CN112585743B - Wiring substrate, electronic component housing package, and electronic device - Google Patents
Wiring substrate, electronic component housing package, and electronic device Download PDFInfo
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- CN112585743B CN112585743B CN201980055421.5A CN201980055421A CN112585743B CN 112585743 B CN112585743 B CN 112585743B CN 201980055421 A CN201980055421 A CN 201980055421A CN 112585743 B CN112585743 B CN 112585743B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Lasers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A wiring substrate according to an embodiment of the present disclosure includes a substrate and at least 1 terminal. The base has a recess open at an upper surface. The terminal extends from the 1 st end to the 2 nd end, and at least 1 or more terminals are provided in the recess. The terminal has a 1 st end located in the recess, a 2 nd end located outside the recess, and an enlarged diameter portion in the recess.
Description
Technical Field
The present disclosure relates to a wiring substrate, a package for accommodating electronic components, and an electronic device.
Background
With the development of information technology, the use of optical communication capable of high-speed and long-distance signal transmission has been advanced. Electronic devices and the like that transmit optical signals are required to stabilize operations and improve transmission efficiency. Patent document 1 describes that: the electronic device includes a wiring substrate, and electronic components such as an LD (Laser Diode) and a PD (Photo Diode).
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2012-256692
Disclosure of Invention
A wiring substrate according to an embodiment of the present disclosure includes a substrate and at least 1 terminal. The base has a 1 st recess open at the upper surface. The terminal extends from the 1 st end to the 2 nd end, and at least 1 or more terminals are positioned in the 1 st concave part. The terminal has a 1 st end located in the 1 st recess, a 2 nd end located outside the 1 st recess, and an enlarged diameter portion in the 1 st recess.
An electronic component housing package according to an embodiment of the present disclosure includes a wiring substrate and a frame. The frame portion is located on a lower surface of the base opposite to the upper surface.
An electronic device according to an embodiment of the present disclosure includes an electronic component and an external substrate. The electronic component is mounted on the lower surface in the base. The external substrate has a through hole corresponding to the terminal.
Drawings
Fig. 1 is a top perspective view of a wiring substrate according to an embodiment of the present disclosure.
Fig. 2 is a top perspective view of a wiring substrate according to an embodiment of the present disclosure.
Fig. 3 is a top perspective view of an electronic component housing package according to an embodiment of the present disclosure.
Fig. 4 is a top perspective view of an electronic component housing package according to an embodiment of the present disclosure.
Fig. 5 is a bottom perspective view of an electronic component housing package according to an embodiment of the present disclosure.
Fig. 6 is a side view of an electronic component housing package according to an embodiment of the present disclosure.
Fig. 7 is a top perspective view of a wiring base and external substrate connection according to an embodiment of the present disclosure.
Fig. 8 is a top perspective view of an electronic component housing package and external substrate connection according to an embodiment of the present disclosure.
Fig. 9 is a top perspective view of an external substrate connected to an electronic component housing package according to an embodiment of the present disclosure.
Fig. 10 is a bottom perspective view of an external substrate connected to an electronic component housing package according to an embodiment of the present disclosure.
Fig. 11 is a top perspective view of the wiring substrate of fig. 1 enlarged.
Fig. 12 is a cross-sectional view under XII-XII of the wiring substrate of fig. 1.
FIG. 13 is a cross-sectional view of the wiring substrate of FIG. 1 taken at XIV-XIV.
Fig. 14 is a cross-sectional view under XIII-XIII of the wiring substrate of fig. 2.
Detailed Description
The wiring substrate 1 according to one embodiment of the present disclosure is described below with reference to the drawings.
Structure of wiring substrate 1
The electronic device 100 includes an electronic component housing package 10. The electronic component housing package 10 includes a wiring substrate 1. The wiring substrate 1 includes a substrate 2 and terminals 4. The wiring substrate 1 is configured by letting the 1 st concave portion 21, the 1 st signal conductor 3, the terminal 4, and the like be located on the upper surface of the substrate 2.
