JP2008193118A - 真空処理装置及び真空処理方法 - Google Patents

真空処理装置及び真空処理方法 Download PDF

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Publication number
JP2008193118A
JP2008193118A JP2008111347A JP2008111347A JP2008193118A JP 2008193118 A JP2008193118 A JP 2008193118A JP 2008111347 A JP2008111347 A JP 2008111347A JP 2008111347 A JP2008111347 A JP 2008111347A JP 2008193118 A JP2008193118 A JP 2008193118A
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JP
Japan
Prior art keywords
cassette
processing
vacuum
wafer
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008111347A
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English (en)
Japanese (ja)
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JP2008193118A5 (enExample
Inventor
Koji Nishihata
廣治 西畑
Kazuhiro Shiroo
和博 城尾
Shiyouji Ikuhara
祥二 幾原
Tetsuya Tawara
哲也 田原
Masashi Okiguchi
昌司 沖口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi Ltd
Hitachi High Tech Corp
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Application filed by Hitachi High Technologies Corp, Hitachi Ltd, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008111347A priority Critical patent/JP2008193118A/ja
Publication of JP2008193118A publication Critical patent/JP2008193118A/ja
Publication of JP2008193118A5 publication Critical patent/JP2008193118A5/ja
Withdrawn legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008111347A 2008-04-22 2008-04-22 真空処理装置及び真空処理方法 Withdrawn JP2008193118A (ja)

Priority Applications (1)

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JP2008111347A JP2008193118A (ja) 2008-04-22 2008-04-22 真空処理装置及び真空処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008111347A JP2008193118A (ja) 2008-04-22 2008-04-22 真空処理装置及び真空処理方法

Related Parent Applications (1)

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JP2008011462A Division JP4252103B2 (ja) 2008-01-22 2008-01-22 真空処理方法及び真空処理装置

Related Child Applications (1)

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JP2009104066A Division JP5107961B2 (ja) 2009-04-22 2009-04-22 真空処理装置及び真空処理方法

Publications (2)

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JP2008193118A true JP2008193118A (ja) 2008-08-21
JP2008193118A5 JP2008193118A5 (enExample) 2009-05-07

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ID=39752839

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JP2008111347A Withdrawn JP2008193118A (ja) 2008-04-22 2008-04-22 真空処理装置及び真空処理方法

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JP (1) JP2008193118A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015138856A (ja) * 2014-01-22 2015-07-30 株式会社ディスコ 切削装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015138856A (ja) * 2014-01-22 2015-07-30 株式会社ディスコ 切削装置

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