JP2008222769A5 - - Google Patents
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- Publication number
- JP2008222769A5 JP2008222769A5 JP2007059909A JP2007059909A JP2008222769A5 JP 2008222769 A5 JP2008222769 A5 JP 2008222769A5 JP 2007059909 A JP2007059909 A JP 2007059909A JP 2007059909 A JP2007059909 A JP 2007059909A JP 2008222769 A5 JP2008222769 A5 JP 2008222769A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic polyurethane
- resin foam
- mass
- temperature
- foam according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006260 foam Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polytetramethylene Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007059909A JP4994894B2 (ja) | 2007-03-09 | 2007-03-09 | 樹脂発泡体およびそれからなる研磨パッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007059909A JP4994894B2 (ja) | 2007-03-09 | 2007-03-09 | 樹脂発泡体およびそれからなる研磨パッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008222769A JP2008222769A (ja) | 2008-09-25 |
| JP2008222769A5 true JP2008222769A5 (https=) | 2009-11-05 |
| JP4994894B2 JP4994894B2 (ja) | 2012-08-08 |
Family
ID=39841767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007059909A Expired - Fee Related JP4994894B2 (ja) | 2007-03-09 | 2007-03-09 | 樹脂発泡体およびそれからなる研磨パッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4994894B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5393434B2 (ja) * | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| WO2010138724A1 (en) * | 2009-05-27 | 2010-12-02 | Rogers Corporation | Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
| JP6303482B2 (ja) * | 2013-12-20 | 2018-04-04 | Dic株式会社 | ウレタン組成物、硬化物、及び、研磨材 |
| US10106662B2 (en) * | 2016-08-04 | 2018-10-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Thermoplastic poromeric polishing pad |
| WO2018087362A1 (de) | 2016-11-14 | 2018-05-17 | Basf Se | Expandierte thermoplastische polyurethanpartikel, verfahren zu deren herstellung sowie verfahren zur herstellung eines formteils |
| JP7097171B2 (ja) * | 2017-11-20 | 2022-07-07 | 株式会社クラレ | 研磨パッド |
| CA3160956A1 (en) * | 2019-11-13 | 2021-05-20 | Basf Se | Comfort etpu |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3649385B2 (ja) * | 2000-01-12 | 2005-05-18 | 東洋ゴム工業株式会社 | 熱可塑性エラストマー微孔質発泡体、その製造方法および研磨シート |
| JP2003145414A (ja) * | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
| JP3983610B2 (ja) * | 2002-07-02 | 2007-09-26 | 株式会社クラレ | 熱可塑性ポリウレタン発泡体およびそれからなる研磨パッド |
| JP4474208B2 (ja) * | 2004-06-10 | 2010-06-02 | 株式会社クラレ | 樹脂発泡体およびそれからなる研磨パッド |
-
2007
- 2007-03-09 JP JP2007059909A patent/JP4994894B2/ja not_active Expired - Fee Related
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