JP6431441B2 - Electronic component mounting package and electronic device using the same - Google Patents

Description

  The present invention relates to an electronic component mounting package for mounting an electronic component such as an optical semiconductor element used in the field of optical communication and the like, and an electronic apparatus using the same.

  In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and attention has been focused on increasing the speed of electronic devices such as semiconductor devices that receive and transmit optical signals using optical communication devices. The optical output of an electronic device typified by such a semiconductor device is about 0.2 to 0.5 mW, and the driving power of a semiconductor element used as an electronic component is about 5 mW. However, in a semiconductor device with a higher output, the optical output has reached a level of 1 mW, and the driving power of the semiconductor element is required to be 10 mW or more. Furthermore, although the transmission speed of the conventional semiconductor device was about 2.5 to 10 Gbps (Giga bit per second), in recent years, a semiconductor element corresponding to 25 to 40 Gbps has been developed, There is a demand for higher output and higher speed.

  A conventional electronic device in which an electronic component including an optical semiconductor element such as an LD (Laser Diode) or a PD (Photo Diode) is mounted on an electronic component mounting package is an electronic component mounting package. The signal terminal and the terminal of the electronic component are electrically connected via a bonding wire, and since the inductance at the bonding wire is large, impedance matching cannot be achieved and transmission loss of high-frequency signals increases.

  For example, Patent Documents 1 and 2 disclose a configuration that solves the problems of the electronic device having a structure in which the signal terminal and the terminal of the electronic component are electrically connected via the bonding wire as described above. The electronic devices disclosed in Patent Documents 1 and 2 include an electronic component mounting package and an electronic component. The electronic component mounting package includes a plate-like base body having a through hole, a signal terminal inserted into the through hole of the base body so that one end portion is exposed from one main surface of the base body in the thickness direction, and the base body A substrate support part protruding from one main surface to one side in the thickness direction, a wiring board supported by the substrate support part on which a signal line conductor is formed, one end of a signal terminal, and a signal line conductor of the wiring board A bonding material (a brazing material) to be bonded. In the electronic devices disclosed in Patent Documents 1 and 2, the electronic component is mounted on the wiring board of the electronic component mounting package, and the signal terminal and the terminal of the electronic component are electrically connected via the signal line conductor. ing.

JP 2004-214651 A JP 2004-363550 A

  In an electronic device as disclosed in Patent Documents 1 and 2, an unnecessary capacitance component is generated between one end portion of a signal terminal and a substrate support portion facing each other through a wiring board, and impedance matching is performed on a certain characteristic impedance. Even if it takes, there exists a problem that a characteristic impedance will shift | deviate and the transmission characteristic of a high frequency signal will fall.

  An object of the present invention is to provide an electronic component mounting package having good high-frequency signal transmission characteristics, and an electronic device using the electronic component mounting package.

  The present invention is a pair of signal terminals formed of a base plate having a pair of through holes formed in a plate shape and penetrating in the thickness direction, and a linear conductor for transmitting a high-frequency signal, one end of which is a part of the base body. A wiring board that is provided on one side in the thickness direction from the main surface, provided to each of the pair of through holes, and facing the one end of the pair of signal terminals, A wiring board in which a component mounting area on which an electronic component is mounted and a signal line conductor for transmitting a high-frequency signal from the signal terminal to the electronic component are formed on an opposing surface facing one end; The one end of the signal terminal is joined to the signal line conductor, the bonding material is provided on the one main surface of the base, and supports the wiring substrate by contacting the back surface of the facing surface of the wiring substrate A substrate support made of metal When viewed from a direction perpendicular to the opposing surface of the wiring board, an electronic component mounting package, characterized in that it comprises, said substrate supporting portion which does not overlap with the one end of said pair of signal terminals.

  The present invention is an electronic device comprising the electronic component mounting package and an electronic component mounted in the component mounting region of the wiring board in the electronic component mounting package.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting package with the favorable transmission characteristic of a high frequency signal and the electronic apparatus using this electronic component mounting package can be provided.

