CN108695228A - Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier - Google Patents
Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier Download PDFInfo
- Publication number
- CN108695228A CN108695228A CN201710229439.5A CN201710229439A CN108695228A CN 108695228 A CN108695228 A CN 108695228A CN 201710229439 A CN201710229439 A CN 201710229439A CN 108695228 A CN108695228 A CN 108695228A
- Authority
- CN
- China
- Prior art keywords
- wafer carrier
- levelling
- wafer
- lifting shaft
- positioning member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of levelling mechanism of wafer carrier, wafer lift mechanism and reaction chamber, the levelling mechanism includes at least three levelling bolts and supporting positioning member, wherein, at least three levelling bolts are symmetrical around supporting positioning member, each levelling bolt through-wafer bracket, and be threadedly coupled with lifting shaft;Supporting positioning member is fixedly connected with wafer carrier, and is formed with spherical recess portion in the upper surface of lifting shaft;Supporting positioning member includes spherical elevation, which matches with spherical elevation.The levelling mechanism of wafer carrier provided by the invention only needs at least three levelling bolts of adjusting that leveling can be completed, and so as to simplify leveling process, improves process efficiency.Moreover, the setting of supporting positioning member does not interfere with the regulated quantity of levelling bolt, so as to increase adjustable extent.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, and in particular, to a kind of levelling mechanism of wafer carrier, chip liter
Descending mechanism and reaction chamber.
Background technology
In IC manufacturing field, many equipment are required for the liter using wafer lift mechanism before carrying out technique
Drop movement cooperative mechanical hand completion chip (Wafer) takes piece or film releasing.The wafer lift mechanism is usually by being used for bearing wafer
Wafer carrier, cylinder and lifting shaft connecting the two composition, and wafer carrier with lifting shaft is connect by regulating mechanism,
And the regulating mechanism can adjust the levelness of the loading end of wafer carrier, to ensure stabilization of the chip in technical process
Property.
Fig. 1 is the structure chart of existing wafer lift mechanism.Referring to Fig. 1, the wafer lift mechanism includes wafer carrier
100, lifting shaft 200 and cylinder 300, wherein wafer carrier 100 is used for bearing wafer.Lifting shaft 200 is vertically arranged, and is lifted
The lower end of axis 200 is connect with cylinder 300, and the upper end of lifting shaft 200 is connect by levelling mechanism 400 with wafer carrier 100.Fig. 2
For the vertical view of existing levelling mechanism.Referring to Fig. 2, levelling mechanism includes four the first bolts (401,403,405 and 407)
With four the second bolts (402,404,406 and 408), wherein each first bolt passes through the through-hole on wafer carrier 100, and
Be arranged 200 upper end of lifting shaft corresponding threaded holes conjunction.Each second bolt and the screw thread being arranged on wafer carrier 100 are logical
Hole matches, and the upper surface of lifting shaft 200 is withstood in the lower end of the second bolt.As a result, by screwing the first bolt, can make
Wafer carrier 100 corresponds to the active position of first bolt close to lifting shaft 200.It, can be to chip by screwing the second bolt
Bracket 100 corresponds to the active position of second bolt far from lifting shaft 200.During leveling, usually placed in wafer surface
Level meter, then, successively to the first bolt of aforementioned four (401,403,405 and 407) and four the second bolts (402,404,
It 406 and 408) carries out a small amount of loosening or screws, until level meter balance, leveling completion.
It is not difficult to find out, although above-mentioned levelling mechanism can realize levelling function, process is complicated, time and effort consuming, to board
Whole efficiency, which is formed, to be influenced, and eight bolts also form mutual restriction while mutual cooperation leveling, to limit
Regulated quantity, adjustable extent are smaller.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art, it is proposed that a kind of tune of wafer carrier
Flattening mechanism, wafer lift mechanism and reaction chamber not only increase adjustable extent, but also can simplify leveling process, improve work
Skill efficiency.
