CN113061865A - Lifting device and semiconductor process equipment - Google Patents

Lifting device and semiconductor process equipment Download PDF

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Publication number
CN113061865A
CN113061865A CN202110300813.2A CN202110300813A CN113061865A CN 113061865 A CN113061865 A CN 113061865A CN 202110300813 A CN202110300813 A CN 202110300813A CN 113061865 A CN113061865 A CN 113061865A
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China
Prior art keywords
sliding plate
plate
sliding
lifting
lifting device
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Granted
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CN202110300813.2A
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Chinese (zh)
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CN113061865B (en
Inventor
赵康宁
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Priority to CN202110300813.2A priority Critical patent/CN113061865B/en
Publication of CN113061865A publication Critical patent/CN113061865A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application discloses hoisting device and semiconductor process equipment relates to the semiconductor manufacturing field. The lifting device is a lifting device of a base in semiconductor process equipment, is used for driving the base to lift in a process chamber and comprises a lifting mechanism and a translation mechanism; the translation mechanism comprises a supporting part, a first sliding plate, a second sliding plate and a mounting plate which are arranged in a stacked mode, the adjusting assembly is connected with the supporting plate and the mounting plate, the mounting plate is fixed to the process chamber, the first sliding plate is connected to the supporting plate in a sliding mode along a first direction, the second sliding plate is connected to the first sliding plate in a sliding mode along a second direction, and a sliding sleeve extending along a third direction is arranged on the second sliding plate; the lifting mechanism comprises a lifting shaft which is slidably arranged in the sliding sleeve. The semiconductor process equipment comprises the lifting device. The embodiment of the application can at least relieve the problem of substrate position deviation.

Description

Lifting device and semiconductor process equipment
Technical Field
The application belongs to the technical field of semiconductors, and particularly relates to a lifting device and semiconductor process equipment.
Background
Magnetron Sputtering or Sputtering Deposition (PVD) is one of Physical Vapor Deposition (PVD), which is the most widely used thin film manufacturing technology in the semiconductor industry, and generally refers to a thin film manufacturing process for preparing a thin film by a Physical method. Generally, the film preparation process adopts magnetron sputtering equipment. However, in the related art magnetron sputtering apparatus, during the process of lifting the substrate, the substrate is prone to position deviation, which affects the concentricity of the substrate, and thus the precision of the preparation process.
Disclosure of Invention
An object of the embodiments of the present application is to provide a lifting device and a semiconductor processing apparatus, which can at least alleviate the problem of substrate position deviation.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a lifting device of a pedestal in semiconductor processing equipment, which is used for driving the pedestal to lift in a process chamber of the semiconductor processing equipment, and the lifting device comprises: a lifting mechanism and a translation mechanism;
the translation mechanism comprises a supporting plate, a first sliding plate, a second sliding plate, an installing plate and an adjusting assembly, wherein the supporting plate, the first sliding plate, the second sliding plate and the installing plate are sequentially stacked, the supporting plate is connected with the installing plate through the adjusting assembly, the installing plate is fixedly connected to the process chamber, the first sliding plate is slidably connected to the supporting plate along a first direction, the second sliding plate is slidably connected to the first sliding plate along a second direction, and the second sliding plate is provided with a sliding sleeve extending along a third direction;
the lifting mechanism comprises a lifting shaft connected with the base, and the lifting shaft is slidably arranged in the sliding sleeve;
the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the lifting direction of the lifting device.
The embodiment of the present application further discloses a semiconductor process apparatus, which includes: the device comprises a process chamber, a base for bearing a substrate and a lifting device;
the base is arranged in the process chamber, and the lifting shaft penetrates into the process chamber from bottom to top and is connected with the base.
In the embodiment of the application, the lifting shaft is connected with the base, and the lifting shaft can move in the sliding sleeve along the third direction so as to adjust the position of the substrate on the base in the third direction; the sliding sleeve is arranged on the second sliding plate, and the second sliding plate can move relative to the first sliding plate along a second direction, so that the position of the base can be adjusted in the second direction sequentially through the second sliding plate, the sliding sleeve and the lifting shaft; the first sliding plate can move along a first direction relative to the supporting plate, so that the position of the base in the first direction can be adjusted through the first sliding plate, the second sliding plate, the sliding sleeve and the lifting shaft in sequence. Based on the arrangement, the lifting device in the embodiment of the application can respectively adjust the displacement of the lifting shaft and the base on the horizontal plane in the first direction and the second direction, so that the substrate is not prone to position deviation in the substrate lifting process of semiconductor process equipment-magnetron sputtering equipment, the concentricity of the substrate is further ensured, and the preparation process precision is greatly improved.
