JP2008163324A5 - - Google Patents

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Publication number
JP2008163324A5
JP2008163324A5 JP2007316705A JP2007316705A JP2008163324A5 JP 2008163324 A5 JP2008163324 A5 JP 2008163324A5 JP 2007316705 A JP2007316705 A JP 2007316705A JP 2007316705 A JP2007316705 A JP 2007316705A JP 2008163324 A5 JP2008163324 A5 JP 2008163324A5
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JP
Japan
Prior art keywords
resin composition
composition according
inorganic filler
resin
average particle
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Application number
JP2007316705A
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English (en)
Japanese (ja)
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JP5256716B2 (ja
JP2008163324A (ja
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Priority to JP2007316705A priority Critical patent/JP5256716B2/ja
Priority claimed from JP2007316705A external-priority patent/JP5256716B2/ja
Publication of JP2008163324A publication Critical patent/JP2008163324A/ja
Publication of JP2008163324A5 publication Critical patent/JP2008163324A5/ja
Application granted granted Critical
Publication of JP5256716B2 publication Critical patent/JP5256716B2/ja
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JP2007316705A 2006-12-08 2007-12-07 樹脂組成物およびそれから得られる成形品 Active JP5256716B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007316705A JP5256716B2 (ja) 2006-12-08 2007-12-07 樹脂組成物およびそれから得られる成形品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006332225 2006-12-08
JP2006332225 2006-12-08
JP2007316705A JP5256716B2 (ja) 2006-12-08 2007-12-07 樹脂組成物およびそれから得られる成形品

Publications (3)

Publication Number Publication Date
JP2008163324A JP2008163324A (ja) 2008-07-17
JP2008163324A5 true JP2008163324A5 (pt) 2010-05-20
JP5256716B2 JP5256716B2 (ja) 2013-08-07

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Family Applications (1)

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JP2007316705A Active JP5256716B2 (ja) 2006-12-08 2007-12-07 樹脂組成物およびそれから得られる成形品

Country Status (1)

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JP (1) JP5256716B2 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098384B2 (ja) * 2007-03-16 2012-12-12 東レ株式会社 フィラー高充填樹脂組成物、錠剤の製造方法およびそれからなる成形品
JP5098385B2 (ja) * 2007-03-16 2012-12-12 東レ株式会社 高誘電性樹脂組成物、錠剤の製造方法およびそれからなる成形品
JP2010084129A (ja) * 2008-09-04 2010-04-15 Sumitomo Chemical Co Ltd 液晶ポリエステル樹脂混合物及びそれを用いてなる反射板並びに発光装置
KR101232270B1 (ko) 2009-12-29 2013-02-12 제일모직주식회사 반사성이 우수한 액정 폴리에스테르 수지 조성물
KR101280100B1 (ko) * 2010-04-23 2013-06-28 폴리플라스틱스 가부시키가이샤 폴리아릴렌 설파이드 수지 조성물
JP5655547B2 (ja) * 2010-12-21 2015-01-21 東ソー株式会社 ポリアリーレンスルフィド樹脂組成物およびそれよりなる二次電池封口板用シール部材
JP2012180497A (ja) * 2011-02-08 2012-09-20 Kaneka Corp 高熱伝導性熱可塑性樹脂組成物
JP5900836B2 (ja) * 2011-12-07 2016-04-06 ダイキン工業株式会社 ローターの製造方法
MX2016005946A (es) * 2013-11-07 2016-07-13 Merck Patent Gmbh Pigmento electricamente conductor.
JP2015129257A (ja) * 2013-12-04 2015-07-16 日東電工株式会社 光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
JP6531414B2 (ja) * 2015-02-10 2019-06-19 東レ株式会社 ポリアミド樹脂組成物およびそれを成形してなる成形品
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596250A (ja) * 1982-07-02 1984-01-13 Mitsubishi Rayon Co Ltd 表面平滑性に優れた樹脂組成物
JP4067317B2 (ja) * 2002-02-27 2008-03-26 大阪瓦斯株式会社 導電性組成物およびその成形体
JP4631272B2 (ja) * 2003-11-14 2011-02-16 東レ株式会社 フィラー高充填樹脂組成物およびそれから得られる成形品
CN101410459B (zh) * 2006-03-30 2013-03-27 旭化成化学株式会社 树脂组合物及其成型品

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