A kind of levelling mechanism of wafer carrier is provided to achieve the purpose of the present invention, for the wafer carrier to be consolidated
It is scheduled on the upper end of lifting shaft, and the levelness in the crystal chip bearing face of the wafer carrier, including at least three leveling can be adjusted
Screw and supporting positioning member, wherein
At least three levelling bolt is symmetrical centered on the supporting positioning member, and each levelling bolt passes through
The wafer carrier is worn, and is threadedly coupled with the lifting shaft;
The supporting positioning member is fixedly connected with the wafer carrier, and is formed with ball in the upper surface of the lifting shaft
Shape recess portion;The supporting positioning member includes spherical elevation, and the spherical recess portion is matched with the spherical elevation.
Preferably, the depth capacity of the spherical recess portion in the vertical direction is less than the spherical elevation in the vertical direction
Maximum length.
Preferably, the spherical elevation is hemisphere.
Preferably, the supporting positioning member further includes column interconnecting piece, the column interconnecting piece and the chip support
Frame is fixedly connected;
The spherical elevation is arranged in the lower end of the column interconnecting piece, and the lower surface relative to the wafer carrier is convex
Go out.
Preferably, it is formed with external screw thread in the periphery wall of the column interconnecting piece;It is formed with spiral shell on the wafer carrier
Pit, the column interconnecting piece are closed by the external screw thread and the corresponding threaded holes.
Preferably, the supporting positioning member is located at the center of the lifting shaft.
As another technical solution, the present invention also provides a kind of wafer lift mechanism, including wafer carrier, lifting shaft and
Driving source, the lifting shaft are vertically arranged, and the lower end of the lifting shaft is connect with the driving source, the upper end of the lifting shaft
It is connect with the wafer carrier by levelling mechanism, the levelling mechanism uses above-mentioned levelling mechanism provided by the invention.
Preferably, the wafer carrier includes ring support, and circumferential symmetrical point is provided with along it on the ring support
Multiple support columns of cloth, to bearing wafer.
Preferably, the driving source includes lifting cylinder or lifting motor.
As another technical solution, the present invention also provides a kind of reaction chambers comprising above-mentioned crystalline substance provided by the invention
Piece elevating mechanism.
The invention has the advantages that:
In the technical solution of the levelling mechanism of wafer carrier provided by the invention, wafer lift mechanism and reaction chamber, by
It is sphere-contact between supporting positioning member and lifting shaft, when loosening successively or screwing at least three levelling bolts, support is fixed
Position part can adapt to the angle change of wafer carrier automatically, without carrying out any adjustment to it, therefore, crystalline substance provided by the invention
The levelling mechanism of piece bracket only needs at least three levelling bolts of adjusting that leveling can be completed, and so as to simplify leveling process, carries
High technology efficiency.Moreover, the setting of supporting positioning member does not interfere with the regulated quantity of levelling bolt, so as to increase adjustable model
It encloses.
Description of the drawings
Fig. 1 is the structure chart of existing wafer lift mechanism;
Fig. 2 is the vertical view of existing levelling mechanism;
Fig. 3 is the structure chart of wafer lift mechanism provided in an embodiment of the present invention;
Fig. 4 is the structure chart of the levelling mechanism of wafer carrier provided in an embodiment of the present invention;
Fig. 5 is the sectional view of the supporting positioning member of levelling mechanism used in the embodiment of the present invention;
Fig. 6 is the vertical view of wafer carrier used in the embodiment of the present invention.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, come below in conjunction with the accompanying drawings to the present invention
Levelling mechanism, wafer lift mechanism and the reaction chamber of the wafer carrier of offer are described in detail.
Also referring to Fig. 3~Fig. 6, wafer lift mechanism provided in an embodiment of the present invention comprising wafer carrier 500,
Lifting shaft 600 and driving source 700.Wherein, lifting shaft 600 is vertically arranged, and the lower end of the lifting shaft 600 connects with driving source 700
It connects, the upper end of lifting shaft 600 is connect by levelling mechanism 800 with wafer carrier 500.Under the driving of driving source 700, lifting shaft
600 drive wafer carriers 500 make elevating movement, and piece or film releasing are taken with cooperative mechanical hand completion chip.Driving source 700 can be
Lifting cylinder or lifting motor.
