WO2020138196A1

WO2020138196A1 - Electronic component mounting package, and electronic device

Info

Publication number: WO2020138196A1
Application number: PCT/JP2019/050890
Authority: WO
Inventors: 友治恩田
Original assignee: 京セラ株式会社
Priority date: 2018-12-26
Filing date: 2019-12-25
Publication date: 2020-07-02
Also published as: JP2022046829A

Abstract

This electronic component mounting package comprises a wiring substrate having a first surface and a wiring pattern positioned on the first surface, a base having a second surface that contacts the first surface at an adjacent surface, a signal line that passes through the base, and an electroconductive bonding material. The wiring pattern has wiring A that extends in a first direction away from the second surface, an electroconductive bonding material bonds the wiring A and the signal line, and the width of the electroconductive bonding material orthogonal to the first direction is greater than the width of the wiring A.

Description

Electronic component mounting package and electronic device

The present disclosure relates to electronic component mounting packages and electronic devices.

There is a package for mounting an electronic component, which has a wiring pattern connected to the electronic component and a signal line joined to the wiring pattern. Signal loss is likely to occur at the junction between the signal line of this package and the wiring pattern. Japanese Unexamined Patent Application Publication No. 2007-150182 discloses a technique of appropriately bringing a signal line and a wiring pattern into close proximity to each other and joining them with solder.

One aspect of the present disclosure is
A wiring board having a first surface and a wiring pattern located on the first surface;
A base having a second surface in contact with a surface adjacent to the first surface;
A signal line penetrating the base,
Conductive bonding material,
Equipped with
The wiring pattern has a wiring A extending in a first direction away from the second surface,
The conductive bonding material bonds the wiring A and the signal line,
In the electronic component mounting package, a width of the conductive bonding material orthogonal to the first direction is wider than the width of the wiring A.

In addition, another aspect of the present disclosure is
The above electronic component mounting package,
Electronic components connected to the wiring pattern,
Is an electronic device.

According to the contents of the present disclosure, there is an effect that the power loss of a signal can be further suppressed in the electronic component mounting package.

It is a whole perspective view of the electronic device of this embodiment. It is the figure which expanded and showed the joining position vicinity of a conductive joining material. It is a figure explaining the shape of a conductive joining material. It is a figure explaining the shape of a conductive joining material. It is the figure which showed the simulation result of a signal transmission characteristic. It is the figure which showed the simulation result of a signal transmission characteristic. It is a figure showing a simulation result of a signal penetration characteristic in a comparative example. It is a figure showing a simulation result of a signal penetration characteristic in a comparative example. It is a perspective view which shows the modification 1 of the package for electronic component mounting. It is a perspective view which shows the modification 2 of the package for electronic component mounting. It is a perspective view which shows the modification 3 of the package for electronic component mounting.

Hereinafter, embodiments will be described with reference to the drawings.
FIG. 1 is an overall perspective view of the electronic device 1 of this embodiment.

The electronic device 1 includes an electronic component mounting package 100 and an electronic component 200.
The electronic component mounting package 100 includes a base 11, a signal line 12, a wiring board 14, a conductive bonding material 16, and the like.

The base 11 may be a conductive metal, and in this case, it functions as a ground plane. In the following description, it is assumed that the base 11 is a conductive metal unless otherwise specified. In addition to this, the base 11 may have a high thermal conductivity. In this specification, thermal conductivity may refer to heat dissipation. The base 11 has a base 111 and a protrusion 112. Here, the base 111 may have, for example, a disc shape with a diameter of 3 to 10 mm and a thickness of 0.5 to 2 mm, but is not limited thereto. The base 111 has a through hole 111a. The insulating member 113 may be located in the through hole 111a. The insulating member 113 may be, for example, a glass or ceramic material. The material of the insulating member 113 and the size of the through hole 111a may be determined according to the desired characteristic impedance. Alternatively, when the base 11 is an insulating member, only the signal line 12 may pass through. The base 111 and the protrusion 112 may be integrated.

