JP2008263126A5 - - Google Patents

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Publication number
JP2008263126A5
JP2008263126A5 JP2007105971A JP2007105971A JP2008263126A5 JP 2008263126 A5 JP2008263126 A5 JP 2008263126A5 JP 2007105971 A JP2007105971 A JP 2007105971A JP 2007105971 A JP2007105971 A JP 2007105971A JP 2008263126 A5 JP2008263126 A5 JP 2008263126A5
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
semiconductor
diamond
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007105971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008263126A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007105971A priority Critical patent/JP2008263126A/ja
Priority claimed from JP2007105971A external-priority patent/JP2008263126A/ja
Priority to CN200810092464.4A priority patent/CN101286487B/zh
Priority to EP08154435.5A priority patent/EP1981094A3/en
Priority to US12/081,230 priority patent/US20080251798A1/en
Publication of JP2008263126A publication Critical patent/JP2008263126A/ja
Publication of JP2008263126A5 publication Critical patent/JP2008263126A5/ja
Pending legal-status Critical Current

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JP2007105971A 2007-04-13 2007-04-13 半導体装置、該半導体装置の製造方法、ｌｅｄヘッド、及び画像形成装置 Pending JP2008263126A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007105971A JP2008263126A (ja) 2007-04-13 2007-04-13 半導体装置、該半導体装置の製造方法、ｌｅｄヘッド、及び画像形成装置
CN200810092464.4A CN101286487B (zh) 2007-04-13 2008-04-11 半导体装置、led头以及图像形成装置
EP08154435.5A EP1981094A3 (en) 2007-04-13 2008-04-11 Semiconductor device, led head and image forming apparatus
US12/081,230 US20080251798A1 (en) 2007-04-13 2008-04-11 Semiconductor device, LED head and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007105971A JP2008263126A (ja) 2007-04-13 2007-04-13 半導体装置、該半導体装置の製造方法、ｌｅｄヘッド、及び画像形成装置

Publications (2)

Publication Number Publication Date
JP2008263126A JP2008263126A (ja) 2008-10-30
JP2008263126A5 true JP2008263126A5 (enExample) 2009-01-22

Family

ID=39472621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007105971A Pending JP2008263126A (ja) 2007-04-13 2007-04-13 半導体装置、該半導体装置の製造方法、ｌｅｄヘッド、及び画像形成装置

Country Status (4)

Country Link
US (1) US20080251798A1 (enExample)
EP (1) EP1981094A3 (enExample)
JP (1) JP2008263126A (enExample)
CN (1) CN101286487B (enExample)

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US8409366B2 (en) 2009-06-23 2013-04-02 Oki Data Corporation Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof
JP4871378B2 (ja) * 2009-08-24 2012-02-08 株式会社沖データ 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置
JP5330953B2 (ja) 2009-10-01 2013-10-30 株式会社沖データ 発光装置
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KR101172950B1 (ko) * 2009-12-02 2012-08-10 정경화 그라파이트 기반의 발광다이오드용 기판 및 이를 이용한 발광다이오드
US20120280352A1 (en) * 2010-01-12 2012-11-08 Novatrans Group Sa Semiconductor structure with heat spreader and method of its manufacture
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US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
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TWI443870B (zh) * 2011-01-05 2014-07-01 Ritedia Corp Vertical light emitting diode and its manufacturing method
CN101964385B (zh) 2010-10-28 2012-08-29 映瑞光电科技(上海)有限公司 发光二极管及其形成方法
WO2012058656A2 (en) * 2010-10-29 2012-05-03 Ritedia Corporation Stress regulated semiconductor and associated methods
TWI473299B (zh) * 2011-12-15 2015-02-11 Ritedia Corp 覆晶式發光二極體及其製法與應用
NO2820167T3 (enExample) * 2012-02-28 2018-05-26
CN102593294B (zh) * 2012-03-15 2016-08-03 安徽三安光电有限公司 复合式氮化镓基半导体生长衬底及其制作方法
TWI466328B (zh) * 2012-06-11 2014-12-21 Ritedia Corp 覆晶式發光二極體及其製法與應用
FR2992466A1 (fr) 2012-06-22 2013-12-27 Soitec Silicon On Insulator Procede de realisation de contact pour led et structure resultante
TWI520378B (zh) * 2012-10-22 2016-02-01 錸鑽科技股份有限公司 覆晶式發光二極體及其應用
TWI455665B (zh) * 2012-11-05 2014-10-01 Ritedia Corp 覆晶式發光二極體封裝模組及其製法
CN102983124B (zh) * 2012-11-14 2015-06-10 深圳大学 具有散热装置的led光源
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
JP2020520129A (ja) * 2017-05-10 2020-07-02 マクマホン, シェーン トマスMCMAHON, Shane Thomas 薄膜結晶化プロセス
TWI633645B (zh) * 2017-08-04 2018-08-21 鼎展電子股份有限公司 可撓性led元件與可撓性led顯示面板
TWI642047B (zh) * 2018-01-26 2018-11-21 鼎展電子股份有限公司 可撓性微發光二極體顯示模組
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JP7615047B2 (ja) * 2019-11-20 2025-01-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および固体撮像装置の製造方法

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US8236594B2 (en) * 2006-10-20 2012-08-07 Chien-Min Sung Semiconductor-on-diamond devices and associated methods

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