It is the perspective view which looked at the electronic component mounting package 1 which concerns on the 1st Embodiment of this invention from the one main surface 11a side of the base | substrate 11. FIG. FIG. 3 is a perspective view of the electronic component mounting package 1 as viewed from the other main surface 11d side of a base body 11; FIG. 3 is an enlarged view showing a main part when the electronic component mounting package 1 is seen through the wiring board 13 from a direction perpendicular to the wiring board 13. FIG. 4 is an enlarged view of the positional relationship of the wiring board 13 with respect to the one principal surface 11a of the base body 11, as viewed from the side of the wiring board 13. 3 is a plan view showing a configuration of a wiring board 13. FIG. It is a perspective view which shows the structure of the electronic apparatus 2 provided with the electronic component mounting package 1 which concerns on this embodiment. FIG. 3 is a diagram of the electronic device 2 as viewed from a direction perpendicular to the wiring board 13 FIG. 3 is a view of the electronic device 2 as viewed from the one principal surface 11a side of a base body 11. FIG. 3 is a view of the electronic device 2 as viewed from the other main surface 11 d side of the base body 11. It is sectional drawing which looked at the electronic apparatus 2 shown in FIG. 8 from cut surface line AA. It is sectional drawing which looked at the electronic apparatus 2 shown in FIG. 8 from cut surface line BB. It is sectional drawing which looked at the electronic apparatus 2 shown in FIG. 8 from cut surface line CC. It is the perspective view which looked at 1A of electronic component mounting packages which concern on the 2nd Embodiment of this invention from the one main surface 11a side of the base | substrate 11. FIG. It is the figure which looked at 1A of electronic component mounting packages from the direction perpendicular | vertical to the wiring board 13A. FIG. 2 is a view of an electronic component mounting package 1A as viewed from one main surface 11a side of a base body 11. It is a perspective view which shows the structure of 2 A of electronic apparatuses provided with the electronic component mounting package 1A which concerns on this embodiment. It is the figure which looked at electronic device 2A from the direction perpendicular to wiring board 13A. FIG. 2 is a view of the electronic device 2A as viewed from the one main surface 11a side of a base body 11.

  An electronic component mounting package and an electronic device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 to 5 are views showing the configuration of the electronic component mounting package 1 according to the first embodiment of the present invention, and FIGS. 6 to 12 include the electronic component mounting package 1 according to the present embodiment. 2 is a diagram showing a configuration of the electronic device 2. FIG.

  The electronic component mounting package 1 is a package for mounting the electronic component 21. The electronic device 2 is a semiconductor device that receives and transmits optical signals in an optical communication device, and includes an electronic component mounting package 1 and an electronic component 21 mounted on a wiring board 13 of the electronic component mounting package 1. Composed.

  The electronic component mounting package 1 includes a base 11, a pair of signal terminals 12 made of a linear conductor that transmits a high-frequency signal, a wiring board 13 having a component mounting area on which an electronic component 21 is mounted, and a bonding material 15. And a substrate support portion 14 made of a metal that supports the wiring substrate 13. Note that a high-frequency signal is a signal corresponding to a transmission speed of a semiconductor device of 2.5 Gbps or higher.

  The base body 11 is formed in a plate shape and has a pair of through holes 11b penetrating in the thickness direction. Each signal terminal 12 is provided in each of the pair of through holes 11b, and one end portion 12a protrudes from one main surface 11a of the base body 11 on one side in the thickness direction. The wiring board 13 is provided so as to be opposed to the respective one end portions 12 a of the pair of signal terminals 12, and transmits a high frequency signal from the pair of signal terminals 12 to the electronic component 21 on the facing surface facing the one end portion 12 a. A pair of signal line conductors 13a are formed. The bonding material 15 bonds the one end portions 12a of the pair of signal terminals 12 and the signal line conductors 13a of the wiring board 13 respectively. The substrate support unit 14 is provided on one main surface 11 a of the base 11, and contacts the back surface of the facing surface of the wiring substrate 13 to support the wiring substrate 13.

  That is, the electronic component mounting package 1 has a pair of signal terminals 12 provided in each of the pair of through holes 11b formed in the plate-like base body 11 from one main surface 11a of the base body 11 to one side in the thickness direction. The one end portion 12 a that comes out and the pair of signal line conductors 13 a of the wiring board 13 supported by the substrate support portion 14 provided on one side in the thickness direction from the one main surface 11 a of the base body 11 are joined by the joining material 15. Has a structured. In the electronic component mounting package 1 of the present embodiment, the substrate support 14 is viewed from a direction perpendicular to the facing surface facing the one end 12a of each signal terminal 12 of the wiring substrate 13, as shown in FIG. Provided so as not to overlap the one end 12a of each signal terminal 12. That is, the width dimension of the substrate support portion 14 is smaller than the distance between the pair of signal terminals 12. Of the back surface opposite to the facing surface, a region facing the one end portion 12a of the signal terminal 12 on the facing surface of the wiring substrate 13 faces the space, and the wiring substrate 13 is disposed on the substrate support portion 14 in the back surface region. It is not supported by.

  According to such an electronic component mounting package 1, the substrate support portion 14 made of metal does not overlap the one end portion 12 a of each signal terminal 12 when viewed from a direction perpendicular to the facing surface of the wiring substrate 13. Thus, unnecessary capacitance components generated between the one end portion 12a of the signal terminal 12 and the substrate support portion 14 are suppressed. Since unnecessary capacitance components are suppressed, the characteristic impedance at the one end 12a of the signal terminal 12 can hardly be shifted when impedance matching is performed on a certain characteristic impedance. As a result, high-frequency signal transmission characteristics can be improved.

