CN110610895A - Spring thimble mechanism for platform and vacuum plasma processing cavity - Google Patents
Spring thimble mechanism for platform and vacuum plasma processing cavity Download PDFInfo
- Publication number
- CN110610895A CN110610895A CN201910932527.0A CN201910932527A CN110610895A CN 110610895 A CN110610895 A CN 110610895A CN 201910932527 A CN201910932527 A CN 201910932527A CN 110610895 A CN110610895 A CN 110610895A
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- thimble
- platform
- spring
- base
- arc
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
Abstract
The invention discloses a spring thimble mechanism for a platform and a vacuum plasma processing cavity, wherein the spring thimble mechanism comprises a thimble which extends out and retracts from the upper end surface of the platform along a pinhole; the device also comprises a guide pipe, a spring and a base; the guide pipe comprises a plurality of arc guide plates which are arranged on the lower end surface of the platform at intervals along the circumferential direction, and the arc guide plates are coaxial with a pinhole; the base is provided with a plurality of circular arc through grooves; each arc through groove is sleeved outside one arc guide plate in a sliding mode; the lower end of the thimble is fixed on the center of the base; the spring is positioned between the upper end surface of the base and the lower end surface of the platform; when the thimble extends out of the upper end surface of the platform, the spring is in a compressed state. The thimble is always vertical to the platform, the problem of rotation deflection and jamming is avoided, the matching gap between the needle hole and the thimble is not required to be considered, and the thimble can be smoothly extended and retracted in the needle hole; meanwhile, the ejector pin can be retracted from the upper end face of the platform, and the ejector pin is prevented from falling out of place.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a spring thimble mechanism for a platform and a vacuum plasma processing cavity.
Background
The thimble mechanism applied in the semiconductor industry in the prior art is shown in figure 10, the thimble is inserted in a hole of a workpiece carrier in a clearance fit manner to realize movement, however, if the fit clearance between the thimble and the pinhole is too small, the thimble is easy to block and stop, accidents occur, if the fit clearance between the thimble and the pinhole is too large, the thimble is in an inclined state in the hole, a certain oblique cutting force is generated between the thimble and the lower end of the pinhole when the thimble is lifted by a top plate, the contact surface is roughened due to friction between the thimble and the pinhole, and the thimble is broken.
Disclosure of Invention
In order to solve the problems, the invention provides a spring thimble mechanism for a platform and a vacuum plasma processing cavity, wherein a thimble is always vertical to the platform, so that the problem of rotation deflection and jamming is avoided, a fit clearance between a needle hole and the thimble is not required to be considered, and the thimble can be ensured to extend and retract smoothly in the needle hole; meanwhile, the ejector pin can be retracted from the upper end face of the platform, and the ejector pin is prevented from falling out of place.
The technical scheme is as follows: the invention provides a spring thimble mechanism for a platform, wherein a pinhole is arranged on the platform; the spring thimble mechanism comprises a thimble extending out and retracting from the upper end surface of the platform along the pinhole; the device also comprises a guide pipe, a spring and a base; the guide pipe comprises a plurality of arc guide plates with the same diameter, the arc guide plates are coaxial with one pinhole and are arranged at intervals along the circumferential direction, and the upper ends of the arc guide plates are fixed on the lower end face of the platform;
the base is provided with a plurality of circular arc through grooves; the arc through grooves correspond to the arc guide plates one by one, and each arc through groove is slidably sleeved outside one arc guide plate; the lower end of the ejector pin is fixed on the base, and the ejector pin is positioned on the axis of the guide pipe and can move axially along the guide pipe;
the spring is sleeved on the periphery of the guide pipe and is positioned between the upper end face of the base and the lower end face of the platform; when the thimble extends out of the upper end surface of the platform, the spring is in a compressed state.
Furthermore, be provided with the protruding spacing boss in upper end on the base for the minimum distance with the platform when restriction base removes to the platform.
Further, the guide pipe also comprises an arc limiting plate positioned at the upper end of the guide pipe; the arc limiting plate is connected between the arc guide plates; the arc limiting plate is positioned on a path of the limiting boss moving towards the platform.
Further, when the spring is in a natural length, the distance between the upper end face of the limiting boss and the lower end face of the arc limiting plate is smaller than the compressible limit length of the spring.
Further, the sum of the natural length of the spring and the thickness of the base is smaller than the length of the guide pipe.
Furthermore, the upper end of the guide pipe is connected with the lower end face of the platform through a flange.
Further, the lower end of the thimble is provided with a threaded part; the base is provided with a threaded hole; the threaded part of the thimble is screwed into the threaded hole for fixation.
