JP2008127577A5 - - Google Patents

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Publication number
JP2008127577A5
JP2008127577A5 JP2007302729A JP2007302729A JP2008127577A5 JP 2008127577 A5 JP2008127577 A5 JP 2008127577A5 JP 2007302729 A JP2007302729 A JP 2007302729A JP 2007302729 A JP2007302729 A JP 2007302729A JP 2008127577 A5 JP2008127577 A5 JP 2008127577A5
Authority
JP
Japan
Prior art keywords
epoxy resin
sealing
general formula
following general
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007302729A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008127577A (ja
Filing date
Publication date
Priority claimed from KR1020060117214A external-priority patent/KR100834351B1/ko
Application filed filed Critical
Publication of JP2008127577A publication Critical patent/JP2008127577A/ja
Publication of JP2008127577A5 publication Critical patent/JP2008127577A5/ja
Pending legal-status Critical Current

Links

JP2007302729A 2006-11-24 2007-11-22 マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ Pending JP2008127577A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060117214A KR100834351B1 (ko) 2006-11-24 2006-11-24 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지

Publications (2)

Publication Number Publication Date
JP2008127577A JP2008127577A (ja) 2008-06-05
JP2008127577A5 true JP2008127577A5 (enExample) 2008-12-11

Family

ID=39476171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007302729A Pending JP2008127577A (ja) 2006-11-24 2007-11-22 マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ

Country Status (4)

Country Link
US (1) US20080131702A1 (enExample)
JP (1) JP2008127577A (enExample)
KR (1) KR100834351B1 (enExample)
CN (1) CN101186802B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010163566A (ja) * 2009-01-16 2010-07-29 Three M Innovative Properties Co エポキシ樹脂組成物
CN102694761B (zh) * 2011-03-24 2017-01-25 中兴通讯股份有限公司 接收信号的方法及系统、收发信号的方法及系统
KR101469265B1 (ko) * 2011-12-26 2014-12-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
US20140018475A1 (en) * 2012-07-16 2014-01-16 Baker Hughes Incorporated High glass transition temperature thermoset and method of making the same
KR20140082521A (ko) * 2012-12-24 2014-07-02 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101557538B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101516068B1 (ko) * 2013-06-14 2015-04-29 삼성전기주식회사 인쇄회로기판용 수지 조성물, 빌드업필름, 프리프레그 및 인쇄회로기판
KR101731495B1 (ko) * 2015-01-08 2017-04-28 한국과학기술연구원 폴리오르가노―실세스퀴옥산 및 파장변환제를 포함하는 코팅 조성물, 및 이를 이용한 파장변환 시트
CN107709400B (zh) * 2015-06-17 2020-05-12 株式会社大赛璐 固化性组合物
KR102487472B1 (ko) * 2015-08-03 2023-01-12 나믹스 가부시끼가이샤 고성능, 열 전도성 표면 실장 (다이 부착) 접착제
US9704767B1 (en) * 2015-12-23 2017-07-11 Intel Corporation Mold compound with reinforced fibers
JP7221079B2 (ja) * 2019-02-27 2023-02-13 株式会社東光高岳 エポキシ樹脂組成物、絶縁性成形体及びその製造方法
JP6855639B2 (ja) * 2019-03-27 2021-04-07 日本発條株式会社 回路基板用積層板、金属ベース回路基板、およびパワーモジュール
TWI784356B (zh) * 2020-11-30 2022-11-21 財團法人工業技術研究院 具環氧基之矽氧烷改質樹脂、封裝材料、與封裝結構
JP2022158797A (ja) * 2021-03-31 2022-10-17 住友ベークライト株式会社 封止用樹脂組成物、硬化物および電子装置の製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294738A (en) * 1963-12-23 1966-12-27 Gen Electric Method for making arylsilsesquioxane ladder polymers
JPS59109565A (ja) * 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
US4835057A (en) * 1987-03-25 1989-05-30 At&T Bell Laboratories Glass fibers having organosilsesquioxane coatings and claddings
CA1327414C (en) * 1988-06-27 1994-03-01 Junichiro Washiyama Heat-resistant resin composition
US5476884A (en) * 1989-02-20 1995-12-19 Toray Industries, Inc. Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents
US5052779A (en) * 1989-07-31 1991-10-01 Sumitomo Electric Industries, Ltd. Polymer clad optical fiber
JPH06216280A (ja) * 1993-01-21 1994-08-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
US5962067A (en) * 1997-09-09 1999-10-05 Lucent Technologies Inc. Method for coating an article with a ladder siloxane polymer and coated article
JP2000017149A (ja) * 1998-07-02 2000-01-18 Nippon Kayaku Co Ltd 封止材用液状エポキシ樹脂組成物及びその硬化物
ES2190277T3 (es) * 1998-12-09 2003-07-16 Vantico Ag Sistema hidrofobo de resina epoxi.
US6764616B1 (en) * 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
KR20000063142A (ko) * 2000-02-17 2000-11-06 이응찬 폴리오르가노실세스키옥산 제조용 출발물질,폴리오르가노실세스키옥산 및 폴리오르가노실세스키옥산제조방법
CN1288914A (zh) * 2000-08-30 2001-03-28 中国科学院化学研究所 一种含复合无机填料的环氧树脂组合物
US6706405B2 (en) * 2002-02-11 2004-03-16 Analytical Services & Materials, Inc. Composite coating for imparting particel erosion resistance
US6856745B2 (en) * 2002-07-02 2005-02-15 Lucent Technologies Inc. Waveguide and applications therefor
US20040077778A1 (en) * 2002-08-07 2004-04-22 Isidor Hazan One-pack primer sealer compositions for SMC automotive body panels
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
KR100543092B1 (ko) * 2002-12-07 2006-01-20 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
CN1315905C (zh) * 2003-02-18 2007-05-16 住友电木株式会社 环氧树脂组合物和半导体器件
US7168266B2 (en) * 2003-03-06 2007-01-30 Lucent Technologies Inc. Process for making crystalline structures having interconnected pores and high refractive index contrasts
WO2004081078A1 (ja) * 2003-03-11 2004-09-23 Sumitomo Bakelite Co. Ltd. 半導体封止用樹脂組成物およびこれを用いた半導体装置
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4734832B2 (ja) * 2003-05-14 2011-07-27 ナガセケムテックス株式会社 光素子用封止材
US20060154079A1 (en) * 2004-02-13 2006-07-13 Atsunori Nishikawa Epoxy resin composition and semiconductor device
US7160963B2 (en) * 2004-04-30 2007-01-09 Eastman Kodak Company Toner fuser member with release layer formed from silsesquioxane-epoxy resin composition
JP4690737B2 (ja) * 2005-02-10 2011-06-01 リンテック株式会社 ラダー型ポリシルセスキオキサンを含む樹脂組成物およびその用途

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