Drawings
FIG. 1 is a schematic illustration of a portion of semiconductor processing equipment as disclosed in an embodiment of the present application;
FIG. 2 is a schematic view of a process chamber, translation mechanism, and lift shaft assembly as disclosed in an embodiment of the present application;
FIG. 3 is a disassembled schematic view of a translation mechanism disclosed in an embodiment of the present application;
FIG. 4 is a bottom view of the translation mechanism disclosed in embodiments of the present application;
FIG. 5 is a schematic view of a first drive assembly of the translation mechanism disclosed in an embodiment of the present application;
FIG. 6 is a partially enlarged view of a first perspective of a first driving assembly disclosed in an embodiment of the present application;
FIG. 7 is an enlarged view of a portion of a second view of the first drive assembly disclosed in an embodiment of the present application;
FIG. 8 is a schematic view of a second drive assembly of the translation mechanism disclosed in an embodiment of the present application;
FIG. 9 is a partial schematic view of an adjustment assembly in the translation mechanism disclosed in an embodiment of the present application;
FIG. 10 is an enlarged partial view of an adjustment assembly disclosed in an embodiment of the present application;
FIG. 11 is a first perspective view of a lifting mechanism disclosed in an embodiment of the present application;
fig. 12 is a second perspective view of a lifting mechanism disclosed in an embodiment of the present application.
Description of reference numerals:
100-a process chamber;
200-a base;
300-a lifting mechanism; 310-a lifting shaft; 321-a first fixing block; 322-a second fixed block; 330-a support block; 331-a fixed part; 3311-first locating side; 332-a support; 3321-a through-hole; 340-a slide block; 341-second locating side; 350-a guide rail; 360-a drive member; 370-leveling members;
400-a translation mechanism; 410-a support plate; 411-mounting hole sites; 420-a first sled; 421-a first track; 422-a first avoidance hole site; 430-a second sled; 431-a second track; 432-a second avoidance hole location; 440-a mounting plate; 450-a sliding sleeve; 460-a regulating component; 461-adjusting support; 462-an adjustment member; 4621-a shaft portion; 4622-bulb section; 470-a first drive assembly; 471-a first input shaft; 472-first bevel gear; 473-a second bevel gear; 474-a first lead screw; 475-a first lead screw nut; 480-a second drive assembly; 481 — second input shaft; 482-a third bevel gear; 483-fourth bevel gear; 484-second lead screw; 485-second lead screw nut; 491 — a first locking member; 492-second retaining member.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The embodiment of the application discloses a lifting device of a pedestal 200 in semiconductor processing equipment, which is used for driving the pedestal 200 to lift in a process chamber 100 of the semiconductor processing equipment, and the disclosed lifting device comprises a lifting mechanism 300 and a translation mechanism 400.
Referring to fig. 1 to 3, the translation mechanism 400 includes a support plate 410, a first slide plate 420, a second slide plate 430, and a mounting plate 440, which are sequentially stacked, and an adjustment assembly 460. In a state where the semiconductor process apparatus is used, the lifting device is used to drive the susceptor 200 to be lifted up and down in the process chamber 100 to adjust the position of the susceptor 200 and the substrate on the susceptor 200 in the height direction. At this time, the support plate 410, the first slide plate 420, the second slide plate 430, and the mounting plate 440 are sequentially stacked in the vertical direction. Wherein the mounting plate 440 is fixedly attached to the process chamber 100. Alternatively, the mounting plate 440 may be statically attached to the process chamber 100 by fasteners such as screws. In addition, the mounting plate 440 may further include a positioning member, such as a positioning pin, and the mounting plate 440 may be positioned with respect to the process chamber 100 by the positioning member, so that the lifting mechanism 300 may be accurately positioned with respect to the process chamber 100. The supporting plate 410 is connected with the mounting plate 440 through the adjusting assembly 460, on one hand, the supporting plate 410 is hoisted through the adjusting assembly 460, so that the supporting plate 410 is hoisted at one side of the mounting plate 440; on the other hand, when the adjustment assembly 460 can perform the adjustment movement, the relative position between the support plate 410 and the mounting plate 440 can also be adjusted by the adjustment assembly 460; when the adjustment assembly 460 is not capable of adjustment movement, the support plate 410 can be lifted by the adjustment assembly 460. The first sliding plate 420 is slidably coupled to the support plate 410 in a first direction. Optionally, a sliding assembly, such as a sliding rail, or the like, may be disposed between the first sliding plate 420 and the supporting plate 410 to ensure stability and smoothness of the relative sliding between the first sliding plate 420 and the supporting plate 410. The second sliding plate 430 is slidably coupled to the first sliding plate 420 in the second direction. Optionally, a sliding assembly, such as a sliding rail, or the like, may be disposed between the second sliding plate 430 and the first sliding plate 420, so as to ensure stability and smoothness of the relative sliding between the second sliding plate 430 and the first sliding plate 420. The second sliding plate 430 is provided with a sliding sleeve 450 extending along the third direction, that is, the axis of the sliding sleeve 450 is parallel to the third direction, and the sliding sleeve 450 can move synchronously with the second sliding plate 430.
