CN111074238B - Leveling device, leveling method and semiconductor processing equipment - Google Patents
Leveling device, leveling method and semiconductor processing equipment Download PDFInfo
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- CN111074238B CN111074238B CN201811215894.0A CN201811215894A CN111074238B CN 111074238 B CN111074238 B CN 111074238B CN 201811215894 A CN201811215894 A CN 201811215894A CN 111074238 B CN111074238 B CN 111074238B
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- leveling
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a leveling device, a leveling method thereof and semiconductor processing equipment. The leveling device is used for adjusting the parallelism and coaxiality of the base relative to the cavity and comprises a leveling tool, wherein the leveling tool comprises a horizontal installation part, a vertical installation part and a vertical connection part for connecting the horizontal installation part and the vertical installation part; the lower surface of the horizontal installation part is used for being attached to the upper surface of the cavity, the lower surface of the vertical installation part is attached to the installation surface of the supporting piece, so that the parallelism of the base and the cavity meets the preset requirement, the vertical connection part penetrates through the installation hole of the cavity, the outer peripheral wall of the vertical connection part is matched with the inner peripheral wall of the installation hole, and the coaxiality of the base and the cavity meets the preset requirement. The leveling tool is used for leveling and centering the base and the cavity, so that the base leveling and centering process can be greatly simplified, the base mounting precision can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield can be improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a leveling device, a leveling method and semiconductor processing equipment.
Background
In general, in the semiconductor industry, feature sizes and aspect ratios are becoming more and more challenging as the geometry of electronic devices is continually reduced and the density of devices is continually increasing. Atomic layer deposition (Atomic layer deposition, ALD) is a new thin film deposition method proposed to address this challenge. Atomic layer deposition is more and more focused by technological workers worldwide due to the unique self-limiting growth mode, and the advantages of accurate and controllable film growth thickness, excellent conformality, controllable composition and the like.
Generally, the ALD apparatus is used for placing substrates of different materials in a reaction chamber, and is generally fixed in a lifting mechanism, and a motor drives a transmission mechanism such as a screw rod to control the process position; after the substrate is placed on the upper surface of the base by the manipulator, the film forming process can be performed after the chamber environment is controlled. However, the positional accuracy of the susceptor directly affects the quality of film formation.
In the related art, in order to realize leveling and centering of the base, the base is generally fixed on the lifting base, and then is operated by means of being installed on a set of complex leveling mechanism of the lifting frame. The leveling mechanism is complex, the installation and operation technical requirements are high, the installation efficiency is affected, and different personnel operate and install different effects, so that the quality is difficult to guarantee.
Disclosure of Invention
The invention aims at solving at least one of the technical problems in the prior art, and provides a leveling device, a leveling method and semiconductor processing equipment.
In order to achieve the above object, according to a first aspect of the present invention, there is provided a leveling device for adjusting parallelism and coaxiality of a base with respect to a chamber, the leveling device including a leveling tool including a horizontal mounting portion, a vertical mounting portion, and a vertical connecting portion connecting the horizontal mounting portion and the vertical mounting portion; wherein, the liquid crystal display device comprises a liquid crystal display device,
the lower surface of the horizontal installation part is used for being attached to the upper surface of the cavity, and the lower surface of the vertical installation part is used for being attached to the installation surface of the support piece for supporting the base, so that the parallelism between the base and the cavity meets the preset requirement;
the vertical connecting portion penetrates through the mounting hole of the chamber, and the outer peripheral wall of the vertical connecting portion is matched with the inner peripheral wall of the mounting hole, so that coaxiality of the base and the chamber meets preset requirements.
Optionally, the vertical installation portion includes a first installation portion connected with the vertical connecting portion and a second installation portion formed by extending outward from the first installation portion, and the lower surface of the second installation portion is attached to the installation surface of the support member.
Optionally, the leveling device further includes a pressing ring and a fastener, the pressing ring is stacked on the upper surface of the second installation portion, and the fastener sequentially passes through the pressing ring and the second installation portion to the inside of the support member, so that the lower surface of the second installation portion is attached to the installation surface of the support member.
Optionally, the leveling device further comprises a frame and at least one locking assembly, wherein the frame is fixed on the lower surface of the chamber through the locking assembly.
Optionally, the locking assembly comprises a stud, a nut, and a fastening screw; wherein, the liquid crystal display device comprises a liquid crystal display device,
one end of the stud bolt is connected with the lower surface of the chamber, and the other end of the stud bolt is fixed on the rack through the nut;
the fastening screw is located on one side of the stud bolt, and penetrates through the frame into the cavity.
