JP2016189431A - Package for mounting electronic component and electronic component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component which reduces a stress occurring in a wiring board due to the heat from an electronic component, while ensuring good transmission characteristics of high frequency signals, and to provide an electronic device using the package for mounting an electronic component.SOLUTION: A package 1 for mounting an electronic component has such a structure that each one end 12a, exposed from one principal surface 11a of a base 11, of a pair of first signal terminals 12 provided in a pair of first through holes 11b formed in a base 11, and the signal line conductor 13d and the component connection conductor 13e of a wiring board 13, mounted on the substrate mounting surface 14a of a substrate mounting part 14, are bonded by a bonding material 15. In the pair of first signal terminals 12, the tip of each one end 12a abuts against the end face 13c of the wiring board 13 facing the base, the center axis L of each one end 12a is outward from the component mounting surface 13a of the wiring board 13, and in a direction perpendicular to the component mounting surface 13a, the one ends 12a are provided to hold the substrate mounting surface 14a of the substrate mounting part 14 therebetween.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component mounting package for mounting an electronic component such as an optical semiconductor element used in the field of optical communication and the like, and an electronic apparatus using the same.

  In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and attention has been focused on increasing the speed of electronic devices such as semiconductor devices that receive and transmit optical signals using optical communication devices. The optical output of an electronic device typified by such a semiconductor device is about 0.2 to 0.5 mW, and the driving power of a semiconductor element used as an electronic component is about 5 mW. However, in a semiconductor device with a higher output, the optical output has become a level of 1 mW, and the driving power of the semiconductor element is required to be 10 mW or more. Furthermore, although the transmission speed of the conventional semiconductor device was about 2.5 to 10 Gbps (Giga bit per second), in recent years, a semiconductor element corresponding to 25 to 40 Gbps has been developed, There is a demand for higher output and higher speed.

  A conventional electronic device in which an electronic component including an optical semiconductor element such as an LD (Laser Diode) or a PD (Photo Diode) is mounted on an electronic component mounting package is an electronic component mounting package. The signal terminal and the terminal of the electronic component are electrically connected via a bonding wire. Since the inductance of the bonding wire is large, impedance matching cannot be achieved and transmission loss of high-frequency signals is large.

  On the other hand, one end of the signal terminal inserted through the through hole of the plate-like substrate is exposed from one main surface of the substrate, and the wiring mounted on the substrate mounting portion provided on the one main surface of the substrate. An electronic component mounting package having a structure in which a signal line conductor of a substrate is bonded with a bonding material (brazing material) is used. An electronic device can be obtained by mounting an electronic component on the wiring board of the electronic component mounting package and electrically connecting the signal terminal and the terminal of the electronic component via a signal line conductor (for example, a patent) References 1-3).

JP 2009-77365 A JP 2009-152520 A JP 2009-170865 A

  In the conventional electronic devices as disclosed in Patent Documents 1 to 3, the heat generated by the electronic components mounted on the wiring board is transferred to the electronic component mounting package via the board mounting portion on which the wiring board is mounted. Therefore, the stress generated in the wiring board due to the heat from the electronic component can be reduced, but it cannot be said that the transmission characteristic of the high-frequency signal is sufficient.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting package having good high frequency signal transmission characteristics and an electronic device using the electronic component mounting package while reducing the stress generated in the wiring board by heat from the electronic component. It is to be.

The present invention is a substrate formed in a plate shape and having a pair of through holes penetrating in the thickness direction;
A substrate mounting portion made of metal provided on one main surface of the base body and having a substrate mounting surface perpendicular to the one main surface;
The wiring board is mounted on the board mounting surface of the board mounting portion in contact with the board mounting surface so that one end surface thereof is separated from one main surface of the base body and faces the pair of through holes. A wiring board provided with a component connection conductor to which an electronic component is connected and a signal line conductor on a component mounting surface located on the back surface of the surface in contact with the substrate mounting surface;
A pair of signal terminals for transmitting a high-frequency signal, each comprising a linear conductor and inserted through the pair of through holes so that one end is exposed from one main surface of the base body,
The tip of the one end is in contact with the one end surface of the wiring board,
The central axis of the one end is provided outside the component mounting surface of the wiring board,
In the direction perpendicular to the component mounting surface, the one end portion and the board mounting portion are located at a position where the one end portion is provided with the substrate mounting surface of the substrate mounting portion in between. ,
An electronic component mounting package comprising: the one end portion of the pair of signal terminals; and a conductive bonding material for bonding the signal line conductor and the component connection conductor.

  In addition, the present invention is an electronic device including the electronic component mounting package and an electronic component connected to the component connection conductor of the wiring board in the electronic component mounting package.