One side of the protrusion 112 is flat, and the wiring board 14 is located on the one side. The wiring board 14 has a first surface 14a. The first surface 14a is a surface opposite to the connection surface with the protrusion 112. The wiring board 14 has a wiring pattern 141 located on the first surface 14a. Here, the wiring board 14 may be used as, for example, a high-frequency line board. The wiring substrate 14 is an insulating substrate and may be, for example, resin. The thickness, the material and the relative permittivity of the material of the wiring board 14 may be appropriately determined according to the desired characteristic impedance. The bonding surface 14b, which is a side surface of the wiring board 14 and is adjacent to the first surface 14a, is bonded to the second surface 11a of the base 111.

The wiring pattern 141 is electrically connected to the electronic component 200 and supplies electric power and a signal to the electronic component 200. The wiring pattern 141 may be a conductive metal film having a low resistance, here, a gold (Au) thin film. The wiring pattern 141 has an end joined to the signal line 12 by a conductive joining material 16. For example, in FIG. 1, two end portions that are joined to the signal line 12 via the conductive joining material 16 are shown. The shape, length and position of the wiring pattern are appropriately determined according to the size and terminal position of the electronic component 200 to be connected.

The signal line 12 is a rod-shaped conductor and penetrates the base 111 of the base 11. In FIG. 1, the signal line 12 penetrates the insulating member 113 in the through hole 111a. The diameter of the signal line 12 may be, for example, about 0.1 to 1.0 mm. At least one of the signal lines 12 is a ground terminal of the base 11, and is directly joined to the base 111. The other signal lines 12 project on the side of the base 111 opposite to the second surface 11a and are electrically connected to external wiring or the like. That is, the signal lines 12 other than the ground terminal are used as lead electrodes. For example, FIG. 1 shows a state in which two signal lines 12 are joined to the wiring pattern 141 via the conductive joining material 16 on the second surface 11a side. The signal line 12 and the wiring pattern 141 do not have to be in direct contact with each other. Further, the signal line 12 does not have to protrude from the second surface 11a. That is, as for the signal line 12, the tip of the signal line 12 may be exposed.

The conductive bonding material 16 electrically bonds the signal line 12 on the second surface 11a and the wiring pattern 141 on the first surface 14a. The conductive bonding material 16 may be a nanoparticle sintering type bonding material paste. The nano-particle sintering type bonding material paste contains a nano-sized metal covered with a surface stabilizer, such as silver or copper, a resin, and an organic solvent. It should be noted that the organic solvent is volatilized after the nanoparticle sintering type bonding material paste is fixed. The nanoparticle-sintering-type bonding material paste is heated to cause a reaction of the resin, and the metal is activated to react with each other to bond with each other, and also react with the metal surface to be fixed. A large thermal conductivity is obtained due to the bonding of the metals. Therefore, the conductive bonding material 16 bonds not only to the signal line 12 and the wiring pattern 141 but also to the insulating member 113 and the insulating surface of the wiring board 14.

The electronic component 200 shown by the broken line in FIG. 1 is located on the first surface 14a and is electrically connected to the wiring pattern 141 directly or by wire bonding. The electronic component 200 may be, for example, a laser diode. Alternatively, the electronic component 200 may be various types such as a photodiode, an LED (Light Emitting Diode) or a Peltier element, and various sensor elements. The heat generated by the operation of the electronic component 200 may be discharged through the base 11.

The protrusion 112, the wiring board 14, the wiring pattern 141, and the electronic component 200 may be covered with a cover member to be isolated from the outside. When the electronic component 200 emits light to the outside, the cover member may have a window portion made of a material that transmits the wavelength of the emitted light.

FIG. 2 is an enlarged view of the vicinity of the bonding position of the conductive bonding material 16.

The tips of the two signal lines 12 are exposed on the second surface 11a of the base 111, respectively, at approximately the center of the exposed surface of the insulating member 113 in the separate through hole 111a. The signal line 12 is separated from the outer base 111 by the insulating member 113 inside the insulating member 113, and a signal is transmitted through the coaxial line in the base 111.