Optionally, the locking assembly comprises a stud and two locking nuts; wherein, the liquid crystal display device comprises a liquid crystal display device,
one end of the double-end stud penetrates through the frame to the chamber, and the other end of the double-end stud extends out of the frame;
the two locking nuts are respectively screwed on the parts of the double-end stud, which are positioned on the two sides of the frame.
Optionally, the flatness of the lower surface of the horizontal mounting portion and the upper surface of the chamber is less than 0.1mm; and/or the parallelism of the lower surface of the vertical mounting part and the lower surface of the horizontal mounting part is less than 0.2mm; and/or the dimension of the vertical connecting part is 0.1 mm-0.5 mm smaller than the dimension of the mounting hole.
In a second aspect of the present invention, there is provided a leveling method for a base, using the leveling device described above, the leveling method comprising:
step S110, adjusting the parallelism and coaxiality of the base relative to the cavity by utilizing the leveling tool so that the parallelism and coaxiality of the base and the cavity meet preset requirements;
and step S120, enabling the base to pass through the mounting hole to be abutted with the mounting surface of the support piece, and leveling the base.
Optionally, step S110 specifically includes:
the vertical connecting part penetrates through the mounting hole of the chamber, and the outer peripheral wall of the vertical connecting part is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the base and the chamber meets the preset requirement;
the lower surface of the horizontal installation part is attached to the upper surface of the cavity, and the lower surface of the vertical installation part is attached to the installation surface of the supporting piece, so that the parallelism of the base and the cavity meets the preset requirement.
In a third aspect of the present invention, there is provided a semiconductor processing apparatus comprising the leveling device described above.
The invention relates to a leveling device, a leveling method and semiconductor processing equipment. The leveling tool comprises a horizontal installation part, a vertical installation part and a vertical connection part for connecting the horizontal installation part and the vertical installation part; the lower surface of the horizontal installation part is used for being attached to the upper surface of the cavity, the lower surface of the vertical installation part is attached to the installation surface of the supporting piece, so that the parallelism of the base and the cavity meets the preset requirement, the vertical connection part penetrates through the installation hole of the cavity, and the outer peripheral wall of the vertical connection part is matched with the inner peripheral wall of the installation hole, so that the coaxiality of the base and the cavity meets the preset requirement. The leveling tool is used for leveling and centering the base and the cavity, so that the base leveling and centering process can be greatly simplified, the base mounting precision can be greatly improved, the film forming uniformity can be effectively ensured, and the process yield can be improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
FIG. 1 is a schematic view of a leveling device according to a first embodiment of the present invention;
FIG. 2 is a schematic view showing the distribution of locking assemblies on a frame according to a second embodiment of the present invention;
FIG. 3 is a schematic view of a locking assembly according to a third embodiment of the present invention;
fig. 4 is a flowchart of a base leveling method according to a fourth embodiment of the present invention.
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
As shown in fig. 1, a first aspect of the present invention relates to a leveling device 100 for adjusting parallelism and coaxiality of a base with respect to a chamber 210. The leveling device 100 includes a leveling tool 110. The leveling tool 110 includes a horizontal mounting portion 111, a vertical mounting portion 112, and a vertical connecting portion 113 connecting the horizontal mounting portion 111 and the vertical mounting portion 112.
Wherein, as shown in fig. 1, the lower surface 111a of the horizontal mounting portion 111 is adapted to be attached to the upper surface 211 of the chamber 210. The lower surface 112a of the vertical mounting portion 112 is adapted to be fitted to the mounting surface 221 of the support 220 of the support base. In this way, the parallelism of the mounting surface 221 of the support 220 with the upper surface 211 of the chamber 210 can be made to satisfy a preset requirement, so that the parallelism of the base with the chamber 210 can be made to satisfy a preset requirement when the base is placed on the mounting surface 221 of the support 220.
As shown in fig. 1, the vertical connection portion 113 penetrates through the mounting hole 212 of the cavity 210, and the outer peripheral wall 113a of the vertical connection portion 113 is matched with the inner peripheral wall 212a of the mounting hole 212, for example, clearance fit can be adopted between the vertical connection portion 113 and the inner peripheral wall 212a, so that the coaxiality of the leveling fixture 110 and the mounting hole 212 (i.e. the coaxiality of the center of the cavity 210) can meet a preset requirement, and when the base passes through the mounting hole 212 and is placed on the support 220, the coaxiality requirement of the base relative to the cavity 210 can be met.