  According to the present invention, there are provided an electronic component mounting package that reduces stress generated in a wiring board due to heat from the electronic component and has good high-frequency signal transmission characteristics, and an electronic device using the electronic component mounting package. can do.

It is the perspective view which looked at the electronic component mounting package 1 which concerns on one Embodiment of this invention from the one main surface 11a side of the base | substrate 11. FIG. FIG. 3 is a perspective view of the electronic component mounting package 1 as viewed from the other main surface 11e side of a base body 11. FIG. 2 is a view of an electronic component mounting package 1 as viewed from a direction perpendicular to a wiring board 13. FIG. 2 is a view of the electronic component mounting package 1 as viewed from the one main surface 11a side of a base body 11; It is the figure which looked at the electronic component mounting package 1 from the other main surface 11e side of the base | substrate 11. FIG. It is sectional drawing which looked at the electronic component mounting package 1 shown in FIG. 4 from cut surface line AA. 1 is a perspective view of an electronic device 2 according to an embodiment of the present invention when viewed from the side of a main surface 11a of a base 11. FIG. FIG. 3 is a view of the electronic device 2 as viewed from a direction perpendicular to the wiring board 13. FIG. 3 is a view of the electronic device 2 as viewed from the one principal surface 11a side of a base body 11. It is sectional drawing which looked at the electronic apparatus 2 shown in FIG. 9 from cut surface line AA.

  An electronic component mounting package and an electronic device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 to 6 are diagrams showing the configuration of the electronic component mounting package 1 according to the present embodiment, and FIGS. 7 to 10 are diagrams showing the configuration of the electronic device 2 according to the present embodiment.

  The electronic component mounting package 1 is a package for mounting the electronic component 21. The electronic device 2 is a semiconductor device that receives and transmits optical signals using an optical communication device, and is connected to the electronic component mounting package 1 and the component connection conductor 13e of the wiring board 13 in the electronic component mounting package 1. The electronic component 21 is comprised.

  The electronic component mounting package 1 includes a base 11, a pair of first signal terminals 12 made of a linear conductor that transmits a high-frequency signal, a wiring board 13 having a component connection conductor 13e to which an electronic component 21 is connected, A board mounting portion 14 made of a metal on which the wiring board 13 is mounted, a bonding material 15, a ground terminal 16, and a second signal terminal 17 are configured. Note that a high-frequency signal is a signal corresponding to a transmission speed of a semiconductor device of 2.5 Gbps or higher.

  The base body 11 is formed in a plate shape and has a pair of first through holes 11b and second through holes 11d penetrating in the thickness direction.

  The base 11 has a function of dissipating heat generated by the electronic component 21 mounted on the wiring substrate 13 mounted on the substrate mounting surface 14 a of the substrate mounting portion 14 to the outside of the electronic component mounting package 1. The base 11 is made of a metal having good thermal conductivity, and is close to the thermal expansion coefficient of the electronic component 21 or the ceramic wiring board 13 to be mounted or has a low cost. For example, an Fe—Ni—Co alloy or Fe -An iron-based alloy such as a Mn alloy or a metal such as pure iron is selected. More specifically, there is an SPC (Steel Plate Cold) material of Fe 99.6 mass% -Mn 0.4 mass%. For example, when the base 11 is made of an Fe—Mn alloy, the ingot (lumb) is manufactured to a predetermined shape by applying a known metal processing method such as rolling or punching, and the first through hole 11b and the second through hole are manufactured. The hole 11d is formed by drilling, for example.

  The shape of the substrate 11 is usually a flat plate having a thickness of 0.5 to 2 mm, and the shape thereof is not particularly limited, but for example, a disk having a diameter of 3 to 10 mm and a radius of 1.5 to 8 mm. For example, a semicircular plate with a part of the circumference cut off, a square plate with a side of 3 to 15 mm, and the like. The thickness of the base body 11 may not be uniform. For example, if the thickness of the outer side of the base body 11 is increased, a heat sink such as a housing for housing the electronic device 2 can be easily adhered. It is preferable because the heat generated from the heat can be easily released to the outside through the substrate 11.

  The thickness of the substrate 11 is preferably 0.5 mm or more and 2 mm or less. When the thickness of the substrate 11 is less than 0.5 mm, the bonding temperature or the like when bonding a metal lid (not shown) for protecting the electronic component 21 to the main surface 11a of the metal substrate 11 is set. The base 11 is easily bent and deformed depending on the joining conditions, and the airtightness is likely to be lowered due to the deformation. On the other hand, when the thickness of the substrate 11 exceeds 2 mm, the thickness of the electronic component mounting package 1 and the electronic device 2 is increased, and it is difficult to reduce the size.