The base body 2 may be circular, for example, when viewed from the top. In the case where the base body 2 is circular in top view, the radius may be 0.5mm to 5mm and the height 1mm to 10mm. The circular shape may include a shape in which a part of the circle is cut out in a top view. The substrate 2 may be rectangular in top view. In the case where the substrate 2 is rectangular in top view, the size may be 1mm×1mm to 10mm×10mm. The substrate 2 may comprise a dielectric material. The substrate 2 may be formed by stacking dielectric materials. In this specification, a structure in which dielectric materials are stacked may be referred to as an insulating layer. As the dielectric material, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, or a glass ceramic material can be used.
The 1 st recess 21 is located on the upper surface of the base 2. The 1 st recess 21 is open at the upper surface. The 1 st concave portion 21 may be formed by cutting a molded body, drilling a fired body, or the like, from the upper surface of the base 2 to the lower surface opposite to the upper surface. In the case where the base 2 is formed by stacking dielectric materials, the 1 st concave portion 21 may be formed by partially cutting out and combining a plurality of dielectrics in a place where the 1 st concave portion 21 is located. The shape of the 1 st concave portion 21 may be circular, for example, when viewed from the top. In the case where the shape of the 1 st concave portion 21 is circular in top view, the radius may be 0.1mm to 1mm. In addition, the 1 st concave portion 21 may be rectangular or oblong with curved corners when viewed from the top. In the case where the 1 st concave portion 21 is rectangular in top view, the size may be 0.2mm×1mm to 2mm×10mm. In the case where the 1 st concave portion 21 is oblong in top view, the radius of curvature of the curved portion may be 0.1mm to 1mm in size. In the case where the 1 st concave portion 21 is circular or oblong in top view, cracks due to stress concentration in the corner portions, such as when the shape is rectangular in top view, do not occur. In the case where the 1 st concave portion 21 is viewed in cross section in the direction from the upper surface to the lower surface, it may be rectangular, for example. The depth of the 1 st concave portion 21 in the direction from the upper surface toward the lower surface may be 0.1mm to 3mm. The 1 st concave portion 21 may be tapered, inverted tapered or stepped when viewed in cross section in a direction from the upper surface to the lower surface.
Terminal 4 has a 1 st end 41 and a 2 nd end 42. Terminal 4 extends from 1 st end 41 to 2 nd end 42. The shape of the terminal 4 may be a bar. The terminals 4 may be provided extending in a direction perpendicular to the upper surface of the base 2. In addition, the term vertical in the present specification includes a case where the vertical direction is slightly inclined with respect to the vertical direction due to manufacturing errors. The error may be in the range of-0.1 deg. to +0.1 deg..
As shown in fig. 11 or 12, the 1 st end 41 is located inside the 1 st recess 21, and the 2 nd end 42 is located outside the 1 st recess 21. The terminal 4 has an enlarged diameter portion 43 in the 1 st recess 21. By providing such an enlarged diameter portion 43 in the 1 st recess 21, the contact area between the enlarged diameter portion 43 and the bonding material such as the solder applied increases during the bonding of the terminal 4 in the 1 st recess 21, and thus the bonding strength between the external substrate 8 such as FPC (Flexible Printed Circuits, flexible printed circuit) and the wiring substrate 1 increases. In addition, when the external substrate 8 and the wiring base 1 are connected, the expanded diameter portion 43 does not protrude from the opening of the 1 st concave portion 21, and therefore the external substrate 8 does not float (float) from the wiring base 1, and the connection reliability is excellent. In addition, for example, when the outer substrate 8 and the enlarged diameter portion 43 of the 1 st recess 21 are connected by brazing material, the 1 st recess 21 can serve as a brazing pit for brazing material that is not used for joining, and therefore, the brazing material does not overflow to the upper surface of the wiring substrate 1. As a result, the suspension of the wiring substrate 1 of the external substrate 8 due to the overflowed solder can be reduced. In the present specification, a portion having a larger diameter than the portion above the opening of the 1 st concave portion 21 is referred to as an enlarged diameter portion 43.