Before loading a base (not shown) on the chamber 210, the base is shaped substantially similar to the leveling tool 110, leveling is performed using the leveling tool 110. Specifically, the leveling tool 110 passes through the mounting hole 212 such that the lower surface 112a of the vertical mounting portion 112 is attached to the mounting surface 221 of the support 220, and the lower surface 111a of the horizontal mounting portion 111 is attached to the upper surface 211 of the chamber 210. The leveling tool 110 and the cavity 210 are machined parts, and flatness and coaxiality of the leveling tool 110 relative to the cavity 210 can be well ensured through reasonable tolerance fit. Afterwards, the leveling tool 110 can be separated from the supporting member 220 and the cavity 210, and finally, the base is placed on the mounting surface 221 of the supporting member 220 through the mounting hole 212, so that the mounting precision requirement of the base can be effectively ensured, and the base and the cavity 210 can meet the requirements of coaxiality and parallelism.
In the leveling device 100 in this embodiment, the leveling tool 110 is used to level and align the coaxiality and parallelism of the base and the cavity 210, so that the process of leveling and aligning the base can be greatly simplified, and the installation precision of the base can be greatly improved, so that the uniformity of the film formation can be effectively ensured, and the process yield can be improved.
As shown in fig. 1, in order to facilitate effective fixing of the vertical mounting portion 112 to the support 220, the vertical mounting portion 112 includes a first mounting portion 112b connected to the vertical connecting portion 113 and a second mounting portion 112c formed to extend outward from the first mounting portion 112 b. In this way, the second mounting portion 112c may be fixedly coupled to the support 220, so that the lower surface of the second mounting portion 112c (i.e., the lower surface 112a of the vertical mounting portion 112) may be brought into contact with the mounting surface 221 of the support 220.
Specifically, as shown in fig. 1, the leveling device 100 further includes a pressure ring 120 and a fastener 130 (the fastener 130 may be a screw member such as a fastening screw in general). Wherein, the pressing ring 120 is stacked on the upper surface of the second mounting portion 112c, and the fastener 130 sequentially passes through the pressing ring 120 and the second mounting portion 112c into the supporting member 220, so that the lower surface of the second mounting portion 112c is attached to the mounting surface 221 of the supporting member 220. Of course, instead of fixedly connecting the vertical mounting portion 112 to the supporting member 220 by means of the pressure ring 120 and the fastening member 130, other fastening structures may be used, for example, only fastening screws or the like may be provided.
As shown in fig. 1, the leveling device 100 further includes a frame 140 and at least one locking assembly 150, and the frame 140 is fixed to a lower surface of the chamber 210 by the locking assembly 150.
Specifically, as shown in fig. 1 and 2, the locking assembly 150 includes a stud 151, a nut 152, and a fastening screw 153. One end of the stud 151 is connected to the lower surface of the chamber 210, and the other end is fixed to the frame 140 by a nut 152 (a spacer may be installed between the nut 152 and the frame 140), and a fastening screw 153 is disposed at one side of the stud 151, and the fastening screw 153 penetrates through the frame 140 into the chamber 210.
As shown in fig. 2, the leveling device 100 may include three locking assemblies 150, and the three locking assemblies 150 are distributed on the frame 140 in a right triangle, however, the three locking assemblies 150 may be distributed on the frame 140 in other manners, for example, in an equilateral triangle manner,
in addition, as shown in FIG. 3, the lock assembly 150 may also include a stud 154 and two lock nuts 155. One end of the stud 154 passes through the frame 140 into the chamber 210 and the other end of the stud 154 extends outside of the frame 140. Two lock nuts 155 are screwed on portions of the stud 154 on both sides of the frame 140, respectively.
Generally, the angle between the upper plane of the base and the reference plane is less than or equal to +/-0.05 degrees, and the coaxiality deviation between the base and the center of the cavity is less than 1.5mm, so that the use requirement can be met; in connection with processing requirements commonly used for semiconductor devices, the flatness between the lower surface 111a of the horizontal mounting portion 111 and the upper surface 211 of the chamber 210 is less than 0.1mm, the parallelism between the lower surface 112a of the vertical mounting portion 112 and the lower surface 111a of the horizontal mounting portion 111 is less than 0.2mm, and the size range of the vertical connection portion 113 is 0.1 to 0.5mm smaller than the size range of the mounting hole 212. Therefore, the mounting precision requirement of the base can be effectively met, the film forming yield can be effectively improved, and the economic benefit is improved.
