JP2008159608A - 半導体装置、半導体装置の製造方法および半導体装置の設計装置 - Google Patents
半導体装置、半導体装置の製造方法および半導体装置の設計装置 Download PDFInfo
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Abstract
【解決手段】各々論理回路が形成された複数の論理回路セルと、前記複数の論理回路セルにそれぞれ接続された複数の配線と、を有し、前記複数の配線のうち、少なくとも1つは、開口部が形成され、他方の配線と開口率を異なるように形成されたことを特徴とする半導体装置。
【選択図】図5
Description
図9(A)〜(D)は、配線Lに形成される、開口率調整のための開口部の形状を様々に変更した例を示したものである。
(付記1)
各々論理回路が形成された複数の論理回路セルと、
前記複数の論理回路セルにそれぞれ接続された複数の配線と、を有し、
前記複数の配線のうち、少なくとも1つは、開口部が形成され、他方の配線と開口率を異なるように形成されたことを特徴とする半導体装置。
(付記2)
前記複数の論理回路セルの各々は、クロック発生セルと、該クロック発生セルからクロック信号が分配される複数のクロック分配セルとを含み、前記配線は該クロック発生セルと該クロック分配セルとをそれぞれ接続するクロック分配線であることを特徴とする付記1記載の半導体装置。
(付記3)
前記開口率は、前記複数のクロック分配線の長さの違いに対応して異なるように構成されていることを特徴とする付記2記載の半導体装置。
(付記4)
前記複数のクロック分配線の長さを比較して、長さが短い前記クロック分配線の前記開口率が、長さが長い前記クロック分配線の前記開口率よりも大きくされていることを特徴とする付記3記載の半導体装置。
(付記5)
前記開口率は、前記複数のクロック分配線の高さの違いに対応して異なるように構成されていることを特徴とする付記2乃至4記載の半導体装置。
(付記6)
前記複数のクロック分配線の高さを比較して、高さが高い前記クロック分配線の前記開口率が、高さが低い前記クロック分配線の前記開口率よりも大きくされていることを特徴とする付記5記載の半導体装置。
(付記7)
前記開口部は、スリット形状であることを特徴とする付記1乃至6のいずれか1項記載の半導体装置。
(付記8)
前記スリット形状は、所定の領域の前記配線を複数に分割することを特徴とする付記7記載の半導体装置。
(付記9)
前記開口部は、ドット形状であることを特徴とする付記1乃至6のいずれか1項記載の半導体装置。
(付記10)
半導体素子に接続される配線が形成される溝部と、該溝部の底部から起立する構造体とを、絶縁膜のパターンエッチングにより形成するエッチング工程と、
前記溝部を導電材料で埋設して前記配線を形成する埋設工程と、を有することを特徴とする半導体装置の製造方法。
(付記11)
前記埋設工程は、前記溝部をメッキにより埋設するメッキ工程を含むことを特徴とする付記10記載の半導体装置の製造方法。
(付記12)
前記構造体は、前記配線の所定の領域を複数に分割するように形成されることを特徴とする付記10または11記載の半導体装置の製造方法。
(付記13)
前記配線は、クロック信号を分配するクロック分配線であることを特徴とする付記10乃至12のいずれか1項記載の半導体装置の製造方法。
(付記14)
半導体装置を構成する個々の論理回路セルの設計を行うセル合成手段と、該複数の論理回路セルの配置の設計を行うセル配置設計手段とを有する、論理設計手段と、
複数の前記論理回路セルを接続する配線を設計する配線設計手段と、
前記配線の長さに対応して、該配線に形成される開口部の開口率を選択する開口率選択手段と、を有することを特徴とする、半導体装置の設計装置。
(付記15)
前記半導体装置を構成する個々の論理回路セルは、クロック発生セルと該クロック発生セルからクロック信号が分配される複数のクロック分配セルとを含むことを特徴とする付記14記載の半導体装置の設計装置。
(付記16)
前記配線は、前記クロック発生セルと前記クロック分配セルとを接続するクロック分配線を含むことを特徴とする付記15記載の半導体装置の設計装置。
(付記17)
前記開口率選択手段は、複数の前記クロック分配線の長さを比較して、長さが短い前記クロック分配線の前記開口率が、長さが長い前記クロック分配線の前記開口率よりも大きくなるように前記開口率を選択することを特徴とする付記16記載の半導体装置の設計装置。
(付記18)
前記開口率選択手段は、前記開口率を前記クロック分配線の高さに対応して選択することを特徴とする付記16または17記載の半導体装置。
(付記19)
半導体装置を構成する個々の論理回路セルの合成と配置を行う論理設計工程と、
複数の前記論理回路セルを接続する配線を設計する配線設計工程と、
前記配線の長さに対応して前記配線に形成される開口部の開口率を選択する開口率選択工程と、を有することを特徴とする、半導体装置の設計方法。
(付記20)
前記開口率選択工程では、前記開口率を選択することによって、前記配線の抵抗率が選択されることを特徴とする付記19記載の半導体装置の設計方法。
101 基板
102 論理回路セル(クロック発生セル)
103,104,105 論理回路セル(クロック分配セル)
122,123,124,L,L1,L2,La,Lb 配線
H,H1,H2,H3,H4,h 開口部
301 基板
302 素子分離絶縁膜
303 MOSトランジスタ
303I ゲート絶縁膜
303G ゲート電極
303S ソース領域
303D ドレイン領域
304 層間絶縁膜
305A バリアメタル層
305B 導電プラグ
306 保護膜
310 層間絶縁膜
311 配線
311B バリアメタル膜
320 キャップ膜
321 層間絶縁膜
322 エッチングストッパ膜
323 層間絶縁膜
324 ビアプラグ
324H ビアホール
324B バリア膜
325 配線
325H 溝部
325B バリア膜
330 構造体
Claims (10)
- 各々論理回路が形成された複数の論理回路セルと、
前記複数の論理回路セルにそれぞれ接続された複数の配線と、を有し、
前記複数の配線のうち、少なくとも1つは、開口部が形成され、他方の配線と開口率を異なるように形成されたことを特徴とする半導体装置。 - 前記複数の論理回路セルの各々は、クロック発生セルと、該クロック発生セルからクロック信号が分配される複数のクロック分配セルとを含み、前記配線は該クロック発生セルと該クロック分配セルとをそれぞれ接続するクロック分配線であることを特徴とする請求項1記載の半導体装置。
- 前記開口率は、前記複数のクロック分配線の長さの違いに対応して異なるように構成されていることを特徴とする請求項2記載の半導体装置。
- 前記複数のクロック分配線の長さを比較して、長さが短い前記クロック分配線の前記開口率が、長さが長い前記クロック分配線の前記開口率よりも大きくされていることを特徴とする請求項3記載の半導体装置。
- 前記開口率は、前記複数のクロック分配線の高さの違いに対応して異なるように構成されていることを特徴とする請求項2乃至4記載の半導体装置。
- 前記開口部は、スリット形状であることを特徴とする請求項1乃至5のいずれか1項記載の半導体装置。
- 半導体素子に接続される配線が形成される溝部と、該溝部の底部から起立する構造体とを、絶縁膜のパターンエッチングにより形成するエッチング工程と、
前記溝部を導電材料で埋設して前記配線を形成する埋設工程と、を有することを特徴とする半導体装置の製造方法。 - 前記構造体は、前記配線の所定の領域を複数に分割するように形成されることを特徴とする請求項7記載の半導体装置の製造方法。
