JP2008211219A5 - - Google Patents
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- Publication number
- JP2008211219A5 JP2008211219A5 JP2008043004A JP2008043004A JP2008211219A5 JP 2008211219 A5 JP2008211219 A5 JP 2008211219A5 JP 2008043004 A JP2008043004 A JP 2008043004A JP 2008043004 A JP2008043004 A JP 2008043004A JP 2008211219 A5 JP2008211219 A5 JP 2008211219A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- manifold
- processing chamber
- flow
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims 46
- 238000000034 method Methods 0.000 claims 24
- 238000010926 purge Methods 0.000 claims 11
- 238000005259 measurement Methods 0.000 claims 6
- 238000011144 upstream manufacturing Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/678,623 | 2007-02-26 | ||
| US11/678,623 US7846497B2 (en) | 2007-02-26 | 2007-02-26 | Method and apparatus for controlling gas flow to a processing chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008211219A JP2008211219A (ja) | 2008-09-11 |
| JP2008211219A5 true JP2008211219A5 (enExample) | 2013-02-14 |
| JP5330709B2 JP5330709B2 (ja) | 2013-10-30 |
Family
ID=39589491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008043004A Expired - Fee Related JP5330709B2 (ja) | 2007-02-26 | 2008-02-25 | 処理チャンバへのガスフローを制御する方法及び装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7846497B2 (enExample) |
| EP (1) | EP1961838A1 (enExample) |
| JP (1) | JP5330709B2 (enExample) |
| KR (1) | KR100975441B1 (enExample) |
| CN (1) | CN101256935B (enExample) |
| SG (1) | SG145668A1 (enExample) |
| TW (1) | TW200846860A (enExample) |
Families Citing this family (61)
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| JP2006253696A (ja) * | 2005-03-10 | 2006-09-21 | Asm America Inc | ガスインジェクタ制御システム |
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| US8623141B2 (en) * | 2009-05-18 | 2014-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Piping system and control for semiconductor processing |
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| JP2012195565A (ja) * | 2011-02-28 | 2012-10-11 | Hitachi Kokusai Electric Inc | 基板処理装置、基板処理方法及び半導体装置の製造方法 |
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| KR101932250B1 (ko) * | 2011-06-30 | 2019-03-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 고속 가스 교환, 고속 가스 전환 및 프로그램 가능한 가스 전달을 위한 방법 및 장치 |
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| JP6336719B2 (ja) * | 2013-07-16 | 2018-06-06 | 株式会社ディスコ | プラズマエッチング装置 |
| US9632516B2 (en) * | 2013-12-19 | 2017-04-25 | Tawan Semiconductor Manufacturing Co., Ltd | Gas-supply system and method |
| US10161060B2 (en) | 2013-12-19 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas-supply system and method |
| JP2016081945A (ja) * | 2014-10-09 | 2016-05-16 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| TW201634738A (zh) * | 2015-01-22 | 2016-10-01 | 應用材料股份有限公司 | 用於在空間上分離之原子層沉積腔室的經改良注射器 |
| CN106025158B (zh) * | 2015-03-27 | 2020-08-11 | 株式会社杰士汤浅国际 | 蓄电元件 |
| US10957561B2 (en) * | 2015-07-30 | 2021-03-23 | Lam Research Corporation | Gas delivery system |
| US10192751B2 (en) | 2015-10-15 | 2019-01-29 | Lam Research Corporation | Systems and methods for ultrahigh selective nitride etch |
| US10825659B2 (en) | 2016-01-07 | 2020-11-03 | Lam Research Corporation | Substrate processing chamber including multiple gas injection points and dual injector |
| US10256075B2 (en) * | 2016-01-22 | 2019-04-09 | Applied Materials, Inc. | Gas splitting by time average injection into different zones by fast gas valves |
| US10699878B2 (en) | 2016-02-12 | 2020-06-30 | Lam Research Corporation | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
