WO2020158928A1

WO2020158928A1 - Electronic component mounting package, and electronic device

Info

Publication number: WO2020158928A1
Application number: PCT/JP2020/003719
Authority: WO
Inventors: 光治坂井; 光北原
Original assignee: 京セラ株式会社
Priority date: 2019-01-31
Filing date: 2020-01-31
Publication date: 2020-08-06
Also published as: JP2022046833A

Abstract

This electronic component mounting package is provided with: a substrate including a base portion with a first surface; a wiring substrate which has a second surface in contact with the first surface, and a third surface positioned on the opposite side to the second surface; a ground layer joined to the third surface of the wiring substrate; and a signal line penetrating through the substrate in a direction transverse to the first surface, and having a first end exposed on the first surface. A first distance between the first end and the ground layer is smaller than a second distance between the second surface and the ground layer.

Description

Electronic component mounting package and electronic device

The present disclosure relates to electronic component mounting packages and electronic devices.

There is a package for mounting an electronic component that has a wiring pattern that is joined to the electronic component and a signal line that is joined to the wiring pattern. In this package, the signal line transmits a signal with a coaxial line structure, and the wiring pattern transmits a signal with a microstrip line structure or a coplanar structure. As disclosed in Japanese Unexamined Patent Application Publication No. 2004-335584, there is a technique related to a structure for reducing the local change of the characteristic impedance and the occurrence of noise at the portion where the structure is switched.

One aspect of the present disclosure is
A substrate including a base having a first surface;
A wiring board having a second surface in contact with the first surface and a third surface located on the opposite side of the second surface;
A ground layer joined to the third surface of the wiring board;
A signal line penetrating the base body in a direction intersecting with the first surface and having a first end exposed on the first surface;
Equipped with
A first distance between the first end and the ground layer is smaller than a second distance between the second surface and the ground layer,
It is a package for mounting electronic components.

In addition, another aspect of the present disclosure is
The above electronic component mounting package,
An electronic component mounted on the wiring board,
It is an electronic device provided with.

It is the whole perspective view showing this embodiment. It is sectional drawing in a surface containing a signal line and perpendicular|vertical to a 2nd surface. 6 is a chart showing parameter settings for calculating a signal loss according to a distance between a signal line and a ground layer. It is a figure which shows the result of the simulation which calculated the reflection loss of signal strength. It is a figure which shows the result of the simulation which calculated the insertion loss of signal strength. It is the figure which showed the change of the magnitude of the return loss in a high frequency band with respect to the distance of a ground layer and a signal line. It is the figure which showed the change of the magnitude of the insertion loss in a high frequency band with respect to the distance of a ground layer and a signal line. FIG. 2 is a partial plan view of the electronic component mounting package according to the present embodiment, which corresponds to the range S in FIG. 1.

Hereinafter, embodiments will be described with reference to the drawings.
FIG. 1 is an overall perspective view of the electronic device 1 of this embodiment.

The electronic device 1 includes an electronic component mounting package 100 and an electronic component 200.
The electronic component mounting package 100 includes a base 11, a signal line 12, a wiring board 14, a ground layer 15, a bonding material 16, a conductive bonding material 17, and the like.

The base 11 is a conductive metal and functions as a ground plane. As the substrate 11, one having high thermal conductivity and high heat dissipation may be used. The base body 11 includes a base portion 111 and a protruding portion 112. The base 111 has, for example, a disk shape with a diameter of 3 to 10 mm and a thickness of 0.5 to 2 mm here, but is not limited thereto. The base 111 has a through hole 111a and a first surface 111b. One end of the through hole 111a is inside the first surface 111b. That is, the through hole 111a penetrates in the direction intersecting the first surface 111b. The inside of the through hole 111a is occupied by the insulating member 113. The insulating member 113 is, for example, a glass or ceramic material. The material of the insulating member 113 and the size of the through hole 111a may be determined according to desired characteristic impedance related to signal transmission by the signal line 12. The base 111 and the protrusion 112 may be integrated.

The projecting portion 112 projects from the first surface 111b of the base 111, which is one of the surfaces including the one end of the through hole 111a. The protrusion 112 has a fourth surface 112a that is in contact with the first surface 111b, and the fourth surface 112a has a planar shape. The wiring board 14 is located above the fourth surface 112 a with the bonding material 16 interposed therebetween.