As shown in fig. 1, in order to further improve the installation efficiency of the base, the leveling device 100 further includes a driving mechanism 160, and the driving mechanism 160 is connected to the supporting member 220 to drive the supporting member 220 to lift. In this way, the supporting member 220 can be driven to move by the driving mechanism 160, so that the leveling and centering of the supporting member 220 can be ensured when the supporting member 220 is at the lowest position (the lowest position is that the supporting member is not lowered any more and only rises along the current position when the base is mounted on the supporting member 220), that is, the initial mounting position of the base is the lowest position, generally, the height of the leveling tool 110 can be determined according to the height between the mounting surface 221 of the supporting member 220 and the upper surface 211 of the chamber 210 when the supporting member is at the lowest position, so that the process of repeatedly adjusting the height of the base after the initial mounting of the base can be omitted, and the mounting efficiency and the mounting quality can be improved.
Of course, instead of driving the support 220 to move by the driving mechanism 160, the support 220 may be driven to move manually, etc.
Specifically, as shown in fig. 1, the driving mechanism 160 includes a driving motor 161, a guide rail 162, and a screw (not shown). The lead screw is respectively connected with the output shaft of the driving motor 161 and the supporting member 220, and can move along the guide rail 162 under the driving of the driving motor 161 so as to drive the supporting member 220 to lift.
Of course, the driving mechanism 160 may be other driving mechanisms besides the above-described structure, for example, the driving mechanism may be a driving motor+gear transmission mechanism, a driving motor+crank block mechanism, or the like.
In a second aspect of the present invention, as shown in fig. 4, a leveling method S100 for a base is provided, and the leveling device described above is adopted, and details of the leveling device may be referred to the related description above, and details of the leveling method S100 are not described herein, where the leveling method S100 includes:
step S110, adjusting the parallelism and the coaxiality of the base relative to the cavity by using the leveling tool so that the parallelism of the base and the cavity meets the preset requirement and the coaxiality of the base and the cavity meets the preset requirement;
and step S120, enabling the base to pass through the mounting holes to be abutted with the mounting surface of the support piece, and leveling the base.
According to the base leveling method, the leveling tool is used for leveling and centering the parallelism and coaxiality of the base relative to the cavity, so that the base leveling and centering process can be greatly simplified, the base mounting precision can be greatly improved, the film forming uniformity can be effectively guaranteed, and the process yield is improved.
Specifically, referring to fig. 1, the leveling tool 110 may be fixed to the support 220 through the mounting hole 212 and the compression ring 120 and the fastening member 130, and at this time, the stud 151 and the fastening screw 153 are in a non-locking state, that is, the leveling tool 110, the frame 140, the support 220, and the like form a freely movable whole; under the action of gravity, the lower surface 111a of the horizontal mounting part 111 of the leveling tool 110 is attached to the upper surface 211 of the chamber 210, and meanwhile, the outer surface 113a of the vertical connecting part 113 and the mounting hole 212 form a small clearance fit. Thus, the support 22 and the chamber 210 can be effectively guaranteed to have good parallelism and coaxiality under the better processing precision guarantee of the leveling tool 110.
Then, the adjusted position of the frame 140 is locked by the locking assembly 150 formed by the three groups of fastening screws 153 distributed at different positions on the frame 140 and the stud bolts 151, so that the position of the supporting piece 220 meeting the requirements of parallelism and coaxiality is also locked.
Finally, only the leveling tool 110, the compression ring 120 and the fastening piece 130 are detached, the base is placed on the supporting piece 220, and the compression ring 120 and the fastening piece 130 are used for fastening again; thus, the installation and the position adjustment of the base are completed, and other operations are not needed.
In a third aspect of the present invention, there is provided a semiconductor processing apparatus (not shown) comprising the leveling device described above.
