the tilting moment of accelerator causes causes air-float guide rail.To overcome the hi-Fix problem of silicon chip under high speed, high acceleration.The characteristics of gas bearing support 1 are: the friction of motion resistance is minimum, and caloric value is extremely low; Dynamic and static coefficient of friction is almost consistent, and operation and reaction speed are fast; Running precision height, low speed do not have creeps.
Levelling gear 2 of the present invention comprise circumferentially uniform 21, three the leveling actuators 21 of leveling actuator at least three edges between gas bearing support 1 and square mirror 5 along vertical adjusting and the side's of manipulation mirror 5, be triangularly arranged with respect to Rx, Ry and the Z direction of gas bearing support 1.
Side's mirror 5 is supported by at least three square mirror pillars 7, and the bottom of square mirror pillar 7 is arranged on the upper surface of levelling gear 2; In the present embodiment, corresponding three square mirror pillars 7, the square mirror pillar 7 and the 21 corresponding settings of leveling actuator of being provided with between levelling gear 2 and the square mirror 5; Side's mirror 5 transmits motion by square mirror pillar 7, and it also is a gentle piece of giving birth to, and buffering can be provided, and prevents the silicon chip platform side's of damage mirror 5 when out of control.
The present invention also comprises as the measuring transducer of silicon chip platform leveling-the be arranged on current vortex sensor 8 between gas bearing support and the Fang Jing, with the measuring transducer of current vortex sensor 8 as the leveling of silicon chip platform, installs under the prerequisite that does not influence precision and changes easily.Three current vortex sensors 8 are being mutual inverted triangular arrangement on the silicon chip platform and between three leveling actuators 21.
The present invention is used for placing the sucker 6 of silicon chip and is made by the Zerodur material, be vacuum state between sucker 6 and the square mirror 5, the middle part of side's mirror 5 is provided with a circular groove, and sucker 6, can take off from square mirror 5 during use in the circular groove of square mirror 5 easily by vacuum suction.
The square mirror of being made by the zerodur material 5 is arranged on the upper surface of silicon chip platform, mainly is to support silicon chip and accurate alignment mark is provided.Be respectively equipped with the minute surface 10 of alignment mark plate 9 and reflection lasering beam on side's mirror 5.The left side and the back of minute surface 10 side's of being separately positioned on mirrors 5 of reflection lasering beam, the position of X, Y that can the side's of measurement mirror 5, Rx, Ry, Rz.
Be set in place in the alignment mark plate 9 of square mirror 5 upper surfaces of vacuum cup 6 peripheries, for the accurate location of silicon chip platform provides positioning reference; The front of the side's of being arranged on mirror 5 and the mirror surface on the left side 10, in order to the position of the side's of measurement mirror 5, simultaneously, also the rotation for the silicon chip platform provides measuring basis.
Said structure can be realized the accurate location of silicon chip in work stage.The vertical precision that guarantees silicon chip is that horizontal accuracy is in 10nm in the 50nm.
Its mechanism of action is roughly as follows:
The gas bearing support 1 " floating " that is made of rosette is on the marble platform, make that by two-way air-bearing a constant distance is arranged between marble and the gas bearing support 1, also, guaranteed the stability that whole silicon wafer platform integral body is moved in the horizontal direction for levelling gear 2, square mirror 5 provide base.
Three the leveling actuators 21 that are arranged between gas bearing support 1 and the square mirror 5 adopt voice coil motor control, and along vertical adjusting and by square mirror pillar 7 manipulation side's mirrors 5, with respect to the Rx of gas bearing support 1, Ry and Z direction (height and inclination) are triangularly arranged.Three variable in distance amounts that current vortex sensor 8 is measured between gas bearing support 1 and the square mirror 5.Utilize this cover focusing and leveling system, can realize the adjusting of submicron order.
Reed 4 is foliaceous springs, utilizes this reed 4 to realize flexibly connecting between planar motor 3 and the levelling gear 2, for levelling gear 2 provides damping, thus the horizontal accuracy of raising silicon chip platform.
The purposes of high precision silicon slice bench of the present invention, the hi-Fix that is used for silicon chip is installed, and it comprises following key link:
1, level and vertical two closed-loop control systems are set, have guaranteed the reliable and stable of silicon chip platform motion, realize the hi-Fix installation of silicon chip on the silicon chip platform by several aspects such as structure, control and measurement from structure and environment.
Wherein, horizontal closed-loop control system is by X, Y, the motion of Rz direction of servo-plane motor 3 control silicon chip platforms; Vertical closed-loop control system is by Z, Rx, the motion of Ry direction of leveling actuator 21 control silicon chip platforms; Thereby realize the control and the adjusting of silicon chip six-freedom degree on the silicon chip platform.
Servo loop of the present invention as shown in Figure 3, its basic functional principle is:
The data of the position of set-point and servo position compare, and its result generates servo force by controller, and servo force compares with perturbed force again, drives the silicon chip platform by actuator, make the silicon chip platform arrive servo position; Compare the servo position recirculation and the set-point that arrive, and the difference up to servo position and set-point arrives in the scope that allows.
The silicon chip platform level to the position detect by laser interferometer and servo (control) system that feeds back in real time controls in real time, detecting also in vertical position by three current vortex sensors, servo (control) system that feeds back in real time controls in real time.The processing and the rigging error of silicon chip platform are passed through feedforward compensation.