  The substrate 11 is made of a metal having good thermal conductivity. Metal is a suitable material because of its good thermal conductivity. Examples of the metal include those having a thermal expansion coefficient close to that of the electronic component 21 to be mounted and the ceramic wiring board 13 and those having a low cost, such as Fe—Ni—Co alloy and Fe—Mn alloy. Iron-based alloys and pure iron are selected. More specifically, there is an SPC (Steel Plate Cold) material of Fe 99.6 mass% -Mn 0.4 mass%. For example, when the base 11 is made of an Fe—Mn alloy, the base 11 is formed into a predetermined shape by applying a known metal processing method such as rolling or punching to the ingot (lumps). The through hole 11b is formed by drilling, for example.

  The shape of the base body 11 is, for example, a flat plate shape, and the shape is not particularly limited. For example, the base 11 has a disk shape with a diameter of 3 to 10 mm, a semi-disk shape with a part of a disk with a radius of 1.5 to 8 mm, and a square plate shape with a side of 3 to 15 mm. Have. The thickness of the substrate 11 may not be uniform. For example, if the thickness of the outer peripheral edge of the base 11 is increased, it becomes easier to closely attach a heat-dissipating member such as a housing that houses the electronic device 2. This is preferable because the heat generated from the electronic component 21 is easily released to the outside through the base 11.

  In the example shown in FIG. 6, one electronic component 21 is mounted on the base body 11 having two through holes 11 b, but a plurality of electronic components 21, the number of electronic components 21, and the number of electronic components 21 Depending on the number of terminals, three or more through holes 11b in which the signal terminals 12 are provided may be formed.

  The thickness of the substrate 11 is preferably 0.5 mm or more and 2 mm or less. When the thickness is less than 0.5 mm, a bonding condition such as a bonding temperature is used when a metal lid (not shown) for protecting the electronic component 21 is bonded to the main surface 11a of the metal base 11. As a result, the base body 11 is likely to be bent. There is a possibility that the airtightness may be lowered due to the deformation of the substrate 11. When the thickness exceeds 2 mm, the thickness of the electronic component mounting package 1 and the electronic device 2 becomes thick, and it becomes difficult to reduce the size.

  The main surface 11a of the base 11 has excellent corrosion resistance, excellent wettability with a bonding material (brazing material) for bonding and fixing the electronic component 21, the wiring board 13, or the lid, and has a thickness of 0. It is preferable that a 5 to 9 μm Ni layer and an Au layer having a thickness of 0.5 to 5 μm are sequentially deposited by plating. Thereby, it is possible to effectively prevent the base 11 from being oxidatively corroded, and to satisfactorily braze (join) the electronic component 21, the wiring board 13, or the lid to the base 11.

  In this embodiment, the board | substrate support part 14 consists of a metal with good heat conductivity. The substrate support portion 14 is formed integrally with the base body 11 and is provided on one side in the thickness direction from one main surface 11 a of the base body 11. The substrate support unit 14 supports the wiring substrate 13 by abutting against the back surface of the wiring substrate 13 facing the one end 12 a of each signal terminal 12. The substrate support portion 14 has a flat surface at a portion in contact with the back surface of the wiring substrate 13, and is formed, for example, in a quadrangular prism shape perpendicular to the one main surface 11a. Since the board support part 14 is made of a metal having good thermal conductivity, the heat generated by the electronic component 21 mounted on the wiring board 13 is dissipated. Most of the heat dissipated from the substrate support 14 is transferred to the base 11. Here, since the base body 11 is made of a metal having good thermal conductivity, the heat dissipated from the substrate support portion 14 and transmitted to the base body 11 is dissipated outside the electronic component mounting package 1. In this way, the heat generated by the electronic component 21 is dissipated from the substrate support portion 14 and the base 11 to the outside of the electronic component mounting package 1, so that deformation of the base 11 due to thermal expansion is suppressed.

  Moreover, it is preferable that the front-end | tip part of the board | substrate support part 14 is formed more narrowly than a base part. As a result, when the substrate support portion 14 and the wiring substrate 13 are bonded together, a brazing material pool is formed in the gap between the tip portion of the substrate support portion 14 and the wiring substrate 13, thereby compensating for a decrease in bonding strength. be able to. The shape of the tip portion of the substrate support portion 14 is not particularly limited, and examples thereof include a hemispherical shape, a truncated cone shape, a truncated pyramid shape, and a shape in which the top of the quadrangular pyramid is formed in a curved shape. . Among these, the shape in which the top of the quadrangular pyramid is formed in a curved surface is preferable. As a result, a brazing material pool is easily formed in the gap between the tip portion of the substrate support portion 14 and the wiring substrate 13, and the bonding strength can be further increased.

  Further, as shown in FIG. 4, the wiring board 13 supported by the board support portion 14 is preferably separated from the one main surface 11 a of the base body 11. By appropriately setting the distance between the wiring board 13 and the one principal surface 11a, electrostatic coupling generated between the portion connected to the one end 12a of the wiring board 13 and the base body 11 can be reduced. As a result, the change in characteristic impedance can be reduced at the one end portion 12a.