As shown in fig. 12 or 14, the enlarged diameter portion 43 may extend from the 1 st end 41 to the opening of the 1 st concave portion 21. In other words, the expanded diameter portion 43 may include the 1 st end 41. In other words, the diameter of the expanded portion 43 may have the same area as the diameter of the 1 st end 41. In the present specification, the area of the diameter of the enlarged diameter portion 43 is the area of a cross section orthogonal to the axis of the terminal 4. The area of the diameter of the 1 st end 41 is the surface area of the 1 st end 41. By making the diameter area of the expanded diameter portion 43 the same as the diameter area of the 1 st end 41, the bonding strength with the connection conductor 5 can be improved. In the present specification, the area of the diameter of the expanded diameter portion 43 is S1, and the area of the diameter of the 1 st end 41 is S2.
As shown in fig. 13, the diameter-enlarged portion 43 may extend from between the 1 st end 41 and the 2 nd portion 42 to the opening of the 1 st concave portion 21. In other words, the 1 st end 41 may not be included in the expanded diameter portion 43. In other words, the diameter of the expanded portion 43 may have a larger area than the diameter of the 1 st end 41. Thus, by not including the 1 st end 41 in the expanded diameter portion 43, for example, in the case where the 1 st concave portion 21 further includes a recess fitted in the 1 st end 41, the connection between the terminal 4 and the base 2 can be made more stable.
The length of the terminal 4 may be 1mm to 10mm. In the case where the terminal 4 is circular in cross section intersecting the axial direction, the radius of the enlarged diameter portion 43 may be 0.1mm to 0.8mm, and the radius other than the enlarged diameter portion 43 may be 0.05mm to 0.5mm. The terminal 4 may be, for example, a metal containing iron or the like. The terminal 4 is electrically connected to an external power source, and supplies power to the mounted electronic component 101. The plurality of terminals 4 may be provided corresponding to the design of the wiring substrate 1. In the case where the plurality of terminals 4 are provided, the terminals 4 may be electrically connected to each other, or the terminals 4 may not be electrically connected to each other.
The enlarged diameter portion 43 may be stepped when viewed in cross section of the shaft including the terminal. When the diameter-enlarged portion 43 is stepped, the step is located below the opening of the 1 st concave portion 21 or in a lower surface direction than the opening. In other words, with respect to the expanded diameter portion 43, the expanded diameter portion 43 does not protrude from the opening in the upper direction. By making the enlarged diameter portion 43 stepped, it is easy to connect the outer substrate 8 and the enlarged diameter portion 43 of the 1 st concave portion 21 with each other using brazing material or the like. As a result, the connection between the terminal 4 and the base 2 is more stable.
In one embodiment of the present disclosure shown in fig. 1, a plurality of terminals 4 are located in the 1 st recess 21. The substrate 2 may have a plurality of 1 st concave portions 21 on its upper surface, or the plurality of terminals 4 may be located in the 1 st concave portions 21.
The connection conductor 5 is located in the 1 st recess 21 and is connected to the 1 st end 41. In one embodiment of the present disclosure shown in fig. 1, the connection conductors 5 are located in the 1 st concave portion 21 in the number of the plurality of terminals 4, and are electrically connected in one-to-one correspondence with the plurality of terminals 4, respectively. In addition, the insulating layer may be located in a region where the terminal 4 and the connection conductor 5 are not provided. The connection conductor 5 is used, for example, for connecting the base 2 and the terminal 4 with a bonding material such as solder. The connection conductor 5 may be provided so as to surround the outer periphery of the expanded diameter portion 43 when viewed from the top. By providing the connection conductor 5 around the outer periphery of the expanded diameter portion 43, it is easy to join the terminal 4 and the connection conductor 5, and when the terminal 4 and the external substrate 8 are joined with solder, the solder flowing into the 1 st concave portion 21 can be caught, so that occurrence of short-circuiting between the terminals 4 can be reduced.
The shape of the connection conductor 5 may be rectangular or circular, for example, in top view. In the case where the connection conductor 5 is rectangular in top view, the size may be 0.2mm×0.2mm to 2mm×2mm. In the case where the connection conductor 5 is circular in top view, the radius may be 0.1mm to 1mm. The connection conductor 5 may be a metal material including, for example, gold, silver, copper, nickel, tungsten, molybdenum, manganese, or the like, and may be a product obtained by firing or metal plating the surface of the uppermost insulating layer in the form of a metallization layer, a plating layer, or the like.
