JP2008127577A - マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ - Google Patents

マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ Download PDF

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Publication number
JP2008127577A
JP2008127577A JP2007302729A JP2007302729A JP2008127577A JP 2008127577 A JP2008127577 A JP 2008127577A JP 2007302729 A JP2007302729 A JP 2007302729A JP 2007302729 A JP2007302729 A JP 2007302729A JP 2008127577 A JP2008127577 A JP 2008127577A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
sealing
multichip package
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007302729A
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English (en)
Japanese (ja)
Other versions
JP2008127577A5 (enExample
Inventor
Kyoung Chul Bae
キョン チュル バエ
Jin A Kim
ジン ア キム
Yoon Kok Park
ヨン コク パク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cheil Industries Inc
Original Assignee
Cheil Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Industries Inc filed Critical Cheil Industries Inc
Publication of JP2008127577A publication Critical patent/JP2008127577A/ja
Publication of JP2008127577A5 publication Critical patent/JP2008127577A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2007302729A 2006-11-24 2007-11-22 マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ Pending JP2008127577A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060117214A KR100834351B1 (ko) 2006-11-24 2006-11-24 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지

Publications (2)

Publication Number Publication Date
JP2008127577A true JP2008127577A (ja) 2008-06-05
JP2008127577A5 JP2008127577A5 (enExample) 2008-12-11

Family

ID=39476171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007302729A Pending JP2008127577A (ja) 2006-11-24 2007-11-22 マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ

Country Status (4)

Country Link
US (1) US20080131702A1 (enExample)
JP (1) JP2008127577A (enExample)
KR (1) KR100834351B1 (enExample)
CN (1) CN101186802B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020138998A (ja) * 2019-02-27 2020-09-03 株式会社東光高岳 エポキシ樹脂組成物、絶縁性成形体及びその製造方法
JP2022158797A (ja) * 2021-03-31 2022-10-17 住友ベークライト株式会社 封止用樹脂組成物、硬化物および電子装置の製造方法

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JP2010163566A (ja) * 2009-01-16 2010-07-29 Three M Innovative Properties Co エポキシ樹脂組成物
CN102694761B (zh) * 2011-03-24 2017-01-25 中兴通讯股份有限公司 接收信号的方法及系统、收发信号的方法及系统
KR101469265B1 (ko) * 2011-12-26 2014-12-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
US20140018475A1 (en) * 2012-07-16 2014-01-16 Baker Hughes Incorporated High glass transition temperature thermoset and method of making the same
KR101557538B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR20140082521A (ko) * 2012-12-24 2014-07-02 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101516068B1 (ko) * 2013-06-14 2015-04-29 삼성전기주식회사 인쇄회로기판용 수지 조성물, 빌드업필름, 프리프레그 및 인쇄회로기판
KR101731495B1 (ko) * 2015-01-08 2017-04-28 한국과학기술연구원 폴리오르가노―실세스퀴옥산 및 파장변환제를 포함하는 코팅 조성물, 및 이를 이용한 파장변환 시트
JP6740226B2 (ja) * 2015-06-17 2020-08-12 株式会社ダイセル 硬化性組成物
US10590319B2 (en) * 2015-08-03 2020-03-17 Namics Corporation High performance, thermally conductive surface mount (die attach) adhesives
US9704767B1 (en) * 2015-12-23 2017-07-11 Intel Corporation Mold compound with reinforced fibers
WO2020194920A1 (ja) * 2019-03-27 2020-10-01 日本発條株式会社 熱硬化性エポキシ樹脂組成物、回路基板用積層板、金属ベース回路基板、およびパワーモジュール
TWI784356B (zh) * 2020-11-30 2022-11-21 財團法人工業技術研究院 具環氧基之矽氧烷改質樹脂、封裝材料、與封裝結構
TWI915528B (zh) * 2021-03-31 2026-02-21 日商日東電工股份有限公司 光半導體密封用樹脂組合物、光半導體密封用樹脂成形物、光半導體密封材及光半導體裝置
US20240404898A1 (en) * 2023-05-30 2024-12-05 Taiwan Semiconductor Manufacturing Company, Ltd. Molding composition, semiconductor package and method of fabricating the same

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020138998A (ja) * 2019-02-27 2020-09-03 株式会社東光高岳 エポキシ樹脂組成物、絶縁性成形体及びその製造方法
JP7221079B2 (ja) 2019-02-27 2023-02-13 株式会社東光高岳 エポキシ樹脂組成物、絶縁性成形体及びその製造方法
JP2022158797A (ja) * 2021-03-31 2022-10-17 住友ベークライト株式会社 封止用樹脂組成物、硬化物および電子装置の製造方法

Also Published As

Publication number Publication date
US20080131702A1 (en) 2008-06-05
KR20080047185A (ko) 2008-05-28
CN101186802A (zh) 2008-05-28
KR100834351B1 (ko) 2008-06-02
CN101186802B (zh) 2011-06-08

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