The semiconductor processing equipment provided with the leveling device adopts the leveling tool to level and adjust the parallelism and coaxiality of the base relative to the cavity, so that the process of leveling and centering the base can be greatly simplified, the mounting precision of the base can be greatly improved, the uniformity of a formed film can be effectively ensured, and the process yield can be improved.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (9)
1. The leveling device is applied to semiconductor processing equipment, and comprises a chamber and a base arranged on the chamber, and is used for adjusting the parallelism and the coaxiality of the base relative to the chamber; wherein, the liquid crystal display device comprises a liquid crystal display device,
the lower surface of the horizontal mounting part is used for being attached to the upper surface of the lower wall of the chamber, and the lower surface of the vertical mounting part is used for being attached to the mounting surface of a support piece for supporting the base, so that the parallelism between the mounting surface of the support piece and the upper surface of the lower wall of the chamber meets the preset requirement;
the vertical connecting part penetrates through the mounting hole of the cavity, and the outer peripheral wall of the vertical connecting part is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the leveling tool and the mounting hole meets the preset requirement;
the leveling device further comprises a frame and at least one locking component, the frame is connected with the supporting piece, and the at least one locking component is used for fixing the frame on the lower surface of the cavity to lock the position of the supporting piece under the condition that the lower surface of the horizontal installation part is attached to the upper surface of the lower wall of the cavity and the lower surface of the vertical installation part is attached to the installation surface of the supporting piece;
the leveling device further comprises a pressing ring and a fastening piece, wherein the pressing ring is used for being pressed at the end part of the vertical installation part, which is adjacent to the supporting piece, and the fastening piece is used for sequentially penetrating through the pressing ring and the end part of the vertical installation part, which is adjacent to the supporting piece, into the supporting piece so that the lower surface of the vertical installation part is attached to the installation surface of the supporting piece; the clamping ring and the fastener are also used for fixing the base at the same position of the supporting piece after the leveling tool is disassembled.
2. The leveling device according to claim 1, wherein the vertical mounting portion includes a first mounting portion connected to the vertical connecting portion and a second mounting portion formed by extending outward from the first mounting portion, and a lower surface of the second mounting portion is fitted to the mounting surface of the support member.
3. The leveling device of claim 2, wherein the pressure ring is stacked on an upper surface of the second mounting portion, and the fastener sequentially passes through the pressure ring, the second mounting portion, and into the support member such that a lower surface of the second mounting portion is in abutment with a mounting surface of the support member.
4. The leveling device of claim 1, wherein the locking assembly comprises a stud, a nut, and a set screw; wherein, the liquid crystal display device comprises a liquid crystal display device,
one end of the stud bolt is connected with the lower surface of the chamber, and the other end of the stud bolt is fixed on the rack through the nut;
the fastening screw is located on one side of the stud bolt, and penetrates through the frame into the cavity.
5. The leveling device of claim 1, wherein the lock assembly comprises a stud and two lock nuts; wherein, the liquid crystal display device comprises a liquid crystal display device,
one end of the double-end stud penetrates through the frame to the chamber, and the other end of the double-end stud extends out of the frame;
the two locking nuts are respectively screwed on the parts of the double-end stud, which are positioned on the two sides of the frame.
6. The leveling device as claimed in any one of claims 1 to 5, characterized in that,
the flatness of the lower surface of the horizontal mounting part and the upper surface of the lower wall of the chamber is less than 0.1mm; and/or the number of the groups of groups,
the parallelism of the lower surface of the vertical mounting part and the lower surface of the horizontal mounting part is less than 0.2 mm.
7. A method for leveling a base, characterized in that the leveling device according to any one of claims 1 to 6 is used,
the leveling method comprises the following steps:
step S110, adjusting the parallelism and coaxiality of the mounting surface of the support piece relative to the cavity by utilizing the leveling tool so that the parallelism and coaxiality of the mounting surface of the support piece and the cavity meet preset requirements;
and step S120, enabling the base to pass through the mounting hole to be abutted with the mounting surface of the support piece, and leveling the base.
8. The leveling method according to claim 7, wherein the step S110 specifically includes:
the vertical connecting part penetrates through the mounting hole of the chamber, and the outer peripheral wall of the vertical connecting part is matched with the inner peripheral wall of the mounting hole, so that the coaxiality of the vertical connecting part and the chamber meets the preset requirement;
the lower surface of the horizontal installation part is attached to the upper surface of the lower wall of the cavity, and the lower surface of the vertical installation part is attached to the installation surface of the support piece, so that the parallelism between the installation surface of the support piece and the cavity meets the preset requirement.
9. A semiconductor processing apparatus comprising the leveling device of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811215894.0A CN111074238B (en) | 2018-10-18 | 2018-10-18 | Leveling device, leveling method and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811215894.0A CN111074238B (en) | 2018-10-18 | 2018-10-18 | Leveling device, leveling method and semiconductor processing equipment |
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| Publication Number | Publication Date |
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| CN111074238A CN111074238A (en) | 2020-04-28 |
| CN111074238B true CN111074238B (en) | 2023-05-16 |
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| CN111534809B (en) * | 2020-05-11 | 2022-09-16 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment |
| CN115110053B (en) * | 2022-07-26 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjustable level base and semiconductor process equipment |
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