In one embodiment of the present disclosure shown in fig. 2, 1 terminal 4 is positioned in the 1 st concave portion 21. The 1 st concave portion 21 may be plural, and 1 terminal 4 may be located in each 1 st concave portion 21. By positioning 1 terminal 4 in 1 st recess 21, outer substrate 8 is less likely to flex than in the embodiment of fig. 1. As a result, the overhang of the external substrate 8 at the boundary between the opening of the 1 st concave portion 21 and the upper surface of the base 2 due to the deflection of the external substrate 8 in the 1 st concave portion 21 can be reduced.
In addition, in one embodiment of the present disclosure shown in fig. 2, the shape of the connection conductor 5 may be made to correspond to the shape of the 1 st concave portion 21. By making the shape of the connection conductor 5 correspond to the shape of the 1 st concave portion 21, the connection region between the base 2 and the terminal 4 can be expanded, and as a result, the bonding strength between the terminal 4 and the connection conductor 5 can be improved.
The 1 st signal conductor 3 is located on the upper surface of the base body 2 and extends in the 1 st direction. The 1 st signal conductor 3 is separated from the 1 st recess 21 in a top view. The shape of the 1 st signal conductor 3 may be rectangular, for example, when viewed from the top. In the case where the shape of the 1 st signal conductor 3 in top view is rectangular, the width may be 0.05mm to 1mm and the length may be 0.5mm to 5mm. The 1 st signal conductor 3 may include a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese, for example. The 1 st signal conductor 3 may be a product obtained by firing or metal plating the upper surface of the substrate 2 at the same time in the form of a metallization layer, a plating layer, or the like. The 1 st signal conductor 3 may be provided to extend in a direction substantially perpendicular to the upper surface of the base 2. The 1 st signal conductor 3 can be used, for example, for transmitting a high-frequency signal belonging to the 10 to 60GHz band.
The 1 st signal conductor 3 is a pair of 1 st signal conductors 3, and may be provided in parallel with each other. By positioning the 1 st signal conductor 3 in parallel, transmission loss in transmitting a high-frequency signal can be reduced.
The present invention may further include a pair of 1 st ground conductors 6 extending in the 1 st direction and sandwiching at least a part of the 1 st signal conductor 3. By providing the 1 st ground conductor 6, when the 1 st signal conductor 3 is a pair of 1 st signal conductors 3, the 1 st signal conductor 3 and the 1 st ground conductor 6 are arranged in a coplanar structure. By arranging the 1 st signal conductor 3 and the 1 st ground conductor 6 in a coplanar structure, a high-frequency signal can be smoothly transmitted. The 1 st ground conductor 6 may be a metal material including gold, silver, copper, nickel, tungsten, molybdenum, manganese, or the like, for example, and may be a product obtained by firing or metal plating the surface of the uppermost insulating layer in the form of a metallization layer, a plating layer, or the like.
Further, the 2 nd ground conductor 61 may be provided closer to the center of the upper surface than the 1 st signal conductor 3 in top view. The 2 nd ground conductor 61 is connected to a pair of 1 st ground conductors 6. The 2 nd ground conductor 61 expands the region of the wiring substrate 1 functioning as a ground. As a result, the transmission of the high-frequency signal is more stable. The 2 nd ground conductor 61 may be a product obtained by firing or metal plating the surface of the uppermost insulating layer in the form of a metallization layer, a plating layer, or the like, for example, and may include a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese.
The 1 st ground conductor 6 may not be provided on the outer periphery of the base 2 and may be provided at the tip of the 1 st signal conductor 3 in top view. By not providing the 1 st ground conductor 6 on the outer periphery of the base 2 and the tip of the 1 st signal conductor 3, the occurrence of a short circuit caused by the contact between the 2 nd signal conductor 82 and the 1 st ground conductor 6 can be reduced when the external substrate 8 and the wiring base 1 are connected. The outer periphery of the base 2 at the front end of the 1 st signal conductor 3 refers to the region a of fig. 1 to 4 in the drawings.
The 1 st ground conductor 6 may be electrically connected to a ground conductor located inside the base body 2 with a via 22. The 1 st ground conductor 6 is connected to the ground conductor located inside the base 2 via the via hole 22, whereby the region functioning as the ground can be expanded.