A vacuum plasma processing cavity comprises a plurality of spring thimble mechanisms; the spring ejector pin mechanism and the needle holes are arranged at the lower end of the workpiece carrying platform in a one-to-one correspondence manner; the manipulator is used for supporting the workpiece and conveying the workpiece to the upper part of the workpiece carrying platform; when the manipulator is positioned above the workpiece carrying platform, the upper end of the thimble can penetrate through the manipulator and is positioned above the manipulator.
Further, the device also comprises a top plate; the top plate is connected with the lower end face of the base; the top plate is provided with a plurality of through holes which correspond to the thimbles one by one; the diameter of the through hole is larger than that of the guide pipe and smaller than that of the base.
Has the advantages that: the arc guide plate is vertically fixed on the lower surface of the platform, and the arc through groove of the base is slidably sleeved outside the arc guide plate, so that the guide effect of the axial movement of the base is achieved, and the base is prevented from rotating and deflecting; the thimble is fixed on the base, the thimble is always vertical to the platform, the problem of rotation deflection and jamming is avoided, the matching gap between the needle hole and the thimble is not needed to be considered, and the thimble can be smoothly extended and retracted in the needle hole.
The spring between the lower surface of the platform and the base can apply rebound force to push the base to descend, so that the ejector pin can be retracted from the upper end surface of the platform, and the ejector pin 1 is prevented from falling out of place; meanwhile, the spring plays a role in buffering the lifting action in the lifting process of the thimble.
Drawings
FIG. 1 is a front view of the pogo pin mechanism of the present invention;
FIG. 2 is a front sectional view of the ejector spring pin mechanism of the present invention;
FIG. 3 is an isometric view of the pogo pin mechanism of the present invention;
FIG. 4 is a schematic structural view of the guide tube of the present invention;
FIG. 5 is a schematic structural diagram of a base according to the present invention;
FIG. 6 is a schematic view of a partial structure of the vacuum plasma processing chamber according to the present invention with the needle retracted;
FIG. 7 is a schematic view of a partial structure of a vacuum plasma processing chamber according to the present invention with the spike extended;
FIG. 8 is a partial top view of a vacuum plasma processing chamber of the present invention;
FIG. 9 is a view showing a connection structure of a top plate and a spring/ejector pin mechanism of the vacuum plasma processing chamber according to the present invention;
fig. 10 is a schematic view of a thimble structure in the prior art.
Detailed Description
The invention provides a spring thimble mechanism for a platform, wherein a needle hole is formed in the platform, and the spring thimble mechanism comprises a thimble 1 which extends out and retracts from the upper end surface of the platform along the needle hole.
The spring thimble mechanism further comprises a guide pipe, a spring 2 and a base 3. The guide pipe comprises a plurality of arc guide plates 4 with the same diameter, the arc guide plates 4 are coaxial with a pinhole, the arc guide plates 4 are arranged at intervals along the circumferential direction, and the upper ends of the arc guide plates 4 are fixed on the lower end face of the platform through flanges 8.
A plurality of circular arc through grooves 5 are formed in the base 3; the arc through grooves 5 correspond to the arc guide plates 4 one by one, and each arc through groove 5 is sleeved outside one arc guide plate 4 in a sliding mode, so that the base 3 is guided to move along the axial direction, and meanwhile, the base 3 is limited not to rotate and deflect. The lower end of the thimble 1 is provided with a threaded part 9; a threaded hole 10 is formed in the base 3; the screw thread part 9 of the thimble 1 is screwed into the screw hole 10 for fixing. And the thimble 1 is located on the axis of the guide tube and can move along the axial direction of the guide tube.
Because the thimble 1 is fixed on the base 3, so long as the diameter of the thimble 1 is less than the diameter of the guide tube and the pinhole, need not to consider the fit clearance of the pinhole and the thimble 1, the thimble 1 always keeps perpendicular to the platform, can not produce the problem of the deflection jam of rotating, guarantee that the thimble 1 stretches out and draws back smoothly in the pinhole.
The spring 2 is sleeved on the periphery of the guide pipe, and the spring 2 is positioned between the upper end face of the base 3 and the lower end face of the platform; when the thimble 1 extends out from the upper end surface of the platform, the spring 2 is in a compressed state. The sum of the natural length of the spring 2 and the thickness of the base 3 is less than the length of the guide pipe, so that the base 3 cannot be popped out by the spring 3 and separated from the arc guide plate 4.