The wiring board 14 has a second surface 14a. The wiring pattern 141 is located on the second surface 14a. The wiring board 14 has a third surface 14b opposite to the second surface 14a. The third surface 14b is joined to the ground layer 15. Here, the wiring board 14 is used as, for example, a high-frequency line board. The wiring board 14 is a flat insulating substrate, and is, for example, a resin or ceramic substrate. The shape of the wiring pattern 141 and the thickness and material of the wiring board 14, particularly the relative dielectric constant of the wiring board 14 may be appropriately determined according to the desired characteristic impedance related to signal transmission. The third surface 14b and the second surface 14a of the wiring board 14 are in contact with the first surface 111b of the base 11, that is, the base 111, respectively. Here, the third surface 14b and the second surface 14a are perpendicular to the first surface 111b.

The ground layer 15 is, for example, a gold (Au) thin film layer and is bonded to the third surface 14b. The ground layer 15 may not cover the entire third surface 14b. The ground layer 15 may have, for example, various shapes surrounding the range of the wiring pattern 141 when viewed from above the second surface 14a.

The bonding material 16 is located between the wiring board 14 and the protrusion 112. More specifically, the bonding material 16 is located between the ground layer 15 on the third surface 14b of the wiring board 14 and the fourth surface 112a of the protrusion 112. The bonding material 16 has a property of being capable of being bonded and solidified by appropriately adjusting the layer thickness. Examples of such a property include a proper viscosity, for example, a viscosity of 30 Pa·s ⁻¹ or more and 250 Pa·s ⁻¹ or less. Here, the bonding material 16 is a nanoparticle sintering type bonding material paste. The nano-particle sintering type bonding material paste contains nano-sized metal particles covered with a surface stabilizer, a resin, and an organic solvent. Examples of the metal particles include silver and copper. In the nanoparticle sintering type bonding material paste, the organic solvent is volatilized after being fixed. That is, in the nanoparticle-sintering-type bonding material paste, the metal particles are activated and the metal particles react with each other to bond, and the metal particles also react with and adhere to the metal surface. Depending on the shapes of the ground layer 15 and the bonding material 16, the third surface 14b and the fourth surface 112a face each other with the ground layer 15 and the bonding material 16 interposed therebetween.

The wiring pattern 141 is electrically connected to the electronic component 200 and supplies electric power and a signal to the electronic component 200. The wiring pattern 141 may be a conductive metal film having a low resistance, here, a gold thin film. Here, the wiring pattern 141 is joined to the signal line 12 at two locations via the conductive joining material 17. The shape, length and position of the wiring pattern 141 may be appropriately determined according to the size and terminal position of the electronic component 200 to be connected. The wiring pattern 141 is separated from the ground layer 15 by the wiring board 14. That is, signals are transmitted on the wiring board 14 by the microstrip line structure.

The signal line 12 is a rod-shaped conductor. The signal line 12 may protrude on the side of the surface 111c of the base 111 opposite to the first surface 111b. The signal line 12 is electrically connected to an external wiring or the like and used as a lead electrode. The diameter of the signal line 12 may be, for example, about 0.1 to 1.0 mm. At least one of the signal lines 12 is a ground terminal of the base 11, and is directly bonded to the base 111. The other signal line 12, here two signal lines 12, penetrate the through hole 111a of the base 111 and the first end 12a is exposed on the first surface 111b. That is, the signal line 12 penetrates the base portion 111 of the base 11 in a direction intersecting the first surface 111b, similarly to the through hole 111a. The signal line 12 does not protrude from the first surface 111b. The first end 12a may be in the same plane as the first surface 111b or may be recessed from the first surface 111b. That is, the first end 12a may be located in the through hole 111a.

The first ends 12a of the two signal lines 12 are located substantially at the center of the exposed portion of the insulating member 113 that occupies the inside of the separate through hole 111a on the first surface 111b of the base 111. These two signal lines 12 may penetrate the insulating member 113. Inside the insulating member 113, the signal line 12 is opposed to the outer base portion 111 by being separated by the insulating member 113. In this way, the signal is transmitted in the base 111 by the coaxial line structure.