| US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
| US10147588B2 (en) | 2016-02-12 | 2018-12-04 | Lam Research Corporation | System and method for increasing electron density levels in a plasma of a substrate processing system |
| US10438833B2 (en) | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
| US10453721B2 (en) | 2016-03-15 | 2019-10-22 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10269600B2 (en) * | 2016-03-15 | 2019-04-23 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10410832B2 (en) | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
| US10604841B2 (en) | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
| GB2557670B (en) * | 2016-12-15 | 2020-04-15 | Thermo Fisher Scient Bremen Gmbh | Improved gas flow control |
| CN108231620B (zh) * | 2016-12-15 | 2021-01-19 | 中微半导体设备(上海)股份有限公司 | 一种气体流量控制装置及其气体流量控制方法 |
| JP7021237B2 (ja) | 2017-02-09 | 2022-02-16 | アプライド マテリアルズ インコーポレイテッド | 水蒸気および酸素の反応物を利用するプラズマ軽減技術 |
| KR101963339B1 (ko) * | 2017-04-20 | 2019-03-28 | 가부시키가이샤 브이텍스 | 진공 용기 내 압력 멀티 제어 장치 및 진공 용기 내 압력 멀티 제어 방법 |
| KR102861934B1 (ko) | 2017-09-26 | 2025-09-18 | 램 리써치 코포레이션 | 펄스 폭 조정된 도즈 제어를 위한 시스템들 및 방법들 |
| KR102617972B1 (ko) | 2017-11-21 | 2023-12-22 | 램 리써치 코포레이션 | 하단 링 및 중간 에지 링 |
| WO2019113478A1 (en) | 2017-12-08 | 2019-06-13 | Lam Research Corporation | Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
| WO2019152486A1 (en) * | 2018-01-31 | 2019-08-08 | Lam Research Corporation | Manifold valve for multiple precursors |
| US11798789B2 (en) | 2018-08-13 | 2023-10-24 | Lam Research Corporation | Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features |
| AT521586B1 (de) * | 2018-08-28 | 2020-12-15 | Avl List Gmbh | Gasmischvorrichtung zur Linearisierung oder Kalibrierung von Gasanalysatoren |
| CN109884255A (zh) * | 2019-03-26 | 2019-06-14 | 翼捷安全设备(昆山)有限公司 | 高精度全自动配气系统及方法 |
| US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
| US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
| TW202128273A (zh) * | 2019-10-08 | 2021-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體注入系統、及將材料沉積於反應室內之基板表面上的方法 |
| JP7296854B2 (ja) * | 2019-11-07 | 2023-06-23 | 東京エレクトロン株式会社 | ガス供給方法及び基板処理装置 |
| WO2021194470A1 (en) | 2020-03-23 | 2021-09-30 | Lam Research Corporation | Mid-ring erosion compensation in substrate processing systems |
| KR20220089052A (ko) * | 2020-12-21 | 2022-06-28 | 삼성전자주식회사 | 반응 가스 공급 시스템, 이를 포함하는 원자층 증착 장치, 및 이를 이용해서 기판을 처리하는 방법 |
| US12400833B2 (en) | 2021-03-02 | 2025-08-26 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| WO2022186971A1 (en) * | 2021-03-03 | 2022-09-09 | Ichor Systems, Inc. | Fluid flow control system comprising a manifold assembly |
| TW202309974A (zh) * | 2021-05-21 | 2023-03-01 | 美商蘭姆研究公司 | 高深寬比3d nand架構中的鎢字元線填充 |
| TWI868717B (zh) * | 2022-03-01 | 2025-01-01 | 美商艾克爾系統公司 | 包含有歧管構件的流體流動控制系統及方法 |
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| US11940819B1 (en) * | 2023-01-20 | 2024-03-26 | Applied Materials, Inc. | Mass flow controller based fast gas exchange |
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-
2007
- 2007-02-26 US US11/678,623 patent/US7846497B2/en not_active Expired - Fee Related
-
2008
- 2008-02-14 EP EP20080151408 patent/EP1961838A1/en not_active Withdrawn
- 2008-02-20 SG SG200801437-5A patent/SG145668A1/en unknown
- 2008-02-25 JP JP2008043004A patent/JP5330709B2/ja not_active Expired - Fee Related
- 2008-02-25 KR KR1020080016714A patent/KR100975441B1/ko not_active Expired - Fee Related
- 2008-02-26 CN CN2008100063306A patent/CN101256935B/zh not_active Expired - Fee Related
- 2008-02-26 TW TW97106678A patent/TW200846860A/zh unknown
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