The wiring A 1411 that is a portion of the wiring pattern 141 that is connected to each of the signal lines 12 extends on the wiring board 14 from the vicinity of the exposed surface of the insulating member 113 in the first direction X away from the second surface 11 a. The first direction X may be a direction perpendicular to the second surface 11a. In addition, in the present specification, the term “perpendicular” includes an error caused in manufacturing. The error may be in the range of −0.1° to +0.1°. The wiring pattern 141 is separated from the protrusion 112 by the wiring board 14. That is, the wiring pattern 141 on the wiring board 14 is a microstrip line.

The conductive bonding material 16 may be located between the signal line 12 and the second surface 11a and the wiring pattern 141 and the first surface 14a. A joint portion A161, which is a part of the conductive joint material 16 on the side closer to the second surface 11a, is joined to the wiring A1411 and the wiring board 14, and is also joined to the insulating member 113 on the second surface 11a. There is.

The characteristic impedances of the coaxial line portion and the microstrip line portion may be matched with each other. The conductive bonding material 16 is a section connecting these, and is a position where the characteristic impedance is likely to locally change. In the electronic component mounting package 100 according to the embodiment of the present disclosure, the conductive bonding material 16 signals the wiring A 1411 and the wiring substrate 14 of the wiring pattern 141 with a width wider than the width of the wiring in the bonding portion with the wiring pattern 141. It is joined to the wire 12 and the insulating member 113. The width refers to the length of the wiring pattern 141 in the direction perpendicular to the extending direction of the wiring. In particular, the width direction of the wiring A 1411 and the conductive bonding material 16 is the length in the direction perpendicular to the first direction X. As a result, the conductive bonding material 16 itself forms a part of the wiring of the microstrip line, and the width of the bonding portion is widened, thereby increasing the capacitance between the conductive bonding material 16 and the protrusion 112, which is a conductor, and increasing the characteristic impedance. Can be lowered. Further, by appropriately adjusting the width and the shape, it is possible to reduce the fluctuation of the characteristic impedance in the signal path from the signal line 12 to the wiring pattern 141.

3A and 3B are diagrams illustrating the shape of the conductive bonding material 16. Here, the base portion 111 and one signal line 12 are cut and shown in a cross section including the signal line 12, and a portion of the wiring pattern 141 hidden by the conductive bonding material 16 is shown by a dotted line. ..

FIG. 3A is a diagram in a cross section parallel to the first surface 14a.
The conductive bonding material 16 is bonded to the first surface 14a with a width wider than the width W0 of the wiring at the bonding portion with the wiring pattern 141 within a range L of a predetermined distance from the bonding surface 14b including the bonding portion A161. .. The maximum value of the width of the joint wider than the width W0 of the wiring in the joint portion of the conductive joint material 16 with the wiring pattern 141 is defined as the maximum width W. In addition, accordingly, the joint portion A 161 is joined to the insulating member 113 over a wider area than the signal line 12 with respect to the second surface 11 a. Since the characteristic impedance decreases as the width of the wiring becomes wider, such a wide joint is used to reduce the local increase in the characteristic impedance at the connecting portion between the signal line 12 and the joint A161. You can In addition, the width of the conductive bonding material 16 is maximum at the position closest to the second surface 11a, and gradually decreases with increasing distance from the second surface 11a. A sudden change in the characteristic impedance in the direction X can be reduced.