The 2 nd ground conductor 61 may be electrically connected to a ground conductor located inside the base body 2 through the via hole 22. The 2 nd ground conductor 61 is connected to the ground conductor located inside the base 2 via the via hole 22, whereby the region functioning as the ground can be expanded.
The substrate 2 may further have: and a 2 nd recess 7 provided on the outer periphery of the base body and at the tip of the 1 st ground conductor. The 2 nd recess 7 may be formed from the upper surface to the side surface, and may be continuously opened at the upper surface and the side surface. In addition, the base body 2 may have a plurality of 2 nd concave portions 7. The 2 nd recess 7 is formed by cutting the base body 2 from the upper surface to the side surface by cutting or the like. In addition, in the case where the 2 nd recess 7 is formed by stacking dielectric materials on the base 2, the 2 nd recess 7 may be formed by cutting out a part of the dielectrics at the place where the 2 nd recess 7 is provided and overlapping the dielectrics. The 2 nd recess 7 may be, for example, circular, rectangular or elliptical in top view. In the case where the 2 nd concave portion 7 is circular in top view, the radius may be 0.1mm to 1mm. In the case where the 2 nd recess 7 is rectangular in top view, the size may be 0.2mm×0.2mm to 2mm×10mm. In the case where the 2 nd recess 7 is circular or elliptical in top view, the stress applied to the corner portion can be relaxed, and as a result, the wiring substrate 1 has fewer cracks.
The 3 rd ground conductor 71 may be located on the inner surface of the 2 nd recess 7. The 3 rd ground conductor 71 may be electrically connected to a ground conductor located inside the base body 2, for example. The 3 rd ground conductor 71 is electrically connected to the ground conductor located inside the base 2, whereby the region functioning as the ground can be expanded. As a result, the grounding of the high-frequency signal transmitted by the 1 st signal conductor 3 is enhanced, and the high-frequency characteristics can be improved. The 3 rd ground conductor 71 may be a product obtained by firing or metal plating the surface of the uppermost insulating layer in the form of a metallization layer, a plating layer, or the like, for example, and may include a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese.
In addition, the 3 rd ground conductor 71 may be connected to and electrically connected with the 1 st ground conductor 6. This can further expand the region functioning as the ground.
Method for producing wiring substrate 1
An example of a method for manufacturing the wiring substrate 1 will be described below. First, an example of a method for manufacturing the substrate 2 constituting the wiring substrate 1 will be described. When the substrate 2 is a sintered body made of alumina, for example, a plurality of insulating layers are formed as follows. First, a slurry is prepared by adding and mixing an appropriate organic binder, solvent, and the like to a raw material powder such as alumina, silica, and the like. Next, the slurry thus produced is subjected to a molding method such as doctor blade method, and is molded into a sheet shape to produce a plurality of ceramic green sheets. At this time, notches are provided at predetermined positions of the ceramic green sheet as the 1 st concave portion 21 and the 2 nd concave portion 7. Then, a plurality of ceramic green sheets are laminated and pressure-bonded. Finally, the laminated ceramic green sheet is fired at a temperature of about 1600 ℃ in a reducing atmosphere, and is shaped appropriately by cutting or punching, thereby producing the substrate 2 of a desired shape.
Next, a process of forming the 1 st signal conductor 3, the connection conductor 5, the 1 st ground conductor 6, the 2 nd ground conductor 61, and the 3 rd ground conductor 71 on the base 2 will be described. When the 1 st signal conductor 3, the connection conductor 5, the 1 st ground conductor 6, the 2 nd ground conductor 61, and the 3 rd ground conductor 71 are formed using a metallization layer containing a high-melting-point metal such as tungsten, molybdenum, or manganese, for example, the following is formed. First, a metal paste is prepared by stirring a powder of a metal having a high melting point, an organic solvent, and a binder together to sufficiently mix them together. The metal paste is printed on a given portion of the ceramic green sheet by screen printing or the like. Then, the ceramic green sheets on which the metal paste is printed are laminated, pressed and fired. Through the above steps, the substrate 2 is coated with the metallization layers as the 1 st signal conductor 3, the connection conductor 5, the 1 st ground conductor 6, the 2 nd ground conductor 61, and the 3 rd ground conductor 71. The 1 st signal conductor 3, the connection conductor 5, the 1 st ground conductor 6, the 2 nd ground conductor 61, and the 3 rd ground conductor 71 may be provided with nickel plating or gold plating on the surfaces. By providing the surface with nickel plating or gold plating, wettability of the joining material such as brazing material in the surface of the metal layer can be improved. As a result, the bondability of the external substrate 8 connected to the metal layer can be improved, and corrosion resistance and weather resistance can be improved.