When the spring thimble mechanism is used, acting force is applied to the base 3 to lift the base 3, the base 3 compresses the spring 2 to slide along the guide pipe, and the thimble 1 extends out of the upper end face of the platform; when the acting force is stopped being applied to the base 3, the rebound force of the compressed spring 2 pushes the base 3 to descend, so that the thimble can be retracted from the upper end face of the platform, and the thimble 1 is prevented from falling out of place. Meanwhile, the spring also plays a role in buffering the lifting action.
The base 3 is provided with a limiting boss 6 protruding towards the upper end, and the guide pipe further comprises an arc limiting plate 7 positioned at the upper end of the guide pipe; the arc limiting plate 7 is connected between the arc guide plates 4; and the arc limiting plate 7 is positioned on the path of the limiting boss 6 moving towards the platform. When the base 3 rises to the position where the upper end surface of the limit boss 6 is connected with the lower end surface of the arc limit plate 7, the base 3 cannot rise continuously due to the minimum distance from the base to the platform.
When the spring 2 is in a natural length, the distance between the upper end surface of the limiting boss 6 and the lower end surface of the arc limiting plate 7 is smaller than the compressible limit length of the spring 2, so that the spring 2 is compressed with a margin and cannot be damaged.
A vacuum plasma processing cavity comprises a plurality of spring thimble mechanisms; the spring ejector pin mechanism is characterized by further comprising a workpiece carrier 11, wherein a plurality of pin holes are formed in the workpiece carrier 11, and the spring ejector pin mechanisms and the pin holes are arranged at the lower end of the workpiece carrier 11 in a one-to-one correspondence manner; a robot arm 12 for supporting and delivering the workpiece above the workpiece stage; when the robot 12 is located above the workpiece stage 11, the upper end of the ejector pin 1 may pass through the robot 12 and be located above the robot 12. In this embodiment, one side of the manipulator 12 is provided with a U-shaped through groove, and when the manipulator 12 moves to an installation station right above the workpiece carrier 11, a plurality of pinholes are all located right below the U-shaped through groove area.
The vacuum plasma processing chamber further comprises a top plate 13; the top plate 13 is connected with the lower end face of the base 3; the top plate 13 is provided with a plurality of through holes 14 which correspond to the thimbles 1 one by one; the diameter of the through hole 14 is larger than that of the guide tube and smaller than that of the base 3. The top plate 13 jacks the base 3, the compression spring 2 and the arc guide plate 4 penetrate through the through hole 14 to extend out.
The spring 2 can be made of common carbon steel by using equipment with the temperature below 100 ℃ in the prior art. However, for equipment with a service temperature of 300 ℃ or higher, the spring 2 can be made of carbon fiber, and the service performance at high temperature is satisfied.
When a workpiece is placed in the vacuum plasma processing cavity, the ejector pin 1 is positioned below the workpiece carrier 11, the manipulator 12 carries the workpiece and moves to an installation station right above the workpiece carrier 11, then the ejector pin 1 is lifted by the top plate 13 to jack the workpiece, then the manipulator is withdrawn, the top plate 13 falls, and the ejector pin 1 descends under the action of the elastic force of the spring 2 to carry the workpiece to the upper surface of the workpiece carrier 11.
When the vacuum plasma processing cavity takes out a workpiece, the top plate 13 lifts the thimble 1 to jack the workpiece, then the manipulator 12 moves to an installation station right above the workpiece carrier 11, then the thimble 1 descends under the action of the elastic force of the spring 2, at the moment, the workpiece falls on the manipulator 12, the manipulator 12 returns, and the workpiece is taken out.
Claims (9)
1. A spring thimble mechanism for a platform is provided with a pinhole; the spring thimble mechanism comprises a thimble (1) which extends out and retracts from the upper end surface of the platform along the pinhole; the method is characterized in that: the device also comprises a guide pipe, a spring (2) and a base (3); the guide pipe comprises a plurality of arc guide plates (4) with the same diameter, the arc guide plates (4) are coaxial with a pinhole, the arc guide plates (4) are arranged at intervals along the circumferential direction, and the upper ends of the arc guide plates (4) are fixed on the lower end face of the platform;
a plurality of circular arc through grooves (5) are formed in the base (3); the arc through grooves (5) correspond to the arc guide plates (4) one by one, and each arc through groove (5) is sleeved outside one arc guide plate (4) in a sliding mode; the lower end of the thimble (1) is fixed on the base (3), and the thimble (1) is positioned on the axis of the guide pipe and can move along the axial direction of the guide pipe;
the spring (2) is sleeved on the periphery of the guide pipe, and the spring (2) is positioned between the upper end face of the base (3) and the lower end face of the platform; when the thimble (1) extends out of the upper end face of the platform, the spring (2) is in a compressed state.