  The main surface 11a of the base 11 has excellent corrosion resistance, excellent wettability with a bonding material (brazing material) for bonding and fixing the electronic component 21, the wiring board 13, or the lid, and has a thickness of 0. It is preferable that a 5 to 9 μm Ni layer and an Au layer having a thickness of 0.5 to 5 μm are sequentially deposited by plating. Thereby, it is possible to effectively prevent the base 11 from being oxidatively corroded, and to satisfactorily braze (join) the electronic component 21, the wiring board 13, or the lid to the base 11.

  The substrate mounting portion 14 is provided on one main surface 11a of the base 11, and has a substrate mounting surface 14a perpendicular to the one main surface 11a. In the electronic component mounting package 1, the substrate mounting unit 14 dissipates heat generated by the electronic component 21 mounted on the wiring substrate 13 mounted on the substrate mounting surface 14 a to the outside of the electronic component mounting package 1. It has a function. The board mounting portion 14 can reduce stress generated in the wiring board 13 due to heat from the electronic component 21 mounted on the wiring board 13 mounted on the board mounting surface 14a.

  In the present embodiment, the substrate mounting portion 14 is formed integrally with the base body 11, is made of a metal having good thermal conductivity similar to the base body 11, and is perpendicular to the main surface 11 a of the base body 11. And an outwardly convex arcuate surface located on the back side of the substrate mounting surface 14a and a side surface connecting the substrate mounting surface 14a and the arcuate surface.

  The wiring board 13 is disposed on the board mounting surface 14a of the board mounting part 14 such that one end face (base-facing end face 13c) is separated from one main surface 11a of the base 11 and faces the pair of first through holes 11b. It is mounted in contact with the substrate mounting surface 14a. Specifically, the wiring substrate 13 is mounted on the substrate mounting surface 14 a of the substrate mounting portion 14 so as to be separated from one main surface 11 a of the base 11, and the mounting conductor 18 is provided on the substrate mounting surface 14 a of the substrate mounting portion 14. A base surface facing the pair of first through holes 11b facing the main surface 11a of the base 11 and the component mounting surface 13b positioned on the back surface of the contact surface 13a. And an opposite end face 13c. The wiring board 13 has a component mounting surface 13b, a signal line conductor 13d for transmitting a high-frequency signal from one of the pair of first signal terminals 12 to the electronic component 21, and an electronic A component connection conductor 13e serving as a grounding conductor, which is mounted with the component 21 and is electrically connected to the other first signal terminal 12 serving as a ground electrode, is provided.

The wiring substrate 13 is formed of an insulating substrate made of a ceramic insulating material such as an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body, an aluminum nitride (AlN) sintered body, and the like. The signal line conductor 13d, the component connection conductor 13e, The wiring conductor containing is formed. If the insulating substrate is made of, for example, an aluminum oxide sintered body, an organic solvent suitable for the raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. Then, a solvent is added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1600 ° C.

  In the wiring substrate 13, the wiring conductor is, for example, on the upper surface of the insulating substrate (the surface corresponding to the component mounting surface 13 b on which the electronic component 21 is mounted on the wiring substrate 13), one of the pair of first signal terminals 12. A signal line conductor 13d for electrically connecting one end portion 12a of one signal terminal 12 and a ground electrode on the lower surface of the electronic component 21, which is a component connecting conductor 13e to which the electronic component 21 is connected, are electrically connected. And a grounding conductor is formed. In addition, the component connection conductor 13e is electrically connected to the ground conductor of the external electric circuit via the bonding material 15 and the other first signal terminal 12, and the lower surface of the insulating substrate (the back surface of the component mounting surface 13b in the wiring substrate 13). Connected to the board mounting surface 14a of the board mounting portion 14 formed on the board mounting surface 14a formed on the board mounting surface 14a of the board mounting portion 14). The mounting conductor 18 is electrically connected to the ground conductor of the external electric circuit via the board mounting portion 14 and the ground terminal 16. Alternatively, in the wiring board 13, the wiring conductor is connected to the component connection conductor 13 e and the mounting conductor 18 by a connection conductor formed on the side surface of the insulating substrate or formed through the insulating substrate. The mounting conductor 18 is preferably provided at least at a position overlapping the bonding material 15 in the direction perpendicular to the component mounting surface 13b of the wiring board 13, and more preferably provided on the entire lower surface of the insulating substrate. Is good. As a result, in a direction perpendicular to the component mounting surface 13b of the wiring board 13, the one end portions 12a of the pair of first signal terminals 12 are provided with the substrate mounting surface 14a of the board mounting portion 14 made of metal interposed therebetween. However, the electric field distribution between the pair of first signal terminals 12 and the signal line conductor 13d and the component connection conductor 13e of the wiring board 13 through the bonding material 15 is between the mounting conductor 18 and the electric field distribution. Therefore, the electric field distribution around the connection portion is stabilized, and the electronic component mounting package 1 having better high-frequency signal transmission characteristics is obtained.