  Furthermore, as described above, the substrate support portion 14 is provided so as not to overlap the one end portions 12 a of the pair of signal terminals 12 when viewed from the direction perpendicular to the wiring substrate 13. The positional relationship between the substrate support portion 14 and the one end portion 12a of each signal terminal 12 will be described in detail.

  In the wiring substrate 13, a pair of signal line conductors 13 a connected to the respective one end portions 12 a of the pair of signal terminals 12 and one signal line conductor 13 a are disposed on the opposing surfaces facing the one end portions 12 a of the pair of signal terminals 12. And a grounding conductor 13b serving as a component mounting region on which the electronic component 21 is mounted and connected to the ground electrode on the lower surface of the electronic component 21 is formed. Further, on the back surface opposite to the facing surface of the wiring substrate 13, a mounting conductor that is joined to the substrate support portion 14 when the wiring substrate 13 is mounted on the substrate support portion 14 may be formed. .

  For example, a mounting conductor is provided on the back surface of the wiring board 13 opposite to the facing surface facing the one end 12 a of the signal terminal 12, and the mounting conductor is a pair of signal terminals when viewed from a direction perpendicular to the wiring board 13. 12, the shortest distance connecting the one end portion 12a and the substrate support portion 14 is ¼ of the wavelength of the high-frequency signal transmitted through the signal terminal 12 and the signal line conductor 13a. The following is preferable. Thereby, the resonance which arises when a high frequency signal transmits the signal terminal 12 can be suppressed.

  Even when the mounting conductor is not provided on the back surface opposite to the facing surface in the wiring board 13, the shortest distance connecting the one end portion 12a and the substrate support portion 14 is set to the signal terminal 12 and the signal It is preferable to set it to 1/4 or less of the wavelength of the high-frequency signal transmitted through the line conductor 13a, and as a result, the resonance that occurs when the high-frequency signal is transmitted through the signal terminal 12 can be suppressed.

  In addition, a mounting conductor is provided on the back surface opposite to the facing surface of the wiring board 13, and the mounting conductor is provided so as to overlap the one end portions 12 a of the pair of signal terminals 12 when viewed from a direction perpendicular to the wiring board 13. In this case, the shortest distance between the one end portion 12a and the substrate support portion 14 that is connected so as not to pass through the mounting conductor is set to ¼ or less of the wavelength of the high-frequency signal transmitted through the signal terminal 12 and the signal line conductor 13a. It is preferable to do. Thereby, the resonance which arises when a high frequency signal transmits the signal terminal 12 can be suppressed.

  The signal terminal 12 has one end 12a projecting from one main surface 11a of the base 11 until it overlaps the signal line conductor 13a, and the other end projecting from the other main surface 11d of the base 11 by 1 to 20 mm. It is fixed by the sealing material 11c filled in. For example, as in the example shown in FIG. 6, one end 12a of the signal terminal 12 and the electronic component 21 are electrically connected via the signal line conductor 13a, and the other end of the signal terminal 12 is connected to an external electric circuit ( The signal terminal 12 functions to transmit an input / output signal between the electronic component 21 and the external electric circuit by being electrically connected to an unillustrated).

  The sealing material 11 c is made of an insulating inorganic material such as glass or ceramics, secures an insulation interval between the signal terminal 12 and the base 11, and fixes the signal terminal 12 in the through hole 11 b of the base 11. Examples of such a sealing material 11c include glass such as borosilicate glass and soda glass, and a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 11c. The relative dielectric constant is appropriately selected for impedance matching. Examples of the ceramic filler that lowers the relative dielectric constant include lithium oxide.

  The signal terminal 12 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the signal terminal 12 is made of an Fe—Ni—Co alloy, a length of 1.5 mm is obtained by applying known metal processing such as rolling, punching, or cutting to the ingot of the alloy. A linear signal terminal 12 having a diameter of ˜22 mm and a diameter of 0.1 to 1 mm is produced. In order to reduce the size while performing matching at a higher characteristic impedance while ensuring the strength of the signal terminal 12, the diameter of the signal terminal 12 is preferably 0.15 to 0.25 mm. If the diameter of the signal terminal 12 is smaller than 0.15 mm, the signal terminal 12 is likely to bend when the electronic component mounting package 1 is mounted, and workability during mounting may be reduced. Further, when the diameter of the signal terminal 12 is larger than 0.25 mm, the diameter of the through hole 11b when impedance matching is increased with the diameter of the signal terminal 12, so that it is difficult to reduce the size.

