JP2008124267A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2008124267A
JP2008124267A JP2006306896A JP2006306896A JP2008124267A JP 2008124267 A JP2008124267 A JP 2008124267A JP 2006306896 A JP2006306896 A JP 2006306896A JP 2006306896 A JP2006306896 A JP 2006306896A JP 2008124267 A JP2008124267 A JP 2008124267A
Authority
JP
Japan
Prior art keywords
light emitting
electrode
glass
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006306896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008124267A5 (enrdf_load_stackoverflow
Inventor
Seiji Yamaguchi
誠治 山口
Yoshinobu Suehiro
好伸 末広
Jitsuki Moriyama
実希 守山
Shigeo Takatani
繁雄 高谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2006306896A priority Critical patent/JP2008124267A/ja
Publication of JP2008124267A publication Critical patent/JP2008124267A/ja
Publication of JP2008124267A5 publication Critical patent/JP2008124267A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006306896A 2006-11-13 2006-11-13 発光装置 Pending JP2008124267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006306896A JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006306896A JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Publications (2)

Publication Number Publication Date
JP2008124267A true JP2008124267A (ja) 2008-05-29
JP2008124267A5 JP2008124267A5 (enrdf_load_stackoverflow) 2009-01-29

Family

ID=39508696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006306896A Pending JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Country Status (1)

Country Link
JP (1) JP2008124267A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027792A (ja) * 2008-07-17 2010-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2011181597A (ja) * 2010-02-26 2011-09-15 Toyoda Gosei Co Ltd 半導体発光素子
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
WO2016063501A1 (ja) * 2014-10-22 2016-04-28 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
WO2017169289A1 (ja) * 2016-03-31 2017-10-05 セントラル硝子株式会社 光学デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
US9634203B2 (en) 2008-05-30 2017-04-25 Sharp Kabushiki Kaisha Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device
JP2010027792A (ja) * 2008-07-17 2010-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2011181597A (ja) * 2010-02-26 2011-09-15 Toyoda Gosei Co Ltd 半導体発光素子
WO2016063501A1 (ja) * 2014-10-22 2016-04-28 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
JPWO2016063501A1 (ja) * 2014-10-22 2017-07-06 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
WO2017169289A1 (ja) * 2016-03-31 2017-10-05 セントラル硝子株式会社 光学デバイスの製造方法

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