2, utilize X, Y on the side's of being arranged on mirror 5 to mirror surface 10, for silicon chip platform fine motion control provides measuring basis; On the minute surface 10 of mirror 5 both sides, the laser side of impinging upon, mirror reflects laser beam, interferometer receive reverberation and and elementary beam compare, result transmission arrives receiver, receiver converts light signal to the signal of telecommunication and is sent to the interferometer plate then.The interferometer plate with this signal and the signal of directly coming from laser head compare, show the motion of mirror with the phase change of signal, signal is realized the position of accurate control silicon chip platform through processing controls Lorentz lorentz motor.
3, the vertical height that adopts current vortex sensor 8 to measure between gas bearing support 1 and the square mirror 5, and adopt voice coil motor control, the realization high accuracy is regulated.Wherein, closed-loop control is adopted in vertical adjusting, and the signal that utilizes high-precision current vortex sensor 8 collections is carried out by voice coil motor by matrix operation.
4, adopt Lorentz lorentz's motor-driven, improve kinematic accuracy.
5, adopt gas bearing support 1, make the silicon chip platform isolate vibrations effectively and reduce friction.
6, utilize the alignment mark 9 on the side's of being arranged on mirror 5 to provide benchmark for the accurate location of silicon chip on the silicon chip platform.
Claims (9)
1, high precision silicon slice bench is characterized in that, comprises from bottom to top the gas bearing support, levelling gear, planar motor, the reed that connect successively, and the top of reed is side's mirror, and the upper surface of Fang Jing is provided with a sucker that is used for placing silicon chip;
Described Fang Jing is by at least three square mirror shore supports, and the bottom of square mirror pillar is arranged on the upper surface of described levelling gear; Also be provided with current vortex sensor between described gas bearing support and the Fang Jing;
Described levelling gear comprises circumferentially uniform leveling actuator of at least three edges, described side's mirror pillar and the corresponding setting of described leveling actuator;
Be respectively equipped with the minute surface of alignment mark plate and reflection lasering beam on the described Fang Jing.
2, high precision silicon slice bench as claimed in claim 1, it is characterized in that, described three leveling actuators are triangularly arranged between gas bearing support and square mirror, and they can and handle Fang Jing along vertical adjusting, make the motion of its Rx with respect to gas bearing support, Ry and Z direction.
3, high precision silicon slice bench as claimed in claim 1 is characterized in that, described three current vortex sensors are being mutual inverted triangular arrangement on the silicon chip platform and between described three leveling actuators.
4, high precision silicon slice bench as claimed in claim 1 is characterized in that, is vacuum state between described sucker and the Fang Jing, and the middle part of Fang Jing is provided with a circular groove, sucker by vacuum suction in the circular groove of Fang Jing.
5, high precision silicon slice bench as claimed in claim 1 is characterized in that, described reed is foliated flexure spring.
6, high precision silicon slice bench according to claim 1 is characterized in that, described planar motor comprises at least three high accuracy Lorentz lorentz motors; One of them moves in the X-axis direction, and two are moved along Y direction in addition.
7, high precision silicon slice bench as claimed in claim 1 is characterized in that, the mirror surface on the described Fang Jing is arranged on its front and the left side, in order to measure the position of Fang Jing in X, Y, Rx, Ry, Rz direction.
8, high precision silicon slice bench as claimed in claim 1 is characterized in that, described alignment mark plate is distributed in the square mirror upper surface of vacuum cup periphery.
9, the purposes of high precision silicon slice bench according to claim 1 is characterized in that, the hi-Fix that is used for silicon chip is installed, and it comprises following key link:
(1) level and vertical two closed-loop control systems are set, have guaranteed the reliable and stable of silicon chip platform motion, make silicon chip realize hi-Fix by structure, control and measurement from structure and environment;
Wherein, horizontal closed-loop control system is by X, Y, the motion of Rz direction of servo-plane Electric Machine Control silicon chip platform; Vertical closed-loop control system is by Z, Rx, the motion of Ry direction of leveling actuator control silicon chip platform, thus the control and the adjusting of realization silicon chip six-freedom degree on the silicon chip platform;
(2) utilize be arranged on Fang Jing go up X, Y to speculum, for silicon chip platform fine motion control provides measuring basis;
(3) adopt the vertical height of electric vortex sensor measuring, and use the voice coil motor leveling, realize the high accuracy adjusting.Promptly adopt closed-loop control to carry out vertical adjusting, utilize the signal of high-precision current vortex sensor collection to carry out computing, carry out by voice coil motor by matrix;
(4) adopt Lorentz lorentz's motor-driven, improve kinematic accuracy;
(5) adopt gas bearing support, make the silicon chip platform can isolate vibrations effectively and reduce friction;
(6) utilize the alignment mark that is arranged on the Fang Jing to provide benchmark for the accurate location of silicon chip on the silicon chip platform.
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| CNB2006100275917A CN100461365C (en) | 2006-06-12 | 2006-06-12 | High precision silicon slice bench and uses thereof |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20070914 Address after: 201203 Zhangjiang East Road, Zhangjiang hi tech park, Shanghai, No. 1525 Applicant after: Shanghai Micro Electronics Equipment Co., Ltd. Co-applicant after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Address before: 201203 Zhangjiang East Road, Zhangjiang hi tech park, Shanghai, No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |