JP2008135696A - Electronic component housing package, electronic apparatus, and optical semiconductor apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component housing package and an electronic apparatus capable of being small integrated and having high reliability of electrical connection between an electronic component and an exterior. <P>SOLUTION: An electronic component housing package has a flat metallic base 1 in which a penetration opening 1a penetrating between upper and lower main surfaces is formed, and a wiring substrate 5 which is jointed with the upper main surface of the base 1 so as to cover the penetration opening 1a and which has a plurality of second electrode pads 7a provided in a lower surface with connecting with a plurality of first electrode pads 6a provided on an upper surface. The wiring substrate 5 has a convex part 5b in an outer periphery of the lower surface joined to the base 1, and a conductor 7b for junction with the base 1 is formed in a lower surface of the convex part 5b. This leads to that the wiring substrate 5 can be miniaturized, and reliability of electrical connection between an electronic component 2 and an exterior becomes high. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component storage package for storing an electronic component such as a high-frequency semiconductor element or an optical semiconductor element, and an electronic device or an optical semiconductor device using the same.

  FIG. 6 shows an example of an optical semiconductor device in which electronic parts composed of optical semiconductor elements such as an optical semiconductor laser (LD) and a photodiode (PD) operating at a high frequency are hermetically sealed in a field such as conventional optical communication. Is shown in cross-sectional view. In the figure, 101 is a base, 102 is an electronic component, 103 is a metal lid, 104 is a translucent member, 105 is a wiring board, and 112 is an optical fiber. A storage package is basically constructed. In addition, an electronic component 102 is mounted on the electronic component storage package, and the lid 103 is joined to form an optical semiconductor device.

  This optical semiconductor device has a plate-like metal base 101 and a cylindrical shape in which a through hole 103b is formed at the center of the upper end surface 103a and the lower end 103c is opened. A metal lid 103 having a lower end 103c bonded to the outer periphery, a translucent member 104 bonded around the opening of the through hole 103b, and the upper and lower main surfaces of the base body 101 are formed so as to penetrate. A wiring board 105 joined to the upper main surface of the base 101 so as to cover the through hole 101 a and an electronic component 102 placed on the upper surface of the wiring board 105 are provided.

The wiring substrate 105 includes a plurality of first electrode pads 106a disposed on the upper surface of the insulating substrate formed by laminating a plurality of insulating layers, and a first electrode pad 106a disposed on the lower surface of the insulating substrate. A plurality of second electrode pads 107a are electrically connected through the conductor. The bonding conductor 107b and the base body 101 provided on the outer periphery of the lower surface of the wiring board 105 are brazed around the opening of the through hole 103 with a brazing material using silver (Ag) brazing or the like. Further, an external connection terminal member 110 is joined to each of the plurality of second electrode pads 107a by a brazing material such as Ag brazing (see, for example, Patent Document 1).
JP 2004-221095 A

  In recent years, the conventional electronic component storage package and the optical semiconductor device tend to be miniaturized and integrated, and accordingly, the wiring board 105 also tends to have a small area. However, if the outer shape of the wiring board 105 is reduced while maintaining the size of the plurality of second electrode pads 107a to make the wiring board 105 have a small area, the second electrode pads 107a and the bonding conductor 107b are used. And a brazing material for joining the external connection terminal member 110 to the second electrode pad 107a and a brazing material for joining the joining conductor 107b of the wiring board 105 to the base 101. In some cases, the second electrode pad 107a and the bonding conductor 107b are electrically short-circuited when they are brazed.

  Accordingly, the present invention has been completed in view of the above-described problems, and the object thereof is an electronic component storage package and an electronic device that can be miniaturized and have high reliability in electrical connection between the electronic component and the outside. The object is to provide an optical semiconductor device.

  The electronic component storing package of the present invention is joined to a flat metal base having a through hole formed between upper and lower main surfaces, and a lower main surface of the base so as to cover the through hole, An electronic component storage package comprising: a wiring substrate having a plurality of second electrode pads connected to a plurality of first electrode pads disposed on an upper surface and disposed on another surface; The wiring board has a convex portion on the outer periphery of the upper surface joined to the base, and a conductor for joining to the base is formed on an upper surface of the convex portion.

  The electronic component storage package according to the present invention is joined to a flat metal base having a through hole formed between upper and lower main surfaces and an upper main surface of the base so as to cover the through hole. An electronic component storage package comprising: a wiring substrate having a plurality of second electrode pads connected to the plurality of first electrode pads disposed on the upper surface and disposed on the lower surface; The wiring board has a convex portion on an outer peripheral portion of a lower surface joined to the base, and a conductor for joining with the base is formed on a lower surface of the convex portion.

  The electronic component storage package according to the present invention is preferably characterized in that a high frequency signal is connected to at least one of the second electrode pads.

  The electronic component storage package of the present invention is preferably characterized in that an external connection terminal member made of a wire is joined to the second electrode pad.

  The electronic component storage package according to the present invention is preferably characterized in that external connection terminal members made of metal balls or solder bumps are joined to the second electrode pads, respectively.

  The electronic component storage package of the present invention is preferably provided on at least one of the surfaces of the wiring board between the adjacent first electrode pads and between the adjacent second electrode pads. A groove is provided so as to cross between the first electrode pads or between the second electrode pads.

  An electronic device according to the present invention has an electronic component storage package according to the present invention, an electronic component placed on the upper surface of the wiring board, and a cylindrical shape in which an upper end surface is closed and a lower end is opened. And a lid body having the lower end joined to the outer peripheral portion of the upper main surface of the base body.

  An optical semiconductor device according to the present invention includes the electronic component storage package according to the present invention, and a cylindrical shape having a through hole formed in the upper end surface and an open lower end, and an outer periphery of the upper main surface of the base body. A metal lid having the lower end joined to a part, a translucent member joined around the opening of the through-hole, and the wiring board with a light-receiving part or a light-emitting part facing the translucent member And an optical semiconductor element mounted on the upper surface of the substrate.

  The electronic component storage package according to the present invention is joined to a flat metal base having a through hole formed between the upper and lower main surfaces, and a lower main surface of the base so as to cover the through hole, A wiring board having a plurality of second electrode pads connected to the plurality of first electrode pads and disposed on the other surface, the wiring board having an upper surface outer periphery bonded to the base body The first electrode pad and the bonding conductor formed on the upper surface of the convex portion are arranged on the same plane because the convex portion is formed on the convex portion and the bonding conductor is formed on the upper surface of the convex portion. It will not be done. As a result, even if the electronic component storage package is miniaturized and the wiring board is miniaturized, the insulating distance between the first electrode pad and the bonding conductor can be secured by the convex portion, and the bonding conductor is bonded to the base. Therefore, it is possible to prevent the brazing material to be in contact with the first electrode pad and electrically short-circuit the first electrode pad and the bonding conductor.

  The electronic component storage package of the present invention is joined to a flat metal base having a through hole penetrating between the upper and lower main surfaces, and an upper main surface of the base so as to cover the through hole. And a wiring board having a plurality of second electrode pads connected to the plurality of first electrode pads disposed on the lower surface and having a plurality of second electrode pads disposed on the lower surface. The second electrode pad and the bonding conductor formed on the lower surface of the convex portion are arranged on the same plane. There is nothing to do. As a result, even if the electronic component storage package is miniaturized and the wiring board is miniaturized, the insulating distance between the second electrode pad and the bonding conductor can be secured by the convex portion, and the second electrode pad can be externally connected. The brazing material for joining the connection terminal member and the brazing material for joining the joining conductor to the base are in contact with each other, and the second electrode pad and the joining conductor are electrically short-circuited. This can prevent the electric signal from being transmitted to the second electrode pad.

  In the electronic component storage package of the present invention, it is preferable that a connection distance between the second electrode pad and the external electric circuit board is convex when a high frequency signal is connected to at least one of the second electrode pads. The inductive component (inductance) becomes larger by providing the portion, and the second electrode pad and the external connection terminal member and the ground conductor (for example, the junction) between the second electrode pad and the external connection terminal member are increased. It acts to counteract the increase in capacitance component that occurs between it and the conductor. As a result, the impedance value mismatch between the second electrode pad and the external electric circuit board can be mitigated, and transmission loss such as reflection loss occurs in the high-frequency signal transmitted through the external connection terminal member. Can be prevented. Therefore, it is possible to provide an electronic component storage package that can operate the electronic component normally and stably even for a high-frequency signal.

  In the electronic component storage package according to the present invention, preferably, since the external connection terminal member made of a wire is joined to the second electrode pad, the second electrode pad and the external electric circuit are connected to the external connection terminal. The electronic components that are connected by the members and accommodated in the electronic component storage package can be operated.

  In the electronic component storage package according to the present invention, preferably, since the external connection terminal member made of a metal ball or a solder bump is joined to the second electrode pad, the second electrode pad and the external electric circuit. Are connected by the external connection terminal member, and the electronic component housed in the electronic component housing package can be operated. Further, since the external connection terminal member is made of a metal ball or a solder bump, it is easy to connect the electronic component storage package and the external electric circuit with a short connection length. Since the connection length is short, the loss of electrical signals can be reduced.

  The electronic component storage package according to the present invention is preferably configured such that the first electrode pad is provided on at least one of the surfaces of the wiring board between the adjacent first electrode pads and between the adjacent second electrode pads. Since the groove is provided so as to cross between each other or between the second electrode pads, the capacitance component generated between the first electrode pads or between the second electrode pads can be reduced. it can. As a result, a decrease in the impedance value of the electric signal transmitted through the first electrode pad or the second electrode pad can be suppressed, and the electric signal can be transmitted efficiently.

  The electronic device of the present invention has the electronic component storage package of the present invention, an electronic component placed on the upper surface of the wiring board, and a cylindrical shape in which the upper end surface is closed and the lower end is opened, By including a lid whose lower end is joined to the outer peripheral portion of the upper main surface of the substrate, the electronic component storage package of the present invention can be miniaturized and the operation reliability of the electronic component can be achieved. It becomes a thing with high property.