When the via hole 22 is formed in the substrate 2, for example, a through hole is provided at a predetermined position of the plurality of ceramic green sheets, and the metal paste is filled in the through hole. Then, the ceramic green sheets are stacked and pressed and fired, thereby providing the ceramic green sheet. The through hole may be provided by, for example, mechanical punching using a metal pin, or hole forming using a laser beam. When filling the through-holes with the metal paste, the metal paste may be easily filled by means such as vacuum suction.
Through the above steps, the wiring substrate 1 can be manufactured.
Structure of electronic component housing package 10
The package 10 for accommodating electronic components according to one embodiment of the present disclosure includes a wiring substrate 1 and a frame 11.
The frame 11 may be located on the lower surface of the base 2. The frame portion 11 may surround a mounting area of the electronic component 101 among the lower surface of the base 2. The shape of the frame 11 may be, for example, circular, rectangular, or elliptical in the case of bottom view. The frame 11 may be formed to conform to the shape of the wiring substrate 1 in top view. When the frame 11 is circular in shape in bottom view, the radius may be 1mm×1mm to 10mm×10mm. When the frame 11 is rectangular in shape in bottom view, the size may be 1mm×1mm to 10mm×10mm. The height of the frame 11 may be 0.5mm to 5mm. For example, a metal such as iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten is used for the frame 11. The frame 11 may be made of an alloy of the above-mentioned metals, for example, a copper-tungsten alloy, a copper-molybdenum alloy, an iron-nickel-cobalt alloy, or the like.
Structure of electronic device 100
An electronic device 100 according to an embodiment of the present disclosure includes an electronic component housing package 10, an electronic component 101, and an external substrate 8.
The electronic component 101 is mounted on a mounting area of the lower surface of the base 2. The electronic component 101 may be, for example, an LD, a PD, or the like. The electronic component 101 may be connected to the 1 st pad 23 and the 2 nd pad 24 located on the lower surface of the base 2 by wire bonding or the like.
The 1 st pad 23 may be electrically connected to the terminal 4. The 2 nd pad 24 may be electrically connected with the 1 st signal conductor 3. The 1 st pad 23 may be, for example, circular in the case of bottom view. In the case where the 1 st pad 23 is circular in bottom view, the radius may be 0.1mm to 0.5mm in size.
In the case where there are a plurality of terminals 4 and the respective terminals 4 are not electrically connected to each other, the number of 1 st pads 23 may correspond to the number of terminals 4. The 2 nd pad 24 may be rectangular, for example, in top view. In the case where the 2 nd pad 24 is rectangular in bottom view, its size may be 0.1×0.1mm to 1×1mm. The number of 2 nd pads 24 may correspond to the number of 1 st signal conductors 3. The 1 st pad 23 and the 2 nd pad 24 may be made of a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese. The 1 st pad 23 and the 2 nd pad 24 may be formed by firing or metal plating simultaneously on the surface of the insulating layer in the form of a metallization layer, a plating layer, or the like.
As shown in fig. 9, the external substrate 8 has through holes 81 corresponding one-to-one to the terminals 4, and when the external substrate 8 is connected to the wiring base 1, the terminals 4 are inserted into the through holes 81 provided in the external substrate 8.
The outer substrate 8 may have an upper surface and a lower surface. The through hole 81 may penetrate the lower surface of the outer substrate 8 from the upper surface. The area of the through hole 81 may be smaller than the diameter-enlarged portion 43 and slightly larger than the cross-sectional area of the 2 nd end 42. Since the area of the through hole 81 is smaller than the enlarged diameter portion 43 and larger than the cross-sectional area of the 2 nd end 42, the wiring base 1 and the external substrate 8 can be easily aligned when the terminal 4 is inserted, and the positional deviation of the external substrate 8 can be reduced. As a result, the high-frequency signal transmission between the electronic component 101 disposed on the wiring substrate 1 and the external substrate 8 connected to the electronic component 101 can be stably controlled. Further, since the brazing material applied to the enlarged diameter portion 43 and the outer substrate 8 can be joined, the joining strength can be improved.