The lifting mechanism 300 comprises a lifting shaft 310 connected with the base 200, the lifting shaft 310 is slidably disposed in the sliding sleeve 450, the lifting shaft 310 is limited by the sliding sleeve 450, the movement direction of the lifting shaft 310 is consistent with the axial direction of the sliding sleeve 450, and the movement direction of the lifting shaft 310 can be adjusted by adjusting the axial direction of the sliding sleeve 450, so that the movement precision of the lifting shaft 310 is improved. Alternatively, the upper portion of the lift shaft 310 may extend into the process chamber 100, and the top end thereof is fixedly connected to the susceptor 200, and at the same time, the lift shaft 310 may move in the third direction within the sliding sleeve 450, so that the height position of the susceptor 200 and the substrate on the susceptor 200 within the process chamber 100 may be adjusted according to actual requirements. Alternatively, the sliding sleeve 450 may be fixed to the second sliding plate 430 by a fastener such as a screw, and since the lifting shaft 310 is disposed in the sliding sleeve 450, the sliding sleeve 450 may move in the second direction with the second sliding plate 430, and the second sliding plate 430 may move in the first direction with the first sliding plate 420. In this way, the sliding sleeve 450, the lifting shaft 310, the base 200 and the substrate on the base 200 can be moved in the first direction and the second direction by the cooperation of the first sliding plate 420 and the second sliding plate 430, so as to adjust the position of the base 200 and the substrate thereon in the horizontal direction. In the embodiment of the present application, the sliding sleeve 450 may be a linear bearing, so as to improve the assembly precision between the sliding sleeve and the lifting shaft 310 and ensure the movement precision of the lifting shaft 310.
It should be noted that, in the embodiment of the present application, the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is a lifting direction of the lifting device. Under the condition that the semiconductor processing equipment is in normal use, the third direction is parallel to the Z-axis direction, the first direction is parallel to the Y-axis direction, and the second direction is parallel to the X-axis direction.
In the embodiment, the lifting shaft 310 is connected to the base 200, and the lifting shaft 310 can move in the sliding sleeve 450 along the third direction to adjust the position of the substrate on the base 200 in the third direction; the sliding sleeve 450 is disposed on the second sliding plate 430, and the second sliding plate 430 is movable in a second direction relative to the first sliding plate 420, so that the position of the base 200 in the second direction can be adjusted sequentially by the second sliding plate 430, the sliding sleeve 450, and the lifting shaft 310; the first sliding plate 420 is movable in a first direction with respect to the support plate 410 so that the position of the base 200 in the first direction can be adjusted by sequentially passing the first sliding plate 420, the second sliding plate 430, the sliding sleeve 450, and the elevation shaft 310. Based on the above arrangement, the lifting device in the embodiment of the present application can respectively adjust the displacement of the lifting shaft 310 and the base 200 on the horizontal plane in the first direction and the second direction, so as to ensure that the substrate is not prone to position deviation in the substrate lifting process of the semiconductor processing equipment, namely, the magnetron sputtering equipment, thereby ensuring the concentricity of the substrate and greatly improving the precision of the preparation process.
Referring to fig. 3, in some embodiments, one of the support plate 410 and the first slide plate 420 is provided with a rail extending in a first direction, and the other is slidably coupled to the rail. Alternatively, a first rail 421 is provided at the bottom of the first sliding plate 420, and a portion of the structure at the top of the support plate 410 is slidably installed in the first rail 421, so that the first sliding plate 420 can be reciprocally moved on the support plate 410 in a first direction to adjust the position of the first sliding plate 420 in the first direction.
With continued reference to fig. 3, in some embodiments, one of the first sled 420 and the second sled 430 is provided with a track extending in the second direction, and the other is slidably coupled to the track. Alternatively, a second rail 431 is provided at the bottom of the second sliding plate 430, and a portion of the structure of the top of the first sliding plate 420 is slidably installed in the second rail 431, so that the second sliding plate 430 can be reciprocally moved in the second direction on the first sliding plate 420 to adjust the position of the second sliding plate 430 in the second direction.
Based on the above arrangement, the sliding sleeve 450 and the lifting shaft 310 located in the sliding sleeve 450 can be driven to move in the first direction and the second direction by the movement of the first sliding plate 420 in the first direction and the movement of the second sliding plate 430 in the second direction, so as to adjust the position of the base 200 and the substrate thereon in the first direction and the second direction.