  An optical semiconductor device according to the present invention includes the electronic component storage package according to the present invention, and a cylindrical shape having a through hole formed in the upper end surface and an open lower end, and an outer periphery of the upper main surface of the base body. A metal lid having the lower end joined to the part, a translucent member joined around the opening of the through hole, and an upper surface of the wiring board with the light receiving part or the light emitting part facing the translucent member And the optical semiconductor element mounted on the optical semiconductor element can be miniaturized using the optical semiconductor element storage package of the present invention, and the optical semiconductor element has high operational reliability. .

  The electronic component storage package and the electronic device and optical semiconductor device using the electronic component storage package of the present invention are exemplified by an electronic component storage package and an optical semiconductor device in which optical semiconductor elements such as LD and PD are hermetically sealed. This will be described in detail below.

  1A is a cross-sectional view seen from the front showing an example of an embodiment of an electronic component storage package and an optical semiconductor device according to the present invention, and FIG. 1B is an electronic component storage package of FIG. 2A is a cross-sectional view seen from the front showing another example of the electronic component storage package and the optical semiconductor device according to the present invention, and FIG. FIG. 3 is a bottom view of the electronic component storage package of FIG. FIGS. 3A and 3B are a cross-sectional view and a bottom view, respectively, seen from the front showing still another example of the electronic component storage package and the optical semiconductor device according to the present invention. 4 (a) and 4 (b) are viewed from the front showing other examples of embodiments of the electronic component storage package and the optical semiconductor device of FIGS. 1 (a) and 2 (a), respectively. It is sectional drawing. FIG. 5A and FIG. 5B are bottom views showing other examples of the wiring board of the electronic component storage package of the present invention. FIG. 5C is a top view showing another example of the wiring board of the electronic component storage package of the present invention. In FIG. 1B, FIG. 2B, FIG. 3B, FIG. 5A, FIG. 5B, and FIG. 5C, the portion where the conductor layer is formed is cross-hatched. Is shown. Therefore, these cross hatching does not show a cross section.

  In these drawings, 1 is a base, 2 is an electronic component (optical semiconductor element), 4 is a translucent member, 5 is a wiring board, 12 is an optical fiber, and 3 is a metal lid. The base 1 and the wiring board 5 basically constitute an electronic component storage package. The electronic component 2 made of an optical semiconductor element is mounted on the electronic component storage package, and the lid 3 is joined to the optical semiconductor device. Become.

  The electronic component storing package of the present invention is joined to a flat metal base 1 having a through hole 1a penetrating between upper and lower main surfaces, and a lower main surface of the base 1 covering the through hole 1a. The plurality of first electrode pads 6a disposed on the upper surface of the insulating substrate formed by laminating a plurality of insulating layers and the inner conductor 8 disposed on the lower surface or side surface of the insulating substrate and disposed on the first electrode pad 6a, respectively. And a wiring board 5 having a plurality of second electrode pads 7a electrically connected to each other through the wiring board 5. The wiring board 5 has a convex part 5b protruding upward on the outer peripheral part of the upper surface joined to the base body 1. And a conductor 7b for bonding to the base body 1 is formed on the upper surface of the convex portion 5b. And the 1st electrode pad 6a is arrange | positioned at the bottom face of the recessed part 5a enclosed by the convex part 5b.

  In addition, as shown in FIG. 2, the electronic component storage package of the present invention has a flat metal base 1 in which a through hole 1a passing through the upper and lower main surfaces is formed, and a base covering the through hole 1a. A plurality of first electrode pads 6a disposed on an upper surface of an insulating substrate formed by laminating a plurality of insulating layers, and a first electrode pad disposed on a lower surface of the insulating substrate. 6a, and a wiring board 5 having a plurality of second electrode pads 7a electrically connected to each other through an internal conductor 8. And a conductor 7b for bonding to the base 1 is formed on the lower surface of the protrusion 5b.

  An external connection terminal member 10 made of a wire material or an external connection terminal member 10 made of a metal ball is joined to each of the second electrode pads 7a. In order to join the external connection terminal member 10, the second electrode pad 7a is usually formed with a larger area than the first electrode pad 6a.

  In the optical semiconductor device of the present invention in which the electronic component 2 made of an optical semiconductor element is mounted on the electronic component storage package shown in FIGS. 1 to 4, the through hole 3 b is formed at the center of the upper end surface 3 a of the lid 3. Is formed, and the translucent member 4 is joined around the opening of the through hole 3b. By providing the translucent member 4, an optical signal can be input to and output from the electronic component 2 through the translucent member 4. Then, the light receiving portion or the light emitting portion of the electronic component 2 is opposed to the translucent member 4, the electronic component 2 is placed on the upper surface of the wiring substrate 5, and a cylindrical shape is formed on the outer peripheral portion of the upper main surface of the substrate 1. By joining the open lower end 3c of the lid 3, the optical semiconductor device shown in FIGS.

  On the other hand, an electronic device according to the present invention is equipped with an electronic component excluding an optical semiconductor element having a signal conversion function between an optical signal and an electric signal, for example, an electronic component composed of a semiconductor element for high frequency amplification. It does not have the translucent member 4 and the optical fiber 12 that conduct the optical signal inside and outside. Therefore, the lid 3 has a closed upper end surface 3a in which the through hole 3b is not formed at the center of the upper end surface 3a, has a cylindrical shape with the lower end 3c being opened, and the lower end 3c is the base 1 Joined to the outer periphery of the upper main surface. Other parts are common to the optical semiconductor device of the present invention. Hereinafter, an optical semiconductor device will be described as an example.

  Hereinafter, embodiments of the electronic component storage package and the optical semiconductor device shown in FIGS. 1 to 4 will be described. In the example of the following embodiment, a case will be described in which the inner conductor 8 is composed of a through conductor 8a that interconnects the inner conductor layers 8b and an inner conductor layer 8b formed as an inner wiring of the wiring board 5. The inner conductor 8 may consist of only the through conductor 8a. In this case, the wiring conductor 5 may be a single-layer wiring board 5. The inner conductor layer 8b is used to reliably connect the through conductors 8a in the upper and lower ceramic green sheets and to route wiring to the inner layer.

  The base 1 in the electronic component storage package and the optical semiconductor device of the present invention has a flat plate shape such as a disk shape, a rectangular shape, a polygonal shape, etc. in plan view, and iron (Fe) -nickel (Ni) -cobalt (Co ) It is made of a metal such as an alloy, Fe-Ni alloy, copper (Cu) -tungsten (W) alloy, etc., and is manufactured into a predetermined shape by subjecting the ingot to a conventionally known metal processing method such as rolling or punching. . The base body 1 is provided with a through hole 1a having a circular shape, a polygonal shape or the like that penetrates between the upper and lower main surfaces of the base body 1. The wiring board 5 is airtightly joined to the through hole 1a by a brazing material such as silver (Ag) brazing around the through hole 1a of the base 1 so as to cover the through hole 1a. In order to join the base body 1 with a brazing material, a bonding conductor 7b is formed on the upper surface or the lower surface of the convex portion 5b of the upper surface outer peripheral portion or the lower surface outer peripheral portion of the wiring board 5.

The wiring substrate 5 is made of a dielectric such as an alumina (Al ₂ O ₃ : aluminum oxide) sintered body, an aluminum nitride (AlN) sintered body, a mullite (3Al ₂ O ₃ · 2SiO ₂ ) sintered body, It is produced as follows. For example, in the case of comprising Al ₂ O ₃ ceramics, first, organic binders, plasticizers and solvents suitable for raw material powders such as Al ₂ O ₃ , silicon oxide (SiO ₂ ), magnesium oxide (MgO) and calcium oxide (CaO). Etc. are added and mixed to form a slurry. From this, a plurality of ceramic green sheets are obtained by a tape forming technique such as a conventionally known doctor blade method or calendar roll method. Next, a metal paste obtained by adding an appropriate organic binder, plasticizer, solvent, etc. to a high melting point metal powder such as W or molybdenum (Mo) to the ceramic green sheet is mixed with a thick film such as a screen printing method. A metallized layer to be the first electrode pad 6a, the second electrode pad 7a, the bonding conductor 7b, and the inner conductor layer 8b is formed in a predetermined pattern by printing and coating using a forming technique. Further, by punching with a mold or the like, a through hole to be a through conductor 8a is formed at a desired position of each ceramic green sheet, and an organic binder suitable for refractory metal powders such as W and Mo is formed in the through hole. Then, a metal paste obtained by adding and mixing a plasticizer, a solvent and the like is filled. Moreover, the ceramic green sheet used as the convex part 5b laminates what formed the punching used as the side wall of the concave part 5a. Thereafter, a plurality of ceramic green sheets are laminated, cut into a predetermined shape such as a disk shape, a square plate shape, or a polygonal plate shape, and then fired at a temperature of about 1600 ° C. in a reducing atmosphere. .

  In the electronic component storage package of the present invention, as shown in FIG. 1, the bonding conductor 7 b is formed on the upper main surface of the wiring substrate 5, and the second electrode pad 7 a is formed on the lower main surface of the wiring substrate 5. Since the base body 1 is bonded to the upper main surface of the wiring board 5 and the external connection terminal member 10 is bonded to the lower main surface of the wiring board 5, even if the wiring board 5 is miniaturized, The distance between the second electrode pad 7a and the bonding conductor 7b can be increased. As a result, contact between the brazing material for joining the external connection terminal member 10 to the second electrode pad 7a and the brazing material for joining the substrate 1 to the joining conductor 7b is prevented, and the second electrode pad 7a. And the bonding conductor 7b can be prevented from being electrically short-circuited, and an electric signal can be reliably transmitted to the second electrode pad 7a.

  Further, a portion to be bonded to the base body 1 is a convex portion 5b having a quadrangular cross section protruding upward, and a bonding conductor 7b for bonding to the base body 1 is formed on the upper surface of the convex portion 5b. That is, the central portion on the upper side of the wiring board 5 is a recess 5a surrounded by the protrusion 5b, and a plurality of first electrode pads 6a are disposed on the bottom surface of the recess 5a. A step is formed by the protrusion 5b between 6a and the bonding conductor 7b. As a result, the wiring substrate 5 is miniaturized and integrated, and the base 1 is bonded to the bonding conductor 7b even when the first electrode pad 6a and the bonding conductor 7b are very close to each other in plan view. The brazing filler metal can be prevented from flowing into the first electrode pad 6a, and the first electrode pad 6a and the bonding conductor 7b can be prevented from being electrically short-circuited. The electric signal can be reliably transmitted to 6a. Therefore, the electronic component storage package can be miniaturized and integrated.

  In the electronic component storage package of the present invention, or as shown in FIGS. 2 and 3, the wiring board 5 is formed as a convex portion 5 b having a quadrangular cross section in which a portion joined to the base body 1 projects downward. A conductor 7b for bonding to the base 1 is formed on the lower surface of the portion 5b. That is, the lower central portion of the wiring substrate 5 is a concave portion 5a surrounded by the convex portion 5b, and a plurality of second electrode pads 7a are disposed on the bottom surface of the concave portion 5a. A step is formed by the convex portion 5b between the pad 7a and the bonding conductor 7b. As a result, even if the wiring substrate 5 is miniaturized and the distance between the second electrode pad 7a and the bonding conductor 7b is very close, the external connection terminal member 10 is attached to the second electrode pad 7a. Contact between the brazing material for bonding and the brazing material for bonding the bonding conductor 7b to the base 1 is prevented, and the second electrode pad 7a and the bonding conductor 7b are electrically short-circuited. As a result, electrical signals can be reliably transmitted to the second electrode pads 7a. Therefore, the electronic component storage package can be miniaturized and integrated.

  Further, when the wiring board 5 is brazed to the base body 1, the base body 1 and the wiring board 5 are joined in a thermally expanded state, and then cooled to room temperature, the thermal expansion difference between the wiring board 5 and the base body 1. Stress on the wiring board 5 remains. Such residual stress acts on the wiring board 5, or when the lid 3 is joined to the outer peripheral portion of the base body 1, circumferential thermal stress acts on the outer peripheral portion of the base body 1, and the thermal stress is applied to the wiring board. 1, in the electronic component storage package of the present invention, as shown in FIG. 1, the wiring board 5 has a convex portion 5 b that protrudes upward from the portion bonded to the base 1, or FIG. As shown in FIG. 3, the wiring board 5 is formed with a convex portion 5b protruding downward from a portion joined to the base body 1, so that the joint portion of the wiring board 5 with the base body 1 is reinforced by the convex portion 5b. Thus, the strength of the joint portion between the wiring board 5 and the base body 1 is improved. That is, the protrusion 5b is less likely to be damaged by the increase in the thickness of the joint between the wiring board 5 and the base body 1.

  Further, the convex portion 5 b has a function of relaxing the residual stress in the peripheral portion of the solder joint between the wiring substrate 5 and the substrate 1 acting on the electronic component mounted on the wiring substrate 5. That is, the convex portion 5b functions as a joint between the wiring board 5 and the base 1, and the stress acts on the electronic component by separating the electronic component from the solder joint where the residual stress is concentrated by the convex portion 5b. To ease. Thus, the wiring board 5 is not easily damaged, and the function of relaxing the stress applied to the electronic component can improve the hermetic reliability inside the electronic device. The electrical connection between the first electrode pad 6a and the second electrode pad 7a can be improved. The reliability of the general connection can be improved, and the electronic component 2 housed therein can be operated normally and stably.

  In recent compact and integrated electronic component storage packages, the wiring board 5 has been reduced in size and thickness, and the wiring board 5 is easily damaged by residual stress. Therefore, the base 1 of the wiring board 5 is joined. The configuration in which the outer peripheral portion is a convex portion 5b protruding upward or downward is effective in preventing breakage of a recently-integrated electronic component storage package.

  As described above, the wiring board 5 is less likely to be damaged by cracks and the like. As a result, the airtight reliability inside the electronic component storage package can be satisfactorily maintained, and the first electrode pad 6a and the second electrode pad can be maintained. It is possible to maintain the reliability of the electrical connection with 7a satisfactorily and operate the electronic component 2 housed therein normally and stably.

  As shown in FIGS. 1 to 3, external connection terminal members 10 are respectively connected to a plurality of second electrode pads 7 a disposed on the lower surface of the wiring board 5 by a brazing material such as Ag brazing. . The external connection terminal member 10 is made of an Fe—Ni—Co alloy, Fe—Ni alloy, or the like, and is made of a wire material such as a columnar shape or a prismatic shape. Preferably, the external connection terminal member 10 is provided with a flange portion having a flat upper surface like the head of a nail at the joint portion (upper end) with the second electrode pad 7a. The external connection terminal member 10 can be firmly joined to the electrode pad 7a. Further, the second electrode pad 7 a is formed in a circular shape or the like larger than the head of the external connection terminal member 10.

  As shown in FIGS. 1 to 3, the external connection terminal member 10 has a length that protrudes downward from the lower surface of the base 1. Then, for example, after the external electrical circuit board or the like is inserted through the tip of the external connection terminal member 10 and the root is connected to the electrode of the external electrical circuit board, the excess portion is cut off. 2 to 3, the length of the external connection terminal member 10 may be set to a length that does not protrude downward from the lower surface of the base 1. Then, the electrodes provided on the surface of the external electric circuit board may be soldered in the same manner as surface mounting.

  Further, as shown in FIGS. 4A and 4B, the external connection terminal member 10 may be a metal ball 10a or a solder bump 10a. In this case, the external connection terminal member 10 is made of copper (Cu), gold (Au), tin (Sn) -lead (Pb) alloy, Au-Sn alloy, and the metal ball 10a made of Cu or Au is made of Ag solder. It joins to the 2nd electrode pad 7a via brazing filler metals, Sn-Pb alloy, and Au-Sn alloy. The metal ball 10a is subjected to Au plating or the like as necessary. In the case of solder bumps made of Sn—Pb alloy or Au—Sn alloy, the solder balls made of Sn—Pb alloy or Au—Sn alloy are welded to the second electrode pad 7a.

  By using the metal balls 10a or the solder bumps 10a for the external connection terminal member 10, the electronic component storage package can be surface-mounted on an external electric circuit. As a result, the mounting operation of the electronic component storage package to the external electric circuit can be facilitated, and by using the metal ball 10a for external connection, the electronic component storage package and the external electric circuit can be connected. The length of the connecting portion can be shortened, the length of the transmission line through which the high-frequency signal is transmitted can be minimized, and transmission loss can be minimized in the connecting portion. Further, even if the amount of heat generated from the electronic component 2 increases due to the high output of the electronic component 2, the heat generated from the electronic component 2 is dissipated to the external electric circuit board via the external connection metal balls 10a. It can be made easier. Thereby, the temperature rise of the electronic component 2 can be prevented, and the electronic component 2 can be operated normally and stably.

  2 and 3, the wiring board 5 is bonded to the upper main surface of the base 1, and a plurality of external connections are provided in the configuration in which the outer peripheral portion of the lower surface of the wiring board 5 has a protruding portion 5b protruding downward. A high frequency signal is connected to the terminal member 10 and the second electrode pad 7a, and the external connection terminal member 10 may function as a high frequency line. When the electronic component storage package is mounted on the external electric circuit board, the lower surface of the base 1 is mounted so as to contact the upper surface of the external electric circuit board (not shown), and the external connection terminal member 10 is mounted on the external electric circuit board. The distance from the connection portion between the external connection terminal member 10 and the second electrode pad 7a to the connection portion between the external connection terminal member 10 and the external electric circuit board is the protruding height of the convex portion 5b. Thus, an inductive component (inductance) in the external connection terminal member 10 can be generated.

  On the other hand, there is a capacitance component between the second electrode pad 7a and the external connection terminal member 10 and the ground conductor (for example, the bonding conductor 7b) at the joint between the second electrode pad 7a and the external connection terminal member 10. However, the capacitance component can be canceled by the induction component of the external connection terminal member 10. As a result, the impedance value at the joint between the second electrode pad 7a and the external connection terminal member 10 can be set to a predetermined value, and the high-frequency signal transmitted through the external connection terminal member 10 has a transmission loss such as a reflection loss. It is possible to reduce the occurrence. Therefore, it is possible to provide an electronic component storage package that can operate the electronic component 2 normally and stably with respect to a high-frequency signal.

  In FIG. 2, three second electrode pads 7a are arranged in two rows. For example, among the three second electrode pads 7a, the center is a high-frequency signal line, and both sides are ground conductor lines. It is good to arrange in the track structure. Thus, by setting the line arrangement as a set of three, a so-called GSG structure of ground (signal) -signal (ground) -ground (ground) is obtained, and transmission characteristics of the high-frequency signal line are improved.

Further, preferably, between the adjacent first electrode pads 6a as shown in FIG. 5 (c), or between the adjacent second electrode pads 7a as shown in FIGS. 5 (a) and 5 (b). Between the first electrode pads 6a or between the first electrode pads 6a and between the second electrode pads 7a, between the first electrode pads 6a or between the second electrode pads 7a. It is preferable that a groove 5c is provided so as to cross each other. The groove 5c removes the dielectric on the surface of the wiring substrate 5 between the plurality of first electrode pads 6a or between the plurality of second electrode pads 7a. Accordingly, it is possible to reduce the capacitance component generated between the plurality of first electrode pads 6a or between the plurality of second electrode pads 7a. For example, if the dielectric constant when the dielectric is _Al 2 _{O 3} quality sintered dielectric constant when it is 9, AlN sintered body is 10,3Al ₂ O ₃ · 2SiO ₂ Quality sintered body Has a dielectric constant of 6.4, and these are replaced with air having a dielectric constant of 1 by the groove 5c.

  As a result, it is possible to reduce a decrease in impedance value with respect to an electric signal transmitted through the plurality of first electrode pads 6a or the plurality of second electrode pads 7a, and to reduce impedance mismatch. In particular, in recent miniaturized electronic component storage packages, the distances between the plurality of first electrode pads 6a or between the plurality of second electrode pads 7a are close to each other, and the capacitance component is reduced. The need for reduction is increasing.

  The planar view shape of the groove 5c may be an oval shape shown in FIGS. 5A and 5B, or a shape in which a plurality of circular shapes shown in FIG. 5C are continuously arranged. . In addition, the shape may be a rectangle, an ellipse, or the like, and may have various shapes.