  In order to fix the signal terminal 12 through the sealing material 11c filled in the through hole 11b, for example, when the sealing material 11c is made of glass, first, a known powder pressing method or extrusion molding method is used. Glass powder is molded to produce a cylindrical molded body of the sealing material 11c having an inner diameter matched with the outer diameter of the signal terminal 12 and an outer diameter matched with the shape of the through hole 11b. Next, the signal terminal 12 is inserted into the molded body of the cylindrical sealing material 11c, the molded body is inserted into the mold, heated to a predetermined temperature to melt the glass, and then cooled to solidify the glass. By doing so, the sealing material 11c having a predetermined shape to which the signal terminal 12 is fixed is formed. Thereafter, the sealing material 11c to which the signal terminal 12 is fixed is inserted into the through hole 11b of the base 11, and the base 11 and the signal terminal 12 are connected to each other through the furnace heated to a predetermined temperature. Secure through. Accordingly, the through hole 11b is hermetically sealed by the sealing material 11c, and the signal terminal 12 is insulated from the base 11 and fixed by the sealing material 11c. The signal terminal 12 and the base body 11 fixed to the through hole 11b form a coaxial line. Only the cylindrical sealing material 11c matched to the shape of the through hole 11b is formed in advance, and this is inserted into the through hole 11b, and the signal terminal 12 is also passed through the sealing material 11c. You may perform joining to the inner surface of 11b, and joining with the sealing material 11c and the outer surface of the signal terminal 12 simultaneously.

  As shown in FIG. 2, a ground terminal 16 is joined to the base 11. The ground terminal 16 is manufactured in the same manner as the signal terminal 12 and is bonded to the other main surface 11d of the base 11 using a bonding material 11e (brazing material) or the like. In order to facilitate positioning and improve the bonding strength, a hole may be formed in advance on the other main surface 11d of the base 11, and the ground terminal 16 may be inserted into the hole for bonding. By joining the ground terminal 16 to the base body 11 in this way, the base body 11 also functions as a ground conductor when the signal terminal 12 is connected to an external electric circuit.

  As shown in FIGS. 1 and 3, the wiring board 13 has a rectangular shape having two short sides perpendicular to the main surface 11 a of the base body 11 when viewed from a direction perpendicular to the facing surface of the wiring board 13. It is. In the present embodiment, when the wiring board 13 is viewed from a direction perpendicular to the facing surface of the wiring board 13, both end portions on the short side are outward from the respective one end portions 12 a of the pair of signal terminals 12. It is extended.

The wiring board 13 includes a wiring conductor including a signal line conductor 13a formed on an insulating board made of a ceramic insulating material such as an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body. It has been done. If the insulating substrate is made of, for example, an aluminum oxide sintered body, an organic solvent suitable for the raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. Then, a solvent is added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of green sheets are laminated as necessary, and are fired at a temperature of about 1600 ° C.

  The wiring board 13 is a wiring conductor, for example, a pair of signal line conductors 13a and a grounding conductor 13b formed on the upper surface of the insulating substrate (an opposite surface facing the one end 12a of the signal terminal 12 in the wiring board 13), And a mounting conductor formed on the lower surface of the insulating substrate (the back surface of the opposite surface in the wiring substrate 13). The pair of signal line conductors 13 a is connected to the respective one end portions 12 a of the pair of signal terminals 12. The grounding conductor 13b is a component mounting area where the electronic component 21 is mounted and connected to the ground electrode on the lower surface of the electronic component 21. The mounting conductor is joined to the substrate support portion 14 when the wiring substrate 13 is mounted on the substrate support portion 14. The grounding conductor 13b and the mounting conductor may be connected by a connection conductor formed on the side surface of the insulating substrate or a connection conductor formed through the insulating substrate. Alternatively, the grounding conductor 13 b is electrically connected to the grounding conductor of the external electric circuit via the bonding material 15 and the signal terminal 12, and the mounting conductor is connected to the external electric circuit via the substrate support part 14 and the grounding terminal 16. Is electrically connected to the ground conductor.

  The signal line conductor 13 a has a function of transmitting a high-frequency signal from the signal terminal 12 to the electronic component 21. Further, the signal line conductor 13 a has a different connection structure depending on the type of the electronic component 21, and is formed according to the type of the electronic component 21. The electronic component 21 and the signal line conductor 13a are connected by, for example, a bonding wire. In order to shorten the bonding wire and reduce the signal transmission loss, for example, as shown in FIG. It is preferable to bend the signal path of the signal transmitted through the signal line conductor 13a by bending 13a so that the bonding wire connection position is as close as possible to the electronic component 21.

  When the signal path of the signal transmitted through the signal line conductor 13a is bent, the signal path includes a first signal path represented by two half lines with the bending point as an end point, a second signal path, Consists of. The internal angle (bending angle) formed by the first signal path and the second signal path is preferably greater than 90 °, and more preferably 120 ° or greater. Thus, high-frequency loss due to reflection at the bent portion of the signal line conductor 13a where the signal path is bent can be reduced. When the signal path is bent, the signal path may be bent step by step so as to have a plurality of bending points. Further, in the structure in which the signal path is bent, when the outer shape of the signal line conductor 13a is a polygon, it is preferable to combine a plurality of corners corresponding to the bent part in which the signal path is bent. The inner angle of each corner corresponding to the bent portion where the signal path is bent is preferably larger than 90 °, more preferably 120 ° or more. Thereby, the loss of high frequency by the corner portion can be further reduced. In the example shown in FIG. 5, the signal line conductor 13 a has a plurality of corner portions combined on the outer side corresponding to the bent portion where the signal path is bent. Are preferably combined. When the outer shape of the signal line conductor 13a is a polygon, it is preferable that the outer shape of the corner corresponding to the bent portion where the signal path is bent is an arc shape. As a result, high-frequency loss can be further reduced.