The conductive bonding material 17 electrically connects the first end 12a of the signal line 12 and the wiring pattern 141 on the second surface 14a. The conductive bonding material 17 may be capable of bonding not only to the signal line 12 and the wiring pattern 141 but also to the insulating insulating member 113 and the wiring board 14 in the through hole 111a. Here, the conductive bonding material 17 may be, for example, a nanoparticle sintering type bonding material paste. The above-mentioned nanoparticle sintering type bonding material paste has conductivity due to the bonding of the metal particles at the time of fixing.

The electronic component 200 shown by the broken line is located on the second surface 14a, and is directly and/or bonded to the wiring pattern 141 by wire bonding or the like to be electrically connected. The electronic component 200 may be, for example, a laser diode. Alternatively, as the electronic component 200, various types such as a photodiode, an LED (Light Emitting Diode) or a Peltier element, and various sensor elements may be used.

The protruding portion 112, the wiring board 14 having the wiring pattern 141, and the electronic component 200 may be covered with the cover member (not shown) as a cover body and separated from the outside by the cover body. When the electronic component 200 emits light to the outside, the cover member may have a window made of a material that transmits the wavelength of the emitted light.

FIG. 2 is a cross-sectional view of the electronic component mounting package 100 of the present embodiment, taken along a plane including one signal line 12 and perpendicular to the second surface 14a.

The bonding material 16, the ground layer 15, and the wiring board 14 are sequentially located on the fourth surface 112 a of the protrusion 112. The bonding material 16 is located between the ground layer 15 and the fourth surface 112 a of the protruding portion 112 and bonded to each. The ground layer 15 is located between the bonding material 16 and the third surface 14b of the wiring board 14, and is bonded to each.

The shortest distance W between the signal line 12 and the contact surface 15a with the third surface 14b of the ground layer 15 is the thickness of the wiring board 14 in the direction perpendicular to the third surface 14b, that is, the wiring board 14 Is smaller than the distance W0 between the second surface 14a and the ground layer 15. Here, the distance W is the first distance in the present embodiment. The distance W0 is the second distance in this embodiment. A part of the signal line 12 is covered with the wiring board 14 on the first surface 111b according to the diameter of the signal line 12 described above. More specifically, here, of the first end 12a of the signal line 12, a range of the height D from the lower end of the first end 12a of the signal line 12 in FIG. 2 is covered with the wiring board 14. That is, when the first surface 111b is viewed from the X direction in FIG. 2, at least part of the first end 12a of the signal line 12 overlaps the wiring board 14. Since the wiring pattern 141 extends in the vertical direction (X direction) with respect to the first surface 111b in FIG. 2, the signal line 12 and the wiring pattern 141 are bonded by the conductive bonding material 17 at the shortest distance. There is. The characteristic impedance of the connecting portion between the conductive bonding material 17 of the microstrip line structure and the coaxial line in the base 111 increases as the distance between the signal line 12 of the coaxial line and the ground layer 15 of the microstrip line structure increases. In the present embodiment, by reducing the distance W and increasing the height D, the local characteristic impedance change, particularly the increase, at the joint portion from the signal line 12 to the wiring pattern 141 is reduced.

Here, the fourth surface 112a, which is the joint surface of the protrusion 112 with the joint material 16, may be equal to the lower end of the through hole 111a. That is, the side of the fourth surface 112a, which is the root portion of the fourth surface 112a, that is in contact with the first surface 111b may be in contact with the lower end of the edge of the through hole 111a. Here, as shown in FIG. 2, the lower end of the edge of the through hole 111a is the lowest portion of the portion where the base 111 and the insulating member 113 are in contact with each other. Further, a case where there is a slight distance shift between the lower end of the edge of the through hole 111a and the root portion of the fourth surface 112a according to the formation accuracy of the base body 11 is also included in the “contact” here. You can be. The distance W and the height D are determined by appropriately adjusting the thickness of the bonding material 16. As a result, a part of the first end 12a of the signal line 12 is covered with the wiring board 14.

