JP2012038483A5 - - Google Patents

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Publication number
JP2012038483A5
JP2012038483A5 JP2010175904A JP2010175904A JP2012038483A5 JP 2012038483 A5 JP2012038483 A5 JP 2012038483A5 JP 2010175904 A JP2010175904 A JP 2010175904A JP 2010175904 A JP2010175904 A JP 2010175904A JP 2012038483 A5 JP2012038483 A5 JP 2012038483A5
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JP
Japan
Prior art keywords
flow path
gas
split
argon gas
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010175904A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012038483A (ja
JP5304749B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010175904A priority Critical patent/JP5304749B2/ja
Priority claimed from JP2010175904A external-priority patent/JP5304749B2/ja
Priority to PCT/JP2011/066299 priority patent/WO2012017812A2/ja
Priority to US13/813,875 priority patent/US9214327B2/en
Publication of JP2012038483A publication Critical patent/JP2012038483A/ja
Publication of JP2012038483A5 publication Critical patent/JP2012038483A5/ja
Application granted granted Critical
Publication of JP5304749B2 publication Critical patent/JP5304749B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010175904A 2010-08-05 2010-08-05 真空分析装置 Active JP5304749B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010175904A JP5304749B2 (ja) 2010-08-05 2010-08-05 真空分析装置
PCT/JP2011/066299 WO2012017812A2 (ja) 2010-08-05 2011-07-19 真空分析装置
US13/813,875 US9214327B2 (en) 2010-08-05 2011-07-19 Vacuum analyzer utilizing resistance tubes to control the flow rate through a vacuum reaction chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010175904A JP5304749B2 (ja) 2010-08-05 2010-08-05 真空分析装置

Publications (3)

Publication Number Publication Date
JP2012038483A JP2012038483A (ja) 2012-02-23
JP2012038483A5 true JP2012038483A5 (enExample) 2013-01-10
JP5304749B2 JP5304749B2 (ja) 2013-10-02

Family

ID=45559887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010175904A Active JP5304749B2 (ja) 2010-08-05 2010-08-05 真空分析装置

Country Status (3)

Country Link
US (1) US9214327B2 (enExample)
JP (1) JP5304749B2 (enExample)
WO (1) WO2012017812A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102983054B (zh) * 2012-11-05 2015-09-02 聚光科技(杭州)股份有限公司 应用在质谱仪中的减压装置及方法
CN104781906B (zh) * 2012-12-20 2017-10-03 Dh科技发展私人贸易有限公司 解析ms3实验期间的事件
JP6180828B2 (ja) * 2013-07-05 2017-08-16 株式会社日立ハイテクノロジーズ 質量分析装置及び質量分析装置の制御方法
GB2540365B (en) * 2015-07-14 2019-12-11 Thermo Fisher Scient Bremen Gmbh Control of gas flow
GB2557670B (en) * 2016-12-15 2020-04-15 Thermo Fisher Scient Bremen Gmbh Improved gas flow control

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000019165A (ja) * 1998-06-30 2000-01-21 Shimadzu Corp ガスクロマトグラフ装置
JP3876554B2 (ja) * 1998-11-25 2007-01-31 株式会社日立製作所 化学物質のモニタ方法及びモニタ装置並びにそれを用いた燃焼炉
US6833028B1 (en) * 2001-02-09 2004-12-21 The Scatter Works Inc. Particle deposition system with enhanced speed and diameter accuracy
US20020189947A1 (en) * 2001-06-13 2002-12-19 Eksigent Technologies Llp Electroosmotic flow controller
MY134338A (en) * 2001-08-24 2007-12-31 Asml Us Inc Atmospheric pressure wafer processing reactor having an internal pressure control system and method
JP4162138B2 (ja) * 2003-10-27 2008-10-08 株式会社リガク 昇温脱離ガス分析装置
US20050108996A1 (en) * 2003-11-26 2005-05-26 Latham Steven R. Filter system for an electronic equipment enclosure
US7140847B2 (en) * 2004-08-11 2006-11-28 The Boc Group, Inc. Integrated high vacuum pumping system
JP2006266854A (ja) * 2005-03-23 2006-10-05 Shinku Jikkenshitsu:Kk 全圧測定電極付き四重極質量分析計及びこれを用いる真空装置
JP5003508B2 (ja) 2008-01-24 2012-08-15 株式会社島津製作所 質量分析システム
JP5226438B2 (ja) * 2008-09-10 2013-07-03 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理方法

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