  The signal line conductor 13 a is preferably provided so as not to overlap the substrate support portion 14 when viewed from the direction perpendicular to the wiring substrate 13. As a result, the thermal stress generated due to the difference in thermal expansion coefficient between the signal line conductor 13 a and the signal terminal 12, the wiring board 13, the board support part 14, and the bonding material (brazing material) 15 passes through the bonding material 15. Since it can suppress concentrating on the junction part of the signal terminal 12 and the signal line conductor 13a, while being able to suppress the crack and peeling which arise in the junction part of the signal terminal 12 and the signal line conductor 13a via the joining material 15, signal It can suppress that the electrical connection defect in the junction part of the terminal 12 and the signal line conductor 13a arises.

  As a method of forming the wiring conductor including the signal line conductor 13a on the insulating substrate, a method of forming the wiring conductor by simultaneous firing with the insulating substrate, a known method of forming a metal metallization after the insulating substrate is manufactured, or an insulating substrate There is a method of forming a wiring conductor by vapor deposition or photolithography after the fabrication. When the electronic device 2 is small, the wiring board 13 mounted on the electronic device 2 is small, so that the wiring conductor is fine. In the case of forming such a fine wiring conductor, it is preferable to form the wiring conductor by vapor deposition or photolithography in order to increase the alignment accuracy between the signal line conductor 13a of the wiring conductor and the signal terminal 12. . In this case, the main surface of the insulating substrate may be polished as necessary.

  Hereinafter, the case where the wiring conductor is formed by vapor deposition or photolithography will be described in detail. The wiring conductor is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

From the viewpoint of improving the adhesion with an insulating substrate made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni- It is preferable to comprise at least one kind of metal having a thermal expansion coefficient close to that of ceramics, such as a Cr) alloy, tantalum nitride (Ta ₂ N), and the thickness is preferably 0.01 to 0.2 μm. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the insulating substrate. If the thickness exceeds 0.2 μm, the adhesion metal layer is caused by internal stress during film formation. There is a tendency to easily peel from the insulating substrate.

  From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion preventing layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and its thickness is preferably 0.05 to 1 μm. If the thickness of the diffusion preventive layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to function as a diffusion preventive layer. If the thickness exceeds 1 μm, the diffusion preventive layer is caused by internal stress during film formation. Tends to be easily peeled off from the adhesive metal layer. When a Ni—Cr alloy is used for the diffusion prevention layer, the Ni—Cr alloy has good adhesion to the insulating substrate, and thus the adhesion metal layer can be omitted.

  The main conductor layer is preferably made of at least one of gold (Au), Cu, Ni, and silver (Ag) having a low electric resistance, and the thickness is preferably 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance becomes large, and the electric resistance required for the wiring conductor of the wiring board 13 tends to be not satisfied. The main conductor layer tends to be easily peeled off from the diffusion preventing layer. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

  The wiring board 13 manufactured in this way is joined to the board support part 14, and the one end part 12 a of the signal terminal 12 and the signal line conductor 13 a are connected by a joining material (brazing material) 15, thereby relating to the present embodiment. The electronic component mounting package 1 is obtained.

  Then, the electronic component 21 is mounted on the wiring substrate 13 in the electronic component mounting package 1, and a lid is joined to the base body 11 as necessary, so that the present embodiment as in the example shown in FIGS. Electronic device 2 of the form.

  The electronic device 2 according to the present embodiment is one in which an electronic component 21 is mounted on an electronic component mounting package 1. As described above, the electronic component mounting package 1 can suppress the generation of unnecessary capacitance components, and can make the characteristic impedance difficult to shift, and thus improve the transmission characteristics of high-frequency signals. It has the effect of being able to. Since the electronic device 2 has the electronic component 21 mounted on the electronic component mounting package 1 that exhibits the above-described effects, the electronic device 2 is an electronic device that operates well at high frequencies.

  Examples of the electronic component 21 include optical semiconductor elements such as LD (laser diode) and PD (photodiode), semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, and pressure sensor elements. , Capacitive elements, resistors and the like.

  The electronic component 21 can be mounted on the wiring board 13 by fixing it using a conductive bonding material such as a brazing material or a conductive resin. For example, when the electronic component 21 is mounted on the wiring substrate 13 after the wiring substrate 13 is mounted on the substrate support portion 14, a gold-tin (Au—Sn) alloy or gold-germanium (Au) is used to fix the wiring substrate 13. -Ge) brazing material is used as a bonding material, and for fixing the electronic component 21, a tin-silver (Sn-Ag) alloy or a tin-silver-copper (Sn-Ag-Cu) alloy having a melting point lower than these is used. An adhesive made of a resin such as Ag epoxy that can be cured at a temperature lower than the melting point may be used as the bonding material.