Referring to fig. 4-7, in some embodiments, the translation mechanism 400 includes a first drive assembly 470 for driving the first sled 420 in a reciprocating motion in a first direction. The first driving assembly 470 includes a first input shaft 471, a first gear set in transmission connection with the first input shaft 471, and a first linear driving set in transmission connection with the first gear set, and a driving end of the first linear driving set is connected with the first sliding plate 420. Alternatively, the first gear set may be a bevel gear set comprising a first bevel gear 472 and a second bevel gear 473 in meshing engagement with each other, wherein the first bevel gear 472 is disposed on the first input shaft 471 and is rotatable with the first input shaft 471. The first linear driving set may include a first lead screw 474 and a first lead screw nut 475, the second bevel gear 473 is disposed on the first lead screw 474 and may drive the first lead screw 474 to rotate synchronously, and the first lead screw nut 475 is in threaded connection with the first lead screw 474. When the first lead screw 474 rotates, the first lead screw nut 475 is movable in the axial direction of the first lead screw 474, and the first lead screw nut 475 is coupled to the first slide plate 420. Based on the above arrangement, when the first input shaft 471 rotates, the first bevel gear 472 can drive the second bevel gear 473 to rotate, the second bevel gear 473 drives the first lead screw 474 to rotate, the first lead screw 474 drives the first lead screw nut 475 to move, and thus the first lead screw nut 475 can drive the first sliding plate 420 to move on the supporting plate 410 along the first direction. It should be noted here that a driving motor may be connected to the first input shaft 471 to provide a driving force through the driving motor, and of course, the driving force may also be manually driven. In addition, the rotation direction of the first input shaft 471 affects the moving direction of the first sliding plate 420, for example, when the first input shaft 471 is rotated in a clockwise direction, the first sliding plate 420 may move in the first direction, and when the first input shaft 471 is rotated in a counterclockwise direction, the first sliding plate 420 may move in a direction opposite to the first direction; of course, it is also possible to reverse, in any case, the first sliding plate 420 may be moved in the first direction or in a direction opposite to the first direction upon the input of power at the first input shaft 471.
Referring to fig. 8, the translating mechanism 400 includes a second drive assembly 480 for driving the second slide plate 430 to reciprocate in the second direction. The second driving assembly 480 includes a second input shaft 481, a second gear set drivingly connected to the second input shaft 481, and a second linear driving set drivingly connected to the second gear set, a driving end of the second linear driving set being connected to the second sliding plate 430. Alternatively, the second gear set may be a helical gear set comprising a third helical gear 482 and a fourth helical gear 483 in mesh with each other, wherein the third helical gear 482 is provided on the second input shaft 481 and is rotatable with the second input shaft 481. The second linear driving group may include a second lead screw 484 and a second lead screw nut 485, the fourth helical gear 483 is disposed on the second lead screw 484, and may drive the second lead screw 484 to rotate synchronously, and the second lead screw nut 485 is connected with the lead screw by screw threads. When the second lead screw 484 rotates, the second lead screw nut 485 can move along the axial direction of the second lead screw 484, and the second lead screw nut 485 is connected with the second sliding plate 430. The principle of the second driving assembly 480 driving the second sliding plate 430 to move in the second direction or the direction opposite to the second direction is similar to the above-mentioned principle of the first driving assembly 470 driving the first sliding plate 420 to move in the first direction or the direction opposite to the first direction, and is not described herein again.
Of course, in other embodiments, the first gear set includes a first bevel gear 472 and a second bevel gear 473 that are engaged, and the first linear drive assembly may also be a rack and pinion assembly that includes a drive gear and a rack that are engaged with each other, the rack being connected to the first sliding plate 420, wherein the second bevel gear 473 is in coaxial driving connection with the drive gear, and the first bevel gear 472 is in driving connection with the first input shaft 471. Based on the above arrangement, when the first input shaft 471 rotates, the first helical gear 472 can drive the second helical gear 473 to rotate, and the third helical gear 473 coaxially drives the transmission gear to rotate, the transmission gear can drive the rack to move, so that the rack drives the first sliding plate 420 to move on the supporting plate 410 along the first direction.
Similarly, the second gear set includes a third helical gear 482 and a fourth helical gear 483 that mesh with each other, and the second linear drive assembly may also be a gear rack set including a drive gear and a rack that mesh with each other. The rack is connected with the second sliding plate 430, the fourth helical gear 483 is coaxially connected with the transmission gear in a transmission way, and the third helical gear 482 is connected with the second input shaft 481 in a transmission way. The principle of the second driving assembly 480 driving the second sliding plate 430 to move in the second direction or the direction opposite to the second direction is similar to the above-mentioned principle of the first driving assembly 470 driving the first sliding plate 420 to move in the first direction or the direction opposite to the first direction, and is not described herein again.