FIG. 3B is a cross-sectional view seen from a direction orthogonal to the normal direction of the first surface 14a and the second surface 11a.
The conductive bonding material 16 is an insulating member up to a position further distant from the first surface 14a than a position farthest from the first surface 14a in the signal line 12 on a surface in contact with the second surface 11a of the bonding portion A161. It is joined to 113. That is, the thickness from the first surface 14a is large in the immediate vicinity of the second surface 11a. It should be noted that the position farthest from the first surface 14a in the signal line 12 may be described as the upper end. The thickness from the first surface 14a to the upper end of the conductive bonding material 16 is the thickness of the conductive bonding material 16, which is indicated by the height H in FIG. 3B. The thickness of the conductive bonding material 16 may be rapidly reduced as the distance from the bonding surface 14b is increased. In addition, on the wiring pattern 141, the thin state does not have to continue and have a large change in thickness. In principle, the thickness of the conductive bonding material 16 does not affect the magnitude of the characteristic impedance. Therefore, it is not necessary to increase the thickness of the conductive bonding material 16 and use a large amount of nanoparticle-sintered bonding material paste. However, since the conductive bonding material 16 is also bonded to the insulating member 113 as described above, the bonding strength is higher than in the conventional case due to the shape of bonding the signal line 12 and the insulating member 113 to the second surface 11a in a wide range. Can be improved.

4A and 4B show the results of a simulation in which the loss in the electronic component mounting package of the above embodiment is calculated with respect to the signal frequency.

In the embodiment of the present disclosure, as the conductive bonding material 16, a nano-particle sintering type bonding material paste in which a nano-sized metal is silver is used, and the conductive bonding material 16 is bonded to the wiring pattern 141 and the wiring board 14. The width is wider than the width of the wiring. As Comparative Example 1, the calculation result when the bonding width of the conductive bonding material 16 is made equal to the width of the wiring is also shown.

It is shown in Fig. 4A that the standard value of the reflection loss is about -15 dB or less. Particularly, in the embodiment of the present disclosure, the increase in loss in the high frequency band is significantly reduced. It should be noted that the closer the reflection loss is to 0, the greater the reflection with respect to the incidence. Also, as shown in FIG. 4B, the insertion loss is reduced to -3 dB or more, which is the reference. Further, in the embodiment of the present disclosure, the increase in insertion loss is further reduced in the high frequency band. The insertion loss increases as the absolute value increases.

5A and 5B are diagrams showing simulation results of signal transmission characteristics in the comparative example.
Here, the calculation results of Comparative Example 1 and Comparative Example 2 in which the wiring thickness is increased with respect to Comparative Example 1 are also shown. In both the reflection loss of FIG. 5A and the insertion loss of FIG. 5B, there is no noticeable difference between Comparative Example 1 and Comparative Example 2 including the high frequency band. That is, even if only the thickness of the conductive bonding material is increased without expanding the width, the signal loss cannot be reduced.

6A, 6B and 7 are perspective views showing an embodiment of the electronic component mounting package 100 of the present embodiment.
The electronic component mounting package 100a shown in FIG. 6A differs from the electronic component mounting package 100 in the width of the wiring pattern 141a. Other configurations, structures, and positional relationships are the same, and the same configurations as those of the electronic component mounting package 100 are designated by the same reference numerals and description thereof will be omitted.

As shown in FIG. 6A, the wiring portion of the wiring pattern 141a that is joined to the conductive joining material 16 may have a shape in which the width decreases toward the second surface 11a. Since the width of the wiring is secured by the conductive bonding material 16, the width of the wiring pattern 141a may be narrow as long as the width of the conductive bonding material 16 is wider than the width of the wiring pattern 141a. That is, it is sufficient that the width of the conductive bonding material 16 changes from the width of the wiring pattern 141a to the width of the wiring pattern 141a. Compared with the wiring pattern 141a that is a gold thin film, the nanoparticle sintering type bonding material paste in which silver or copper is used as the conductor metal is lower in cost, and thus by thinning the wiring pattern 141a in this way, The cost can be reduced. Although the width of the wiring pattern 141a is changed in the wiring direction in both of the two joining portions in the same manner, such a change may be made in only one of them. In addition, the range in which the width of the wiring changes may be limited to only the portion bonded to the conductive bonding material 16 or only a part in the vicinity thereof.