  As shown in FIGS. 5A and 5B, the groove 5c is provided between the first electrode pads 6a in the wiring substrate 5 between the plurality of second electrode pads 7a. It is more effective than the case where the groove 5c is provided. Generally, providing the groove 5c between the second electrode pads 7a having a larger electrode pad size than the first electrode pad 6a lowers the effective dielectric constant, so that the gap between the plurality of second electrode pads 7a is reduced. The effect of reducing the generated capacitance component is increased. In general, the second electrode pad 7a may be bonded to the external connection terminal member 10, and the area of the second electrode pad 7a is the first electrode pad in order to secure a bonding area with the external connection terminal member 10. It is formed larger than the area of 6a. For this reason, the capacitance component generated between the plurality of second electrode pads 7a is larger than the capacitance component generated between the first electrode pads 6a. Therefore, it is more effective to suppress the capacitance component if the groove 5c is provided between the plurality of second electrode pads 7a.

  In FIG. 5A, the second electrode pads 7a are arranged in three vertical rows and two horizontal rows. For example, a line configuration in which a high frequency signal line is connected to the center of the second electrode pads 7a arranged in three vertical positions of the second electrode pads 7a and a ground conductor line is connected to the upper and lower sides thereof is horizontal. A GSG line configuration arranged in two rows is shown. And the groove | channel 5c is provided between the 2nd electrode pads 7a used as G and S, respectively. With this configuration, the capacitance component generated between GS can be reduced, and the impedance value of the high-frequency signal passing through the second electrode pad 7a serving as the high-frequency signal line is not greatly reduced.

  In FIG. 5B, the second electrode pads 7a are arranged in four vertical rows and two horizontal rows. For example, a high-frequency signal line is connected to two of the second electrode pads 7a arranged vertically in the second electrode pad 7a, and two ground pads are connected to the upper and lower sides thereof. . In this way, by forming a set of four lines, a so-called GSSG line configuration of ground (Signal) -signal (Signal) -signal (Signal) -ground (Ground) can be obtained. A differential signal can be transmitted to the high-frequency signal line. In this configuration, as shown in FIG. 5B, the effect of lowering the capacitance component is great even if only one groove 5c is provided between the second electrode pads 7a serving as two high-frequency signal lines. In general, differential signals are transmitted as a set of signals having opposite phases (+ and −) as a set. At this time, SS signals in which signals having phases opposite to each other are transmitted compared to the influence of the capacitive component between GS. The influence of the capacitance component in between increases. In addition, when only one groove 5c is provided between the second electrode pads 7a, it is possible to reduce manufacturing steps and improve manufacturing efficiency.

  Preferably, as shown in FIG. 3, the first coplanar conductor layer 6 b is formed on the upper surface of the wiring substrate 5 around the first electrode pad 6 a with a predetermined interval, and the bottom surface of the recess 5 a of the wiring substrate 5. In this case, the second coplanar ground conductor layer 7c is preferably formed around the second electrode pad 7a with a predetermined interval. With this configuration, the first coplanar conductor layer 6b and the second coplanar ground conductor layer 7c provide a shielding effect (electromagnetic shielding effect) on the upper and lower surfaces of the wiring board 5, and high-frequency signals are normal due to the influence of noise and the like. In addition, it is possible to prevent loss due to radiation of high-frequency signals on the upper and lower surfaces of the wiring board 5. When the first coplanar conductor layer 6b and the second coplanar ground conductor layer 7c are formed on almost the entire surface so as to cover the upper surface of the wiring board 5 other than the electrode forming portion and the bottom surface of the concave portion 5a, Good.

  The lid 3 has a top end surface closed and a bottom end opened by applying a conventionally known metal processing method such as rolling, punching, drawing, etc. to a metal ingot such as an Fe—Ni—Co alloy. It is manufactured in a bottomed cylindrical shape. The bottomed cylindrical lid 3 has a circular cross section, a polygonal cylindrical portion, and an upper end surface 3a having the same shape as the cross section of the cylindrical portion, which are individually manufactured, brazed, soldered, It may be joined by welding or the like.

  In the optical semiconductor element housing package in which the optical semiconductor element 2 such as LD or PD is hermetically sealed and accommodated as the electronic component 2 shown in FIGS. 1 and 2, the optical semiconductor element 2 and the optical fiber 12 In order to be able to input and output optical signals between them, the upper end surface 3a of the lid 3 is provided with a circular or polygonal through hole 3b in plan view, and the through hole is formed so as to close the through hole 3b. The translucent member 4 is airtightly joined to the periphery of the upper end surface 3a side opening of 3b by glass joining or soldering. The translucent member 4 has a disk shape, a lens shape, a spherical shape, a hemispherical shape, or the like made of glass, sapphire, or the like. In the case of a hemispherical part, it is joined to the lid 3 at the outer peripheral part of the flat part. When the electronic component 2 is other than an optical semiconductor device such as an integrated circuit element (IC), a field effect transistor (FET), or a capacitor, it is not necessary to input / output an optical signal to / from the electronic component 2, so the lid 3 and the translucent member 4 are unnecessary.

  The lower end 3 c of the lid 3 is a flange as shown in FIGS. 1 to 4, and the outer peripheral end of the flange is formed to have the same outer diameter as the outer peripheral end of the base 1. Then, the lid 3 is placed on the upper main surface of the base body 1, and the lower end 3c (the flange) of the lid body 3 and the outer peripheral portion of the upper main surface of the base body 1 are joined by a seam welding method or the like. By this joining method, the base 1 and the lower end 3c of the lid 3 are hermetically sealed.