FIG. 3 is a table showing parameter settings for calculating the signal loss according to the distance W in the electronic component mounting package of the above embodiment. With the conventional position where the signal line 12 and the wiring board 14 do not contact as a reference, the distance W is made shorter than this reference, and various distances W at which the signal line 12 and the wiring board 14 contact each other and corresponding contact heights D The simulation of signal loss was performed respectively. The reference parameter settings are shown in the top row of FIG.

FIG. 4A and FIG. 4B are diagrams showing the results of simulations in which the reflection loss and the insertion loss of the signal strength are calculated. 5A and 5B are diagrams showing changes in the magnitude of the reflection loss and the insertion loss with respect to the distance W in the high frequency band. Note that the smaller the value of the reflection loss, the smaller the loss, and the larger the value of the insertion loss, the smaller the loss.
As shown in FIG. 4A, as the distance W between the ground layer 15 and the signal line 12 becomes smaller, the change in reflection loss with respect to the signal frequency becomes smaller as compared with the reference parameter setting. In particular, when the distance W is small, the increase in reflection loss is reduced on the high frequency band side of 30 GHz or higher. Further, as shown in FIG. 4B, as the distance W between the ground layer 15 and the signal line 12 decreases, the decrease in insertion loss with respect to the signal frequency is reduced. Particularly, when the distance W is small, a high frequency band of 30 GHz or higher is obtained. On the side, the improvement of insertion loss is suitably seen.

5A and 5B, for each distance W, the maximum value of the reflection loss in the high frequency band, here, 30 to 50 GHz is shown in FIG. 5A, and the minimum value of the insertion loss is shown in FIG. 5B. .. As shown in FIG. 5A, there is a tendency that the value of the reflection loss becomes smaller and the loss becomes smaller on the side where the distance between the ground layer 15 and the signal line 12 is smaller. Further, as shown in FIG. 5B, there is a tendency that the value of the insertion loss becomes larger and the loss becomes smaller on the side where the distance between the ground layer 15 and the signal line 12 is smaller. That is, since the distance between the ground layer 15 and the signal line 12 is appropriately smaller than the distance between the second surface 14a indicating the thickness of the wiring board 14 and the ground layer 15, the loss is reduced as compared with the conventional case, It becomes possible to efficiently supply electric power and transmit signals.

As described above, the electronic component mounting package 100 of the present embodiment includes the base 11 including the base 111 having the first surface 111b, the second surface 14a in contact with the first surface 111b, and the side opposite to the second surface 14a. The wiring board 14 having the third surface 14b located at, the ground layer 15 having the first end 12a joined to the third surface 14b, and the base 11 penetrating in the direction intersecting the first surface 111b, The signal line 12 exposed on the first surface 111b. The distance W between the first end 12a and the ground layer 15 is smaller than the distance W0 between the second surface 14a and the ground layer 15.
As a result, it is possible to effectively reduce the local increase in the characteristic impedance at the joint of the signal path by the signal line 12 and the wiring pattern 141, and reduce the signal loss. Therefore, according to the electronic component mounting package 100, it is possible to easily and efficiently transmit a signal to the mounted electronic component 200. Particularly, according to the electronic component mounting package 100, the transmission efficiency in the high frequency band is improved.

Also, the second surface 14a may be perpendicular to the first surface 111b. That is, since the signal line 12 penetrating the first surface 111b and the wiring pattern 141 on the second surface 14a extend in the same direction, bending is unlikely to occur at the joint between the signal line 12 and the wiring pattern 141. As a result, the signal line 12 and the wiring pattern 141 are more stably connected, and the transmission loss can be reduced.

The base 11 further includes a protrusion 112 protruding from the first surface 111b, the protrusion 112 has a fourth surface 112a in contact with the first surface 111b, and the wiring board 14 has a third surface 14b. May be located on the protrusion 112 so as to face the fourth surface 112a. With such a shape, the wiring board 14 in which the second surface 14a is in contact with the first surface 111b of the base 11 can be easily and accurately positioned.