In the electronic component mounting package 100b shown in FIG. 6B, the wiring length of the wiring pattern 141b is shorter than that of the electronic

component mounting packages

100 and 100a. Other configurations, structures, and positional relationships are the same, and the same configurations as those of the electronic component mounting package 100 are designated by the same reference numerals and description thereof will be omitted.

As shown in FIG. 6B, the wiring portion to be joined to the wiring pattern 141b may be shortened so that the area of the portion of the wiring pattern 141b between the conductive bonding material 16 and the wiring substrate 14 becomes small. .. Since the conductive bonding material 16 is used instead of the wiring pattern, the wiring pattern 141b may not be provided in the range in which the conductive bonding material 16 extends from the second surface 11a with a sufficient width. Similar to the wiring pattern 141a, the cost can be reduced by shortening the gold thin film wiring pattern 141b.

In the electronic component mounting package 100c shown in FIG. 7, the signal line 12 is located in the height direction from the first surface 14a with the first surface 14a sandwiched therebetween. In this case, since the wiring pattern 141c extends to the end of the first surface 14a on the side in contact with the second surface 11a, the signal line 12 and the wiring pattern 141c may be in direct contact with each other.

As described above, the width of the conductive bonding material 16 gradually approaches the width of the wiring pattern 141, the wiring pattern 141a, the wiring pattern 141b, or the wiring pattern 141c, so that the characteristic impedance is locally increased and abruptly changed. It can be reduced. By stabilizing the characteristic impedance, it is possible to reduce signal transmission loss and loss due to reflection.

As described above, the electronic component mounting package 100 of the present embodiment has the wiring board 14 having the first surface 14a and the wiring pattern 141 located on the first surface 14a, and the wiring board 14 is A base 11 having a second surface 11a in contact with the bonding surface 14b adjacent to the first surface 14a, a signal line 12 penetrating the base 11, and a conductive bonding material 16 are provided. The wiring pattern 141 has a wiring A1411 which is a portion extending in the first direction X away from the second surface 11a, and the conductive bonding material 16 is a signal of the wiring pattern 141 on the first surface 14a and the signal on the second surface 11a. The width of the conductive bonding material 16 that is joined to the line 12 and is orthogonal to the first direction is wider than the width W0 of the wiring A1411.
As described above, the conductive bonding material 16 is positioned on the wiring board made of an insulating material so as to exceed the width of the wiring pattern 141, so that the wiring pattern 141 is apparently formed at the joint portion between the signal line 12 and the wiring pattern 141. Has widened. This locally reduces the increase in characteristic impedance and reduces power loss due to signal reflection and the like. By performing such a configuration using the conductive bonding material 16 instead of designing the wiring pattern itself, it is possible to perform flexible adjustment according to the product at the manufacturing stage of the electronic component mounting package 100. Further, it is easier to adjust as compared with the wiring designed in advance, and the profile of the characteristic impedance can be adjusted appropriately. In particular, in the electronic component mounting package that can mount multiple different electronic components, various adjustments can be easily performed for the same electronic component mounting package when the optimal width etc. changes for each electronic component. Becomes Further, it is possible to save the labor of manufacturing the electronic component mounting package with different designs. In addition, since the increase in the characteristic impedance is reduced by the conductive bonding material 16 itself, it is possible to reduce the abrupt change in the characteristic impedance, particularly the increase, even if the signal line 12 and the wiring pattern 141 are not directly bonded. As a result, the design of the arrangement of each component of the electronic component mounting package 100 is facilitated, and the electronic component mounting package 100 that can efficiently transmit signals to the electronic component 200 can be obtained more easily.

The end of the signal line 12 in contact with the conductive bonding material 16 may be located in the same plane as the second surface 11a or inside the base 11 with respect to the second surface 11a. As a result, it is possible to reduce the generation of noise due to only the signal line 12, which is the lead electrode having the coaxial structure, protruding from the second surface 11 a and being positioned in parallel with the wiring pattern 141. In particular, since the conductive bonding material 16 can also be bonded to the insulating member 113 on the second surface 11a, sufficient bonding strength can be obtained even if only the tip of the signal line 12 is connected. Therefore, it is possible to reduce the occurrence of a problem due to the protrusion of the signal line 12.