- 半導体装置を構成する個々の論理回路セルの設計を行うセル合成手段と、該複数の論理回路セルの配置の設計を行うセル配置設計手段とを有する、論理設計手段と、
前記複数の論理回路セルを接続する配線を設計する配線設計手段と、
前記配線の長さに対応して、該配線に形成される開口部の開口率を選択する開口率選択手段と、を有することを特徴とする、半導体装置の設計装置。 - 前記開口率選択手段は、複数の前記配線の長さを比較して、長さが短い前記配線の前記開口率が、長さが長い前記配線の前記開口率よりも大きくなるように前記開口率を選択することを特徴とする請求項9記載の半導体装置の設計装置。
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US11/957,706 US7670925B2 (en) | 2006-12-20 | 2007-12-17 | Semiconductor device, method of manufacturing same, and apparatus for designing same |
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Cited By (2)
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JP2014014079A (ja) * | 2009-01-16 | 2014-01-23 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP2018063435A (ja) * | 2008-11-28 | 2018-04-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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US10388568B2 (en) | 2011-06-28 | 2019-08-20 | Monolithic 3D Inc. | 3D semiconductor device and system |
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US11881443B2 (en) | 2012-04-09 | 2024-01-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11088050B2 (en) | 2012-04-09 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers |
US11410912B2 (en) | 2012-04-09 | 2022-08-09 | Monolithic 3D Inc. | 3D semiconductor device with vias and isolation layers |
US11476181B1 (en) | 2012-04-09 | 2022-10-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11735501B1 (en) | 2012-04-09 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11164811B2 (en) | 2012-04-09 | 2021-11-02 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers and oxide-to-oxide bonding |
US10600888B2 (en) | 2012-04-09 | 2020-03-24 | Monolithic 3D Inc. | 3D semiconductor device |
US11594473B2 (en) | 2012-04-09 | 2023-02-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US9871012B2 (en) * | 2012-08-31 | 2018-01-16 | Qualcomm Incorporated | Method and apparatus for routing die signals using external interconnects |
US11309292B2 (en) | 2012-12-22 | 2022-04-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11784169B2 (en) | 2012-12-22 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11217565B2 (en) | 2012-12-22 | 2022-01-04 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11961827B1 (en) | 2012-12-22 | 2024-04-16 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11018116B2 (en) | 2012-12-22 | 2021-05-25 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
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US11063024B1 (en) | 2012-12-22 | 2021-07-13 | Monlithic 3D Inc. | Method to form a 3D semiconductor device and structure |
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US11487928B2 (en) | 2013-04-15 | 2022-11-01 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US9021414B1 (en) | 2013-04-15 | 2015-04-28 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
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US11011507B1 (en) | 2015-04-19 | 2021-05-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
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US10381328B2 (en) | 2015-04-19 | 2019-08-13 | Monolithic 3D Inc. | Semiconductor device and structure |
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US10522225B1 (en) | 2015-10-02 | 2019-12-31 | Monolithic 3D Inc. | Semiconductor device with non-volatile memory |