  In addition, after mounting the electronic component 21 on the wiring board 13, the wiring board 13 may be mounted on the board support part 14. In this case, contrary to the above, when mounting the wiring board 13 on the board support part 14. The melting point of the bonding material used for the above may be lowered. In any case, a paste of a bonding material is printed on the wiring substrate 13 by using a well-known screen printing method, a bonding material layer is formed by a photolithography method, or a low melting point brazing material to be a bonding material For example, a preform can be placed.

  In the electronic device 2, the lid provided on the one principal surface 11 a of the base body 11 as necessary has an outer shape along the outer peripheral region of the base body 11, and the wiring board 13 and the substrate support section on the one principal surface 11 a of the base body 11 14 has a space that covers 14. The lid may be provided with a window that transmits light at a portion facing the electronic component 21, or an optical fiber and an optical isolator for preventing return light may be joined instead of or in addition to the window. Good. In the electronic device 2 according to the present embodiment, when the electronic component 21 of an optical element that is optically connected to the outside is mounted, the functions of the substrate support portion 14 and the base 11 that dissipate heat from the electronic component 21 to the outside. Therefore, the deformation of the base body 11 due to thermal expansion is suppressed, so that the deviation of the optical connection between the outside and the electronic component 21 can be reduced, and the optical characteristics can be maintained well.

  The lid is made of a metal such as an Fe—Ni—Co alloy, an Fe—Ni alloy, or an Fe—Mn alloy, and is produced by subjecting these plate materials to known metal processing such as press working or punching. As the material of the lid, a material having a thermal expansion coefficient comparable to that of the material of the base 11 is preferable, and the same material as that of the base 11 is more preferably used. When the lid has a window, a flat or lens-shaped glass window member is bonded to a part provided with a hole in the portion facing the electronic component 21 with a low melting point glass or the like.

  The lid is joined to the base 11 by welding such as seam welding or YAG laser welding or by brazing with a joining material such as an Au-Sn brazing material.

  13 to 15 are views showing the configuration of an electronic component mounting package 1A according to the second embodiment of the present invention. 16 to 18 are views showing the configuration of an electronic apparatus 2A provided with the electronic component mounting package 1A according to the present embodiment.

  The electronic component mounting package 1A is configured in the same manner as the electronic component mounting package 1 except that the configuration related to the wiring board 13A is different from the wiring board 13 described above. The electronic device 2A is configured in the same manner as the electronic device 2 except that the electronic device mounting package 1A having the wiring board 13A is provided. As described above, the electronic component mounting package 1A and the electronic device 2A according to the present embodiment have the same parts as the electronic component mounting package 1 and the electronic device 2 according to the first embodiment described above. Accordingly, in the following description and drawings, corresponding similar parts are denoted by the same reference numerals and description thereof is omitted.

  The electronic component mounting package 1 </ b> A protrudes from the main surface 11 a of the base 11 to one side in the thickness direction of the pair of signal terminals 12 provided in each of the pair of through holes 11 b formed in the plate-like base 11. Each end portion 12a and a pair of signal line conductors 13Aa of the wiring board 13A supported by the substrate support portion 14 provided on one side in the thickness direction from the one main surface 11a of the base body 11 are joined by the joining material 15. It has a structure. In the electronic component mounting package 1 </ b> A, the substrate support portion 14 is connected to one end portion 12 a of each signal terminal 12 when viewed from a direction perpendicular to the facing surface facing the one end portion 12 a of each signal terminal 12 of the wiring substrate 13 </ b> A. Provided so as not to overlap. As a result, as described above, the generation of unnecessary capacitance components between the one end portion 12a of the signal terminal 12 and the substrate support portion 14 is suppressed, and when impedance matching is performed on a certain characteristic impedance, The characteristic impedance at the one end portion 12a of the terminal 12 can be made difficult to shift. As a result, high-frequency signal transmission characteristics can be improved.

  Furthermore, in the present embodiment, the facing surface of the wiring board 13A has a rectangular shape perpendicular to the one principal surface 11a of the base 11, and the two short sides 13Ab are perpendicular to the one principal surface 11a. That is, the wiring board 13A has a rectangular shape having two short sides 13Ab perpendicular to the main surface 11a of the base body 11 when viewed from a direction perpendicular to the facing surface of the wiring board 13A. In the wiring board 13A, the two short sides 13Ab overlap with the respective one end portions 12a of the pair of signal terminals 12 when viewed from the direction perpendicular to the facing surface. That is, the wiring board 13A has no portion extending outward from each end portion 12a of the pair of signal terminals 12 when viewed from the direction perpendicular to the facing surface, and the length of the long side is as described above. It is shorter than the wiring board 13. Further, the wiring substrate 13A has a longer side length longer than that of the one end portion 12a where the short side is located inward.