  The signal line conductor 13 d has a function of transmitting a high-frequency signal from one of the pair of first signal terminals 12 to the electronic component 21. Further, since the connection of the signal line conductor 13d differs depending on the electronic component 21, it is formed accordingly. The electronic component 21 and the signal line conductor 13d are connected by, for example, a bonding wire. In order to reduce the signal transmission loss by shortening the bonding wire, for example, as shown in FIG. It is preferable that the connection position of the bonding wire be as close as possible to the electronic component 21 by bending the conductor 13d.

  When the signal line conductor 13d is bent, if the bending angle is bent stepwise so that the bending angle is larger than 90 °, or if the corner portion of the bent portion is rounded, the high frequency due to reflection at the bent portion. This is preferable because the loss can be reduced. In the case of bending stepwise, it is preferable to set the bending angle to 120 ° or more because loss is reduced. Further, in the example shown in FIG. 3, only the outer side of the bent part is bent stepwise, but it is more preferable that the inner side of the bent part is bent stepwise and rounded similarly.

  In the wiring board 13, a wiring conductor including the signal line conductor 13 d and the component connection conductor 13 e can be formed by a well-known method of forming metal metallization by simultaneous firing with the insulating board or after the insulating board is manufactured, There is a method of forming by a vapor deposition method or a photolithography method after manufacturing. When the electronic device 2 is small, the wiring board 13 mounted on the electronic device 2 is further small, so that the wiring conductor is fine, and the positioning accuracy between the wiring conductor and the pair of first signal terminals 12 is increased. Is preferably formed by vapor deposition or photolithography. In this case, the main surface of the insulating substrate may be polished as necessary.

  Hereinafter, the case where the wiring conductor is formed on the wiring substrate 13 by vapor deposition or photolithography will be described in detail. The wiring conductor is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

From the viewpoint of improving the adhesion with an insulating substrate made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni- It is preferable to comprise at least one kind of metal having a thermal expansion coefficient close to that of ceramics, such as a Cr) alloy, tantalum nitride (Ta ₂ N), and the thickness is preferably 0.01 to 0.2 μm. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the insulating substrate. If the thickness exceeds 0.2 μm, the adhesion metal layer is caused by internal stress during film formation. There is a tendency to easily peel from the insulating substrate.

  From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion preventing layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and its thickness is preferably 0.05 to 1 μm. If the thickness of the diffusion preventive layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to function as a diffusion preventive layer. If the thickness exceeds 1 μm, the diffusion preventive layer is caused by internal stress during film formation. Tends to be easily peeled off from the adhesive metal layer. When a Ni—Cr alloy is used for the diffusion preventing layer, the adhesion metal layer can be omitted because the Ni—Cr alloy has good adhesion to the insulating substrate.

  The main conductor layer is preferably made of at least one of gold (Au), copper (Cu), nickel (Ni), and silver (Ag) having a low electric resistance, and the thickness is preferably 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance becomes large, and the electric resistance required for the wiring conductor of the wiring board 13 tends to be not satisfied. The main conductor layer tends to be easily peeled off from the diffusion preventing layer. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

  The pair of first signal terminals 12 are formed in a columnar shape, and are inserted into the pair of first through holes 11b so that each end 12a is exposed from the one main surface 11a of the base body 11. In the pair of first signal terminals 12, the tip ends of the one end portions 12 a abut against the substrate-facing end surface 13 c of the wiring substrate 13, and the center axis L of each one end portion 12 a is outside the component mounting surface 13 b of the wiring substrate 13. It is provided to become. Further, in the direction perpendicular to the component mounting surface 13 b of the wiring substrate 13, each end portion 12 a of the pair of first signal terminals 12 is provided with the substrate mounting surface 14 a of the substrate mounting portion 14 interposed therebetween. In other words, in the substrate mounting portion 14, the substrate mounting surface 14 a is disposed between the one end portions 12 a of the pair of first signal terminals 12. The bonding material 15 has conductivity, and bonds the one end 12a of the pair of first signal terminals 12 to the signal line conductor 13d and the component connection conductor 13e of the wiring board 13.