US10847540B2 (en) | 2015-10-24 | 2020-11-24 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11296115B1 (en) | 2015-10-24 | 2022-04-05 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11114464B2 (en) | 2015-10-24 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
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US11937422B2 (en) | 2015-11-07 | 2024-03-19 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11114427B2 (en) | 2015-11-07 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor processor and memory device and structure |
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US11812620B2 (en) | 2016-10-10 | 2023-11-07 | Monolithic 3D Inc. | 3D DRAM memory devices and structures with control circuits |
US11930648B1 (en) | 2016-10-10 | 2024-03-12 | Monolithic 3D Inc. | 3D memory devices and structures with metal layers |
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US11296106B2 (en) | 2019-04-08 | 2022-04-05 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11018156B2 (en) | 2019-04-08 | 2021-05-25 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US10892016B1 (en) | 2019-04-08 | 2021-01-12 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
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US11158652B1 (en) | 2019-04-08 | 2021-10-26 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609153A (ja) * | 1983-06-29 | 1985-01-18 | Hitachi Ltd | 半導体集積回路内抵抗体の抵抗値調整方法 |
JPH04221830A (ja) * | 1990-12-25 | 1992-08-12 | Mitsubishi Electric Corp | 信号分配用配線 |
JP2001217248A (ja) * | 2000-02-04 | 2001-08-10 | Nec Corp | 半導体装置の配線形成方法 |
JP2007180110A (ja) * | 2005-12-27 | 2007-07-12 | Nec Corp | 半導体装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1105411A (en) | 1964-09-07 | 1968-03-06 | Standard Telephones Cables Ltd | Improvements in or relating to apparatus for working conductive materials by electric spark discharges |
JPH04326411A (ja) | 1991-04-26 | 1992-11-16 | Oki Electric Ind Co Ltd | クロック分配回路 |
US5292689A (en) * | 1992-09-04 | 1994-03-08 | International Business Machines Corporation | Method for planarizing semiconductor structure using subminimum features |
GB9312674D0 (en) * | 1993-06-18 | 1993-08-04 | Pilkington Micro Electronics | Configurabel logic array |
US5593918A (en) * | 1994-04-22 | 1997-01-14 | Lsi Logic Corporation | Techniques for forming superconductive lines |
JPH08272480A (ja) | 1995-03-28 | 1996-10-18 | Matsushita Electric Ind Co Ltd | 遅延調整手段付き半導体集積回路とその遅延調整方式 |
US6335640B1 (en) * | 1997-03-11 | 2002-01-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device with its layout designed by the cell base method |
US7388289B1 (en) * | 1999-09-02 | 2008-06-17 | Micron Technology, Inc. | Local multilayered metallization |
US6794694B2 (en) * | 2000-12-21 | 2004-09-21 | Agere Systems Inc. | Inter-wiring-layer capacitors |
US6732335B2 (en) * | 2002-04-23 | 2004-05-04 | Oki Electric Industry Co., Ltd. | Semiconductor IC with an inside capacitor for a power supply circuit and a method of automatically designing the same |
US6958513B2 (en) * | 2003-06-06 | 2005-10-25 | Chih-Hsin Wang | Floating-gate memory cell having trench structure with ballistic-charge injector, and the array of memory cells |
US7187036B2 (en) * | 2004-03-31 | 2007-03-06 | Taiwan Semiconductor Manufacturing Company | Connection structure for SOI devices |