  Such a wiring board 13A having a long side shorter than the wiring board 13 has a smaller area that is not in contact with the board support portion 14 on the back surface of the facing surface, and therefore has less distortion in this area. It becomes. When the distortion can be reduced, it is possible to reduce the shift in the positional relationship among the one end portion 12a, the wiring board 13A, the signal line conductor 13Aa, and the mounting conductor. Thereby, since the deviation of the electric field distribution generated around these becomes small, it is possible to suppress the characteristic impedance from deviating from a desired value. As a result, the transmission characteristics of the high frequency signal can be made more stable.

  The pair of signal line conductors 13Aa are provided as close to the short side 13Ab as possible. Preferably, each of the pair of signal line conductors 13Aa is provided up to the edge of the short side 13Ab. Therefore, electrical connection can be achieved by bridging the pair of signal line conductors 13 </ b> Aa and the one end portions 12 a of the pair of signal terminals 12 by the bonding material 15.

  Moreover, while mounting the electronic component 21 on the wiring board 13A in the electronic component mounting package 1A, and joining a lid to the base 11 as necessary, an electronic device such as the example shown in FIGS. 2A. Since the electronic component 21 is mounted on the electronic component mounting package 1 </ b> A according to this embodiment in which the characteristic impedance is less likely to shift, the electronic device 2 </ b> A is an electronic device that operates well at high frequencies.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.

  For example, in the above-described embodiment, the cylindrical electronic component mounting packages 1 and 1A using the circular base body 11 as shown in FIGS. 1 and 13 have been described as an example, but a prismatic electronic component mounting package may be used. I do not care.

  Further, when the electronic component 21 generates a large amount of heat, a Peltier element or the like is mounted between the electronic component 21 (and the wiring boards 13 and 13A) and the board support portion 14 to cool the electronic component 21. Also good.

DESCRIPTION OF SYMBOLS 1,1A Electronic component mounting package 2,2A Electronic device 11 Base body 11b Through-hole 12 Signal terminal 13, 13A Wiring board 13a, 13Aa Signal line conductor 14 Substrate support part

Claims (7)

A base formed in a plate shape and having a pair of through holes penetrating in the thickness direction;
A pair of signal terminals made of linear conductors for transmitting a high-frequency signal, wherein one end portion protrudes from one main surface of the base in the thickness direction and is provided in each of the pair of through holes. A signal terminal;
A wiring board provided opposite to the one end of the pair of signal terminals, wherein a component mounting area on which electronic components are mounted on a facing surface facing the one end, and a high-frequency signal from the signal terminal A wiring board on which a signal line conductor for transmitting to the electronic component is formed;
A joining material joining the one end of the pair of signal terminals and the signal line conductor;
A substrate support portion made of a metal that is provided on the one main surface of the base and is in contact with the back surface of the facing surface of the wiring substrate to support the wiring substrate, and is perpendicular to the facing surface of the wiring substrate. when viewed from the direction seen including a said substrate support which does not overlap with the one end of said pair of signal terminals,
The facing surface of the wiring board has a rectangular shape perpendicular to the one principal surface of the base body, and two sides perpendicular to the one principal surface are viewed from a direction perpendicular to the facing surface of the wiring substrate. In some cases, the electronic component mounting package is characterized in that it overlaps the one end portions of the pair of signal terminals . A base formed in a plate shape and having a pair of through holes penetrating in the thickness direction;
A pair of signal terminals made of linear conductors for transmitting a high-frequency signal, wherein one end portion protrudes from one main surface of the base in the thickness direction and is provided in each of the pair of through holes. A signal terminal;
A wiring board provided opposite to the one end of the pair of signal terminals, wherein a component mounting area on which electronic components are mounted on a facing surface facing the one end, and a high-frequency signal from the signal terminal A wiring board on which a signal line conductor for transmitting to the electronic component is formed;
A joining material joining the one end of the pair of signal terminals and the signal line conductor;
A substrate support portion made of a metal that is provided on the one main surface of the base and is in contact with the back surface of the facing surface of the wiring substrate to support the wiring substrate, and is perpendicular to the facing surface of the wiring substrate. The substrate support portion that does not overlap the one end portion of the pair of signal terminals when viewed from the direction,
An electronic component mounting package , wherein the substrate support portion has a tip portion formed narrower than a base portion . 3. The electronic component mounting package according to claim 2, wherein the tip end portion of the substrate support portion has a quadrangular pyramid shape. The electronic component mounting package according to claim 2 or 3, wherein the tip portion of the substrate support portion has a shape in which a top portion is formed in a curved shape. The electronic component mounting package according to any one of claims 1 to 4, wherein the base body and the substrate support portion are integrally formed. The electronic component mounting package according to any one of claims 1 to 5, wherein the wiring board is separated from the one main surface of the base. The electronic component mounting package according to any one of claims 1 to 6 ,
An electronic device comprising: an electronic component mounted on the component mounting region of the wiring board in the electronic component mounting package.

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