  In the example shown in FIGS. 7 to 10, the electronic device 2 includes an electronic component mounting package 1 including a base body 11 having a pair of first through holes 11 b, and one electronic component 21 is mounted on a wiring board 13. However, depending on the number of electronic components 21 and the number of terminals of the electronic components 21, the base 11 is different from the pair of first through holes 11 b. It may be configured to have two through holes 11d. In the present embodiment, the electronic component mounting package 1 includes a second signal terminal 17 made of a linear conductor, and the second signal terminal 17 is such that one end portion 17 a is exposed from one main surface 11 a of the base 11. In addition, the second through hole 11d is inserted. For example, the second signal terminal 17 functions as a signal terminal that electrically connects a PD that receives light emitted from an LD mounted as the electronic component 21 and generates an electric signal, and an external electric circuit.

  The high frequency signal flows on the surface of the conductor due to the skin effect. The skin effect is a phenomenon in which the current density is high on the surface of the conductor and becomes low as it leaves the surface. In the present embodiment, in the connection structure of the connection portion between the pair of first signal terminals 12, the signal line conductor 13 d of the wiring board 13, and the component connection conductor 13 e through the bonding material 15, the pair of first signal terminals 12 Since the tip end of each one end portion 12a is in contact with the base-facing end surface 13c of the wiring board 13, each end portion 12a, the signal line conductor 13d, and the component connection conductor 13e are overlapped facing each other. Compared with the connection structure, the signal line conductor 13d and the component connection conductor 13e from the surface (inner side surface) and the outer side surface (outer side surface) of each end portion 12a on the substrate mounting portion 14 side. In the high-frequency signal transmitted through the inner surface and the outer surface of each end portion 12a and incident on the signal line conductor 13d and the component connection conductor 13e via the bonding material 15. The difference in length of the transmission path respectively is reduced. Moreover, the transmission path of the high frequency signal by the joining material 15 between each one end part 12a, the signal line conductor 13d, and the component connection conductor 13e is shortened, and with respect to each one end part 12a, the signal line conductor 13d, and the component connection conductor 13e. The bending angle of the transmission path of the high frequency signal is small. As a result, impedance matching is applied to a certain characteristic impedance at the connection portion between the one end portion 12a of the pair of first signal terminals 12 and the signal line conductor 13d and the component connection conductor 13e of the wiring board 13 via the bonding material 15. Thus, the mismatch of characteristic impedance is suppressed, and the electronic component mounting package 1 having a small reflection loss and good transmission characteristics is obtained.

  Further, in the present embodiment, as shown in FIG. 6, in the connection structure of the connection portion between the pair of first signal terminals 12, the signal line conductor 13 d of the wiring board 13 and the component connection conductor 13 e through the bonding material 15. The surface on the mounting conductor 18 side (the surface on the substrate mounting portion 14 side (inside surface)) at each end portion 12a of the pair of first signal terminals 12 is disposed closer to the central axis L than the mounting conductor 18. At the same time, the central axis L of each one end portion 12a of the pair of first signal terminals 12 is outward from the component mounting surface 13b of the wiring board 13. Specifically, the pair of first signal terminals 12 has one end at each end. Since the central axis L of the portion 12a is provided at a distance of 0.1 mm outward from the component mounting surface 13b of the wiring board 13, the tip of each one end portion 12a of the pair of first signal terminals 12, the mounting conductor 18, and Can suppress electrical short circuit Furthermore, in FIG. 6, the surface area of each one end portion 12a exposed to the central axis L side from the component mounting surface 13b is increased, and the electric field distribution generated between each one end portion 12a and one main surface 11a of the base 11 is stabilized. Thus, the electronic component mounting package 1 having better transmission characteristics of high-frequency signals is obtained. When the pair of first signal terminals 12 are provided such that the central axis L of each one end portion 12a is on the inner side (the mounting conductor 18 side) than the component mounting surface 13b of the wiring board 13, In FIG. 6, the surface area of each end portion 12a exposed to the mounting conductor 18 side from the component mounting surface 13b is increased, but an electric field generated from each end portion 12a is applied to the mounting conductor 18, the base body 11 or the board mounting portion 14. As a result, the electric field distribution becomes unstable with variations in the respective intervals due to manufacturing variations. Therefore, it is preferable that the pair of first signal terminals 12 be provided such that the central axis L of each one end portion 12 a is outward from the component mounting surface 13 b of the wiring board 13.