As shown in fig. 10, a 2 nd signal conductor 82 may be provided on the lower surface of the external substrate 8. The 2 nd signal conductor 82 may be located at a position that is in contact with the 1 st signal conductor 3 when connected to the wiring substrate 1. Thus, the 2 nd signal conductor 82 and the 1 st signal conductor 3 can be electrically connected easily, and signals can be transmitted efficiently.
The external substrate 8 may be, for example, an FPC. In the case where the external substrate 8 is an FPC, conductive metals such as copper foil are bonded to the upper and lower surfaces of insulating, thin and flexible base films including polyimide and the like. Further, by etching the conductive metal into a predetermined shape, the external substrate 8 provided with the 2 nd signal conductor 82 having a desired shape can be manufactured.
Regarding the connection between the external substrate 8 and the wiring substrate 1, the terminals 4 are inserted into the through holes 81 of the external substrate 8, the enlarged diameter portions 43 of the terminals 4 are connected to the lower surface of the external substrate 8 via a bonding material such as solder, and the upper surface of the wiring substrate 1 and the lower surface of the external substrate 8 are closely adhered to each other to be connected. At this time, the upper surface of the wiring substrate 1 and the lower surface of the external substrate 8 are connected via solder or the like.
Regarding the connection between the external substrate 8 and the wiring base 1, not only the lower surface of the external substrate 8 and the enlarged diameter portion 43, but also the upper surface of the external substrate 8 and the terminals 4 may be joined via solder or the like. This can improve the bonding strength between the wiring base 1 and the external substrate 8.
When the 2 nd signal conductor 82 is provided on the external substrate 8, the 2 nd signal conductor 82 and the wiring substrate 1 may be electrically connected via solder or the like.
The cover may be engaged with the frame 11. The cover may be circular, rectangular, or elliptical, for example, when viewed from the bottom. The lid may be formed to conform to the shape of the base 2 when viewed from the bottom. For example, a metal containing iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten may be used as the cover. Alternatively, an alloy of the above-mentioned metals, for example, a copper-tungsten alloy, a copper-molybdenum alloy, an iron-nickel-cobalt alloy, or the like may be used for the cover. The lid body can be manufactured by a metal working method such as a rolling method and a punching method performed on an ingot of a metal material.
The present disclosure is not limited to the above-described embodiments, and various modifications and the like can be made without departing from the gist of the present disclosure. Further, all changes and the like that fall within the scope of the claims are within the scope of the present disclosure.
Description of the reference numerals
1: wiring substrate
10: package for housing electronic component
11: frame part
100: electronic device
101: electronic component
2: matrix body
21: recess 1
22: via hole
23: no. 1 bonding pad
24: no. 2 bonding pad
3: 1 st signal conductor
4: terminal for connecting a plurality of terminals
41: end 1
42: end 2
43: enlarged diameter part
5: connection conductor
6: 1 st ground conductor
61: 2 nd ground conductor
7: recess 2
71: 3 rd ground conductor
8: external substrate
81: through hole
82: 2 nd signal conductor
Claims (12)
1. A wiring substrate is characterized by comprising:
a base having a 1 st recess opened on an upper surface;
a 1 st signal conductor extending in a 1 st direction at the upper surface;
at least 1 terminal extending from end 1 to end 2; and
a connection conductor positioned in the 1 st concave part and connected with the 1 st end,
in the terminal, the 1 st end is positioned in the 1 st concave part, the 2 nd end is positioned outside the 1 st concave part, and the 1 st concave part is provided with a diameter expanding part,
the enlarged diameter portion is stepped when viewed in cross section of a shaft including the terminal.
2. The wiring substrate according to claim 1, wherein,
the expanded diameter portion extends from the 1 st end toward the opening.
3. The wiring substrate according to claim 1, wherein,
the diameter area S1 of the expanded portion is larger than the diameter area S2 of the 1 st end.