Above-mentioned levelling mechanism 800 is used to wafer carrier 500 being fixed on the upper end of lifting shaft 600, and can adjust chip
The levelness of the loading end of bracket 500, so that it is guaranteed that stability of the chip in technical process.As shown in Figure 4 and Figure 5, at this
In embodiment, levelling mechanism 800 includes three levelling bolts (801,802,803) and supporting positioning member 804, wherein three tune
Plain screw (801,802,803) is symmetrical centered on supporting positioning member 804, it is preferred that supporting positioning member 800 is located at lifting
The center of axis 600.Each levelling bolt through-wafer bracket 500, and be threadedly coupled with lifting shaft 600.Specifically, in chip
There are three the through-holes for running through its thickness for setting on bracket 500, and accordingly, there are three the settings of the upper surface of lifting shaft 600
Threaded hole.Levelling bolt passes through the through-hole on wafer carrier 500, and is closed with the corresponding threaded holes on wafer carrier 500.Pass through pine
It moves or screws levelling bolt, levelling bolt can be made to be risen or fallen relative to lifting shaft 600, so as to so that wafer carrier
500 correspond to the active position of the levelling bolt far from or close to lifting shaft 600, and then realize the levelness to wafer carrier 500
Adjusting.
As shown in figure 5, supporting positioning member 804 is fixedly connected with wafer carrier 500.Specifically, supporting positioning member 804 includes
Column interconnecting piece 8041 and spherical elevation 8042, wherein column interconnecting piece 8041 is fixedly connected with wafer carrier 500, and the two is solid
Surely the mode connected is specifically as follows:It is formed with external screw thread in the periphery wall of column interconnecting piece 8041;The shape on wafer carrier 500
At there is a threaded hole, column interconnecting piece 8041 is closed by the corresponding threaded holes on its external screw thread and wafer carrier 500, to realize with
The threaded connection of wafer carrier 500.By adjusting height of the column interconnecting piece 8041 relative to wafer carrier 500, can adjust
Spacing between the lower surface and the upper surface of lifting shaft 600 of wafer carrier 500, so as to adjust levelling range.
Spherical elevation 8042 is arranged in the lower end of column interconnecting piece 8041, and the lower surface relative to wafer carrier 500 is convex
Go out.The spherical elevation 8042 can be hemisphere.
Also, it is formed with spherical recess portion 601 in the upper surface of lifting shaft 600, the spherical recess portion 601 and spherical elevation 8042
It matches, to make supporting positioning member 804 form sphere-contact with lifting shaft 600, is loosening or screwing above three tune successively
When plain screw (801,802,803), a certain range of variation, in the process, spherical elevation occur for the angle of wafer carrier 500
8042 fit with spherical recess portion 601 always, to play the role of support and positioning, to which supporting positioning member 804 can be automatic
The angle change for adapting to wafer carrier 500, without carrying out any adjustment to it, thus, it is only required to adjust three levelling bolts
Leveling can be completed in (801,802,803), so as to simplify leveling process, improves process efficiency.Moreover, supporting positioning member
804 setting does not interfere with the regulated quantity of levelling bolt, so as to increase adjustable extent.
Preferably, the depth capacity of spherical recess portion 601 in the vertical direction is less than spherical elevation 8042 in the vertical direction
Maximum length, that is, a part for spherical elevation 8042 be higher than lifting shaft 600 upper surface, so as to so that wafer carrier 500
Lower surface and the upper surface of lifting shaft 600 between there is spacing so that wafer carrier 500 can tilt certain angle, protect
Card provides enough regulated quantitys for leveling.
It should be noted that in the present embodiment, levelling bolt is three, but the present invention is not limited thereto, in reality
In the application of border, levelling bolt can also be designed as four or five or more according to specific needs.
It should also be noted that, in the present embodiment, supporting positioning member 804 is threadedly coupled with wafer carrier 500, but this
Invention is not limited thereto, and in practical applications, supporting positioning member 804 can also use any other mode and wafer carrier
500 are fixedly connected, such as weld.