  The optical fiber 12 is provided to exchange optical signals between the optical semiconductor element 2 and the outside when the electronic component 2 is an optical semiconductor element, and is made of a metal such as an Fe—Ni—Co alloy. Is fixed to the upper end surface of the cylindrical fixing member 13, and the lower end surface of the fixing member 13 is joined to the outer peripheral surface of the lid 3 by welding such as laser welding, so that the optical fiber 12 is interposed via the fixing member 13. Then, it is fixed above the translucent member 4 and becomes an optical semiconductor device as a product. As a result, optical signals can be exchanged between the optical semiconductor element 2 accommodated inside and the outside via the optical fiber 12. When the electronic component 2 is other than an optical semiconductor element, it is not necessary to input / output an optical signal to / from the electronic component 2, and therefore it is not necessary to fix the optical fiber 12 and the fixing member 13.

  The optical semiconductor device as an example of the electronic device electrically connects the electrode of the electronic component 2 to an external electric circuit via the wiring substrate 5 and connects to the optical semiconductor element 2 by an electric signal supplied from the external electric circuit. An optical semiconductor device used for high-speed optical communication or the like by exciting light such as laser light, transmitting the light in the order of the translucent member 4 and the optical fiber 12, and transmitting the light to the outside through the optical fiber 12. Function as. Alternatively, an optical signal transmitted from the outside via the optical fiber 12 and transmitted to the light receiving element as the electronic component 2 through the translucent member 4 is transmitted as an electric signal to the external electric circuit via the wiring board 5. Output.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the external connection terminal member 10 may be made of a low resistance material such as Cu or Au. With this configuration, it is possible to effectively prevent an increase in resistance loss that occurs in a signal transmitted through the external connection terminal member 10.

  In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

(A) is sectional drawing which shows an example of embodiment of the electronic component storage package and electronic device of this invention, (b) is a top view of the electronic component storage package shown to (a). (A) is sectional drawing which shows the other example of embodiment of the electronic component storage package and electronic device of this invention, (b) is a bottom view of (a). (A) is sectional drawing which shows the other example of embodiment of the electronic component storage package and electronic device of this invention, (b) is a bottom view of (a). (A) is sectional drawing which shows the other example of embodiment of the electronic component storage package and electronic device of this invention, (b) is a bottom view of (a). (A), (b) is a bottom view which shows the other example of embodiment of the wiring board used for the electronic component storage package of this invention, respectively. (C) is a top view which shows the other example of embodiment of the wiring board used for the electronic component storage package of this invention. It is sectional drawing which shows the example of the conventional package for electronic component accommodation, and an electronic apparatus.

Explanation of symbols

1: Substrate 1a: Through hole 2: Electronic component 3: Lid 3a: Upper end surface 3b: Through hole 3c: Lower end 4: Translucent member 5: Wiring substrate 5b: Convex portion 5c: Groove 6a: First electrode pad 7a: second electrode pad 8: internal conductor 10: external connection terminal member

Claims (8)

A flat metal base having a through-hole penetrating between the upper and lower main surfaces, and a plurality of first members joined to the lower main surface of the base so as to cover the through-hole and disposed on the upper surface And a wiring board having a plurality of second electrode pads connected to the other electrode pads, the wiring board being bonded to the base body. A package for storing electronic parts, characterized in that a convex portion is formed on an outer peripheral portion of the upper surface, and a conductor for bonding to the base is formed on an upper surface of the convex portion. A flat metal base having a through-hole penetrating between the upper and lower main surfaces, and a plurality of first bases bonded to the upper main surface of the base so as to cover the through-hole and disposed on the upper surface And a wiring board having a plurality of second electrode pads connected to the electrode pad and disposed on the lower surface, wherein the wiring board is bonded to the base. A package for storing electronic components, characterized in that a convex portion is provided on an outer peripheral portion, and a conductor for joining to the base is formed on a lower surface of the convex portion. 3. The electronic component storage package according to claim 2, wherein a high frequency signal is connected to at least one of the second electrode pads. 4. The electronic component storage package according to claim 1, wherein an external connection terminal member made of a wire is joined to each of the second electrode pads. 5. 4. The electronic component storage package according to claim 1, wherein external connection terminal members made of metal balls or solder bumps are joined to the second electrode pads. 5. At least one of the surfaces of the wiring board between the adjacent first electrode pads and between the adjacent second electrode pads is between the first electrode pads or the second electrode. 6. The electronic component storage package according to claim 1, wherein a groove is provided so as to cross between the pads. The electronic component storage package according to any one of claims 1 to 6, an electronic component placed on an upper surface of the wiring board, and a cylindrical shape having an upper end surface closed and a lower end opened. An electronic device comprising: a lid body having the lower end joined to an outer peripheral portion of the upper main surface of the base body. The electronic component storage package according to any one of claims 1 to 7, and a cylindrical shape in which a through hole is formed in a central portion of an upper end surface and a lower end is opened, and the upper side of the base body A metal lid having the lower end joined to the outer peripheral part of the main surface, a translucent member joined around the opening of the through hole, and a light receiving part or a light emitting part facing the translucent member And an optical semiconductor element mounted on the upper surface of the wiring board.

Images