2. The pogo pin mechanism of claim 1, wherein: and the base (3) is provided with a limiting boss (6) protruding towards the upper end and used for limiting the minimum distance between the base (3) and the platform when the base moves towards the platform.
3. The pogo pin mechanism of claim 2, wherein: the guide pipe also comprises an arc limiting plate (7) positioned at the upper end of the guide pipe; the arc limiting plate (7) is connected between the arc guide plates (4); the arc limiting plate (7) is positioned on a path of the limiting boss (6) moving towards the platform.
4. The pogo pin mechanism of claim 3, wherein: when the spring (2) is in a natural length, the distance between the upper end surface of the limiting boss (6) and the lower end surface of the arc limiting plate (7) is smaller than the compressible limit length of the spring (2).
5. The pogo pin mechanism of any one of claims 1-4, wherein: the sum of the natural length of the spring (2) and the thickness of the base (3) is less than the length of the guide pipe.
6. The pogo pin mechanism of claim 5, wherein: the upper end of the guide pipe is connected with the lower end face of the platform through a flange (8).
7. The pogo pin mechanism of claim 6, wherein: the lower end of the thimble (1) is provided with a thread part (9); a threaded hole (10) is formed in the base (3); the threaded part (9) of the thimble (1) is screwed into the threaded hole (10) for fixation.
8. A vacuum plasma processing chamber, comprising: comprising a plurality of pogo pin mechanisms according to any of claims 1-7; the spring ejector pin mechanism is characterized by further comprising a workpiece carrier (11), wherein a plurality of pin holes are formed in the workpiece carrier (11), and the spring ejector pin mechanisms and the pin holes are arranged at the lower end of the workpiece carrier (11) in a one-to-one correspondence manner; the device also comprises a manipulator (12) for supporting the workpiece and delivering the workpiece to the upper part of the workpiece carrier; when the manipulator (12) is positioned above the workpiece carrying platform (11), the upper end of the thimble (1) can penetrate through the manipulator (12) and is positioned above the manipulator (12).
9. The vacuum plasma processing chamber of claim 8, wherein: further comprising a top plate (13); the top plate (13) is connected with the lower end face of the base (3); the top plate (13) is provided with a plurality of through holes (14) which correspond to the thimbles (1) one by one; the diameter of the through hole (14) is larger than that of the guide pipe and smaller than that of the base (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910932527.0A CN110610895A (en) | 2019-09-29 | 2019-09-29 | Spring thimble mechanism for platform and vacuum plasma processing cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910932527.0A CN110610895A (en) | 2019-09-29 | 2019-09-29 | Spring thimble mechanism for platform and vacuum plasma processing cavity |
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| Publication Number | Publication Date |
|---|---|
| CN110610895A true CN110610895A (en) | 2019-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910932527.0A Pending CN110610895A (en) | 2019-09-29 | 2019-09-29 | Spring thimble mechanism for platform and vacuum plasma processing cavity |
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| Country | Link |
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| CN (1) | CN110610895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112813419A (en) * | 2020-12-24 | 2021-05-18 | 北京北方华创微电子装备有限公司 | Process chamber of semiconductor process equipment and semiconductor process equipment |
| CN113764247A (en) * | 2020-06-02 | 2021-12-07 | 江苏鲁汶仪器有限公司 | Thimble lifting device for vacuum chamber and plasma etching system |
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| CN101276777A (en) * | 2007-03-27 | 2008-10-01 | 东京毅力科创株式会社 | Substrate mounting stage and substrate processing apparatus |
| KR20140101946A (en) * | 2013-02-13 | 2014-08-21 | 세메스 주식회사 | lift pin assembly |
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| CN106935540A (en) * | 2015-12-29 | 2017-07-07 | 中微半导体设备(上海)有限公司 | Chip jacking apparatus and its jacking method |
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| CN109494183A (en) * | 2017-09-12 | 2019-03-19 | 三星电子株式会社 | Go up and down needle assemblies, substrate supporting unit and substrate-treating apparatus |
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2019
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| CN1905152A (en) * | 2005-07-29 | 2007-01-31 | 东京毅力科创株式会社 | Substrate lifting device and substrate processing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113764247A (en) * | 2020-06-02 | 2021-12-07 | 江苏鲁汶仪器有限公司 | Thimble lifting device for vacuum chamber and plasma etching system |
| CN112813419A (en) * | 2020-12-24 | 2021-05-18 | 北京北方华创微电子装备有限公司 | Process chamber of semiconductor process equipment and semiconductor process equipment |
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Application publication date: 20191224 |