Referring to fig. 3, 9 and 10, in some embodiments, the adjustment assembly 460 includes a plurality of pairs of adjustment abutments 461 and adjustment members 462 that cooperate with one another, the adjustment abutments 461 being fixed to the support plate 410, one end of the adjustment members 462 being ball-coupled to the adjustment abutments 461, and the other end of the adjustment members 462 being threadedly coupled to the mounting plate 440. Alternatively, the adjustment element 462 may include a stem 4621 and a bulb 4622 disposed at one end of the stem 4621, the other end of the stem 4621 being externally threaded. Accordingly, the adjustment mount 461 has a spherical cavity and the mounting plate 440 is internally threaded. When the adjusting element 462 is installed, the ball head 4622 of the adjusting element 462 is matched with the ball cavity of the adjusting seat 461, so that the adjusting element 462 is movably connected with the supporting plate 410 in a ball pair manner; the other end of the adjusting member 462 is threadedly coupled to the mounting plate 440. When the adjusting part 462 is rotated, the supporting plate 410 may be moved in a third direction or a direction opposite to the third direction by the adjusting support 461. So, the supporting plate 410 is connected with the mounting plate 440 through the cooperation of adjusting part 462 and adjusting support 461, on the one hand can realize the hoist and mount to the supporting plate 410, on the other hand, can also finely tune the position of supporting plate 410 to satisfy actual demand. To rotate adjustment member 462, a hole may be formed in adjustment support 461 and aligned with ball head 4622 of adjustment member 462, and ball head 4622 may be provided with a slot for threading such that adjustment member 462 may be threaded by a tool extending through the hole of adjustment support 461 into the slot on ball head 4622 to adjust the position of support plate 410 in the third direction. In addition, since the lifting mechanism 300 is heavy, graphite lubrication may be added between the adjusting member 462 and the adjusting seat 461 to prevent the occurrence of seizing.
Further, the supporting plate 410 is opened with a mounting hole 411 for mounting the adjusting support 461. Alternatively, the adjustment seat 461 may be threadedly fitted into the mounting hole portion 411. The first sliding plate 420 and the second sliding plate 430 are respectively provided with an avoiding hole position for penetrating the adjusting member 462, and the cross-sectional area of the avoiding hole position is larger than that of the adjusting member 462. Because the first sliding plate 420 and the second sliding plate 430 are both disposed between the supporting plate 410 and the mounting plate 440, and the adjusting member 462 is connected between the supporting plate 410 and the mounting plate 440, in order to avoid the adjusting member 462, in the embodiment of the present application, a first avoiding hole position 422 is disposed on the first sliding plate 420, and a second avoiding hole position 432 is disposed on the second sliding plate 430, so that the adjusting member 462 can pass through the first sliding plate 420 and the second sliding plate 430. Of course, in other embodiments, the first and second sliding plates 420 and 430 may be sized small, i.e., the adjustment members 462 are located on the outer periphery of the first and second sliding plates 420 and 430, and the first and second sliding plates 420 and 430 do not affect the arrangement of the adjustment members 462. In the embodiment of the present application, since the adjusting element 462 is connected to the adjusting support 461 through a ball pair, the adjusting element 462 can rotate a certain angle relative to the adjusting support 461, and at this time, in order to prevent the first sliding plate 420 and the second sliding plate 430 from interfering with the rotation of the adjusting element 462, the sizes of the first avoiding hole 422 and the second avoiding hole 432 are made large, so that a certain floating space can be ensured to be left between the first avoiding hole 422 and the adjusting element 462 and between the second avoiding hole 432 and the adjusting element 462, so that the adjusting element 462 can have a certain floating amount.
With continued reference to fig. 10, in some embodiments, the adjustment assembly 460 may include four pairs of adjustment abutments 461 and adjustment members 462, and each pair of adjustment abutment 461 and adjustment member 462 may adjust a corresponding position on the support plate 410 in the third direction. The four pairs of the adjustment supports 461 and the adjustment members 462 are adjusted in a combined manner so that the respective positions of the support plate 410 are at the same height in the third direction, thereby ensuring the levelness of the support plate 410 and thus the levelness of the base 200. When the levelness of the supporting plate 410 and the base 200 is adjusted, an angle α may occur between the second sliding plate 430 and the mounting plate 440, and at this time, the adjusting member 462 is in a self-adaptive tilt transition without interference when adjusting the components.