  Further, in the present embodiment, the pair of first signal terminals 12 are arranged in the direction perpendicular to the component mounting surface 13b of the wiring board 13 with respect to the positions of the one end portion 12 and the board mounting portion 14 so that each end portion 12a is made of metal. Since the substrate mounting surface 14a of the substrate mounting portion 14 is provided between the one end portion 12a of the pair of first signal terminals 12 and the substrate mounting surface 14a of the substrate mounting portion 14, an unnecessary capacitance component is provided. When impedance matching is performed on a certain characteristic impedance, mismatch of characteristic impedance is suppressed, and as a result, high-frequency signal transmission characteristics can be improved. That is, in the connection structure of the connection portion through the bonding material 15 between the pair of first signal terminals 12, the signal line conductor 13 d and the component connection conductor 13 e of the wiring board 13, the characteristic impedance that decreases due to the capacitance component of the bonding material 15 Can be increased to match the desired characteristic impedance. Further, since the board mounting portion 14 and the tips of the respective one end portions 12a of the pair of first signal terminals 12 do not overlap in the direction perpendicular to the component mounting surface 13b of the wiring board 13, the board mounting portion 14 and the pair of first signal terminals 12 are not overlapped. The stress caused by the thermal expansion or contraction of the one signal terminal 12 is suppressed from being concentrated on the connection portion between the wiring substrate 13 and the tip of each one end portion 12a of the pair of first signal terminals 12, and the wiring substrate 13 is cracked. And cracks are suppressed.

  In the pair of first signal terminals 12, the distance between each end 12 a and the board mounting surface 14 a when viewed from the direction perpendicular to the component mounting surface 13 b of the wiring board 13 is the pair of first signal terminals 12. It is preferable that the wavelength of the high-frequency signal transmitted through the signal line conductor 13d is ¼ or less. Thereby, the resonance which arises when a high frequency signal transmits a pair of 1st signal terminal 12 can be suppressed.

  Further, the shape of the tip of each one end portion 12a of the pair of first signal terminals 12 is not particularly limited, but is preferably a tapered shape such as a hemispherical shape, a truncated cone shape, and a truncated pyramid shape. Since the tip of each one end portion 12a of the pair of first signal terminals 12 is tapered, the change in the shape of the transmission path of the high-frequency signal becomes gentle, so that the change in impedance at each one end portion 12a becomes gentle, Even if it forms into the fillet shape of the joining material 15 which can obtain sufficient joining strength with each one end part 12a, the signal line conductor 13d, and the component connection conductor 13e, the signal line conductor 13d and the joining material 15 on the component connection conductor 13e The thickness can be reduced, the impedance can be further reduced, and a connection structure with a small reflection loss of high-frequency signals and good transmission characteristics can be obtained. In addition, while reducing the thickness of the bonding material 15 on the signal line conductor 13d and the component connection conductor 13e, it is possible to increase the area in which each end portion 12a of the pair of first signal terminals 12 and the bonding material 15 are connected. Therefore, the joining strength between each one end 12a, the signal line conductor 13d, and the component connection conductor 13e is improved, and a connection structure having excellent connection reliability can be obtained. Furthermore, at the connection portion between the pair of first signal terminals 12 and the signal line conductor 13d and the component connection conductor 13e of the wiring board 13, the capacitance component generated at the tip of each end portion 12a of the pair of first signal terminals 12 can be reduced. Thus, the value of the characteristic impedance that decreases due to the capacitance component of the bonding material 15 can be increased, and matching with the desired characteristic impedance can be achieved.

  The pair of first signal terminals 12 is made of a metal such as an Fe—Ni—Co alloy or Fe—Ni alloy. For example, when the first signal terminal 12 is made of an Fe—Ni—Co alloy, By performing a known metal working method such as rolling, punching or cutting, a wire having a length of 1.5 to 22 mm and a diameter of 0.1 to 1 mm is produced. In order to reduce the size of the pair of first signal terminals 12 while ensuring the strength of the pair of first signal terminals 12 while performing matching with a higher characteristic impedance, the diameter of the pair of first signal terminals 12 is preferably 0.15 to 0.25 mm. If the diameter of the pair of first signal terminals 12 is smaller than 0.15 mm, the first signal terminals 12 are likely to be bent during handling when the electronic component mounting package 1 is mounted, and workability is likely to be reduced. Further, if the diameter is larger than 0.25 mm, the diameter of the first through hole 11b when impedance matching is performed increases with the diameter of the first signal terminal 12, which is not suitable for downsizing of the product. End up.

