JP2008160163A5 - - Google Patents
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- Publication number
- JP2008160163A5 JP2008160163A5 JP2008075930A JP2008075930A JP2008160163A5 JP 2008160163 A5 JP2008160163 A5 JP 2008160163A5 JP 2008075930 A JP2008075930 A JP 2008075930A JP 2008075930 A JP2008075930 A JP 2008075930A JP 2008160163 A5 JP2008160163 A5 JP 2008160163A5
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode
- sealing body
- resin sealing
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 9
- 238000007789 sealing Methods 0.000 claims 9
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008075930A JP4804497B2 (ja) | 2008-03-24 | 2008-03-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008075930A JP4804497B2 (ja) | 2008-03-24 | 2008-03-24 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003054638A Division JP4173751B2 (ja) | 2003-02-28 | 2003-02-28 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008160163A JP2008160163A (ja) | 2008-07-10 |
JP2008160163A5 true JP2008160163A5 (zh) | 2008-09-04 |
JP4804497B2 JP4804497B2 (ja) | 2011-11-02 |
Family
ID=39660648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008075930A Expired - Lifetime JP4804497B2 (ja) | 2008-03-24 | 2008-03-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4804497B2 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752358B (zh) * | 2008-12-08 | 2012-07-04 | 万国半导体有限公司 | 带有整合旁路电容器的紧密半导体封装及其方法 |
JP2010165923A (ja) * | 2009-01-16 | 2010-07-29 | Renesas Electronics Corp | 半導体装置、及びその製造方法 |
JP5921072B2 (ja) * | 2011-03-05 | 2016-05-24 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
JP2017050489A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 半導体パッケージおよび半導体パッケージの製造方法 |
JP6967335B2 (ja) * | 2016-03-15 | 2021-11-17 | ローム株式会社 | 半導体装置 |
JP6884723B2 (ja) * | 2018-03-23 | 2021-06-09 | 株式会社東芝 | 半導体装置 |
JP7150461B2 (ja) | 2018-04-24 | 2022-10-11 | ローム株式会社 | 半導体装置 |
JP7419781B2 (ja) * | 2019-12-10 | 2024-01-23 | 富士電機株式会社 | 半導体モジュール |
JP7337034B2 (ja) * | 2020-09-15 | 2023-09-01 | 三菱電機株式会社 | 半導体パッケージおよび半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6249041B1 (en) * | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
JP4260263B2 (ja) * | 1999-01-28 | 2009-04-30 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3650008B2 (ja) * | 2000-09-04 | 2005-05-18 | 三洋電機株式会社 | Mosfetを用いた保護回路装置およびその製造方法 |
JP3639515B2 (ja) * | 2000-09-04 | 2005-04-20 | 三洋電機株式会社 | Mosfetの実装構造の製造方法 |
-
2008
- 2008-03-24 JP JP2008075930A patent/JP4804497B2/ja not_active Expired - Lifetime
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