Further, the width of the conductive bonding material 16 may be maximum at the position closest to the second surface 11a. That is, by increasing the bonding width at the tip of the signal line 12 having the coaxial structure with the conductive bonding material 16, it is possible to further reduce the increase in the characteristic impedance at the point where the structure of the signal line is switched. As a result, the electronic component mounting package 100 can reduce power loss of signals.

Also, the width of the conductive bonding material 16 may decrease with increasing distance from the second surface 11a. By connecting from the structure that reduces the increase in impedance at the tip of the signal line 12 to the wiring pattern 141 in which the characteristic impedance is designed in advance, a sharp change in the characteristic impedance can be achieved before connecting to the wiring pattern 141. Will be reduced. As a result, in the electronic component mounting package 100, it is possible to reduce the occurrence of noise in signals or the increase in power loss.

The width of the wiring A1411 that overlaps with the conductive bonding material 16 may decrease toward the second surface 11a. In the portion where the width of the conductive bonding material 16 is wide, the width of the conductive bonding material 16 determines the characteristic impedance, so it is not necessary to widen the width of the wiring A1411. Therefore, by decreasing the width of the wiring in this portion, the amount of the conductive metal used for the wiring pattern 141, especially the amount of gold used, can be reduced while reducing the width of the wiring as a whole, that is, a sharp change in the characteristic impedance. Can be reduced and the cost can be reduced.

Further, the conductive bonding material 16 may have a bonding portion A161 that also bonds to the signal line 12 and the insulating member 113 on the second surface 11a. By thus bonding the conductive bonding material 16 not only to the wiring pattern 141 and the signal line 12 but also to the insulating member 113, the bonding strength can be improved, so that initial defects can be reduced and durability can be improved. Can be improved.

Further, the bonding portion A161 of the conductive bonding material 16 may be bonded on the second surface 11a at a position farther from the first surface 14a than the signal line 12. As described above, since the bonding is performed not only in the range close to the first surface 14a but also in a wide range, it is difficult to concentrate the force on the bonding portion between the bonding portion A161 and the signal line 12, and the conductive bonding material is used. Since 16 is less likely to be peeled off from the signal line 12, it is possible to reduce initial failure and disconnection during use.

Further, the conductive bonding material 16 may be a nanoparticle sintering type bonding material paste. The resin of the nanoparticle sintering type bonding material paste is firmly bonded to the insulating member 113 and the wiring board 14, so that more stable bonding can be obtained. Thereby, as described above, the wiring pattern 141 is bonded to the wiring substrate 14 with a width wider than that of the wiring pattern 141. By adjusting the bonding range of this nanoparticle sintering type bonding material paste, it is possible to more flexibly obtain an appropriate characteristic impedance distribution from the tip of the signal line 12 in the extending direction of the wiring. As a result, signal power loss can be effectively reduced. In addition, since the sintering temperature of the nanoparticle-sintering-type bonding material paste is often lower than that of solder, it is possible to reduce the influence of high heat on other parts.

Further, the electronic device 1 of the present embodiment includes the electronic component mounting package 100 described above and the electronic component 200 connected to the wiring pattern 141. In such an electronic device, the power loss of the signal can be reduced by more appropriately matching the characteristic impedance, and the electronic component 200 can be effectively operated without wasting the power consumption.

The above embodiment is an example, and various modifications can be made.
For example, the positional relationship between the first surface 14a and the second surface 11a may not be orthogonal to each other, and the shape of each surface may be appropriately adjusted according to the electronic component 200 and the like. Further, the wiring A1411 of the wiring pattern 141 that is joined to the signal line 12 does not have to extend in the direction orthogonal to the second surface 11a.

Further, in the above embodiment, the signal line 12 is described as not protruding from the second surface 11a, but it may be slightly protruding. In this case, the signal line 12 and the wiring pattern 141 may be in direct contact with each other.