Referring to fig. 3 and 4, in some embodiments, the translation mechanism 400 further includes a first locking member 491, the first locking member 491 configured to lock or unlock the support plate 410 and the first slide plate 420. When the first driving assembly 470 drives the first sliding plate 420 to move relative to the support plate 410, the first locking member 491 is unlocked, and at this time, the first sliding plate 420 can be moved in the first direction by the driving action of the first driving assembly 470. When the adjustment is completed, the first locking member 491 is locked to prevent the first slide plate 420 from moving further and affecting the position accuracy. Alternatively, the first locking member 491 may be a locking screw, and accordingly, a screw hole is provided on the support plate 410, and the locking screw is screwed into the screw hole and abuts against the first slide plate 420 through a front end portion of the locking screw, thereby achieving a locking effect on the first slide plate 420.
Similarly, the translating mechanism 400 further includes a second lock 492, the second lock 492 configured to lock or unlock the second slide plate 430 and the first slide plate 420. When the second driving assembly 480 drives the second sliding plate 430 to move relative to the first sliding plate 420, the second locking member 492 is unlocked, and the second sliding plate 430 can be moved in the second direction by the driving of the second driving assembly 480. When adjustment is complete, the second locking member 492 is locked to prevent further movement of the second slide plate 430 to affect positional accuracy. Alternatively, the second locking member 492 may be a locking screw, and accordingly, a threaded hole is formed in the first sliding plate 420, and the locking screw is screwed into the threaded hole and abuts against the second sliding plate 430 by a front end of the locking screw, thereby achieving a locking effect on the second sliding plate 430.
Similarly, the translation mechanism 400 further includes a third lock (not shown) configured to lock or unlock one of the support plate 410, the first slide plate 420, and the second slide plate 430 to the mounting plate 440. It should be noted that, since the mounting plate 440 is fixed, the supporting plate 410 is connected to the mounting plate 440 via the adjusting assembly 460, the first sliding plate 420 is slidably disposed on the supporting plate 410, and the second sliding plate 430 is slidably disposed on the first sliding plate 420. Thus, when the support plate 410 is locked to the mounting plate 440, the support plate 410 is not moved, the first sliding plate 420 is movable in a first direction, and the second sliding plate 430 is movable in a second direction; when the first sliding plate 420 is locked with the mounting plate 440, the first sliding plate 420 is not moved, the supporting plate 410 can be adjusted to move by the adjusting assembly 460, and the second sliding plate 430 can move along the second direction; when the second sliding plate 430 is locked with the mounting plate 440, the second sliding plate 430 is not moved, the support plate 410 can be adjustably moved by the adjustment assembly 460, and the first sliding plate 420 can be moved in a first direction. In order to ensure the position accuracy of the base 200 and the substrate thereon, in the embodiment of the present invention, the first locking member 491, the second locking member 492 and the third locking member can be used in combination, in this case, the first locking member 491 is used for locking the support plate 410 and the first sliding plate 420, the second locking member 492 is used for locking the second sliding plate 430 and the first sliding plate 420, and the third locking member is used for locking the support plate 410 and the mounting plate 440, so that when all three locking members are in the locking state, the translation mechanism 400 does not move, and thus the sliding sleeve 450 and the lifting shaft 310 are not prone to position deviation, and the position accuracy of the base 200 and the substrate thereon connected with the lifting shaft 310 is ensured.
Referring to fig. 11 and 12, in some embodiments, the lifting mechanism 300 further includes a first fixing block 321, a second fixing block 322, a supporting block 330, and a slider 340 that can move up and down in a third direction; the supporting block 330 includes a fixing portion 331 and a supporting portion 332, wherein the fixing portion 331 is connected to the slider 340, the supporting portion 332 is disposed between the first fixing block 321 and the second fixing block 322, the first fixing block 321 and the second fixing block 322 are both fixedly connected to the lifting shaft 310, a through hole 3321 for penetrating the lifting shaft 310 is formed in the supporting portion 332, and a gap is formed between the lifting shaft 310 and the through hole 3321. The first fixing block 321 and the second fixing block 322 are clasped to the lifting shaft 310, and optionally, the first fixing block 321 may be an anchor ear, and the second fixing block 322 may also be an anchor ear. The first fixing block 321 and the second fixing block 322 have a certain interval therebetween to receive a partial structure of the supporting block 330. The supporting portion 332 is located between the first fixing block 321 and the second fixing block 322, so that the supporting portion 332 can be respectively abutted from both sides through the first fixing block 321 and the second fixing block 322, and further, when the lifting shaft 310 reciprocates along the third direction, the supporting block 330 can be driven to also reciprocate along the third direction through the matching relationship among the first fixing block 321, the second fixing block 322 and the supporting portion 332. Alternatively, the elevating shaft 310 passes through the through hole 3321 of the supporting portion 332 with a certain gap from the through hole 3321, so that a certain floating amount may be provided between the elevating shaft 310 and the supporting block 330 to offset errors due to machining and assembling accuracy. The slider 340 is slidably disposed on the guide rail 350, and the guide rail 350 extends along the third direction, so that the slider 340 can move along the third direction to ensure that the lifting shaft 310 can move along the third direction. To move the slider 340 along the guide rail 350, the lifting mechanism 300 may further include a driving member 360, and optionally, the driving member 360 may be a motor screw assembly, an air cylinder, an electric cylinder, or the like.