  In the electronic component mounting package 1 of the present embodiment, the pair of first signal terminals 12 are protruded from the one main surface 11a of the base 11 until the tips of the one end portions 12a abut against the base-facing end surface 13c of the wiring board 13. Each other end protrudes from the other main surface 11e of the base 11 by 1 to 20 mm, and is fixed by a sealing material 11c filled in the first through hole 11b. For example, as in the example shown in FIG. 9, each end portion 12a of the pair of first signal terminals 12 and the electronic component 21 are electrically connected via the signal line conductor 13d and the component connection conductor 13e, The first signal terminal 12 has a function of transmitting input / output signals between the electronic component 21 and the external electric circuit by electrically connecting the other end of the first signal terminal 12 to an external electric circuit (not shown). Fulfill.

  The sealing material 11 c is made of an insulating inorganic material such as glass or ceramics, and ensures an insulation interval between the first signal terminal 12 and the base body 11, and the first signal terminal 12 is connected to the first through hole 11 b of the base body 11. It has the function of fixing inside. Further, the sealing material 11 c has a function of securing an insulation interval between the second signal terminal 17 and the base body 11 and fixing the second signal terminal 17 in the second through hole 11 d of the base body 11. Examples of such a sealing material 11c include glass such as borosilicate glass and soda glass, and a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 11c. The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide.

  The first signal terminal 12 is fixed through the sealing material 11c filled in the first through hole 11b, and the second signal terminal 17 is fixed through the sealing material 11c filled in the second through hole 11d. For example, when the sealing material 11c is made of glass, first, glass powder is molded using a known powder pressing method or extrusion molding method, and the inner diameter is set to the first signal terminal 12 and the second signal. A cylindrical molded body having an outer diameter matched to the shape of the first through hole 11b and the second through hole 11d in accordance with the outer diameter of the terminal 17 is produced, and the first signal is placed in the hole of the molded body of the sealing material 11c. The molded body is inserted into the mold through the terminal 12 and the second signal terminal 17, heated to a predetermined temperature to melt the glass, and then cooled and solidified, whereby the first signal terminal 12 and the second signal terminal 17 are A sealing material 11c having a predetermined shape to which the two-signal terminal 17 is fixed Keep forms. Thus, the first through hole 11b and the second through hole 11d are hermetically sealed by the sealing material 11c, and the first signal terminal 12 and the second signal terminal 17 are insulated from the base body 11 by the sealing material 11c. Are fixed to form a coaxial line.

  Only the sealing material 11c matched to the shape of the first through hole 11b and the second through hole 11d is formed in advance, and this is inserted into the first through hole 11b and the second through hole 11d and the first signal terminal 12 is inserted. And the second signal terminal 17 are also passed through the holes of the sealing material 11c, and the sealing material 11c, the inner surfaces of the first through hole 11b and the second through hole 11d, and the outer surfaces of the first signal terminal 12 and the second signal terminal 17 May be simultaneously performed.

  In the present embodiment, the ground terminal 16 is joined to the base 11. The ground terminal 16 is manufactured in the same manner as the first signal terminal 12, and is bonded to the other main surface 11e of the base 11 using a bonding material 11f (brazing material) or the like. In order to facilitate positioning and improve bonding strength, a hole may be formed in the other main surface 11e of the base 11 in advance, and the ground terminal 16 may be bonded to the hole. By joining the ground terminal 16 to the base 11 in this way, the base 11 also functions as a ground conductor when the first signal terminal 12 is connected to an external electric circuit.

  In this embodiment, the wiring board 13 is joined to the board mounting part 14, and each end part 12 a of the first signal terminal 12 is connected to the signal line conductor 13 d and the component connection conductor 13 e with a joining material (brazing material) 15. The electronic component mounting package 1 according to FIG.

  Then, the electronic component 21 is mounted on the wiring board 13 in the electronic component mounting package 1, and the lid body is bonded to the base body 11 as necessary, so that the present embodiment as shown in the example shown in FIGS. Electronic device 2 of the form.

  The electronic device 2 according to the present embodiment reduces the stress generated in the wiring board 13 due to the heat from the electronic component 21 and also has a good high frequency signal transmission characteristic, and the wiring board of the electronic component mounting package 1 according to the present embodiment. Since the electronic component 21 is mounted on the electronic device 13, the electronic device can operate with high frequency.

  Examples of the electronic component 21 include optical semiconductor elements such as LD (laser diode) and PD (photodiode), semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, and pressure sensor elements. , Capacitive elements, resistors and the like.

  The electronic component 21 may be mounted on the wiring board 13 by being fixed with a conductive bonding material such as a brazing material or a conductive resin. For example, when the electronic component 21 is mounted on the wiring board 13 after the wiring board 13 is mounted on the board mounting portion 14, a gold-tin (Au—Sn) alloy or gold-germanium (Au) is used to fix the wiring board 13. -Ge) brazing material is used as a bonding material, and for fixing the electronic component 21, a tin-silver (Sn-Ag) alloy or a tin-silver-copper (Sn-Ag-Cu) alloy having a melting point lower than these is used. A brazing material or a resin adhesive such as Ag epoxy that can be cured at a temperature lower than the melting point may be used as the bonding material.