US7081406B2 (en) * | 2004-08-10 | 2006-07-25 | Lsi Logic Corporation | Interconnect dielectric tuning |
JP4535845B2 (ja) * | 2004-10-29 | 2010-09-01 | 富士通セミコンダクター株式会社 | 半導体装置 |
US7767570B2 (en) * | 2006-03-22 | 2010-08-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy vias for damascene process |
US7638843B2 (en) * | 2006-05-05 | 2009-12-29 | Texas Instruments Incorporated | Integrating high performance and low power multi-gate devices |
US7564709B2 (en) * | 2006-12-13 | 2009-07-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for utilizing DRAM components in a system-on-chip |
-
2006
- 2006-12-20 JP JP2006343094A patent/JP2008159608A/ja active Pending
-
2007
- 2007-12-17 US US11/957,706 patent/US7670925B2/en not_active Expired - Fee Related
-
2010
- 2010-01-22 US US12/691,866 patent/US8319277B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609153A (ja) * | 1983-06-29 | 1985-01-18 | Hitachi Ltd | 半導体集積回路内抵抗体の抵抗値調整方法 |
JPH04221830A (ja) * | 1990-12-25 | 1992-08-12 | Mitsubishi Electric Corp | 信号分配用配線 |
JP2001217248A (ja) * | 2000-02-04 | 2001-08-10 | Nec Corp | 半導体装置の配線形成方法 |
JP2007180110A (ja) * | 2005-12-27 | 2007-07-12 | Nec Corp | 半導体装置 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11250785B2 (en) | 2008-11-28 | 2022-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
US10971075B2 (en) | 2008-11-28 | 2021-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
US10304873B2 (en) | 2008-11-28 | 2019-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
US10629134B2 (en) | 2008-11-28 | 2020-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
JP2018063435A (ja) * | 2008-11-28 | 2018-04-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US11527208B2 (en) | 2008-11-28 | 2022-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
US11776483B2 (en) | 2008-11-28 | 2023-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
JP2019159337A (ja) * | 2008-11-28 | 2019-09-19 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP2017083881A (ja) * | 2009-01-16 | 2017-05-18 | 株式会社半導体エネルギー研究所 | 表示装置 |
KR101649859B1 (ko) | 2009-01-16 | 2016-08-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
KR101563918B1 (ko) * | 2009-01-16 | 2015-10-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR20150013100A (ko) * | 2009-01-16 | 2015-02-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
US10741138B2 (en) | 2009-01-16 | 2020-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
US8736539B2 (en) | 2009-01-16 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
US11151953B2 (en) | 2009-01-16 | 2021-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
JP2014014079A (ja) * | 2009-01-16 | 2014-01-23 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US11468857B2 (en) | 2009-01-16 | 2022-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
US10332610B2 (en) | 2009-01-16 | 2019-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
US11735133B2 (en) | 2009-01-16 | 2023-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
JP2014112230A (ja) * | 2009-01-16 | 2014-06-19 | Semiconductor Energy Lab Co Ltd | 表示装置及び電子機器 |
Also Published As
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US7670925B2 (en) | 2010-03-02 |
US20100123480A1 (en) | 2010-05-20 |
US20080150586A1 (en) | 2008-06-26 |
US8319277B2 (en) | 2012-11-27 |
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