4. The wiring substrate according to any one of claim 1 to 3, wherein,
the plurality of terminals are located in the 1 st concave portion.
5. The wiring substrate according to any one of claim 1 to 3, wherein,
the wiring substrate has a plurality of 1 st concave parts, and 1 terminal is provided in each of the 1 st concave parts.
6. The wiring substrate according to any one of claim 1 to 3, wherein,
the connection conductor is provided so as to surround the outer periphery of the expanded diameter portion when viewed from the top.
7. The wiring substrate according to any one of claim 1 to 3, wherein,
the wiring substrate has:
a pair of 1 st ground conductors extending in the 1 st direction and sandwiching the 1 st signal conductor.
8. The wiring substrate according to claim 7, wherein,
having a 2 nd ground conductor at a position closer to the center of the upper surface than the 1 st signal conductor,
the 2 nd ground conductor is connected to the pair of 1 st ground conductors.
9. The wiring substrate according to claim 7, wherein the substrate has:
and a 2 nd recess provided on the outer periphery of the base body and at the tip of the 1 st ground conductor.
10. The wiring substrate according to claim 9, wherein,
the wiring substrate has: a 3 rd ground conductor located in the 2 nd recess,
the 3 rd ground conductor is connected to the 1 st ground conductor.
11. An electronic component housing package, comprising:
the wiring substrate according to any one of claims 1 to 10; and
a frame portion located on an opposite lower surface of the upper surface.
12. An electronic device, comprising:
the electronic component housing package of claim 11;
an electronic component mounted on the lower surface; and
an external substrate having a through hole corresponding to the terminal,
the terminal is inserted into the through hole.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018242948 | 2018-12-26 | ||
| JP2018-242948 | 2018-12-26 | ||
| PCT/JP2019/050927 WO2020138209A1 (en) | 2018-12-26 | 2019-12-25 | Wiring base, electronic component housing package, and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112585743A CN112585743A (en) | 2021-03-30 |
| CN112585743B true CN112585743B (en) | 2023-10-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980055421.5A Active CN112585743B (en) | 2018-12-26 | 2019-12-25 | Wiring substrate, electronic component housing package, and electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7027578B2 (en) |
| KR (1) | KR102463392B1 (en) |
| CN (1) | CN112585743B (en) |
| WO (1) | WO2020138209A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117546613A (en) * | 2021-06-21 | 2024-02-09 | 京瓷株式会社 | Wiring board, electronic component housing package, and electronic device |
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| JP4828998B2 (en) | 2006-04-24 | 2011-11-30 | 京セラ株式会社 | Wiring board |
| JP5952425B2 (en) | 2012-11-29 | 2016-07-13 | 京セラ株式会社 | Electronic component storage container and electronic device |
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2019
- 2019-12-25 CN CN201980055421.5A patent/CN112585743B/en active Active
- 2019-12-25 KR KR1020217003182A patent/KR102463392B1/en active IP Right Grant
- 2019-12-25 JP JP2020563366A patent/JP7027578B2/en active Active
- 2019-12-25 WO PCT/JP2019/050927 patent/WO2020138209A1/en active Application Filing
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|---|---|---|---|---|
| JP2008135696A (en) * | 2006-10-27 | 2008-06-12 | Kyocera Corp | Electronic component housing package, electronic apparatus, and optical semiconductor apparatus |
| WO2012073963A1 (en) * | 2010-11-29 | 2012-06-07 | 京セラ株式会社 | Package for electronic component mounting and electronic device using same |
| JP2012227482A (en) * | 2011-04-22 | 2012-11-15 | Kyocera Corp | Electronic component mounting package and electronic device using the same |
| JP2012256692A (en) * | 2011-06-08 | 2012-12-27 | Mitsubishi Electric Corp | Optical module |
| JP2014138190A (en) * | 2013-01-18 | 2014-07-28 | Schott Ag | Transistor outline housing and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR102463392B1 (en) | 2022-11-04 |
| WO2020138209A1 (en) | 2020-07-02 |
| JPWO2020138209A1 (en) | 2021-09-09 |
| JP7027578B2 (en) | 2022-03-01 |
| CN112585743A (en) | 2021-03-30 |
| KR20210027447A (en) | 2021-03-10 |
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