JP2008193581A - 圧電振動子及びその製造方法 - Google Patents

圧電振動子及びその製造方法 Download PDF

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Publication number
JP2008193581A
JP2008193581A JP2007028045A JP2007028045A JP2008193581A JP 2008193581 A JP2008193581 A JP 2008193581A JP 2007028045 A JP2007028045 A JP 2007028045A JP 2007028045 A JP2007028045 A JP 2007028045A JP 2008193581 A JP2008193581 A JP 2008193581A
Authority
JP
Japan
Prior art keywords
piezoelectric vibrator
region
lid
frame
frame wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007028045A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008193581A5 (enExample
Inventor
Kazuo Ishikawa
賀津雄 石川
Yukihiro Tonegawa
幸弘 利根川
Akitoshi Hara
明稔 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2007028045A priority Critical patent/JP2008193581A/ja
Publication of JP2008193581A publication Critical patent/JP2008193581A/ja
Publication of JP2008193581A5 publication Critical patent/JP2008193581A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2007028045A 2007-02-07 2007-02-07 圧電振動子及びその製造方法 Withdrawn JP2008193581A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007028045A JP2008193581A (ja) 2007-02-07 2007-02-07 圧電振動子及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007028045A JP2008193581A (ja) 2007-02-07 2007-02-07 圧電振動子及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008193581A true JP2008193581A (ja) 2008-08-21
JP2008193581A5 JP2008193581A5 (enExample) 2010-03-18

Family

ID=39753212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007028045A Withdrawn JP2008193581A (ja) 2007-02-07 2007-02-07 圧電振動子及びその製造方法

Country Status (1)

Country Link
JP (1) JP2008193581A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101234482B1 (ko) 2009-12-09 2013-02-18 세이코 엡슨 가부시키가이샤 압전 디바이스
ITTO20110876A1 (it) * 2011-09-30 2013-03-31 Stmicroelectronics Malta Ltd Metodo di saldatura di un cappuccio ad uno strato di supporto
JP2019047309A (ja) * 2017-09-01 2019-03-22 株式会社村田製作所 圧電振動子

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151614A (ja) * 2000-11-10 2002-05-24 Kyocera Corp 半導体素子収納用パッケージ
JP2002164455A (ja) * 2000-11-24 2002-06-07 Kyocera Corp 半導体素子収納用パッケージ
JP2005130093A (ja) * 2003-10-22 2005-05-19 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイス用蓋体および圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005151336A (ja) * 2003-11-18 2005-06-09 Seiko Epson Corp 圧電デバイスおよび蓋体の製造方法ならびに圧電デバイスと圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005302990A (ja) * 2004-04-12 2005-10-27 Miyota Kk パッケージ用ロー材付き封着板およびその製造方法
JP2006114601A (ja) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd 蓋体と電子部品用パッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151614A (ja) * 2000-11-10 2002-05-24 Kyocera Corp 半導体素子収納用パッケージ
JP2002164455A (ja) * 2000-11-24 2002-06-07 Kyocera Corp 半導体素子収納用パッケージ
JP2005130093A (ja) * 2003-10-22 2005-05-19 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイス用蓋体および圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005151336A (ja) * 2003-11-18 2005-06-09 Seiko Epson Corp 圧電デバイスおよび蓋体の製造方法ならびに圧電デバイスと圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005302990A (ja) * 2004-04-12 2005-10-27 Miyota Kk パッケージ用ロー材付き封着板およびその製造方法
JP2006114601A (ja) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd 蓋体と電子部品用パッケージ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101234482B1 (ko) 2009-12-09 2013-02-18 세이코 엡슨 가부시키가이샤 압전 디바이스
ITTO20110876A1 (it) * 2011-09-30 2013-03-31 Stmicroelectronics Malta Ltd Metodo di saldatura di un cappuccio ad uno strato di supporto
US9390988B2 (en) 2011-09-30 2016-07-12 Stmicroelectronics (Malta) Ltd Method for soldering a cap to a support layer
JP2019047309A (ja) * 2017-09-01 2019-03-22 株式会社村田製作所 圧電振動子
US11152912B2 (en) 2017-09-01 2021-10-19 Murata Manufacturing Co., Ltd. Piezoelectric resonator unit

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