As another technical solution, the embodiment of the present invention also provides a kind of wafer lift mechanism, structure such as Fig. 3 institutes
Show, and there has been detailed description in the above-described embodiments, is not repeated to describe herein.
In the present embodiment, as shown in fig. 6, wafer carrier 500 includes ring support 501, it is arranged on ring support 501
Have along its circumferential symmetrical multiple support column 502, to bearing wafer.
Wafer lift mechanism provided in an embodiment of the present invention, by using above-mentioned leveling machine provided in an embodiment of the present invention
Structure not only increases adjustable extent, but also can simplify leveling process, improves process efficiency.
As another technical solution, the embodiment of the present invention also provides a kind of reaction chamber comprising the embodiment of the present invention
The above-mentioned wafer lift mechanism provided.
Reaction chamber provided in an embodiment of the present invention, by using above-mentioned wafer lift machine provided in an embodiment of the present invention
Structure not only increases adjustable extent, but also can simplify leveling process, improves process efficiency.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of levelling mechanism of wafer carrier, the upper end for the wafer carrier to be fixed on to lifting shaft, and can adjust
The levelness in the crystal chip bearing face of the wafer carrier, which is characterized in that including at least three levelling bolts and supporting positioning member,
Wherein,
At least three levelling bolt is symmetrical centered on the supporting positioning member, and each levelling bolt runs through institute
Wafer carrier is stated, and is threadedly coupled with the lifting shaft;
The supporting positioning member is fixedly connected with the wafer carrier, and is formed in the upper surface of the lifting shaft spherical recessed
Portion;The supporting positioning member includes spherical elevation, and the spherical recess portion is matched with the spherical elevation.
2. the levelling mechanism of wafer carrier according to claim 1, which is characterized in that the spherical recess portion is in vertical direction
On depth capacity be less than the maximum length of the spherical elevation in the vertical direction.
3. the levelling mechanism of wafer carrier according to claim 1, which is characterized in that the spherical elevation is hemisphere.
4. the levelling mechanism of the wafer carrier according to claim 1-3 any one, which is characterized in that the support positioning
Part further includes column interconnecting piece, and the column interconnecting piece is fixedly connected with the wafer carrier;
The spherical elevation is arranged in the lower end of the column interconnecting piece, and is protruded relative to the lower surface of the wafer carrier.
5. the levelling mechanism of wafer carrier according to claim 4, which is characterized in that in the periphery of the column interconnecting piece
Wall is formed with external screw thread;Threaded hole is formed on the wafer carrier, the column interconnecting piece passes through the external screw thread and institute
State corresponding threaded holes conjunction.
6. the levelling mechanism of wafer carrier according to claim 1, which is characterized in that the supporting positioning member is located at described
The center of lifting shaft.
7. a kind of wafer lift mechanism, including wafer carrier, lifting shaft and driving source, the lifting shaft are vertically arranged, and described
The lower end of lifting shaft is connect with the driving source, and the upper end of the lifting shaft is connect by levelling mechanism with the wafer carrier,
It is characterized in that, the levelling mechanism is using the levelling mechanism described in claim 1-6 any one.
8. wafer lift mechanism according to claim 7, which is characterized in that the wafer carrier includes ring support,
It is provided on the ring support along its circumferential symmetrical multiple support column, to bearing wafer.
9. wafer lift mechanism according to claim 7, which is characterized in that the driving source includes lifting cylinder or liter
Motor drops.