The electronic component mounting package 100 may further include a bonding material 16 that is located between the fourth surface 112 a and the ground layer 15 and bonded to the fourth surface 112 a and the ground layer 15. As described above, the bonding material 16, the ground layer 15, and the wiring board 14 are sequentially arranged on the fourth surface 112 a of the protrusion 112, and the positional relationship between the ground layer 15 and the signal line 12 is determined according to the thickness of the bonding material 16. Is determined. Therefore, by adjusting the thickness of the bonding material 16, it is possible to easily obtain an electronic component mounting package having a small characteristic impedance. Further, since no step is formed between the signal line 12 and the wiring pattern 141, the signal line 12 and the wiring pattern 141 can be connected in a short distance by a small amount of the conductive bonding material 17. Further, the conductive bonding material 17 itself is also arranged so as to form a part of the microstrip line structure, and the distance between the conductive bonding material 17 and the ground layer 15 can be shortened. As a result, the change in characteristic impedance is further reduced, and good signal transmission is possible. Further, the conductive bonding material 17 connects the first surface 111b and the second surface 14a perpendicular to the first surface 111b. The signal line 12 and the wiring pattern 141 can be connected to each other above the second surface 14a of the conductive bonding material 17, that is, without increasing the dimension in the height direction excessively. Therefore, the stress due to the shrinkage due to heating is less likely to act in the direction in which the base 11 and the wiring board 14 are bent, and distortion or the like can be reduced. In addition, the thickness of the bonding material 16 can be adjusted more easily than in the case where a conductor film or a conductor plate is simply used. Therefore, the positional relationship between the ground layer 15 and the signal line 12 can be easily adjusted appropriately to make the electronic component having a small characteristic impedance. A mounting package can be obtained.

Also, the bonding material 16 may be a nanoparticle sintered type member paste. The nanoparticle-sintered member paste here means the state after being fixed. This ensures that the bonding material 16 is also bonded to the wiring board 14 that is an insulating member. Moreover, since the bonding material 16 is a paste-like member, the thickness of the bonding material 16 can be easily adjusted. Therefore, it is possible to accurately position the bonding material 16 at a desired position, bond the bonding material 16 to the protrusion 112 and the wiring board 14, and solidify the bonding material 16. Therefore, it is suitable for obtaining the electronic component mounting package 100 of the present embodiment.

In addition, the base 111 of the base 11 has a through hole 111a penetrating in a direction intersecting with the first surface 111b, and the signal line 12 penetrates the through hole 111a and has an insulating member 113 in the through hole 111a. And may face the base 111. At this time, the side where the first surface 111b and the fourth surface 112a are in contact may be in contact with the edge of the through hole 111a. With such a structure, it is possible to easily form the electronic component mounting package 100 having the above-described magnitude relationship between the first distance W and the second distance W0. Further, the thickness of the bonding material 16 can be easily determined according to the desired distance W.

Also, the upper end of the first end 12a of the signal line 12 may be located above the second surface 14a. In this case, the signal line 12 and the wiring pattern 141 can be preferably electrically connected to each other without unnecessarily increasing the amount of the conductive bonding material 17.

Further, FIG. 6 is a plan view of the range S shown in FIG. 1 viewed from a direction perpendicular to the first surface 111b. As shown in FIG. 6, when the signal line 12 is viewed from a direction (X direction) perpendicular to the first surface 111b, the first portion 12b that does not overlap the wiring board 14 and the wiring board 14 are provided. It may have the 2nd portion 12c which overlaps and is located. The first portion 12b may be larger than the second portion 12c. In such a case, the effect of reducing the signal transmission loss in the above-mentioned high frequency band is enhanced. It should be noted that, here, that the first portion 12b is larger than the second portion 12c means, for example, that the area of the first portion 12b in FIG. 6 is larger than the area of the second portion 12c.

Further, the electronic device 1 of the present embodiment includes the above-mentioned electronic component mounting package 100 and the electronic component 200 mounted on the wiring board 14. According to this electronic device 1, the characteristic impedance relating to signal transmission can be appropriately reduced with an easy structure and formation process. As a result, in the electronic device 1, the drive signal can be input to the electronic component 200 easily, efficiently, and reliably.

The above embodiment is an example, and various modifications can be made.
For example, although the thickness of the bonding material 16 is uniform and the second surface 14a and the third surface 14b are parallel to the fourth surface 112a in the above-described embodiment, the bonding material 16 and the wiring board are described. The shapes of 14 and the protrusion 112 are not limited to this. For example, the thickness of the bonding material 16 may be non-uniform, and the second surface 14a and/or the third surface 14b may be slightly inclined with respect to the fourth surface 112a.

