JP2008124339A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008124339A5 JP2008124339A5 JP2006308322A JP2006308322A JP2008124339A5 JP 2008124339 A5 JP2008124339 A5 JP 2008124339A5 JP 2006308322 A JP2006308322 A JP 2006308322A JP 2006308322 A JP2006308322 A JP 2006308322A JP 2008124339 A5 JP2008124339 A5 JP 2008124339A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- forming
- wiring layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 7
- 238000009713 electroplating Methods 0.000 claims 5
- 230000004888 barrier function Effects 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006308322A JP5069449B2 (ja) | 2006-11-14 | 2006-11-14 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006308322A JP5069449B2 (ja) | 2006-11-14 | 2006-11-14 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008124339A JP2008124339A (ja) | 2008-05-29 |
| JP2008124339A5 true JP2008124339A5 (enrdf_load_stackoverflow) | 2009-11-05 |
| JP5069449B2 JP5069449B2 (ja) | 2012-11-07 |
Family
ID=39508751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006308322A Active JP5069449B2 (ja) | 2006-11-14 | 2006-11-14 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5069449B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110038521A (ko) * | 2009-10-08 | 2011-04-14 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그 제조방법 |
| KR102494110B1 (ko) * | 2015-08-28 | 2023-01-30 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체 장치 및 그 제조 방법 |
| CN110915307B (zh) * | 2017-05-19 | 2023-02-03 | 佐佐木贝慈 | 电子部件搭载用基板及其制造方法 |
| TWI705747B (zh) * | 2019-08-30 | 2020-09-21 | 嘉聯益科技股份有限公司 | 多層軟性電路板及其製造方法 |
| JP2022014750A (ja) * | 2020-07-07 | 2022-01-20 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| TWI831123B (zh) * | 2022-01-28 | 2024-02-01 | 巨擘科技股份有限公司 | 多層基板表面處理層結構 |
| CN115190701B (zh) * | 2022-05-13 | 2023-06-02 | 广州广芯封装基板有限公司 | 一种埋入式线路封装基板及其加工方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03253091A (ja) * | 1990-03-02 | 1991-11-12 | Tokuyama Soda Co Ltd | プリント配線板の製造方法 |
| JPH11126974A (ja) * | 1997-10-24 | 1999-05-11 | Asahi Chem Res Lab Ltd | 多層配線板の製造方法 |
| JP2002299779A (ja) * | 2001-03-30 | 2002-10-11 | Hitachi Metals Ltd | 配線形成用帯材及びそれを用いたバンプ付き配線を有する配線板並びに配線形成用帯材を用いた転写配線板の製造方法 |
| JP2003008228A (ja) * | 2001-06-22 | 2003-01-10 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| JP2004095972A (ja) * | 2002-09-03 | 2004-03-25 | Sumitomo Metal Electronics Devices Inc | プラスチックパッケージの製造方法 |
| JP2005166910A (ja) * | 2003-12-02 | 2005-06-23 | Fujikura Ltd | プリント配線板およびその製造方法 |
-
2006
- 2006-11-14 JP JP2006308322A patent/JP5069449B2/ja active Active