10. a kind of reaction chamber, which is characterized in that including the wafer lift mechanism described in claim 7-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710229439.5A CN108695228A (en) | 2017-04-10 | 2017-04-10 | Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710229439.5A CN108695228A (en) | 2017-04-10 | 2017-04-10 | Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108695228A true CN108695228A (en) | 2018-10-23 |
Family
ID=63843199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710229439.5A Pending CN108695228A (en) | 2017-04-10 | 2017-04-10 | Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108695228A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111235550A (en) * | 2018-11-29 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Base adjusting device and chamber |
| CN111326438A (en) * | 2018-12-14 | 2020-06-23 | 北京北方华创微电子装备有限公司 | Leveling device and reaction chamber |
| CN113061865A (en) * | 2021-03-22 | 2021-07-02 | 北京北方华创微电子装备有限公司 | Lifting device and semiconductor process equipment |
| CN113130373A (en) * | 2020-01-16 | 2021-07-16 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113871337A (en) * | 2021-09-27 | 2021-12-31 | 北京北方华创微电子装备有限公司 | Bracket, semiconductor chamber and semiconductor processing equipment |
| WO2023051437A1 (en) * | 2021-09-29 | 2023-04-06 | 北京北方华创微电子装备有限公司 | Semiconductor process device and wafer support structure thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101135410A (en) * | 2006-09-01 | 2008-03-05 | 中国科学院西安光学精密机械研究所 | Leveling device of article carrying platform |
| KR20110130900A (en) * | 2010-05-28 | 2011-12-06 | 주식회사 테라세미콘 | Apparatus for processing a substrate |
| CN104535045A (en) * | 2014-12-18 | 2015-04-22 | 上海建工集团股份有限公司 | Wall-hanging hydrostatic level mounting device and wall-hanging hydrostatic level mounting method |
| CN104576469A (en) * | 2013-10-14 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Levelness adjusting structure, lifting device and cavity |
| CN104975257A (en) * | 2014-04-04 | 2015-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for adjusting levelness of PIN lifting mechanism |
| CN205244777U (en) * | 2015-11-30 | 2016-05-18 | 安徽四创电子股份有限公司 | Wave guide support frame with adjustable |
| CN105805506A (en) * | 2016-04-15 | 2016-07-27 | 刘同文 | Level bracket structure and leveling method thereof |
| CN205483579U (en) * | 2016-01-19 | 2016-08-17 | 武汉理工大学 | Car test bench leveling strutting arrangement |
-
2017
- 2017-04-10 CN CN201710229439.5A patent/CN108695228A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101135410A (en) * | 2006-09-01 | 2008-03-05 | 中国科学院西安光学精密机械研究所 | Leveling device of article carrying platform |
| KR20110130900A (en) * | 2010-05-28 | 2011-12-06 | 주식회사 테라세미콘 | Apparatus for processing a substrate |
| CN104576469A (en) * | 2013-10-14 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Levelness adjusting structure, lifting device and cavity |
| CN104975257A (en) * | 2014-04-04 | 2015-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for adjusting levelness of PIN lifting mechanism |
| CN104535045A (en) * | 2014-12-18 | 2015-04-22 | 上海建工集团股份有限公司 | Wall-hanging hydrostatic level mounting device and wall-hanging hydrostatic level mounting method |
| CN205244777U (en) * | 2015-11-30 | 2016-05-18 | 安徽四创电子股份有限公司 | Wave guide support frame with adjustable |
| CN205483579U (en) * | 2016-01-19 | 2016-08-17 | 武汉理工大学 | Car test bench leveling strutting arrangement |
| CN105805506A (en) * | 2016-04-15 | 2016-07-27 | 刘同文 | Level bracket structure and leveling method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111235550A (en) * | 2018-11-29 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Base adjusting device and chamber |
| CN111326438A (en) * | 2018-12-14 | 2020-06-23 | 北京北方华创微电子装备有限公司 | Leveling device and reaction chamber |
| CN113130373A (en) * | 2020-01-16 | 2021-07-16 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113130373B (en) * | 2020-01-16 | 2024-05-14 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113061865A (en) * | 2021-03-22 | 2021-07-02 | 北京北方华创微电子装备有限公司 | Lifting device and semiconductor process equipment |
| CN113871337A (en) * | 2021-09-27 | 2021-12-31 | 北京北方华创微电子装备有限公司 | Bracket, semiconductor chamber and semiconductor processing equipment |
| CN113871337B (en) * | 2021-09-27 | 2023-03-24 | 北京北方华创微电子装备有限公司 | Bracket, semiconductor chamber and semiconductor processing equipment |
| WO2023051437A1 (en) * | 2021-09-29 | 2023-04-06 | 北京北方华创微电子装备有限公司 | Semiconductor process device and wafer support structure thereof |
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Application publication date: 20181023 |