With continued reference to fig. 12, in order to improve the positioning accuracy, in the embodiment of the present application, the fixing portion 331 has a first positioning side surface 3311, the slider 340 has a second positioning side surface 341, and the first positioning side surface 3311 and the second positioning side surface 341 are tightly attached to each other when the supporting block 330 and the slider 340 are assembled. Based on the above arrangement, high-precision positioning between the supporting block 330 and the slider 340 is achieved. After the supporting block 330 and the sliding block 340 are assembled with each other, the first positioning side 3311 is tightly attached to the second positioning side 341, so that the relative position between the supporting block 330 and the guide rail 350 is not changed, and the moving direction of the supporting block 330 is consistent with the third direction.
With continued reference to fig. 11, in some embodiments, the fixed portion 331 is connected to the slider 340 by a connector; the lifting mechanism 300 includes a plurality of leveling members 370, the leveling members 370 are screwed to the fixing portion 331, and ends of the leveling members 370 can abut against the slider 340. Alternatively, the connecting member may be a screw, the leveling member 370 may be a leveling screw, the fixing portion 331 of the supporting block 330 may be connected to the sliding block 340 through the connecting member, and the gap between the supporting block 330 and the sliding block 340 may be adjusted through the leveling member 370 to adjust the level of the supporting block 330, and thus, the vertical direction of the lifting shaft 310. When the lifting shaft 310 is concentric with the sliding sleeve 450, the problems of abrasion and the like caused by the interference of the relative movement between the lifting shaft 310 and the sliding sleeve 450 can be avoided. Alternatively, four leveling members 370 may be arranged on the fixing portion 331, respectively, and the relative positions between the fixing portion 331 and the sliding block 340 are adjusted by screwing the leveling members 370 to ensure that the gaps between the two are equal, thereby achieving leveling.
The embodiment of the application also discloses semiconductor processing equipment, which comprises a process chamber 100, a base 200 for bearing the substrate and the lifting device, wherein the base 200 is arranged in the process chamber 100, and a lifting shaft 310 penetrates into the process chamber 100 from bottom to top and is connected with the base 200. For the specific structure of the semiconductor processing equipment, reference may be made to the related art, which will not be described in detail herein.
In summary, in the embodiment of the present application, the position of the base 200 can be adjusted, and the levelness of the base 200 can be adjusted, so that the levelness required by the process and the concentricity requirements of the base, the process module and the target can be met.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (11)

1. A susceptor lift apparatus in a semiconductor processing apparatus for driving the susceptor (200) to be raised and lowered in a process chamber (100) of the semiconductor processing apparatus, comprising: a lifting mechanism (300) and a translation mechanism (400);
the translation mechanism (400) comprises a supporting plate (410), a first sliding plate (420), a second sliding plate (430), a mounting plate (440) and an adjusting assembly (460), wherein the supporting plate (410) is connected with the mounting plate (440) through the adjusting assembly (460), the mounting plate (440) is fixedly connected to the process chamber (100), the first sliding plate (420) is slidably connected to the supporting plate (410) along a first direction, the second sliding plate (430) is slidably connected to the first sliding plate (420) along a second direction, and a sliding sleeve (450) extending along a third direction is arranged on the second sliding plate (430);
the lifting mechanism (300) comprises a lifting shaft (310) connected with the base (200), and the lifting shaft (310) is slidably arranged in the sliding sleeve (450);
the first direction, the second direction and the third direction are perpendicular to each other, and the third direction is the lifting direction of the lifting device.
2. The lifting device according to claim 1, characterized in that one of the support plate (410) and the first sliding plate (420) is provided with a rail extending in the first direction, and the other is slidably connected with the rail;
and/or one of the first sliding plate (420) and the second sliding plate (430) is provided with a track extending along the second direction, and the other one is connected with the track in a sliding way.