  Further, after mounting the electronic component 21 on the wiring board 13, the wiring board 13 may be mounted on the board mounting portion 14. In this case, contrary to the above, when mounting the wiring board 13 on the board mounting portion 14. The melting point of the bonding material used for the above may be lowered. In any case, a paste of a bonding material is printed on the wiring substrate 13 by using a well-known screen printing method, a bonding material layer is formed by a photolithography method, or a low melting point brazing material to be a bonding material For example, a preform can be placed.

  The lid provided on the main surface 11a of the base body 11 as necessary in the electronic device 2 has an outer shape along the outer peripheral region of the base body 11, and the wiring board 13 and the substrate mounting portion on the main surface 11a of the base body 11 14 has a space that covers 14. The lid may be provided with a window that transmits light at a portion facing the electronic component 21, or an optical fiber and an optical isolator for preventing return light may be joined instead of or in addition to the window. Good. In the electronic device 2 according to the present embodiment, when the electronic component 21 of the optical element that is optically connected to the outside is mounted, the deformation of the base body 11 due to thermal expansion is suppressed. The shift in optical connection can be reduced, and the optical characteristics can be maintained well.

  The lid is made of a metal such as an Fe—Ni—Co alloy, an Fe—Ni alloy, or an Fe—Mn alloy, and is produced by subjecting these plate materials to a known metal working method such as press working or punching. The lid body preferably has the same thermal expansion coefficient as the material of the substrate 11, and more preferably the same material as the material of the substrate 11. When the lid has a window, a flat or lens-shaped glass window member is bonded to a member provided with a hole in the portion facing the electronic component 21 with a low melting point glass or the like.

  The lid is joined to the base 11 by welding such as seam welding or YAG laser welding or by brazing with a joining material such as an Au-Sn brazing material.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.

  For example, in the above-described embodiment, the electronic component mounting package 1 using the circular base body 11 as shown in FIG. 1 has been described as an example, but a box-shaped electronic component mounting package may be used.

  If the electronic component 21 generates a large amount of heat, a Peltier element or the like is mounted between the electronic component 21 (and the wiring board 13) and the board mounting portion 14 to cool the electronic component 21. Good.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting package 2 Electronic device 11 Base | substrate 11a One main surface 11b 1st through-hole 11c Sealing material 11d 2nd through-hole 11e Other main surface 12 1st signal terminal 12a One end part 13 Wiring board 13a Contact surface 13b Component mounting Surface 13c Substrate facing end surface 13d Signal line conductor 13e Component connection conductor 14 Substrate mounting portion 14a Substrate mounting surface 15 Bonding material 16 Ground terminal 17 Second signal terminal 17a One end portion 18 Mounting conductor 21 Electronic component

Claims (5)

A base formed in a plate shape and having a pair of through holes penetrating in the thickness direction;
A substrate mounting portion made of metal provided on one main surface of the base body and having a substrate mounting surface perpendicular to the one main surface;
The wiring board is mounted on the board mounting surface of the board mounting portion in contact with the board mounting surface so that one end surface thereof is separated from one main surface of the base body and faces the pair of through holes. A wiring board provided with a component connection conductor to which an electronic component is connected and a signal line conductor on a component mounting surface located on the back surface of the surface in contact with the substrate mounting surface;
A pair of signal terminals for transmitting a high-frequency signal, each comprising a linear conductor and inserted through the pair of through holes so that one end is exposed from one main surface of the base body,
The tip of the one end is in contact with the one end surface of the wiring board,
The central axis of the one end is provided outside the component mounting surface of the wiring board,
In the direction perpendicular to the component mounting surface, the one end portion and the board mounting portion are located at a position where the one end portion is provided with the substrate mounting surface of the substrate mounting portion in between. ,
An electronic component mounting package comprising: the one end portion of the pair of signal terminals; and a conductive bonding material that joins the signal line conductor and the component connection conductor.   The electronic component mounting package according to claim 1, wherein the base body and the substrate mounting portion are integrally formed.   3. The electronic component mounting package according to claim 1, wherein the pair of signal terminals have a cylindrical shape.   The electronic component mounting package according to claim 1, wherein tips of the one end portions of the pair of signal terminals are tapered. The electronic component mounting package according to any one of claims 1 to 4,
An electronic device comprising: an electronic component connected to the component connection conductor of the wiring board in the electronic component mounting package.