Further, in the above embodiment, the distance W is adjusted by the thickness of the bonding material 16, but another plate material having a predetermined thickness may be located between the protrusion 112 and the ground layer 15. ..

Further, in the base body 11 of the electronic component mounting package 100 according to the above-described embodiment, it is described that the first ends 12a of the two signal lines 12 are exposed from the first surface 111b. It is not limited to two. For example, the tips of three or more signal lines 12 may be exposed from the first surface 111b and may transmit a plurality of signals. In the above embodiment, the first ends 12a of the two signal lines 12 are located at the same distance from the ground layer 15, but the first ends 12a of the plurality of signal lines 12 are described. The distance between the ground layer 15 and the ground layer 15 may be different as long as no problem occurs in signal transmission.

Further, in the above-described embodiment, the nanoparticle sintering type bonding material paste has been described as an example of the bonding material 16, but other materials may be used, or a material having no conductivity may be used. The material having no conductivity is, for example, resin. When the bonding material 16 does not have conductivity, the ground layer 15 may have a pattern shape that contacts any part of the base 11.

In addition, in the above-described embodiment, the electronic device 1 including the one protruding portion 112, the one wiring board 14, and the one electronic component 200 has been described as an example, but the present invention is not limited to this. For example, one electronic device 1 may have a plurality of electronic components 200, and accordingly, the electronic component mounting package 100 may have a plurality of wiring boards 14. At this time, the plurality of wiring boards 14 may be joined to one protrusion 112, or may be joined to separate protrusions 112.

The electronic component mounting package 100 may be manufactured and traded separately from the electronic component 200. In addition, the specific configurations, structures, and positional relations of respective parts shown in the above-described embodiments can be appropriately changed without departing from the gist of the present disclosure.

The present disclosure can be used for electronic component mounting packages and electronic devices.

REFERENCE SIGNS LIST 1 electronic device 11 base 111 base 111a through hole 111b first surface 112 protrusion 112a fourth surface 113 insulating member 12 signal line 12a first end 12b first portion 12c second portion 14 wiring board 14a second surface 14b third surface 141 Wiring pattern 15 Ground layer 15a Contact surface 16 Bonding material 17 Conductive bonding material 100 Electronic component mounting package 200 Electronic component W First distance W0 Second distance

Claims

A substrate including a base having a first surface;
A wiring board having a second surface in contact with the first surface and a third surface located on the opposite side of the second surface;
A ground layer joined to the third surface of the wiring board;
A signal line penetrating the base body in a direction intersecting with the first surface and having a first end exposed on the first surface;
Equipped with
A first distance between the first end and the ground layer is smaller than a second distance between the second surface and the ground layer,
Electronic component mounting package.
The electronic component mounting package according to claim 1, wherein the second surface is perpendicular to the first surface.
The base further includes a protrusion protruding from the first surface,
The protrusion has a fourth surface in contact with the first surface,
The wiring board is located on the protrusion so that the third surface faces the fourth surface,
The electronic component mounting package according to claim 1.
The electronic component mounting package according to claim 3, further comprising a bonding material that is located between the fourth surface and the ground layer and that bonds to the fourth surface and the ground layer.
The electronic component mounting package according to claim 4, wherein the bonding material is a nanoparticle sintering type bonding material paste.
The base portion of the base has a through-hole penetrating in a direction intersecting with the first surface,
The signal line penetrates the through hole and faces the base through an insulating member in the through hole,
A side where the first surface and the second surface are in contact with an edge of the through hole,
The electronic component mounting package according to any one of claims 1 to 5.
The electronic component mounting package according to any one of claims 1 to 6, wherein an upper end of the first end of the signal line is located above the second surface.
The signal line has a first portion that does not overlap the wiring board and a second portion that overlaps the wiring board when viewed from a direction perpendicular to the first surface. And
The first portion is larger than the second portion,
The electronic component mounting package according to claim 7.
An electronic component mounting package according to any one of claims 1 to 8,
An electronic component mounted on the wiring board,
An electronic device comprising.