3. The lifting device of claim 1, wherein the translation mechanism (400) further comprises a first drive assembly (470) for driving the first sled (420) in the first direction, the first drive assembly (470) comprising a first input shaft (471), a first gear set in driving connection with the first input shaft (471), and a first linear drive group in driving connection with the first gear set, a drive end of the first linear drive group being connected with the first sled (420);
and/or the translation mechanism (400) further comprises a second driving assembly (480) for driving the second sliding plate (430) to move along the second direction, wherein the second driving assembly (480) comprises a second input shaft (481), a second gear set in transmission connection with the second input shaft (481), and a second linear driving set in transmission connection with the second gear set, and a driving end of the second linear driving set is connected with the second sliding plate (430).
4. A lifting device as claimed in claim 3, wherein the first and second gear sets each comprise two helical gears in mesh;
the first linear driving set and the second linear driving set comprise a lead screw and a lead screw nut which are matched, the lead screw nut is connected with the first sliding plate (420) or the second sliding plate (430), one of the bevel gears is in transmission connection with the lead screw, and the other bevel gear is in transmission connection with the first input shaft (471) or the second input shaft (481); or, the first linear driving set and the second linear driving set both comprise a transmission gear and a rack which are meshed with each other, the rack is connected with the first sliding plate (420) or the second sliding plate (430), one of the bevel gears is coaxially connected with the transmission gear in a transmission manner, and the other bevel gear is connected with the first input shaft (471) or the second input shaft (481) in a transmission manner.
5. The lifting device as recited in claim 1, wherein the adjustment assembly (460) includes a plurality of pairs of cooperating adjustment abutments (461) and adjustment members (462), the adjustment abutments (461) being fixed to the support plate (410), one end of the adjustment members (462) being ball-coupled to the adjustment abutments (461), and the other end of the adjustment members (462) being threadably coupled to the mounting plate (440).
6. The lifting device according to claim 5, wherein the supporting plate (410) is provided with an installation hole (411) for installing the adjusting support (461), the first sliding plate (420) and the second sliding plate (430) are respectively provided with an avoiding hole for penetrating the adjusting member (462), and the cross-sectional area of the avoiding hole is larger than that of the adjusting member (462).
7. The lifting device according to claim 1, characterized in that the translation mechanism (400) comprises a first locking member (491), the first locking member (491) being configured to lock or unlock the support plate (410) and the first slide plate (420);
and/or, the translation mechanism (400) comprises a second lock (492), the second lock (492) being configured to lock or unlock the second sliding plate (430) and the first sliding plate (420);
and/or, the translation mechanism (400) comprises a third lock configured to lock or unlock the mounting plate (440) and one of the support plate (410), the first sliding plate (420), and the second sliding plate (430).
8. The lifting device according to claim 1, wherein the lifting mechanism (300) further comprises a first fixed block (321), a second fixed block (322), a support block (330), and a slider (340) capable of lifting and lowering along the third direction;
the supporting block (330) comprises a fixing portion (331) and a supporting portion (332), the fixing portion (331) is connected with the sliding block (340), the supporting portion (332) is arranged between the first fixing block (321) and the second fixing block (322), the first fixing block (321) and the second fixing block (322) are fixedly connected with the lifting shaft (310), a through hole (3321) used for penetrating through the lifting shaft (310) is formed in the supporting portion (332), and a gap is formed between the lifting shaft (310) and the through hole (3321).
9. The lifting device according to claim 8, characterized in that the fixing portion (331) has a first positioning side surface (3311), the slider (340) has a second positioning side surface (341), and the first positioning side surface (3311) and the second positioning side surface (341) are closely fitted with the supporting block (330) and the slider (340) assembled.
10. The lifting device according to claim 8, characterized in that the fixed part (331) is connected with the slider (340) by a connecting piece;
the lifting mechanism (300) further comprises a plurality of leveling pieces (370), the leveling pieces (370) are in threaded connection with the fixing portion (331), and the end portions of the leveling pieces (370) can be abutted to the sliding block (340).
11. A semiconductor processing apparatus comprising a process chamber (100), a susceptor (200) for carrying a substrate, and a lifting device according to any one of claims 1 to 10;
the base (200) is arranged in the process chamber (100), and the lifting shaft (310) penetrates into the process chamber (100) from bottom to top and is connected with the base (200).
CN202110300813.2A 2021-03-22 2021-03-22 Lifting device and semiconductor process equipment Active CN113061865B (en)

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CN111609936A (en) * 2020-05-25 2020-09-01 北京北方华创微电子装备有限公司 Temperature measuring device in semiconductor process equipment and semiconductor process equipment
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CN205173896U (en) * 2015-11-30 2016-04-20 宁波Gqy视讯股份有限公司 Six spool electronic regulation platforms
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WO2024022423A1 (en) * 2022-07-29 2024-02-01 北京北方华创微电子装备有限公司 Wafer-bearing device and adjustment mechanism therefor, and semiconductor process apparatus

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