Further, in the above-described embodiment, the joint portion of the conductive joint material 16 has the maximum joint width with the first surface 14a at the contact surface with the second surface 11a, and gradually decreases with increasing distance from the second surface 11a. As a shape, a semicircle to an ellipse-like shape is shown, but the shape is not limited to this. The bonding portion of the conductive bonding material 16 may have a tapered shape in a plan view toward the first surface 14a, or may have a curve that gradually approaches the width of the wiring pattern 141. Further, the bonding width may be maximized at a position slightly apart from the contact surface with the second surface 11a depending on structural restrictions. Further, the change in the bonding width may be intermittent or may be in the form of fine steps. Further, the joining width may be finely increased or decreased depending on the accuracy of determining the joining range.

In addition, in the above-described embodiment, the description was made using the nanoparticle-sintered bonding material paste, but any other conductive bonding material that bonds to the wiring board 14 may be used.

Further, in the above-described embodiment, the signal line 12 and the wiring pattern 141 are joined by using the conductive joining material 16, but the same conductive joining is used for other connection parts, for example, for mounting the electronic component 200. Material 16 may be used, or a conventional bonding material may be used.

Further, when the signal is not transmitted by the coaxial line but the signal line 12 simply transmits a voltage change or the like, or a current flows, the base 11 may not be a conductive metal. .. When the base 11 is an insulating member having no conductivity, the signal line 12 may directly contact the base 11 and penetrate the through hole 111a. In this case, the wiring pattern 14 also does not become a microstrip line. Further, the conductive bonding material 16 may be directly bonded to the second surface 11a of the base 11 which is an insulating member. Further, the through hole 111 a may not be a hole formed in the base body 11 afterwards, but may be formed as a result of forming the base body 11 of the insulating member around the signal line 12.
In addition, specific details such as the configuration, the structure, the positional relationship, and the shape shown in the above-described embodiment can be appropriately changed without departing from the gist of the present disclosure.

The contents of the present disclosure can be used for electronic component mounting packages and electronic devices.

DESCRIPTION OF SYMBOLS 1 electronic device 11 base 11a second surface 111 base 111a through hole 112 protrusion 113 insulating member 12 signal line 14 wiring board 14a first surface

14b bonding surfaces

141, 141a to 141c wiring pattern 1411 wiring A
16 Conductive Joining Material 161 Joining Part A
100, 100a to 100c Electronic component mounting package 200 Electronic component

Claims

A wiring board having a first surface and a wiring pattern located on the first surface;
A base having a second surface in contact with a surface adjacent to the first surface;
A signal line penetrating the base,
Conductive bonding material,
Equipped with
The wiring pattern has a wiring A extending in a first direction away from the second surface,
The conductive bonding material bonds the wiring A and the signal line,
A package for mounting an electronic component, wherein a width of the conductive bonding material orthogonal to the first direction is wider than the width of the wiring A.
The electronic component mounting according to claim 1, wherein the signal line has an end portion of the signal line in contact with the conductive bonding material, which is located at the same position as the second surface or inside the base from the second surface. For the package.
The electronic component mounting package according to claim 1 or 2, wherein the width of the conductive bonding material is maximum at a position closest to the second surface.
The electronic component mounting package according to claim 3, wherein the width of the conductive bonding material decreases with increasing distance from the second surface.
The electronic component mounting package according to any one of claims 1 to 4, wherein the width of the wiring A that overlaps with the conductive bonding material is reduced toward the second surface.
The package for mounting electronic parts according to any one of claims 1 to 5, wherein the conductive bonding material has a bonding portion A that also bonds to the second surface.
The electronic component mounting package according to claim 6, wherein the joint portion A is joined at a position farther from the first surface than the signal line.
The electronic component mounting package according to any one of claims 1 to 7, wherein the conductive bonding material is a nanoparticle sintering type bonding material paste.
An electronic component mounting package according to any one of claims 1 to 8,
An electronic component connected to the wiring pattern,
An electronic device comprising: